Samsung electro-mechanics co., ltd. (20240215165). PRINTED CIRCUIT BOARD simplified abstract

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PRINTED CIRCUIT BOARD

Organization Name

samsung electro-mechanics co., ltd.

Inventor(s)

Myong Keun Jung of Suwon-si (KR)

Hyun Woo Kwon of Suwon-si (KR)

PRINTED CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240215165 titled 'PRINTED CIRCUIT BOARD

The abstract describes a patent application for a printed circuit board consisting of two board units with different wiring densities and metal layer structures.

  • The first board unit has a first insulating layer with a via hole, a wiring layer, and a metal layer filling the via hole.
  • The second board unit has a second insulating layer with a via hole, a wiring layer with higher density than the first, and a metal layer with a different plating structure.
  • The second board unit is placed on top of the first board unit, creating a more complex circuit design.

Potential Applications: - Electronics manufacturing - Communication systems - Automotive industry

Problems Solved: - Increased wiring density - Enhanced circuit performance - Improved signal transmission

Benefits: - Higher efficiency in electronic devices - Better signal integrity - Enhanced overall performance

Commercial Applications: - PCB manufacturing companies - Electronics design firms - Telecommunications industry

Questions about the technology: 1. How does the different plating structure of the metal layers affect the overall performance of the circuit board? 2. What are the specific advantages of having a higher wiring density in the second board unit compared to the first?


Original Abstract Submitted

a printed circuit board includes: a first board unit including a first insulating layer having a first via hole, a first wiring layer disposed on or in the first insulating layer, and a first via including a first metal layer substantially filling the first via hole; and a second board unit including a second insulating layer having a second via hole, a second wiring layer disposed on or in the second insulating layer, and a second via including a second metal layer substantially filling the second via hole. the second board unit is disposed on the first board unit, the second wiring layer has a higher wiring density than that of the first wiring layer, and the second metal layer has a plating structure different from that of the first metal layer.

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