Samsung electronics co., ltd. (20240186174). APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
Contents
- 1 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Fumitaka Moroishi of Yokohama City (JP)
Tatsuya Ishimoto of Yokohama City (JP)
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186174 titled 'APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
Simplified Explanation
The semiconductor manufacturing apparatus described in the abstract includes a pick-up head with ejection and suction holes for gas, a warpage measurement portion, and a controller to adjust gas flow rates based on chip warpage measurements.
- Pick-up head with ejection and suction holes for gas
- Warpage measurement portion to measure chip warpage
- Controller to adjust gas flow rates based on chip warpage measurements
Potential Applications
This technology could be applied in various semiconductor manufacturing processes where precise and reliable chip mounting is crucial.
Problems Solved
This innovation addresses the challenge of ensuring highly reliable chip mounting in semiconductor manufacturing by adjusting gas flow rates based on chip warpage measurements.
Benefits
The benefits of this technology include improved reliability in chip mounting, increased precision in semiconductor manufacturing processes, and potentially higher overall product quality.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor manufacturing equipment, electronics production, and other industries requiring precise chip mounting processes.
Possible Prior Art
One possible prior art in this field could be the use of vacuum suction technology in semiconductor manufacturing processes to hold and mount chips securely.
=== What are the specific gas flow rates adjusted by the controller in response to chip warpage measurements? The specific gas flow rates adjusted by the controller in response to chip warpage measurements are the gas supply flow rate from the ejection holes and the suction flow rate from the suction holes.
=== How does the warpage measurement portion measure the warpage of the chip held by the pick-up head? The warpage measurement portion measures the warpage of the chip held by the pick-up head using sensors or other measurement devices to detect any deviations from the desired flatness or shape of the chip.
Original Abstract Submitted
in order to provide a semiconductor manufacturing apparatus capable of realizing highly reliable mounting, a semiconductor manufacturing apparatus includes a pick-up head having a plurality of ejection holes for ejecting gas and a plurality of suction holes for suctioning the gas provided in a holding surface that holds a chip. a warpage measurement portion is configured to measure warpage of the chip held by the pick-up head, and a controller is configured to control at least one of a gas supply flow rate from the plurality of ejection holes and a suction flow rate from the plurality of suction holes in response to the measured warpage of the chip.
