Samsung electronics co., ltd. (20240162132). FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 FAN-OUT SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
FAN-OUT SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162132 titled 'FAN-OUT SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a semiconductor chip, a connection structure below the chip, and an external connection terminal below the connection structure. The connection structure consists of a first via array, a second via array, and a first pad between them.
- The semiconductor package includes a semiconductor chip, a connection structure, and an external connection terminal.
- The connection structure comprises a first via array, a second via array, and a first pad.
- The second via array is offset from the first via array and does not overlap it in a vertical direction.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Electronics industry
Problems Solved
This technology helps in:
- Improving electrical connections in semiconductor packages
- Enhancing the performance of semiconductor chips
Benefits
The benefits of this technology include:
- Better signal transmission
- Increased reliability of semiconductor packages
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications industry
Possible Prior Art
One possible prior art could be:
- Traditional semiconductor packaging methods
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This question is not directly addressed in the article, but it would be interesting to see a comparison of this technology with traditional packaging methods.
What are the specific performance improvements seen with this new connection structure?
The article does not provide detailed information on the performance enhancements achieved with this technology, which could be a key point for further exploration.
Original Abstract Submitted
provided is a semiconductor package including a semiconductor chip, a connection structure below the semiconductor chip and electrically connected to the semiconductor chip, and an external connection terminal below the connection structure, wherein the connection structure includes a first via array including a plurality of first vias in a first direction, a second via array above the first via array and including a plurality of second vias in the first direction, and a first pad between the first via array and the second via array and on upper surfaces of the plurality of the first vias, wherein the second via array is offset from the first via array in the first direction and does not overlap the first via array in a vertical direction.
