Samsung display co., ltd. (20240188405). BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME simplified abstract
Contents
- 1 BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 What are some questions (generic, that could be applied to other similar articles) that are not answered by this article?
- 1.11 Do you know of any Frequently Updated Research on this?
- 1.12 Original Abstract Submitted
BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
Organization Name
Inventor(s)
JEONG-SEOP Choi of Cheonan-si (KR)
BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240188405 titled 'BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
Simplified Explanation
The bonding device described in the patent application includes a support with through-holes, a diaphragm covering the support, a pressing pad on top of the support, and a window fixing chuck with a groove facing the pressing pad. The pressing pad consists of a pad and at least one support bar extending in a first direction.
- Support with through-holes
- Diaphragm covering the support
- Pressing pad on top of the support
- Window fixing chuck with a groove facing the pressing pad
- Pressing pad includes a pad and at least one support bar
Potential Applications
The technology described in this patent application could be applied in the manufacturing industry for bonding various materials together, such as in the production of electronic components or medical devices.
Problems Solved
This technology solves the problem of securely bonding materials together with precision and control, ensuring a strong and reliable bond between different components.
Benefits
The benefits of this technology include improved bonding efficiency, accuracy, and consistency, leading to higher quality products with enhanced performance and durability.
Potential Commercial Applications
The potential commercial applications of this technology include the production of electronic devices, medical equipment, aerospace components, and automotive parts where precise bonding is essential for product functionality and reliability.
Possible Prior Art
One possible prior art for this technology could be similar bonding devices used in the semiconductor industry for assembling microchips and electronic circuits.
What are some questions (generic, that could be applied to other similar articles) that are not answered by this article?
How does this bonding device compare to existing bonding technologies in terms of efficiency and cost-effectiveness?
The efficiency and cost-effectiveness of this bonding device compared to existing technologies are not addressed in the article.
Are there any limitations or constraints in the application of this bonding device to specific industries or materials?
The limitations or constraints in the application of this bonding device to specific industries or materials are not discussed in the article.
Do you know of any Frequently Updated Research on this?
Currently, there is no information available on frequently updated research related to this specific bonding device.
Original Abstract Submitted
a bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.
