Samsung electronics co., ltd. (20240104287). LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract
Contents
- 1 LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
Organization Name
Inventor(s)
LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240104287 titled 'LAYOUT DESIGN METHOD AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
Simplified Explanation
The patent application describes a method for designing a layout of an integrated circuit device, which includes designing a preliminary layout with a source/drain contact pattern, designing a first layout with a cut pattern for cutting the source/drain contact pattern, designing a second layout by excluding a pattern overlapping the first layout from the preliminary layout, and correcting the preliminary layout by reflecting an etch skew based on parameters of the second layout.
- Designing a preliminary layout with a source/drain contact pattern
- Designing a first layout with a cut pattern for cutting the source/drain contact pattern
- Designing a second layout by excluding overlapping patterns from the first layout
- Correcting the preliminary layout based on parameters of the second layout
Potential Applications
The technology described in the patent application could be applied in the semiconductor industry for designing integrated circuit devices with improved layout efficiency and accuracy.
Problems Solved
This technology solves the problem of designing complex layouts for integrated circuit devices by providing a method to optimize the layout design process and correct any errors that may occur during the design phase.
Benefits
The benefits of this technology include increased efficiency in layout design, improved accuracy in pattern placement, and overall better performance of integrated circuit devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor manufacturing industry, where companies can utilize this method to design and produce advanced integrated circuit devices with higher precision and reliability.
Possible Prior Art
One possible prior art in this field could be existing layout design methods for integrated circuit devices that may not include the specific steps outlined in this patent application.
Unanswered Questions
How does this method compare to existing layout design techniques in terms of efficiency and accuracy?
This article does not provide a direct comparison between this method and existing techniques in the field.
What are the specific parameters used to reflect the etch skew in the correction process of the preliminary layout?
The article does not detail the specific parameters that are used to reflect the etch skew in the correction process.
Original Abstract Submitted
provided is a layout design method including designing a preliminary layout including a source/drain contact pattern of an integrated circuit device, designing a first layout including a cut pattern for cutting the source/drain contact pattern, designing a second layout configured by excluding a pattern overlapping the pattern of the first layout from the preliminary layout, and correcting the preliminary layout by reflecting an etch skew based on at least one parameter of the second layout.
