Samsung electronics co., ltd. (20240162111). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
Organization Name
Inventor(s)
Seunghyun Cho of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162111 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
Simplified Explanation
The semiconductor package described in the patent application includes a flexible insulating substrate with wiring, vias, semiconductor devices, and a heat dissipation resin layer.
- Flexible insulating substrate with first and second surfaces
- First wiring on the first surface
- Second wiring on the second surface
- Vias coupling the first and second wiring
- Semiconductor devices on the first surface
- Heat dissipation resin layer covering at least one semiconductor device
Potential Applications
The technology described in this patent application could be applied in:
- Consumer electronics
- Automotive industry
- Aerospace industry
Problems Solved
This technology helps in:
- Improving heat dissipation in semiconductor devices
- Enhancing flexibility and durability of the package
Benefits
The benefits of this technology include:
- Increased reliability of semiconductor devices
- Improved performance due to better heat dissipation
- Cost-effective manufacturing process
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor packaging industry
- Electronics manufacturing sector
- Thermal management solutions market
Possible Prior Art
One possible prior art for this technology could be:
- Flexible packaging solutions for semiconductor devices
- Heat dissipation techniques in electronic components
What is the manufacturing process for this semiconductor package?
The manufacturing process for this semiconductor package involves:
- Fabricating the flexible insulating substrate
- Depositing the wiring and vias
- Mounting the semiconductor devices
- Applying the heat dissipation resin layer
How does the heat dissipation resin layer improve the performance of the semiconductor devices?
The heat dissipation resin layer helps in:
- Efficiently transferring heat away from the semiconductor devices
- Preventing overheating and potential damage to the components
Original Abstract Submitted
a semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a plurality of semiconductor devices on the first surface of the flexible insulating substrate, and a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices.
