Samsung electronics co., ltd. (20240178191). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
Seunghun Shin of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178191 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor chip described in the abstract includes a semiconductor substrate with through electrodes, wiring structures, front and rear chip connection pads, and insulating layers. The front insulating layer has a cover insulating portion that covers a side surface of the inter-wire insulating layer.
- Through electrodes passing through the semiconductor substrate
- Wiring structures on the active surface connected to the through electrodes
- Front and rear chip connection pads for electrical connections
- Insulating layers surrounding the wiring structures and connection pads
- Front insulating layer with a cover insulating portion
Potential Applications
The technology described in this patent application could be applied in the manufacturing of advanced semiconductor chips for various electronic devices, such as smartphones, computers, and IoT devices.
Problems Solved
This technology helps in improving the electrical connectivity and insulation within semiconductor chips, leading to enhanced performance and reliability of electronic devices.
Benefits
The benefits of this technology include increased efficiency, reduced signal interference, improved durability, and overall better functionality of electronic devices utilizing these semiconductor chips.
Potential Commercial Applications
The semiconductor chip technology described in this patent application could find commercial applications in the semiconductor industry, specifically in the production of high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of insulating layers in semiconductor chips to improve electrical connectivity and reliability. Additionally, the integration of through electrodes and wiring structures is a common practice in semiconductor chip manufacturing.
Unanswered Questions
How does this technology compare to existing semiconductor chip designs in terms of performance and reliability?
This article does not provide a direct comparison between this technology and existing semiconductor chip designs. Further research or testing may be needed to determine the specific advantages or disadvantages of this innovation in relation to current industry standards.
Original Abstract Submitted
a semiconductor chip including a semiconductor substrate having an active surface and a non-active surface opposite to each other, a plurality of through electrodes passing through the semiconductor substrate, a plurality of wiring structures on the active surface and electrically connected to the plurality of through electrodes, an inter-wire insulating layer surrounding the plurality of wiring structures, a plurality of front chip connection pads electrically connected to the plurality of wiring structures, a front insulating layer surrounding the plurality of front chip connection pads, on the inter-wire insulating layer, a plurality of rear chip connection pads disposed on the non-active surface and electrically connected to the plurality of through electrodes, and a rear insulating layer surrounding the plurality of rear chip connection pads, on the non-active surface, wherein the front insulating layer includes a cover insulating portion covering a side surface of the inter-wire insulating layer may be provided.
