Samsung electronics co., ltd. (20240162323). INTEGRATED CIRCUIT DEVICE simplified abstract
Contents
- 1 INTEGRATED CIRCUIT DEVICE
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162323 titled 'INTEGRATED CIRCUIT DEVICE
Simplified Explanation
The integrated circuit device described in the patent application includes a substrate with multiple fins extending in a horizontal direction, source/drain areas on the fins, a back side contact connecting the source/drain areas, and a back side conductive layer also connected to the back side contact.
- The device features multiple fins spaced apart from each other and extending in a horizontal direction.
- Source/drain areas are located on specific fins.
- A back side contact connects the source/drain areas on different fins.
- A back side conductive layer is connected to the back side contact.
Potential Applications
The technology described in the patent application could be applied in:
- Semiconductor manufacturing
- Integrated circuit design
- Electronics industry
Problems Solved
This technology helps in:
- Improving connectivity in integrated circuits
- Enhancing performance of semiconductor devices
- Increasing efficiency in electronic devices
Benefits
The benefits of this technology include:
- Improved electrical connections
- Enhanced functionality of integrated circuits
- Higher performance in electronic devices
Potential Commercial Applications
This technology could be utilized in:
- Smartphone manufacturing
- Computer hardware production
- Consumer electronics development
Possible Prior Art
One possible prior art for this technology could be the use of back side contacts in semiconductor devices to improve connectivity and performance.
Unanswered Questions
How does this technology impact energy efficiency in electronic devices?
This technology can potentially improve energy efficiency by enhancing the performance of integrated circuits, leading to more efficient electronic devices.
What are the potential cost implications of implementing this technology in semiconductor manufacturing?
The cost implications of implementing this technology could vary depending on the scale of production and the specific requirements of semiconductor manufacturing processes. Further cost analysis would be needed to determine the exact impact.
Original Abstract Submitted
the integrated circuit device includes a substrate, a first fin extending in a first horizontal direction on the substrate, a second fin and a third fin spaced apart from each other in the first horizontal direction and extending in the first horizontal direction, a second source/drain area on the second fin and the third fin, a back side contact between the second fin and the third fin and electrically connected to the second source/drain area, and a back side conductive layer extending in the first horizontal direction and electrically connected to the back side contact. the back side contact includes a first portion protruding from the substrate and a second portion that is coplanar, in a vertical direction, with the substrate. a width of the second portion in the second horizontal direction is greater than a width of the first portion in the second horizontal direction.
