Samsung electronics co., ltd. (20240173751). SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM simplified abstract
Contents
- 1 SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM
Organization Name
Inventor(s)
SANGJINE Park of Suwon-si (KR)
SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240173751 titled 'SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM
Simplified Explanation
The method described in the patent application involves wetting a substrate, supplying a supercritical fluid onto the wetted substrate to dry it, and then cleaning the dried substrate by supplying a cleaning solution onto both the top and bottom surfaces of the substrate.
- Wetting of substrate
- Supplying supercritical fluid to dry the substrate
- Cleaning the dried substrate with a cleaning solution on both surfaces
Potential Applications
The technology could be applied in industries such as semiconductor manufacturing, optical coatings, and pharmaceuticals.
Problems Solved
This method provides a more efficient and effective way to dry and clean substrates compared to traditional methods.
Benefits
The benefits of this technology include faster processing times, improved cleanliness of substrates, and reduced environmental impact.
Potential Commercial Applications
The technology could be used in manufacturing processes for electronic devices, medical equipment, and precision instruments.
Possible Prior Art
One possible prior art could be the use of traditional drying and cleaning methods for substrates in various industries.
Unanswered Questions
How does the supercritical fluid affect the drying process compared to other drying methods?
The article does not provide a detailed comparison of the drying efficiency and effectiveness of using supercritical fluid versus other drying methods.
Are there any limitations or drawbacks to using this method for processing substrates?
The article does not address any potential limitations or drawbacks that may arise from implementing this technology in industrial settings.
Original Abstract Submitted
a method of processing a substrate includes wetting a substrate, supplying a supercritical fluid onto the wetted substrate to dry the substrate, and cleaning the dried substrate. the cleaning of the substrate includes supplying a cleaning solution onto a top surface of the substrate, and supplying a cleaning solution onto a bottom surface of the substrate.
