Samsung electronics co., ltd. (20240164084). SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Dong Wook Kim of Suwon-si (KR)
Sang Wuk Park of Suwon-si (KR)
Geon Yeop Lee of Suwon-si (KR)
Jung Pyo Hong of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240164084 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a substrate with an active area, first and second landing pads connected to the active area, first and second lower electrodes extending in a direction perpendicular to the substrate, a dielectric layer, and an upper electrode on the dielectric layer.
- The semiconductor device has a substrate with an active area.
- It includes first and second landing pads connected to the active area.
- The device features first and second lower electrodes extending perpendicular to the substrate.
- A dielectric layer extends along the first and second lower electrodes.
- An upper electrode is disposed on the dielectric layer.
Potential Applications
The semiconductor device could be used in various electronic applications such as integrated circuits, sensors, and memory devices.
Problems Solved
The device provides a compact and efficient design for semiconductor components, allowing for improved performance and functionality.
Benefits
The semiconductor device offers enhanced electrical properties, increased reliability, and reduced power consumption compared to traditional designs.
Potential Commercial Applications
The technology could be applied in the manufacturing of advanced electronic devices for consumer electronics, telecommunications, and automotive industries.
Possible Prior Art
One possible prior art for this technology could be the development of similar semiconductor devices with multiple landing pads and electrodes, but with different configurations or materials.
Unanswered Questions
How does this semiconductor device compare to existing technologies in terms of performance and cost?
The article does not provide a direct comparison with existing technologies in terms of performance and cost. Further research or testing may be needed to evaluate these aspects.
What are the specific manufacturing processes involved in producing this semiconductor device?
The article does not detail the specific manufacturing processes involved in producing this semiconductor device. Understanding the manufacturing processes could provide insights into scalability and cost-effectiveness.
Original Abstract Submitted
a semiconductor device includes: a substrate includes an active area; a first landing pad connected to the active area and disposed on the substrate; a second landing pad connected to the active area, and spaced apart from the first landing pad, wherein the second landing pad is disposed on the substrate; a first lower electrode disposed on the first landing pad and extending in a direction substantially perpendicular to the substrate; a second lower electrode disposed on the second landing pad and extending in the direction substantially perpendicular to the substrate; a dielectric layer extending along the first lower electrode and the second lower electrode; and an upper electrode disposed on the dielectric layer, wherein a first upper surface of the first landing pad is disposed below a second upper surface of the second landing pad with respect to a lower surface of the substrate.
