Samsung electronics co., ltd. (20240162127). SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS
Organization Name
Inventor(s)
Seonghoon Bae of Suwon-si (KR)
Kwangok Jeong of Suwon-si (KR)
SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162127 titled 'SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS
Simplified Explanation
The semiconductor package described in the abstract includes a lower redistribution structure with an insulating layer, a connection pad, and an upper pad, a semiconductor chip mounted on the lower redistribution structure, a conductive post, at least one dummy post, and an upper redistribution structure connected to the semiconductor chip.
- Lower redistribution structure:
- Includes insulating layer, connection pad, and upper pad
- Semiconductor chip:
- Mounted on lower redistribution structure and connected to upper pad
- Conductive post:
- Disposed on connection pad
- Dummy post:
- Disposed on lower redistribution structure, shorter than conductive post
- Upper redistribution structure:
- Connected to semiconductor chip
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for packaging and connecting semiconductor chips in electronic devices.
Problems Solved
This technology helps in improving the connectivity and packaging of semiconductor chips, ensuring efficient performance and reliability in electronic devices.
Benefits
- Enhanced connectivity and packaging of semiconductor chips - Improved performance and reliability of electronic devices
Potential Commercial Applications
- Optimized Semiconductor Chip Packaging for Enhanced Connectivity and Reliability
Possible Prior Art
There may be prior art related to semiconductor chip packaging and connectivity solutions, but specific examples are not provided in this abstract.
Unanswered Questions
How does the height difference between the dummy post and conductive post impact the overall performance of the semiconductor package?
The height difference between the dummy post and conductive post may affect the electrical properties and thermal management of the semiconductor package.
What are the specific electronic devices or applications that could benefit the most from this semiconductor packaging technology?
Identifying the target market or specific applications where this technology can provide the most significant advantages would be beneficial for commercialization efforts.
Original Abstract Submitted
a semiconductor package according to an example embodiment of the present disclosure comprises: a lower redistribution structure including an insulating layer, a connection pad disposed on an upper surface of the insulating layer, and an upper pad; a semiconductor chip mounted on the lower redistribution structure and connected to the upper pad; a conductive post disposed on the connection pad; at least one dummy post disposed on the lower redistribution structure; and an upper redistribution structure disposed on the semiconductor chip and connected to the conductive post, and a height of the at least one dummy post is smaller than a height of the conductive post.
