Samsung electro-mechanics co., ltd. (20240212940). MULTILAYER ELECTRONIC COMPONENT simplified abstract
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
Byung Jun Jeon of Suwon-si (KR)
Chae Min Park of Suwon-si (KR)
Hyung Duk Yun of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240212940 titled 'MULTILAYER ELECTRONIC COMPONENT
The abstract describes a multilayer electronic component with external electrodes connected to internal electrodes through base plating layers and electrode layers made of conductive metal and glass. The base plating layers contain nickel grains of a certain size in a specific region.
- The electronic component has a multilayer structure with external electrodes connected to internal electrodes.
- The base plating layers on the external electrodes contain nickel grains of a certain size in a specific region.
- The electrode layers are made of conductive metal and glass, providing electrical conductivity.
- The specific grain size and distribution in the base plating layers contribute to the component's performance and reliability.
- The technology aims to improve the functionality and durability of electronic components.
Potential Applications: - Consumer electronics - Automotive electronics - Industrial automation
Problems Solved: - Enhanced electrical conductivity - Improved component reliability - Increased durability under various operating conditions
Benefits: - Higher performance electronic components - Longer lifespan of electronic devices - Improved overall product quality
Commercial Applications: Title: Advanced Multilayer Electronic Components for Enhanced Performance This technology can be utilized in various industries such as consumer electronics, automotive, and industrial automation for the development of high-performance electronic devices with improved reliability and durability.
Questions about the technology: 1. How does the specific grain size and distribution in the base plating layers impact the performance of the electronic component? 2. What are the potential challenges in manufacturing electronic components with such intricate multilayer structures?
Frequently Updated Research: There is ongoing research in the field of advanced materials and manufacturing techniques for electronic components to further enhance their performance and reliability. Stay updated on the latest developments in multilayer electronic components for cutting-edge technology applications.
Original Abstract Submitted
a multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 �m�5 �m region selected from a cross-section of the first base plating layer in the first and second directions includes three or more ni grains having a grain size of 4 �m or greater.
