Samsung electronics co., ltd. (20240120299). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120299 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor structure with a lower through structure, a connection structure, and a second semiconductor structure with an upper through structure. The connection structure consists of lower and upper curved pads, with the upper curved pad connected to the upper through structure.
- Lower through structure penetrating the first semiconductor substrate
- Connection structure with lower and upper curved pads
- Second semiconductor structure with upper through structure
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor packaging
- Integrated circuits
- Electronics manufacturing
Problems Solved
This technology helps address the following issues:
- Improving connectivity in semiconductor packages
- Enhancing the structural integrity of semiconductor devices
- Facilitating the assembly process of electronic components
Benefits
The benefits of this technology include:
- Increased reliability of semiconductor packages
- Improved performance of electronic devices
- Simplified manufacturing processes
Potential Commercial Applications
A potential commercial application for this technology could be in the field of:
- Semiconductor packaging solutions for consumer electronics
Possible Prior Art
One possible prior art for this technology could be the use of curved pads in semiconductor packaging to improve connectivity and structural integrity.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison with existing semiconductor packaging methods.
What are the specific dimensions and materials used in the construction of the semiconductor package?
The article does not provide detailed information on the specific dimensions and materials used in the construction of the semiconductor package.
Original Abstract Submitted
a semiconductor package includes a first semiconductor structure including a first semiconductor substrate and a lower through structure that penetrates the first semiconductor substrate, a connection structure on the first semiconductor structure and a second semiconductor structure on the connection structure, the second semiconductor structure including a second semiconductor substrate and an upper through structure that penetrates the second semiconductor substrate, where the connection structure includes a lower curved pad on the lower through structure, and an upper curved pad on the lower curved pad, where a top surface of the lower curved pad includes a curved surface, where a bottom surface of the upper curved pad includes a curved surface, and where the upper curved pad is connected to the upper through structure.
