Samsung electronics co., ltd. (20240186215). THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract
Contents
- 1 THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
Organization Name
Inventor(s)
Youngsuk Nam of Yongin-si (KR)
Bangweon Lee of Yongin-si (KR)
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186215 titled 'THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
Simplified Explanation
The method of manufacturing a thermal interface material involves removing oxide layers from fine particles and liquid metal through an acidic solution, allowing for better penetration and extraction of the materials.
- Fine particles are mixed with an acidic solution to remove a first oxide layer.
- Liquid metal is injected into the acidic solution to remove a second oxide layer.
- Fine particles with the first oxide layer removed penetrate into the liquid metal with the second oxide layer removed.
- The liquid metal with the fine particles is then extracted from the acidic solution.
Potential Applications
The technology can be used in the manufacturing of thermal interface materials for electronic devices, such as computer processors and LED lights.
Problems Solved
This method solves the problem of oxide layers on fine particles and liquid metal, which can hinder the effectiveness of thermal interface materials.
Benefits
The benefits of this technology include improved thermal conductivity and efficiency in electronic devices, leading to better performance and longevity.
Potential Commercial Applications
A potential commercial application of this technology could be in the production of high-performance thermal interface materials for the electronics industry.
Possible Prior Art
One possible prior art could be the use of chemical treatments to remove oxide layers from materials in various manufacturing processes.
Unanswered Questions
How does this method compare to traditional methods of manufacturing thermal interface materials?
This method offers a more efficient way of removing oxide layers from fine particles and liquid metal, potentially leading to better thermal conductivity.
What are the environmental implications of using acidic solutions in this manufacturing process?
The use of acidic solutions may raise concerns about environmental impact and waste disposal. Further research may be needed to assess the sustainability of this method.
Original Abstract Submitted
a method of manufacturing a thermal interface material may include mixing fine particles with an acidic solution to remove a first oxide layer from a surface of each of the fine particles, injecting a liquid metal into the acidic solution to remove a second oxide layer from a surface of the liquid metal and for the fine particles from which the first oxide layer is removed in the acidic solution to penetrate into the liquid metal from which the second oxide layer is remove, and extracting the liquid metal including the fine particles therein from the acidic solution.
