Samsung electronics co., ltd. (20240162195). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162195 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a first semiconductor chip with a support structure, a second semiconductor chip stacked on top with a smaller width, and an insulating adhesive layer covering the support structure between the two chips.
- The first semiconductor chip has a support structure extending away from its top surface.
- The second semiconductor chip is stacked on the first chip with a smaller horizontal width.
- The insulating adhesive layer extends away from between the two chips to cover the support structure.
- The support structure is horizontally spaced apart from the edge of the second semiconductor chip and the insulating adhesive layer.
Potential Applications
This technology could be applied in the development of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This innovation helps in improving the structural integrity and thermal management of semiconductor packages by providing insulation and support between stacked chips.
Benefits
The benefits of this technology include enhanced reliability, increased performance, and improved efficiency of semiconductor packages in electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for manufacturing high-performance and reliable electronic devices.
Possible Prior Art
One possible prior art could be the use of insulating adhesive layers in semiconductor packaging to provide electrical insulation and mechanical support between stacked chips.
Unanswered Questions
How does this technology impact the overall size of the semiconductor package?
The abstract does not provide information on whether this technology affects the overall size of the semiconductor package and if it enables more compact designs.
What materials are used in the insulating adhesive layer for this semiconductor package?
The abstract does not specify the materials used in the insulating adhesive layer and whether they have any specific properties or requirements for optimal performance.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip including a support structure extending away from a top surface thereof, a second semiconductor chip stacked on the first semiconductor chip, having a horizontal width that is less than that of the first semiconductor chip, and having an edge horizontally spaced apart from that of the first semiconductor chip in a plan view, and an insulating adhesive layer between the first semiconductor chip and the second semiconductor chip that extends away from between the first semiconductor chip and the second semiconductor chip to cover the support structure. in a plan view, the support structure is horizontally spaced apart from the edge of the second semiconductor chip and an edge of the insulating adhesive layer.
