Samsung display co., ltd. (20240183029). DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME simplified abstract
Contents
- 1 DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME
Organization Name
Inventor(s)
HYUNEOK Shin of Yongin-si (KR)
JOONYONG Park of Yongin-si (KR)
DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240183029 titled 'DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME
Simplified Explanation
The deposition apparatus described in the abstract includes a chamber with an inner space, a movement device for moving a substrate, and a deposition source that provides the deposition material. The deposition source consists of a first deposition source for a first deposition process and a second deposition source for a second deposition process on the substrate.
- Chamber with inner space
- Movement device for substrate
- Deposition source with first and second deposition processes
Potential Applications
The technology can be used in the semiconductor industry for thin film deposition processes, such as in the manufacturing of integrated circuits.
Problems Solved
The apparatus allows for sequential deposition processes on a moving substrate, enabling more complex layering and material combinations in thin film applications.
Benefits
- Improved control over deposition processes - Enhanced flexibility in material combinations - Higher efficiency in thin film manufacturing
Potential Commercial Applications
"Sequential Deposition Apparatus for Thin Film Manufacturing"
Possible Prior Art
There may be prior art related to similar deposition apparatus used in thin film deposition processes in the semiconductor industry.
What are the limitations of the deposition apparatus described in the patent application?
The limitations of the deposition apparatus described in the patent application are not clearly outlined. However, potential limitations could include the complexity of coordinating multiple deposition sources and the need for precise control over the movement of the substrate.
How does the deposition apparatus improve upon existing technologies in thin film deposition processes?
The deposition apparatus improves upon existing technologies by allowing for sequential deposition processes on a moving substrate, which enables more complex layering and material combinations. This can result in enhanced performance and efficiency in thin film manufacturing processes.
Original Abstract Submitted
a deposition apparatus includes a chamber in which an inner space is defined, a movement device which moves a substrate to which a deposition material is provided, and a deposition source which is accommodated in the inner space and provides the deposition material. the deposition source includes a first deposition source which performs a first deposition process while the substrate is moved in a first direction by the movement device and a second deposition source which performs a second deposition process on the substrate after the first deposition process.
