Samsung electronics co., ltd. (20240162014). PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS simplified abstract
Contents
- 1 PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall efficiency of plasma processing operations?
- 1.11 What are the maintenance requirements for the opening/closing devices in this process chamber?
- 1.12 Original Abstract Submitted
PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS
Organization Name
Inventor(s)
PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162014 titled 'PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS
Simplified Explanation
The patent application describes a process chamber with two opening/closing devices to maintain a vacuum state during plasma processing.
- The housing provides a process space for plasma processing.
- The first opening/closing device includes a frame and at least one blade for opening/closing.
- The second opening/closing device is located on the outside of the housing, aligned with the first device, and includes a frame and a door structure.
- Both devices work together to keep the process space in a vacuum state.
Potential Applications
This technology could be applied in industries such as semiconductor manufacturing, solar panel production, and advanced materials research.
Problems Solved
This innovation solves the problem of maintaining a vacuum state in the process chamber during plasma processing, which is crucial for achieving high-quality results.
Benefits
The benefits of this technology include improved process control, enhanced product quality, and increased efficiency in plasma processing operations.
Potential Commercial Applications
One potential commercial application of this technology is in the production of microelectronics, where precise plasma processing is essential for manufacturing high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be similar vacuum chamber systems used in semiconductor fabrication processes.
Unanswered Questions
How does this technology impact the overall efficiency of plasma processing operations?
This article does not provide specific data on the efficiency improvements brought about by this technology. Further research or testing may be needed to quantify the impact on efficiency.
What are the maintenance requirements for the opening/closing devices in this process chamber?
The article does not detail the maintenance schedule or procedures for the opening/closing devices. Understanding the maintenance requirements is crucial for ensuring the long-term reliability of the system.
Original Abstract Submitted
a process chamber includes a housing providing a process space where plasma processing is performed, a first opening/closing device in a side wall of the housing, the first opening/closing device including a first frame and at least one opening/closing blade connected to the first frame, and a second opening/closing device on an outside of the side wall of the housing and on a same line as the first opening/closing device, the second opening/closing device including a second frame and an opening/closing door structure connected to the second frame, wherein the first opening/closing device and the second opening/closing device are configured to maintain a vacuum state of the process space.
