Samsung electronics co., ltd. (20240192154). PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME simplified abstract
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PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME
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PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240192154 titled 'PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME
The patent application describes a pattern inspection apparatus that uses an electron gun to generate an input electron beam and emit it onto a wafer and sample with holes of varying thicknesses. The emitted electrons are detected by a detector to create a scanning electron microscope (SEM) image, which is then processed by a processor to generate a three-dimensional profiling image with depth information of the wafer. The processor also determines if the condition of the input electron beam has changed based on the SEM image analysis.
- The apparatus includes a sample with holes of different thicknesses.
- An electron gun generates an input electron beam directed at the wafer and sample.
- A detector captures emitted electrons to create an SEM image.
- A processor processes the SEM image to create a three-dimensional profiling image and assesses changes in the input electron beam condition.
Potential Applications: - Semiconductor manufacturing for quality control - Nanotechnology research for precise measurements - Material science for analyzing surface structures
Problems Solved: - Accurate inspection of patterns with varying thicknesses - Efficient detection of changes in the input electron beam condition
Benefits: - Enhanced quality control in semiconductor manufacturing - Improved accuracy in nanotechnology research - Increased efficiency in material science analysis
Commercial Applications: Title: Advanced Pattern Inspection Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to ensure the quality and accuracy of patterned structures, leading to improved production processes and final product quality.
Prior Art: Researchers can explore prior patents related to pattern inspection apparatuses, electron beam technology, and SEM image processing to understand the existing knowledge in this field.
Frequently Updated Research: Researchers in the field of semiconductor manufacturing and nanotechnology may conduct studies on optimizing pattern inspection techniques using electron beam technology and SEM imaging for enhanced accuracy and efficiency.
Questions about Pattern Inspection Apparatus: 1. How does the apparatus differentiate between holes of varying thicknesses in the sample? 2. What are the key parameters that the processor analyzes to determine changes in the input electron beam condition?
Original Abstract Submitted
a pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (sem) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the sem image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the sem image.
