Samsung electro-mechanics co., ltd. (20240215159). CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240215159 titled 'CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
The circuit board described in the abstract includes a first insulating layer without a reinforcing material, a conductive pad protruding above the layer, and a second insulating layer with a reinforcing material below the first layer. The corner of the conductive pad has a curved shape.
- The circuit board features a unique design with a conductive pad that protrudes above the insulating layer.
- The first insulating layer lacks a reinforcing material, while the second insulating layer includes one for added strength.
- The curved shape of the conductive pad's corner sets this circuit board apart from traditional designs.
- This innovation may improve the durability and performance of electronic devices.
- The circuit board design could potentially enhance signal transmission and reduce interference in electronic systems.
Potential Applications: - Consumer electronics - Telecommunications equipment - Industrial machinery
Problems Solved: - Enhanced durability and strength in circuit board design - Improved signal transmission and reduced interference
Benefits: - Increased reliability of electronic devices - Enhanced performance in signal transmission - Potential cost savings in manufacturing processes
Commercial Applications: Title: Innovative Circuit Board Design for Enhanced Performance This technology could be utilized in various industries such as consumer electronics, telecommunications, and industrial machinery. The improved durability and signal transmission capabilities could lead to more reliable and efficient electronic devices.
Questions about the technology: 1. How does the absence of a reinforcing material in the first insulating layer impact the overall strength of the circuit board? 2. What specific advantages does the curved shape of the conductive pad's corner offer in terms of performance and signal transmission?
Original Abstract Submitted
a circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer, and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. a corner of the conductive pad has a curved shape.
