Samsung electronics co., ltd. (20240186231). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
Organization Name
Inventor(s)
Kyounglim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186231 titled 'SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
Simplified Explanation
The semiconductor package described in the abstract includes a lower redistribution structure, a semiconductor device, a lower encapsulant, and an upper composite redistribution structure. The upper composite redistribution structure consists of a primary conductive structure, a secondary conductive structure, connection vias, and an upper encapsulant.
- Lower redistribution structure: Provides a foundation for the semiconductor device.
- Semiconductor device: Positioned on the lower redistribution structure.
- Lower encapsulant: Surrounds the side surface of the semiconductor device.
- Upper composite redistribution structure: Located on the upper portion of the semiconductor device.
- Primary conductive structure: Part of the upper composite redistribution structure.
- Secondary conductive structure: Positioned on the primary conductive structure.
- Connection vias: Connect the primary conductive structure and the secondary conductive structure.
- Upper encapsulant: Surrounds the connection vias within the upper composite redistribution structure.
Potential Applications
The technology described in the patent application could be used in the manufacturing of advanced semiconductor packages for various electronic devices.
Problems Solved
This technology helps in improving the performance and reliability of semiconductor devices by providing a robust structure for connecting different components.
Benefits
The benefits of this technology include enhanced electrical connectivity, improved thermal management, and overall increased functionality of semiconductor devices.
Potential Commercial Applications
The technology could be applied in the production of high-performance integrated circuits, microprocessors, and other electronic components for industries such as telecommunications, computing, and automotive.
Possible Prior Art
One possible prior art could be the use of similar composite redistribution structures in semiconductor packaging to improve connectivity and performance.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison to existing semiconductor packaging methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges that may arise when implementing this technology on a large scale, such as cost implications, manufacturing complexities, or compatibility issues with existing processes.
Original Abstract Submitted
a semiconductor package includes a lower redistribution structure. a semiconductor device is disposed on the lower redistribution structure. a lower encapsulant is disposed on the lower redistribution structure and surrounds a side surface of the semiconductor device. an upper composite redistribution structure is disposed on an upper portion of the semiconductor device and includes a primary conductive structure, a secondary conductive structure disposed on the primary conductive structure, connection vias disposed between the primary conductive structure and the secondary conductive structure, and an upper encapsulant disposed between the primary conductive structure and the secondary conductive structure and surrounding the connection vias.
