Samsung electronics co., ltd. (20240186278). MOUNTING DEVICE AND MOUNTING METHOD simplified abstract

MOUNTING DEVICE AND MOUNTING METHOD

Organization Name

samsung electronics co., ltd.

Inventor(s)

Masato Kajinami of Yokohama-shi (JP)

Hansung Cho of Suwon-si (KR)

Kazuya Ono of Suwon-si (KR)

Byeongjin Kim of Suwon-si (KR)

Daisuke Nagatomo of Yokohama-shi (JP)

Fumitaka Moroishi of Yokohama-shi (JP)

Masanori Izumita of Yokohama-shi (JP)

Sungmin Ahn of Suwon-si (KR)

MOUNTING DEVICE AND MOUNTING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186278 titled 'MOUNTING DEVICE AND MOUNTING METHOD

Simplified Explanation

The abstract describes a mounting device with a bonding actuator that can achieve high-precision mounting by adjusting the relative position and parallelism of a chip and a wafer in six axial directions.

• The mounting device includes a bonding actuator with a housing, a slider, a coil, and a yoke in a non-contact state.
• Two voice coil motors (VCMs) are driven in the x-axis direction, three VCMs in the y-axis direction, and one VCM in the z-axis direction.
• The coil is fixed to the housing, and the yoke is fixed to the slider.
• The bonding actuator drives the slider in six axial directions to perform bonding while adjusting the position and parallelism of the chip and wafer.

Potential Applications

This technology could be applied in semiconductor manufacturing, electronics assembly, and other industries requiring high-precision bonding processes.

Problems Solved

This technology solves the problem of achieving high-precision mounting and bonding of components, which is crucial in industries where accuracy is paramount.

Benefits

The benefits of this technology include improved product quality, increased production efficiency, and reduced manufacturing costs due to precise bonding processes.

Potential Commercial Applications

Potential commercial applications of this technology include semiconductor fabrication equipment, electronic device manufacturing machinery, and precision engineering tools.

Possible Prior Art

One possible prior art could be similar mounting devices with bonding actuators, but with less precision and control over the bonding process.

Unanswered Questions

How does this technology compare to existing mounting devices in terms of speed and accuracy?

The abstract does not provide specific details on the speed and accuracy of this technology compared to existing mounting devices.

Are there any limitations or constraints in the implementation of this technology in different manufacturing environments?

The abstract does not mention any limitations or constraints that may arise when implementing this technology in various manufacturing settings.

Original Abstract Submitted

provided are mounting devices and mounting methods configured to realize high-precision mounting. a mounting device including a bonding actuator having a housing, a slider accommodated in the housing in a non-contact state and provided with a head, a coil and a yoke in a non-contact state, two voice coil motors (vcms) driven in an x-axis direction, three vcms driven in a y-axis direction, and one vcm driven in a z-axis direction may be provided. the coil may be fixed to the housing and the yoke may be fixed to the slider. the bonding actuator may perform bonding while adjusting a relative position and parallelism of a chip and a wafer, by driving the slider in six axial directions, which include the x-axis direction, the y-axis direction, the z-axis direction, a tx direction, a ty direction, and a tz direction.