Samsung electronics co., ltd. (20240188218). CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract
Contents
- 1 CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
Organization Name
Inventor(s)
CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240188218 titled 'CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
Simplified Explanation
The circuit board module described in the patent application includes a first substrate, a second substrate with a first inlet, a first interposer connecting the substrates and providing a space between them, a sealing member covering the first inlet, and a filler between the substrates. The sealing member has an insertion area for injecting the filler, and at least one of the substrates or the interposer has openings for air intake and exhaust in the space.
- First substrate
- Second substrate
- First interposer
- Sealing member
- Filler
- Air openings
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems that require secure and efficient sealing of components.
Problems Solved
This technology solves the problem of effectively sealing circuit board modules while allowing for the introduction and removal of filler material and air in the space between substrates.
Benefits
The benefits of this technology include improved reliability and longevity of electronic devices, enhanced protection against environmental factors, and easier maintenance and repair processes.
Potential Commercial Applications
The technology could be utilized in the manufacturing of smartphones, tablets, laptops, and other electronic devices where compact and reliable circuit board modules are essential for performance.
Possible Prior Art
One possible prior art could be the use of gaskets or seals in electronic devices to prevent dust and moisture ingress. However, the specific configuration of the sealing member and filler injection system described in this patent application may be novel.
Unanswered Questions
How does the filler material interact with the substrates and interposer to provide a secure seal?
The patent application does not provide detailed information on the chemical or physical properties of the filler material and how it adheres to the components.
Are there any specific requirements for the air intake and exhaust openings in terms of size or placement?
The patent application does not specify any guidelines for the design of the air openings, which could impact the efficiency of the sealing system.
Original Abstract Submitted
a circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.
