Samsung electronics co., ltd. (20240178122). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kyung Don Mun of Suwon-si (KR)
Kyoung Lim Suk of Suwon-si (KR)
Shang-Hoon Seo of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178122 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a unique connection structure with a post on a connection substrate, a molding layer encapsulating the semiconductor chip and connection structure, and redistribution substrates. The connection substrate has a conductive pattern that vertically penetrates it, with the post in contact with the pattern. The width of the post is less than the width of the connection substrate.
- Connection structure with post on connection substrate
- Conductive pattern vertically penetrating connection substrate
- Molding layer encapsulating semiconductor chip and connection structure
- Width of post less than width of connection substrate
Potential Applications
This technology could be applied in various electronic devices requiring compact and efficient semiconductor packaging, such as smartphones, tablets, laptops, and IoT devices.
Problems Solved
1. Improved reliability and performance of semiconductor packages 2. Enhanced thermal management due to efficient encapsulation design
Benefits
1. Higher reliability and durability of electronic devices 2. Improved thermal performance for better overall device efficiency 3. Compact design for space-constrained applications
Potential Commercial Applications
Optimizing Semiconductor Packaging for Electronic Devices
Possible Prior Art
Prior art in semiconductor packaging includes traditional wire bonding and flip chip technologies, which may not offer the same level of efficiency and compactness as the described connection structure with a post on the connection substrate.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this new semiconductor packaging technology.
What are the potential challenges in scaling up production of semiconductor packages using this new connection structure?
The article does not address the scalability issues that may arise when mass-producing semiconductor packages with the described connection structure.
Original Abstract Submitted
a semiconductor package, including a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a connection structure on the first redistribution substrate and spaced apart from the semiconductor chip, the connection structure including a connection substrate and a post on the connection substrate, a second redistribution substrate on the semiconductor chip and the connection structure, and a molding layer between the first redistribution substrate and the second redistribution substrate, the molding layer encapsulating the semiconductor chip and the connection structure, wherein the connection substrate includes a conductive pattern that vertically penetrates the connection substrate, the post is in contact with a top surface of the conductive pattern, and a width of the post is less than a width of the connection substrate.
