Samsung electronics co., ltd. (20240179850). ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR simplified abstract
Contents
- 1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Organization Name
Inventor(s)
Chunghyo Jung of Suwon-si (KR)
Chiyoung Yoon of Suwon-si (KR)
Jungsik Choi of Siheung-si (KR)
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240179850 titled 'ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Simplified Explanation
The abstract describes an electronic device with an injection mold that includes a mounting part, a wiring groove, plated wiring on the groove, and an electronic element mounted on the part and connected to the plated wiring. The plated wiring is on the outer region of the mold, and the electronic element is dispensed on the plated wiring.
- Injection mold with mounting part and wiring groove
- Plated wiring on the wiring groove
- Electronic element mounted on the mounting part and connected to the plated wiring
- Plated wiring on the outer region of the injection mold
- Electronic element dispensed on the plated wiring
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, such as smartphones, tablets, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently integrating electronic elements into injection molded parts, providing a more streamlined and cost-effective manufacturing process.
Benefits
The benefits of this technology include improved electrical connections, reduced production costs, and enhanced overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the production of electronic devices in various industries, such as telecommunications, automotive, and home appliances.
Possible Prior Art
One possible prior art could be the use of traditional wiring methods in injection molded parts, which may not be as efficient or cost-effective as the technology described in this patent application.
Unanswered Questions
How does the dispensing process of the electronic element on the plated wiring work?
The abstract does not provide detailed information on the dispensing process of the electronic element on the plated wiring. Further clarification on this process would be beneficial for understanding the implementation of this technology.
What materials are used for the plated wiring and how does it enhance the electrical connection?
The abstract does not specify the materials used for the plated wiring or how it enhances the electrical connection. Exploring the specific materials and their properties would provide a deeper insight into the functionality of this technology.
Original Abstract Submitted
an electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.
