Samsung electronics co., ltd. (20240162017). SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
Contents
- 1 SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
Youngrok Kwon of Suwon-si (KR)
SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162017 titled 'SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
The patent application describes a substrate supporting device with a cooling plate, thermal-insulation plate, and chucking plate with a heater. The thermal-insulation plate has an adiabatic space, and the cooling plate has a connection hole connected to the adiabatic space.
- Cooling plate with cooling hole
- Thermal-insulation plate with adiabatic space
- Chucking plate with heater
- Connection hole in cooling plate connected to adiabatic space
Potential Applications
The technology can be used in semiconductor manufacturing, electronic device assembly, and other industries requiring precise temperature control during substrate processing.
Problems Solved
The device solves the problem of maintaining a stable temperature for substrates during processing, preventing overheating or cooling.
Benefits
The device improves processing efficiency, reduces the risk of substrate damage, and enhances overall product quality.
Potential Commercial Applications
The technology can be applied in semiconductor fabrication facilities, research laboratories, and manufacturing plants for various electronic components.
Possible Prior Art
Prior art may include similar substrate supporting devices with cooling and heating elements, but the specific design and integration of the cooling plate, thermal-insulation plate, and chucking plate with adiabatic space may be unique to this patent application.
Unanswered Questions
How does this technology compare to existing substrate supporting devices in terms of energy efficiency?
The patent application does not provide specific data on the energy efficiency of the device compared to existing technologies. Further research or testing may be needed to evaluate this aspect.
What materials are used in the construction of the cooling plate, thermal-insulation plate, and chucking plate?
The patent application does not detail the specific materials used in the construction of the components. Understanding the material composition can be crucial for assessing durability, thermal conductivity, and overall performance of the device.
Original Abstract Submitted
a substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. the chucking plate may include a heater. the thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. the cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.
