Samsung electronics co., ltd. (20240128171). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract

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METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Junwoo Myung of Suwon-si (KR)

Gun Lee of Suwon-si (KR)

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128171 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

Simplified Explanation

The method described in the patent application involves manufacturing a semiconductor package by applying a cutter to separate a main portion of a second metal layer from an edge portion surrounding it, peeling the edge portion of the second metal layer, adding a cover insulating layer on top of the main portion, and placing a semiconductor chip on the cover insulating layer.

  • Applying a cutter to separate the main portion of the second metal layer from the edge portion.
  • Peeling the edge portion of the second metal layer from the first metal layer.
  • Forming a cover insulating layer on top of the main portion of the second metal layer.
  • Placing a semiconductor chip on top of the cover insulating layer.

Potential Applications

This technology could be used in the manufacturing of various semiconductor packages for electronic devices.

Problems Solved

This method helps in efficiently separating and insulating different layers in a semiconductor package, ensuring proper functionality and reliability.

Benefits

- Improved manufacturing process for semiconductor packages - Enhanced performance and reliability of electronic devices - Cost-effective production method

Potential Commercial Applications

The technology can be applied in the production of smartphones, tablets, computers, and other electronic devices.

Possible Prior Art

Prior methods of manufacturing semiconductor packages may have involved more complex and time-consuming processes for separating and insulating metal layers.

Unanswered Questions

How does this method compare to traditional methods in terms of cost and efficiency?

The article does not provide a direct comparison between this method and traditional manufacturing processes.

Are there any limitations or specific requirements for implementing this method in semiconductor package production?

The article does not mention any potential limitations or specific conditions for using this manufacturing technique.


Original Abstract Submitted

a method of manufacturing a semiconductor package includes applying a cutter to a boundary between a main portion of a second metal layer and an edge portion of the second metal layer that surrounds the main portion, the second metal layer being on an upper surface of a first metal layer disposed on an upper surface of a carrier substrate, peeling the edge portion of the second metal layer from the first metal layer, forming a cover insulating layer on an upper surface of the main portion of the second metal layer, and disposing a semiconductor chip on an upper surface of the cover insulating layer.