Samsung display co., ltd. (20240120311). BONDING APPARATUS simplified abstract
Contents
- 1 BONDING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional bonding methods in terms of efficiency and cost-effectiveness?
- 1.11 What are the potential limitations or challenges in implementing this technology on a large scale in industrial settings?
- 1.12 Original Abstract Submitted
BONDING APPARATUS
Organization Name
Inventor(s)
FUTOSHI Yoshida of Yongin-si (KR)
JONGHYUP Kim of Yongin-si (KR)
JINPYUNG Lee of Yongin-si (KR)
DONGHYUN Han of Yongin-si (KR)
BONDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120311 titled 'BONDING APPARATUS
Simplified Explanation
The bonding apparatus described in the patent application includes a chamber with a light transmission part that transmits light onto a substrate where at least one chip is placed, and a light generation part that irradiates the light. The light transmission part features an absorption prevention layer with through-holes and a light diffusion layer that reduces heat generation and evenly distributes the light onto the substrate.
- Light transmission part with absorption prevention layer and light diffusion layer
- Chamber with light generation part for irradiating light onto substrate with chip
- Through-holes in absorption prevention layer for light transmission
- Light diffusion layer reduces heat generation and ensures uniform light distribution
Potential Applications
The technology described in the patent application could be applied in various industries such as semiconductor manufacturing, electronics assembly, and LED production.
Problems Solved
This technology solves the problem of uneven light distribution and heat generation in bonding processes, leading to improved efficiency and quality in chip bonding applications.
Benefits
The benefits of this technology include enhanced bonding accuracy, reduced heat-related issues, and increased productivity in chip bonding processes.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of electronic devices where precise chip bonding is crucial for performance and reliability.
Possible Prior Art
Prior art in the field of bonding apparatus may include similar devices with light transmission and diffusion components, but the specific design and features described in this patent application may be novel and inventive.
Unanswered Questions
How does this technology compare to traditional bonding methods in terms of efficiency and cost-effectiveness?
This article does not provide a direct comparison between this technology and traditional bonding methods in terms of efficiency and cost-effectiveness.
What are the potential limitations or challenges in implementing this technology on a large scale in industrial settings?
This article does not address the potential limitations or challenges in implementing this technology on a large scale in industrial settings.
Original Abstract Submitted
a bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. the light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.
