Samsung electronics co., ltd. (20240178342). CHIP WET-TRANSFERRING DEVICE simplified abstract
Contents
- 1 CHIP WET-TRANSFERRING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP WET-TRANSFERRING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP WET-TRANSFERRING DEVICE
Organization Name
Inventor(s)
Kyungwook Hwang of Suwon-si (KR)
Joonyong Park of Suwon-si (KR)
Sanghoon Song of Suwon-si (KR)
CHIP WET-TRANSFERRING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178342 titled 'CHIP WET-TRANSFERRING DEVICE
Simplified Explanation
The chip wet-transferring device described in the patent application includes a chamber, a support member for a transfer substrate with grooves and micro-semiconductor chips, and a magnetic field generator to remove chips from the substrate using a magnetic field.
- The device is designed to remove micro-semiconductor chips from a transfer substrate by generating a magnetic field that moves the chips in a direction parallel to the substrate's surface.
- The support member in the chamber holds the transfer substrate, which contains grooves and multiple micro-semiconductor chips.
- The magnetic field generator targets and removes specific micro-semiconductor chips that are outside the grooves on the transfer substrate.
Potential Applications
The technology could be applied in semiconductor manufacturing processes, specifically in the handling and transferring of micro-semiconductor chips during production.
Problems Solved
This technology solves the problem of efficiently and precisely removing micro-semiconductor chips from a transfer substrate without damaging them or the substrate.
Benefits
The device allows for the automated and controlled removal of micro-semiconductor chips, increasing efficiency and reducing the risk of damage during the transfer process.
Potential Commercial Applications
"Automated Micro-Semiconductor Chip Removal Device for Semiconductor Manufacturing Processes"
Possible Prior Art
There may be prior art related to devices or methods for transferring micro-semiconductor chips in semiconductor manufacturing processes, but specific examples are not provided in the patent application.
Unanswered Questions
How does the magnetic field generator target specific chips for removal?
The patent application does not detail the specific mechanism by which the magnetic field generator identifies and removes individual micro-semiconductor chips from the transfer substrate.
What is the expected lifespan of the chip wet-transferring device?
The patent application does not mention the durability or expected lifespan of the device, which could be crucial information for potential users or manufacturers.
Original Abstract Submitted
a chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.
