Samsung display co., ltd. (20240179942). DISPLAY APPARATUS simplified abstract
Contents
- 1 DISPLAY APPARATUS
DISPLAY APPARATUS
Organization Name
Inventor(s)
Donghwan Shim of Yongin-si (KR)
Taehoon Yang of Yongin-si (KR)
DISPLAY APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240179942 titled 'DISPLAY APPARATUS
Simplified Explanation
The display apparatus described in the patent application includes a substrate with a bent portion, a plurality of display elements, and a thin film encapsulation layer with alternating inorganic and organic thin layers.
- Substrate with display area and peripheral area, including a bent portion
- Plurality of display elements in the display area
- Thin film encapsulation layer with first, second, and organic encapsulation layers
- Second encapsulation layer with alternating inorganic and organic thin layers
Potential Applications
The technology described in this patent application could be used in various display devices such as smartphones, tablets, and televisions.
Problems Solved
This technology helps to protect the display elements from external factors such as moisture, dust, and physical damage, thereby increasing the lifespan of the display apparatus.
Benefits
The use of the thin film encapsulation layer improves the durability and reliability of the display apparatus, leading to better performance and longevity.
Potential Commercial Applications
"Thin Film Encapsulation Technology for Display Devices" could be applied in the manufacturing of consumer electronics, medical devices, and automotive displays.
Possible Prior Art
One possible prior art could be the use of traditional encapsulation methods in display devices, which may not provide the same level of protection and durability as the thin film encapsulation layer described in this patent application.
Unanswered Questions
How does this technology compare to other encapsulation methods currently used in display devices?
The article does not provide a direct comparison between this technology and other encapsulation methods, leaving room for further research and analysis in this area.
What are the potential challenges in implementing this technology on a large scale in manufacturing processes?
The article does not address the potential challenges that manufacturers may face when implementing this technology on a large scale, such as cost, scalability, and compatibility with existing production lines.
Original Abstract Submitted
a display apparatus includes: a substrate including a display area and a peripheral area around the display area, the substrate having a bent portion; a plurality of display elements in the display area; and a thin film encapsulation layer over the plurality of display elements and including a first encapsulation layer, a second encapsulation layer over the first encapsulation layer, and an organic encapsulation layer between the first encapsulation layer and the second encapsulation layer, wherein the second encapsulation layer includes a plurality of inorganic thin layers and a plurality of organic thin layers alternately arranged, and a thickness of the second encapsulation layer is equal to or less than a thickness of the first encapsulation layer.
