Samsung electronics co., ltd. (20240160115). OVERLAY CORRECTION METHOD, AND EXPOSURE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING OVERLAY CORRECTION METHOD simplified abstract
Contents
- 1 OVERLAY CORRECTION METHOD, AND EXPOSURE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING OVERLAY CORRECTION METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 OVERLAY CORRECTION METHOD, AND EXPOSURE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING OVERLAY CORRECTION METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
OVERLAY CORRECTION METHOD, AND EXPOSURE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING OVERLAY CORRECTION METHOD
Organization Name
Inventor(s)
Seungyoon Lee of Suwon-si (KR)
OVERLAY CORRECTION METHOD, AND EXPOSURE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING OVERLAY CORRECTION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240160115 titled 'OVERLAY CORRECTION METHOD, AND EXPOSURE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING OVERLAY CORRECTION METHOD
Simplified Explanation
The abstract describes an overlay correction method for correcting overlay due to degradation of a wafer table, along with an exposure method and a semiconductor device manufacturing method that include the overlay correction method. The method involves acquiring leveling data, converting it into overlay data, splitting shots into sub-shots, extracting a model for each sub-shot, and correcting overlay parameters of exposure equipment in real-time based on the models.
- Acquiring leveling data regarding a wafer
- Converting leveling data into overlay data
- Splitting shots into sub-shots via shot size split
- Extracting a model for each sub-shot from overlay data
- Correcting overlay parameters of exposure equipment in real-time based on the models
Potential Applications
The technology can be applied in semiconductor manufacturing processes to improve overlay accuracy and quality control.
Problems Solved
1. Correcting overlay due to degradation of a wafer table 2. Real-time correction of overlay parameters in the exposure process
Benefits
1. Improved overlay accuracy 2. Enhanced quality control in semiconductor device manufacturing
Potential Commercial Applications
Optimizing overlay correction methods in semiconductor manufacturing processes for increased efficiency and accuracy.
Possible Prior Art
Prior art in overlay correction methods in semiconductor manufacturing processes may include methods that involve data analysis and correction algorithms to improve overlay accuracy.
Unanswered Questions
How does the method handle variations in wafer size or shape?
The abstract does not provide information on how the method adjusts for variations in wafer size or shape during the overlay correction process.
What is the impact of the real-time correction on overall production time?
The abstract does not address how the real-time correction of overlay parameters affects the overall production time of semiconductor devices.
Original Abstract Submitted
provided are an overlay correction method for effectively correcting an overlay due to degradation of a wafer table, and an exposure method and a semiconductor device manufacturing method, which include the overlay correction method, wherein the overlay correction method includes acquiring leveling data regarding a wafer, converting the leveling data into overlay data, splitting a shot into sub-shots via shot size split, extracting a model for each sub-shot from the overlay data, and correcting an overlay parameter of exposure equipment on the basis of the model for each sub-shot, wherein the correction of the overlay parameter is applied in real time to an exposure process for the wafer in a feedforward method.
