Samsung display co., ltd. (20240258088). SPUTTERING APPARATUS simplified abstract
Contents
SPUTTERING APPARATUS
Organization Name
Inventor(s)
HYUN-WOO Kim of Cheonan-si (KR)
SANGMOK Nam of Seongnam-si (KR)
JONGHO Hyun of Cheonan-si (KR)
NAM-JIN Hyung of Cheonan-si (KR)
SPUTTERING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258088 titled 'SPUTTERING APPARATUS
The sputtering apparatus described in the abstract includes a magnet module with a reciprocating magnet unit, a first shielding member attached to the magnet unit, a protective sheet between the back plate and the magnet module, and a second shielding member fixed between the back plate and the magnet module.
- Magnet module with reciprocating magnet unit
- First shielding member attached to the magnet unit
- Protective sheet between back plate and magnet module
- Second shielding member fixed between back plate and magnet module
Potential Applications: - Thin film deposition in semiconductor manufacturing - Coating processes in the automotive industry - Solar panel production
Problems Solved: - Minimizing contamination during sputtering process - Enhancing efficiency of thin film deposition - Improving overall quality of coated products
Benefits: - Increased productivity in manufacturing processes - Enhanced product performance and durability - Reduced maintenance and cleaning requirements
Commercial Applications: Title: Advanced Sputtering Apparatus for Precision Coating This technology can be utilized in industries such as semiconductor manufacturing, automotive, and renewable energy for precise and efficient thin film deposition and coating processes. The market implications include improved product quality, reduced production costs, and increased competitiveness in the global market.
Questions about Sputtering Apparatus: 1. How does the magnet module contribute to the sputtering process? 2. What are the advantages of using a protective sheet in the apparatus?
Frequently Updated Research: Researchers are constantly exploring new materials and methods to enhance the efficiency and precision of sputtering processes in various industries. Stay updated on the latest advancements in thin film deposition technology for potential improvements in product quality and manufacturing efficiency.
Original Abstract Submitted
a sputtering apparatus includes a back plate supporting a sputtering target, a magnet module disposed under the back plate and including a magnet unit reciprocating in a first direction, a first shielding member attached on a portion of the magnet unit, moving together with the magnet unit, and covering at least a portion of the magnet unit, a protective sheet disposed between the back plate and the magnet module, and a second shielding member disposed between the back plate and the magnet module, and having a fixed position.
