Samsung electronics co., ltd. (20240107726). ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD simplified abstract
Contents
- 1 ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107726 titled 'ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD
Simplified Explanation
The example electronic device described in the abstract includes an interposer surrounding some circuit components on a printed circuit board, with through holes for electrical connections and conductive regions for grounding.
- The electronic device includes a printed circuit board with circuit components and an interposer surrounding some components.
- The interposer has through holes for electrical connections and conductive regions for grounding.
- The outer surface of the interposer has a conductive region connected to the printed circuit board's ground, while the inner surface has a conductive region connected to the circuit components.
Potential Applications
This technology could be applied in various electronic devices where precise electrical connections and grounding are required, such as smartphones, tablets, and laptops.
Problems Solved
This technology helps in improving the electrical connections and grounding in electronic devices, reducing interference and improving overall performance.
Benefits
The benefits of this technology include enhanced electrical connectivity, improved grounding, and potentially better overall performance of electronic devices.
Potential Commercial Applications
This technology could be utilized by electronics manufacturers to enhance the quality and performance of their products, potentially leading to increased customer satisfaction and market competitiveness.
Possible Prior Art
One possible prior art for this technology could be the use of interposers in electronic devices for improved electrical connections and grounding.
Unanswered Questions
How does this technology impact the overall size of the electronic device?
This article does not address how the addition of the interposer and through holes may impact the size and form factor of the electronic device.
What materials are typically used for the interposer in electronic devices?
The article does not specify the materials commonly used for the interposer in electronic devices.
Original Abstract Submitted
an example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. the interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. the outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
