Samsung electronics co., ltd. (20240128171). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128171 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
Simplified Explanation
The method described in the patent application involves manufacturing a semiconductor package by applying a cutter to separate a main portion of a second metal layer from an edge portion surrounding it, peeling the edge portion of the second metal layer, adding a cover insulating layer on top of the main portion, and placing a semiconductor chip on the cover insulating layer.
- Applying a cutter to separate the main portion of the second metal layer from the edge portion.
- Peeling the edge portion of the second metal layer from the first metal layer.
- Forming a cover insulating layer on top of the main portion of the second metal layer.
- Placing a semiconductor chip on top of the cover insulating layer.
Potential Applications
This technology could be used in the manufacturing of various semiconductor packages for electronic devices.
Problems Solved
This method helps in efficiently separating and insulating different layers in a semiconductor package, ensuring proper functionality and reliability.
Benefits
- Improved manufacturing process for semiconductor packages - Enhanced performance and reliability of electronic devices - Cost-effective production method
Potential Commercial Applications
The technology can be applied in the production of smartphones, tablets, computers, and other electronic devices.
Possible Prior Art
Prior methods of manufacturing semiconductor packages may have involved more complex and time-consuming processes for separating and insulating metal layers.
Unanswered Questions
How does this method compare to traditional methods in terms of cost and efficiency?
The article does not provide a direct comparison between this method and traditional manufacturing processes.
Are there any limitations or specific requirements for implementing this method in semiconductor package production?
The article does not mention any potential limitations or specific conditions for using this manufacturing technique.
Original Abstract Submitted
a method of manufacturing a semiconductor package includes applying a cutter to a boundary between a main portion of a second metal layer and an edge portion of the second metal layer that surrounds the main portion, the second metal layer being on an upper surface of a first metal layer disposed on an upper surface of a carrier substrate, peeling the edge portion of the second metal layer from the first metal layer, forming a cover insulating layer on an upper surface of the main portion of the second metal layer, and disposing a semiconductor chip on an upper surface of the cover insulating layer.
