Samsung electronics co., ltd. (20240178025). SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract
Contents
SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM
Organization Name
Inventor(s)
Hyunwoong Choi of Suwon-si (KR)
Beomsoo Hwang of Suwon-si (KR)
SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178025 titled 'SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM
Simplified Explanation
The semiconductor processing device described in the abstract is a system that uses a combination of a laser sensor, camera sensor, lighting device, and a controller to detect defects on a bare wafer during the manufacturing process. Here is a simplified explanation of the patent application:
- The device includes a stage where a bare wafer is placed.
- A laser sensor and camera sensor are positioned above the stage to capture images of the wafer.
- A lighting device illuminates the wafer for better imaging.
- The controller rotates the wafer on the stage to capture multiple sub-images and generate an original image.
- The controller then analyzes the original image to detect defects on the wafer.
- Additionally, the controller measures the distance between the laser sensor and the wafer to detect defects more accurately while rotating the wafer.
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- Potential Applications of this Technology
- Quality control in semiconductor manufacturing - Defect detection in bare wafers
- Problems Solved by this Technology
- Early detection of defects in the manufacturing process - Improved accuracy in defect detection
- Benefits of this Technology
- Increased efficiency in semiconductor production - Reduction in defective products
- Potential Commercial Applications of this Technology
- Improving Semiconductor Manufacturing Processes
- Potential Commercial Applications of this Technology
- Possible Prior Art
No prior art known at this time.
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- Unanswered Questions
- How does this technology compare to traditional defect detection methods in semiconductor manufacturing?
This article does not provide a direct comparison between this technology and traditional defect detection methods. It would be beneficial to understand the specific advantages and limitations of this new approach compared to existing techniques.
- What are the potential limitations or challenges faced when implementing this technology in a semiconductor manufacturing environment?
The article does not address any potential limitations or challenges that may arise when implementing this technology. It would be important to consider factors such as cost, scalability, and integration with existing systems to fully understand the practical implications of adopting this innovation.
Original Abstract Submitted
a semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.
