Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract
Contents
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213204 titled 'CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
The circuit board described in the abstract includes a first insulating layer without a reinforcing material, a conductive pad protruding above the layer, a dam protruding from the layer's surface outside the pad's region, and a second insulating layer below the first layer with a reinforcing material.
- First insulating layer without reinforcing material
- Conductive pad protruding above the layer
- Dam protruding from the layer's surface outside the pad's region
- Second insulating layer below the first layer with a reinforcing material
- Dam height higher than the conductive pad
Potential Applications: - Electronics manufacturing - Circuit board design - Semiconductor industry
Problems Solved: - Enhanced circuit board durability - Improved signal transmission - Increased reliability in electronic devices
Benefits: - Stronger circuit boards - Better performance in electronic devices - Longer lifespan of electronic components
Commercial Applications: Title: Advanced Circuit Board Technology for Enhanced Electronics This technology can be used in various industries such as consumer electronics, telecommunications, and automotive for improved product performance and reliability.
Questions about the technology: 1. How does the absence of a reinforcing material in the first insulating layer impact the overall durability of the circuit board? 2. What are the specific advantages of having a dam protruding from the surface of the insulating layer in terms of signal transmission and reliability?
Original Abstract Submitted
a circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer; a dam that protrudes from the surface of the first insulating layer and is disposed outside a region where the conductive pad is disposed on a plane; and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. a height of the dam based on the surface of the first insulating layer is higher than a height of the conductive pad.
