Samsung electronics co., ltd. (20240157502). CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS simplified abstract
Contents
- 1 CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
Organization Name
Inventor(s)
DONGHOON Kwon of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240157502 titled 'CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
Simplified Explanation
The patent application relates to a chemical mechanical polishing apparatus with a unique design for polishing wafers using a slurry containing a photocatalyst and light irradiation.
- Polishing platen with an opening
- Polishing pad with a transmissive part overlapping the opening
- Slurry supply delivering a slurry with a photocatalyst to the polishing pad
- Head part for mounting a wafer
- Light irradiation part positioned within the opening of the polishing platen
Potential Applications
The technology can be applied in semiconductor manufacturing for polishing wafers with improved efficiency and precision.
Problems Solved
1. Enhanced polishing performance with the use of a photocatalyst in the slurry. 2. Improved control and monitoring of the polishing process with light irradiation.
Benefits
1. Increased productivity in wafer polishing operations. 2. Better quality control and consistency in the polishing results.
Potential Commercial Applications
Optimizing Wafer Polishing Efficiency with Photocatalyst Slurry and Light Irradiation
Possible Prior Art
There may be prior art related to chemical mechanical polishing apparatus with different configurations or materials used in the polishing process.
Unanswered Questions
How does the photocatalyst in the slurry affect the polishing process?
The article does not provide specific details on the mechanism behind the photocatalyst's role in enhancing the polishing performance.
What are the specific parameters for the light irradiation part within the opening of the polishing platen?
The article does not mention the exact specifications or requirements for the light irradiation part used in the apparatus.
Original Abstract Submitted
this disclosure relates to a chemical mechanical polishing apparatus, and may include: a polishing platen including an opening; a polishing pad positioned on the polishing platen and including a transmissive part overlapping the opening; a slurry supply supplying a slurry including a photocatalyst to the polishing pad; a head part positioned on the polishing pad and capable of mounting a wafer; and a light irradiation part positioned within the opening of the polishing platen.
