Samsung display co., ltd. (20240282717). CHIP ON FILM PACKAGE simplified abstract
Contents
CHIP ON FILM PACKAGE
Organization Name
Inventor(s)
CHIP ON FILM PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282717 titled 'CHIP ON FILM PACKAGE
The abstract describes a chip on film package that includes a base substrate with a driving chip area, output lines, and an adhesive member.
- Base substrate with driving chip area and output lines
- Adhesive member overlapping driving chip area
- Driving chip disposed on base substrate
- Output lines electrically connected to driving chip
- First areas covering ends of driving chip area
- Second area covering second side of driving chip area
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics for displays and control systems.
Problems Solved: - Provides a compact and efficient packaging solution for driving chips. - Ensures secure electrical connections and protection for the driving chip.
Benefits: - Improved reliability and performance of electronic devices. - Cost-effective packaging solution for driving chips. - Enhanced durability and longevity of the driving chip.
Commercial Applications: Title: Innovative Chip on Film Package for Electronic Devices This technology can be utilized in the consumer electronics industry for manufacturing compact and reliable electronic devices. It can also benefit the automotive sector by providing efficient packaging solutions for various electronic components.
Questions about Chip on Film Package: 1. How does the adhesive member enhance the performance of the driving chip package?
The adhesive member ensures secure attachment and protection for the driving chip, improving its reliability and longevity.
2. What are the key advantages of using a chip on film package in electronic devices?
Chip on film packages offer a compact and efficient solution for integrating driving chips, leading to improved performance and durability in electronic devices.
Original Abstract Submitted
a chip on film package includes a base substrate including a driving chip area including a first side and a second side facing the first side, first areas covering ends of the first side of the driving chip area and including first bent portions, and a second area covering the second side of the driving chip area, a driving chip disposed on a first surface of the base substrate in the driving chip area, output lines electrically connected to the driving chip and disposed on the first surface of the base substrate in the first areas and the second area, and an adhesive member disposed on the base substrate and overlapping an entirety of the first areas and an entirety of the driving chip area in a plan view.
