Samsung electronics co., ltd. (20240179925). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Joonghyun Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240179925 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
A semiconductor package includes a substrate with at least one controller chip and at least one chip structure, consisting of a buffer chip, an upper chip stack, and a lower chip stack. The upper wire connects the upper chip stack, buffer chip, and controller chip, while the lower wire connects the lower chip stack and controller chip. A connection wire links the controller chip to the substrate, and connection bumps below the substrate connect to the controller chip and chip structure.
- Substrate with controller chip and chip structure
- Chip structure with buffer chip, upper chip stack, and lower chip stack
- Upper wire connecting upper chip stack, buffer chip, and controller chip
- Lower wire connecting lower chip stack and controller chip
- Connection wire linking controller chip to substrate
- Connection bumps below substrate connecting to controller chip and chip structure
Potential Applications
The technology described in this patent application could be applied in various semiconductor devices, such as microprocessors, memory modules, and integrated circuits.
Problems Solved
This innovation addresses the challenge of efficiently connecting multiple chip structures within a semiconductor package, enhancing overall performance and reliability.
Benefits
The benefits of this technology include improved electrical connectivity, increased functionality, and enhanced durability of semiconductor packages.
Potential Commercial Applications
"Enhanced Electrical Connectivity in Semiconductor Packages"
Possible Prior Art
There may be prior art related to the integration of multiple chip structures within semiconductor packages, but specific examples are not provided in this patent application.
Unanswered Questions
How does this technology impact the overall size of semiconductor packages?
The article does not mention the potential impact of this technology on the size of semiconductor packages.
What materials are used for the connection bumps in this innovation?
The patent application does not specify the materials used for the connection bumps in the semiconductor package.
Original Abstract Submitted
a semiconductor package may include a substrate; at least one controller chip on the substrate; at least one chip structure on the substrate, the at least one chip structure including a buffer chip, an upper chip stack on the buffer chip, and a lower chip stack below the buffer chip; an upper wire electrically connecting the upper chip stack, the buffer chip, and the at least one controller chip; a lower wire electrically connecting the lower chip stack and the at least one controller chip; a connection wire electrically connecting the at least one controller chip to the substrate; and connection bumps below the substrate, the connection bumps being electrically connected to the at least one controller chip and the at least one chip structure.
