Samsung electronics co., ltd. (20240105657). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yongsung Park of Suwon-si (KR)
Jongbeom Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105657 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a first substrate with a first bonding pad, a solder ball on the first bonding pad, and a blocking layer on the solder ball. The thickness of the blocking layer varies in a direction away from the first substrate.
- The semiconductor package includes a first substrate, which is the base material for the package.
- A first bonding pad is located on the first substrate, providing a connection point for other components.
- A solder ball is placed on the first bonding pad, allowing for electrical connections.
- A blocking layer is applied on the solder ball, with a thickness that changes as it moves away from the first substrate.
Potential Applications
The technology described in the patent application could be used in:
- Semiconductor manufacturing
- Electronics packaging
- Integrated circuit production
Problems Solved
This technology helps address issues such as:
- Ensuring proper electrical connections
- Preventing short circuits
- Improving the reliability of semiconductor packages
Benefits
The benefits of this technology include:
- Enhanced performance of semiconductor devices
- Increased durability of electronic components
- Improved overall quality of semiconductor packages
Potential Commercial Applications
With its innovative design, this technology could be applied in various commercial sectors, including:
- Consumer electronics
- Automotive industry
- Telecommunications
Possible Prior Art
One possible prior art related to this technology is the use of different materials for blocking layers in semiconductor packages.
Unanswered Questions
How does the thickness variation of the blocking layer impact the overall performance of the semiconductor package?
The thickness variation of the blocking layer could affect the electrical conductivity and heat dissipation of the package.
Are there any specific manufacturing processes required to implement the varying thickness of the blocking layer?
Manufacturing processes such as deposition techniques or etching methods may be needed to achieve the desired thickness variation in the blocking layer.
Original Abstract Submitted
a semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from the first substrate.
