Samsung electronics co., ltd. (20240128354). SEMICONDUCTOR DEVICES simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Jaehyoung Lim of Suwon-si (KR)
SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128354 titled 'SEMICONDUCTOR DEVICES
Simplified Explanation
The method of manufacturing a semiconductor device involves forming an alignment key through a portion of a substrate, removing a portion of the substrate to expose the alignment key, and forming a contact plug and a power rail for electrical connections.
- Formation of an alignment key through a portion of the substrate
- Transistor formation on the second surface of the substrate
- Removal of a portion of the substrate to expose the alignment key
- Formation of a contact plug for electrical connection to the source/drain layer
- Formation of a power rail on the first surface of the substrate for electrical connection
Potential Applications
The technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, microprocessors, and memory chips.
Problems Solved
1. Precise alignment during the manufacturing process 2. Efficient electrical connections within the semiconductor device
Benefits
1. Improved accuracy and reliability in semiconductor device manufacturing 2. Enhanced performance of the semiconductor device 3. Cost-effective production process
Potential Commercial Applications
Optimizing Semiconductor Device Manufacturing Process for Enhanced Performance
Possible Prior Art
There may be prior art related to alignment key formation and electrical connections in semiconductor devices, but specific examples are not provided in this context.
Unanswered Questions
How does this technology impact the overall efficiency of semiconductor device manufacturing processes?
The technology improves the accuracy and reliability of alignment during manufacturing, leading to more efficient production processes and higher quality semiconductor devices.
What are the potential cost savings associated with implementing this technology in semiconductor device manufacturing?
By enhancing the precision of alignment and electrical connections, the technology can reduce manufacturing errors and improve overall yield, resulting in cost savings for semiconductor manufacturers.
Original Abstract Submitted
in a method of manufacturing a semiconductor device, an alignment key is formed through a portion of a substrate including first and second surfaces opposite to each other, which is adjacent to the second surface of the substrate. a transistor including a gate structure and a source/drain layer is formed on the second surface of the substrate. a portion of the substrate adjacent to the first surface of the substrate is removed to expose the alignment key. a contact plug is formed through a portion of the substrate adjacent to the first surface of the substrate to be electrically connected to the source/drain layer. a power rail is formed on the first surface of the substrate to be electrically connected to the contact plug.
