Samsung electronics co., ltd. (20240186282). DIE BONDING APPARATUS simplified abstract
Contents
- 1 DIE BONDING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DIE BONDING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the magnetic field affect the bonding process itself?
- 1.11 Are there any limitations to the use of magnetic materials in die bonding?
- 1.12 Original Abstract Submitted
DIE BONDING APPARATUS
Organization Name
Inventor(s)
Kyeongbin Lim of Suwon-si (KR)
DIE BONDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186282 titled 'DIE BONDING APPARATUS
Simplified Explanation
The patent application describes a die bonding apparatus that uses magnetic materials and an electromagnet to align two dies in a vertical direction during the bonding process.
- The stage supports the first die, while the pickup head picks up the second die.
- Magnetic materials are arranged on both dies.
- An electromagnet on the pickup head or stage generates a magnetic field when the dies are at a predetermined distance.
- The magnetic field aligns the magnetic materials on the dies in the vertical direction.
Potential Applications
This technology could be used in semiconductor manufacturing processes where precise alignment of dies is crucial for the functionality of the final product.
Problems Solved
This innovation solves the problem of misalignment of dies during the bonding process, which can lead to defective products and decreased yield rates.
Benefits
The benefits of this technology include improved accuracy and efficiency in die bonding, leading to higher quality products and increased productivity.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of integrated circuits and other electronic devices where die bonding is a critical step in the manufacturing process.
Possible Prior Art
Prior art in die bonding technology includes methods using optical alignment systems or mechanical fixtures to align dies during the bonding process.
Unanswered Questions
How does the magnetic field affect the bonding process itself?
The article does not provide information on how the magnetic field generated by the electromagnet impacts the actual bonding of the dies together.
Are there any limitations to the use of magnetic materials in die bonding?
The article does not address any potential limitations or challenges that may arise from using magnetic materials in the die bonding process.
Original Abstract Submitted
a die bonding apparatus comprising a stage configured to support a first die, a pickup head configured to pick up a second die, regions of magnetic materials arranged on the first die and the second die, an electromagnet arranged on a surface of the pickup head or the stage; and a controller configured to apply a current to the electromagnet to generate a magnetic field when the first die and the second die are disposed at a predetermined distance from each other in a vertical direction. as a result of the magnetic field generated by the electromagnet, the regions of magnetic material arranged on first die and the second die are aligned with one another in the vertical direction.
