Samsung electronics co., ltd. (20240128174). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128174 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a redistribution substrate with redistribution layers, a semiconductor chip connected to the redistribution layers, an upper encapsulant encapsulating the semiconductor chip, a passive component connected to the redistribution layer on the lower surface of the substrate, a lower encapsulant encapsulating the passive component, and bumps protruding downwardly from the lower surface of the substrate.
- Semiconductor package with redistribution substrate, semiconductor chip, upper encapsulant, passive component, lower encapsulant, and bumps
- Redistribution substrate with redistribution layers
- Semiconductor chip connected to redistribution layers
- Upper encapsulant encapsulating semiconductor chip
- Passive component connected to redistribution layer on lower surface
- Lower encapsulant encapsulating passive component
- Bumps protruding downwardly from lower surface
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Advanced electronic devices
- Semiconductor packaging industry
- Microelectronics
Problems Solved
This technology helps solve the following problems:
- Improved electrical connections
- Enhanced reliability of semiconductor packages
- Efficient heat dissipation
Benefits
The benefits of this technology include:
- Higher performance of electronic devices
- Increased durability of semiconductor packages
- Better overall functionality
Potential Commercial Applications
The potential commercial applications of this technology could include:
- Consumer electronics
- Automotive electronics
- Aerospace industry
Possible Prior Art
One possible prior art for this technology could be the use of redistribution substrates in semiconductor packaging to improve electrical connections and heat dissipation.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What are the specific materials used in the bumps for this semiconductor package?
The article does not specify the materials used in the bumps for this semiconductor package.
Original Abstract Submitted
a semiconductor package is provided including: a redistribution substrate having an upper surface and a lower surface, opposite to each other, and including redistribution layers; a semiconductor chip disposed on the upper surface of the redistribution substrate and electrically connected to the redistribution layers; an upper encapsulant encapsulating at least a portion of the semiconductor chip and disposed on the upper surface of the redistribution substrate; a passive component disposed on the lower surface of the redistribution substrate and electrically connected to the redistribution layer; a lower encapsulant encapsulating at least a portion of the passive component and disposed on the lower surface of the redistribution substrate, and having a plurality of openings exposing lowermost redistribution layers among the redistribution layers; and a plurality of bumps respectively disposed within the plurality of openings, the bumps respectively including a first portion in contact with the lowermost redistribution layers and a second portion extending from the first portion and protruding partially downwardly of the plurality of openings.
