Samsung electronics co., ltd. (20240162213). CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract
Contents
- 1 CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
Yechung Chung of Suwon-si (KR)
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162213 titled 'CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Simplified Explanation
The display apparatus described in the patent application includes a silicon substrate with an opaque material, a display panel, a base film with a display driving chip, a connector, and a driving printed circuit board. The silicon substrate and base film have a one-to-one relationship, with the base film overlapping about 90% of the length of the silicon substrate.
- Silicon substrate with opaque material
- Display panel on silicon substrate
- Base film with display driving chip
- Connector on base film
- Driving printed circuit board connected to base film
Potential Applications
The technology described in this patent application could be used in various display devices such as smartphones, tablets, laptops, and televisions.
Problems Solved
This technology solves the problem of efficiently integrating display components on a silicon substrate, providing a compact and reliable display apparatus.
Benefits
The benefits of this technology include improved display performance, reduced size and weight of display devices, and simplified manufacturing processes.
Potential Commercial Applications
The technology could be applied in the consumer electronics industry for the production of high-quality and compact display devices.
Possible Prior Art
One possible prior art for this technology could be the use of silicon substrates in display devices, but the specific integration and overlap with a base film as described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing display apparatus designs in terms of cost and efficiency?
This article does not provide information on the cost implications or efficiency comparisons of this technology with existing display apparatus designs.
What are the environmental impacts of manufacturing and disposing of display apparatus using this technology?
The article does not address the environmental considerations related to the manufacturing and disposal of display apparatus utilizing this technology.
Original Abstract Submitted
a display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the fourth surface having a portion facing the first surface of the silicon substrate, a display driving chip mounted on the base film, a connector disposed on a portion of the third surface of the base film, and a driving printed circuit board (pcb) electrically connected with the base film, wherein the silicon substrate corresponds to the base film in a one-to-one relationship, and a length of an edge of the base film overlapping the silicon substrate is about 90% of a length of an edge of the silicon substrate parallel to the edge of the base film.
