Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
Patent Applications by Samsung Electronics Co., Ltd. on October 3rd, 2024
Samsung Electronics Co., Ltd.: 155 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (13), H01L25/065 (11), H04L5/00 (7), H01L29/417 (7), G06F3/06 (7) G06F1/1652 (3), H04W76/19 (2), G10L15/22 (2), H01L25/0652 (2), H01L23/5286 (2)
With keywords such as: device, data, based, circuit, memory, layer, region, including, information, and semiconductor in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Sunghyun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Jihong KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonhee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61L2/10
CPC Code(s): A61L2/10
Abstract: a sterilization module according to an embodiment of the present disclosure may include: an ultraviolet unit including a light source comprising a light emitting element configured to generate ultraviolet rays; a first case including a partition wall surrounding an edge of the ultraviolet unit, the first case covering a rear surface of the ultraviolet unit; a second case covering a front surface of the ultraviolet unit, and including a first support configured to support the ultraviolet unit, a light opening configured to pass ultraviolet rays emitted from the light source, a case coupling portion configured to be coupled to the first case, a sealing portion configured to contact and press the partition wall to seal an area between the first case and the second case; and a protective window arranged on the light opening and supported by the second case.
20240326108. AUTOMATIC CHAMBER CLEANING SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwangjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Kihong PARK of Suwon-si (KR) for samsung electronics co., ltd., Hoseok SONG of Suwon-si (KR) for samsung electronics co., ltd., Shinsang LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyoyong JIN of Suwon-si (KR) for samsung electronics co., ltd., Minwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jihoon CHU of Suwon-si (KR) for samsung electronics co., ltd., Sunyoung HAN of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B08B9/087, A46B13/00, A46B13/02, B08B9/46
CPC Code(s): B08B9/087
Abstract: an automatic chamber cleaning system includes a chamber including an opening in an upper portion, an inner space, and an inner wall, and an automatic chamber cleaning device on the chamber, the automatic chamber cleaning device including roller cleaning devices configured to clean the inner wall of the chamber, a vertical driver configured to move the roller cleaning devices in a vertical direction of the chamber through the opening of the chamber into the inner space of the chamber, a horizontal driver configured to move the roller cleaning devices inside the chamber in a radial direction, and a main rotation driver configured to rotate the roller cleaning devices inside the chamber about a center of the chamber along a rotation direction of the chamber.
Inventor(s): Geunyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Keunseuk OH of Suwon-si (KR) for samsung electronics co., ltd., Yuhwan JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65D5/44
CPC Code(s): B65D5/44
Abstract: a packaging assembly for packaging cookware for an oven having a cooking chamber. the packaging assembly comprises a first packaging material and a second packaging material in contact with the first packaging material where the first packaging material (comprises a first accommodation space which is open toward the second packaging material, and the second packaging material comprises a second accommodation space which is open toward the first packaging material the packaging assembly has an external shape corresponding to the cooking chamber and can be accommodated in the cooking chamber, and the length of the first packaging material along a direction from the surface of the first packaging material where the first packaging material and the second packaging material come into contact with each other is longer than the length of the second packaging material along the direction.
20240327136. APPARATUS FOR TRANSFERRING CARRIERS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minkyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunggyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae Kang of Suwon-si (KR) for samsung electronics co., ltd., Sangmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaesung Byun of Suwon-si (KR) for samsung electronics co., ltd., Yongjun Ahn of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeonghun Lim of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk Chang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65G47/90, H01L21/677, H01L21/687
CPC Code(s): B65G47/90
Abstract: an apparatus includes an elevator, a plurality of storages, a plurality of first robots and a plurality of second robots. the elevator may elevate a vehicle containing a plurality of semiconductor device carriers to position the vehicle at each of a plurality of process floors. at least one of the plurality of storages may be provided at each of the plurality of process floors to store the plurality of semiconductor device carriers. at least one of the plurality of first robots may be provided at each of the plurality of process floors to transfer the vehicle between the elevator and a respective one of the plurality of process floors. at least one of the second robots may be provided at each of the plurality of process floors to transfer at least one of the plurality of semiconductor device carriers between the vehicle and one of the plurality of storages.
20240327168. INTER-FLOOR TRANSPORT SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seunggyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Yong-Jun AHN of Suwon-si (KR) for samsung electronics co., ltd., Min Kyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeonghun LIM of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B66B11/04, B66B9/00, B66B9/04, B66B11/02
CPC Code(s): B66B11/0407
Abstract: an inter-floor transport system includes an aerial vehicle configured to move vertically and horizontally along a passage and a power assembly including a power supply adjacent to the passage and a guide cable extending along the passage and connected to the power supply, where the aerial vehicle is configured to receive power through the guide cable without contacting the guide cable.
Inventor(s): Aram JEON of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jinwon JEON of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07C309/58, C07C309/42, G03F7/004, G03F7/029, G03F7/20
CPC Code(s): C07C309/58
Abstract: provided are an organic salt represented by formula 1, a resist composition including the same, and a method of forming a pattern by using the same:
Inventor(s): Aram JEON of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jinwon JEON of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07C309/58, C07C309/42, G03F7/004, G03F7/029, G03F7/20
CPC Code(s): C07C309/58
Abstract:
ab formula 1
Inventor(s): Aram JEON of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jinwon JEON of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07C309/58, C07C309/42, G03F7/004, G03F7/029, G03F7/20
CPC Code(s): C07C309/58
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract:
m(l)(l) formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract: wherein, mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract: wherein i) xis c(r) and xis c(r), wherein rand rare bonded together to form a group represented by formula 2, ii) xis c(r) and xis c(r), wherein rand rare bonded together to form a group represented by formula 2, or iii) xis c(r) and xis c(r), wherein rand rare bonded together to form a group represented by formula 2; ring cyand ring cyare condensed with each other, and the remaining descriptions of formulae 1a, 1b, and 2 are as provided herein.
Inventor(s): Seulgi LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungil LIM of Suwon-si (KR) for samsung electronics co., ltd., Younghyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/22, B01D46/00, B01D46/42
CPC Code(s): D06F58/22
Abstract: a washing machine is disclosed. the present washing machine comprises: a main body; a tub provided inside the main body; an inflow duct in through which air discharged from the tub flows; a heat exchange duct connected to the inflow duct; a discharge duct for connecting the heat exchange duct and the tub, and discharging, to the tub, the air discharged from the heat exchange duct; and a filter assembly disposed between the inflow duct and the heat exchange duct, wherein the filter assembly includes: a polyhedral filter housing receiving the air from the inflow duct; filters arranged at at least three sides of the filter housing; and a knob member connected to the filter housing, and exposed to the outside of the main body through an opening formed at the front of the main body.
20240328070. CLOTHING CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gihoon KO of Suwon-si (KR) for samsung electronics co., ltd., Jinsook PARK of Suwon-si (KR) for samsung electronics co., ltd., Myunggyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngsun SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F73/02, D06F58/10, D06F58/20
CPC Code(s): D06F73/02
Abstract: a clothes care apparatus includes a main body including a care room to accommodate clothes, a support disposed on a side wall of the care room, and a shelf frame to be detachably supported on the support and including a first side frame and a second side frame to be supported on the support and a plurality of support frames arranged between the first side frame and the second side frame to support items. the shelf frame is supported by the support, and is supported within the care room in response to coupling the shelf frame to one side wall of the care room so that the plurality of support frames is arranged to be spaced apart in an up-down direction.
Inventor(s): Vincenzo CAPUANO of Playa Vista CA (US) for samsung electronics co., ltd.
IPC Code(s): G01C21/16
CPC Code(s): G01C21/1656
Abstract: a method and an apparatus are provided that includes acquiring observations by one or more electro-optical (eo) sensors on a front-facing surface of a user equipment (ue). a processor of the ue extracts feature points from the observations expressed in a first coordinate frame of the ue. the processor matches the feature points to corresponding points of a model in a second coordinate frame of a user of the ue. the processor determines an integrated navigation solution in a third coordinate frame based on the matched feature points.
Inventor(s): Kyungmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinsoo Choi of Suwon-si (KR) for samsung electronics co., ltd., Sungbum Park of Suwon-si (KR) for samsung electronics co., ltd., Sangwook Lee of Suwon-si (KR) for samsung electronics co., ltd., Bohwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01D5/20, G01R19/00, G01R25/00, H05B6/12
CPC Code(s): G01D5/20
Abstract: an induction device includes: a wireless power transmission circuit; a current sensor; and at least one processor connected to the wireless power transmission circuit and the current sensor, wherein the at least one processor is configured to output first power for detecting of an external device through the wireless power transmission circuit, identify a first phase of a first current by measuring the first current flowing through a transmission coil of the wireless power transmission circuit using the current sensor while outputting the first power, in a first state where the external device is not in proximity, identify a phase delay value between the first phase of the first current and a second phase of a second current, and identify a second state where the external device is in proximity when the identified phase delay value is equal to or greater than a designated threshold.
Inventor(s): JIN-HOON JANG of UIWANG-SI (KR) for samsung electronics co., ltd., KYUNGRYUN KIM of SEOUL (KR) for samsung electronics co., ltd., YOUNG JU KIM of SUWON-SI (KR) for samsung electronics co., ltd., SEUNG-JUN LEE of HWASEONG-SI (KR) for samsung electronics co., ltd., YOUNGBIN LEE of SEOUL (KR) for samsung electronics co., ltd., YEONKYU CHOI of SEOUL (KR) for samsung electronics co., ltd.
IPC Code(s): G01N33/574, G01N33/50
CPC Code(s): G01N33/574
Abstract: disclosed is an operating method of a memory device communicating with a memory controller, which includes receiving a first command from the memory controller, the first command indicating initiation of synchronization of a data clock signal and defining a clock section corresponding to the synchronization, preparing a toggling of the data clock signal during a preparation time period, processing a first data stream based on the data clock signal toggling at a reference frequency, and processing a second data stream based on the data clock toggling at the reference frequency and extended for a period of the defined first clock section.
Inventor(s): Guanbo Chen of McKinney TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Hao-Hsuan Chang of Plano TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Songwei Li of McKinney TX (US) for samsung electronics co., ltd., Hoang Viet Nguyen of Frisco TX (US) for samsung electronics co., ltd., Siddharth K. Advani of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S13/56, H04B17/309
CPC Code(s): G01S13/56
Abstract: a method includes obtaining wireless fidelity (wi-fi) based channel state information (csi). the method also includes filtering the csi to remove radio frequency (rf) interference. the method further includes executing a motion detection module that detects for motion in a space based on whether macro-movements are present in the filtered csi, and provides an indication that the space is occupied upon detecting motion in the space. the method also includes, in response to the indication that the space is occupied, executing an occupancy detection module that detects whether the space is still occupied based on whether micro-movements and breath signals are present in the filtered csi, retains the indication that the space is occupied upon detecting that the space is still occupied, and provides an indication that the space is not occupied upon detecting that the space is no longer occupied.
[[20240329419. OPTICAL COMBINER FOR DISPLAYING AUGMENTED REALITY WITH USER'S VISION CORRECTION, METHOD FOR OPERATING THE OPTICAL COMBINER, AUGMENTED REALITY GLASSES FOR DISPLAYING AUGMENTED REALITY WITH USER'S VISION CORRECTION_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Aleksandr Evgenyevich Viacheslavovich ANGERVAKS of St. Petersburg (RU) for samsung electronics co., ltd., Roman Aleksandrovich Aleksandrovich OKUN of St. Petersburg (RU) for samsung electronics co., ltd., Anastasia Sergeevna Germanovich PEREVOZNIKOVA of Izhevsk (RU) for samsung electronics co., ltd., Nikolay Viktorovich MURAVYEV of Moscow (RU) for samsung electronics co., ltd., Gavril Nikolaevich VOSTRIKOV of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): G02B27/42, G02B6/34, G02B27/01
CPC Code(s): G02B27/4205
Abstract: the disclosure relates to augmented reality devices. an optical combiner configured to display augmented reality with user's vision correction is provided. the optical combiner includes a compensator, a waveguide having an in-coupling diffractive optical elements (doe) and an out-coupling doe, and a virtual image projector. the waveguide has a thickness gradient along the first and second side of the waveguide such that with propagation of virtual image-forming rays inside the waveguide from the in-coupling doe to the out-coupling doe, the incidence angle of the rays on walls inside the waveguide increases. the out-coupling doe is placed opposite a user's eye, and is configured to output virtual image-forming rays, incident on the out-coupling doe at an angle equal to or greater than the smallest angle of predetermined angular selectivity range of the out-coupling doe, from the waveguide into the user's eye.
Inventor(s): Minwoo RYU of Suwon-si (KR) for samsung electronics co., ltd., Jinhee KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangsik YOON of Suwon-si (KR) for samsung electronics co., ltd., Donghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/648
CPC Code(s): G05D1/648
Abstract: the present disclosure relates to a robot. the robot according to one embodiment of the present disclosure comprises: a memory for storing at least one program; and a processor for executing instructions stored in the at least one program, wherein the processor can divide a travel map into a plurality of cleaning areas on the basis of one or more boundaries, identify, if at least some of the boundaries are identified as a protrusion, the type of protrusion on the basis of the cleaning progress of one area in which the robot is located from among the plurality of cleaning areas, and control in any one of a plurality of travelling patterns on the basis of the identified type of the protrusion.
Inventor(s): Jeonhoe HEO of Suwon-si (KR) for samsung electronics co., ltd., Jaeseung HONG of Suwon-si (KR) for samsung electronics co., ltd., Dohan LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/163
Abstract: a ring-shaped wearable electronic device may comprise a ring-shaped outer frame including an inner surface. the ring-shaped wearable electronic device may comprise a fixing portion protruding from the inner surface of the outer frame. the ring-shaped wearable electronic device may comprise an inner frame integrally formed on the outer frame to cover the electronic component, the fixing portion, and the inner surface of the outer frame, the inner frame may have a ring-shaped opening configured to receive a finger of a user. the fixing portion may include a plurality of first ribs located to an upper end portion of the outer frame and spaced apart from each other and a plurality of second ribs located to a lower end portion of the outer frame and spaced apart from each other. at least a portion of the electronic component may be disposed between the plurality of ribs so that the at least one electronic component is fixed to the outer frame with the inner frame integrally formed on the outer frame.
Inventor(s): Youngmin JI of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungho AHN of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Sunggwan WOO of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihyung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seongdae CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1652
Abstract: an electronic device include a first housing; a second housing slidable with respect to the first housing along a first direction and a second direction opposite to the first direction; a flexible display in which a display region is expanded as the second housing moves in the first direction, or a display region is reduced as the second housing moves in the second direction; and a support disposed to the second housing to surround a periphery of the flexible display facing the first direction, and wherein the support includes a plurality of supporting protrusions in contact with the periphery of the flexible display, the plurality of supporting protrusions spaced apart from each other on an one surface of the flexible display.
Inventor(s): Yongil KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongsoo SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/041, G06F3/16, H04M1/02
CPC Code(s): G06F1/1652
Abstract: an electronic device may include a housing, a first audio module positioned on a first side surface of the housing and a second audio module positioned on a second side surface of the housing, a display which includes a touch sensor panel, and moves with respect to the housing so at least a part of the display is exposed from the inside of the housing to the front side of the electronic device, and processor operatively connected to the display, wherein the processor is configured to identify whether the display moves by sliding or rolling with respect to the housing to allow at least a part of the display to be exposed, and correct an audio signal with respect to the at least one first audio module and the at least one second audio module corresponding to the display being moved.
Inventor(s): Jungchul AN of Suwon-si (KR) for samsung electronics co., ltd., Jaehwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungki CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04M1/02
CPC Code(s): G06F1/1652
Abstract: an electronic device includes a panel which forms at least a part of a display unit and which is folded along a folding line; a bending unit arranged to be adjacent to the long side of the panel; a film unit which is connected to the bending unit and which includes a display driving circuit; an fpcb which is connected to the film unit and which connects a processor and the display driving circuit; and a protection member arranged on the bending unit so as to cover at least a part of the bending unit, wherein the protection member is adhered onto one surface of the bending unit, at which the bending unit makes contact with a bracket.
Inventor(s): Heebo SHIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jongmin KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jingook KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Suman LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Wonseok RHEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Seongki JEONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Seungwhee CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04M1/02
CPC Code(s): G06F1/1681
Abstract: an electronic device is provided, which includes a hinge structure having a support portion located between the flexible printed circuit board and the flexible display, wherein, in an unfolded state, at least part of the support portion is disposed between the first hinge plate and the second hinge plate, a first bracket coupled to the first housing and rotating as the first housing rotates about a first rotation axis, and a second bracket coupled to the second housing and rotating as the second housing rotates about a second rotation axis, wherein, in the unfolded state of the electronic device, the support portion, the first hinge plate and the second hinge plate support at least one region of the flexible display in a state that the first hinge plate is at least partially supported by a first area of the support portion and the second hinge plate is at least partially supported by a second area of the support portion opposite to the first area, and wherein, in a folded state of the electronic device, the support portion is spaced apart from the first hinge plate and the second hinge plate.
Inventor(s): Sungsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Beomsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggeun AHN of Suwon-si (KR) for samsung electronics co., ltd., Gunhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/0488, G06T11/00
CPC Code(s): G06F3/016
Abstract: according to an embodiment, a wearable device may display, based on contact on a second surface identified using a touch sensor, a visual object indicating a first position of the touch input on the second surface in a screen through a display. the wearable device may identify, in response to the touch input, a second position in the screen of a gaze identified based on an image obtained through a camera exposed outside at a portion of a first surface. the wearable device may provide, in response to the second position identified within a specified distance from the first position of the visual object, feedback with respect to the touch input. the wearable device may cease to provide the feedback in response to the second position identified outside from the first position by the specified distance.
Inventor(s): Ivan France of Saratoga CA (US) for samsung electronics co., ltd., Nigel Clarke of Sunnyvale CA (US) for samsung electronics co., ltd., Curtis Aumiller of San Jose CA (US) for samsung electronics co., ltd., Tara Sriram of Sunnyvale CA (US) for samsung electronics co., ltd., Shafae Ali of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/038, G06F3/0354
CPC Code(s): G06F3/038
Abstract: in one embodiment, an apparatus includes a controller trigger that includes an input surface configured to receive input based on movement of a finger of a user, the trigger having a range of motion along a trigger path. the apparatus further includes a mode selector configured to actuate movement of an intermediate switching component between a discrete-input mode and a variable-input mode. the intermediate switching component includes a moveable arm, and in the discrete input mode the moveable arm occupies at least a portion of the trigger path, thereby limiting the range of motion of the trigger; and in the variable input mode the moveable arm does not occupy the trigger path. the apparatus further includes a switch configured to receive input, in the discrete-input mode, based on a movement of the intermediate switching component, in response to a physical contact by the trigger.
Inventor(s): Hoyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/044
CPC Code(s): G06F3/0416
Abstract: an electronic device and a touch control method therefor are provided. the electronic device includes a housing, a flexible display that is drawn into or out of the housing by a sliding operation, a transparent window disposed in the housing so that a partial region of the flexible display drawn into the housing passes therethrough, and a transparent electrode layer disposed between the transparent window and the flexible display. at least one first touch electrode may be disposed in the transparent electrode layer. the at least one first touch electrode disposed in the transparent electrode layer may be activated. at least one second touch electrode arranged in the partial region of the flexible display may be deactivated.
Inventor(s): Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggeun AHN of Suwon-si (KR) for samsung electronics co., ltd., Gunhee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04815, G02B27/01, G06T19/00, G06V40/20
CPC Code(s): G06F3/04815
Abstract: a wearable device may obtain an image, while a screen is displayed, using a camera. the wearable device may identify a visual object corresponding to an external object from the image. the wearable device may display, at a first location of a portion of the visual object corresponding to a portion of the external object farther than a reference distance from a second surface, a pointer on the screen. the wearable device may recognize the external object contacted on the second surface according to movement from outside the reference distance, as a touch input at a second location identified based on a path of the movement and the first location, and provide feedback with respect to the touch input.
Inventor(s): Seunghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yoonsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonkyu JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0484, G06F3/01, G06F3/16
CPC Code(s): G06F3/0484
Abstract: an electronic device is provided. the electronic device includes a display, memory storing one or more computer programs, and one or more processors communicatively coupled to the display and the memory, wherein the computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to detect a first event while a first screen is displayed through the display, display a first user interface including information related to a first function corresponding to the first event on at least a portion of the first screen through the display based on the detection of the first event, identify a direction of a gaze of a user of the electronic device, while the first user interface is displayed, display a second user interface, based at least in part on the direction of the gaze corresponding to a location where the first user interface is displayed, and determine whether to execute the first function corresponding to the first event, based on a first user input detected while the second user interface is displayed.
Inventor(s): Rowen Alphonso PEREIRA of Bengaluru (IN) for samsung electronics co., ltd., Saugata Das Purkayastha of Bengaluru (IN) for samsung electronics co., ltd., Kumar Abhinav of Bengaluru (IN) for samsung electronics co., ltd., Deepak Kumar Pattnaik of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0611
Abstract: a method performed by a storage device for reducing latency of read operations performed on the storage device, includes: transmitting host memory buffer (hmb) destination information to a host device. the hmb destination information relates to a read destination space reserved within a hmb of the host device. the method also includes receiving a read request from the host device for performing at least one data read operation on a memory of the storage device. the read request specifies data to be read from the memory of the storage device. the method further includes: performing the at least one data read operation on the memory for reading the data specified in the read request and transmitting the data read from the memory to the read destination space reserved within the hmb of the host device.
Inventor(s): Vinay Kumar M N of Bengaluru (IN) for samsung electronics co., ltd., Akhilesh Kumar Jaiswal of Bengaluru (IN) for samsung electronics co., ltd., Puneet Kukreja of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F11/30
CPC Code(s): G06F3/0616
Abstract: the present disclosure provides a method and a flash memory device for detecting temperature in the flash memory device. the method includes receiving an input/output (i/o) request from a host device and determining on-cell count value for a targeted page within an active block of the flash memory device upon receiving the i/o request. the method further includes comparing the on-cell count value of the targeted page, which is within the active block of the flash memory device, with a stored on-cell count data of the flash memory device. additionally, the method includes determining the temperature of the flash memory device corresponding to a stored on-cell count value based on the comparison. a notification signal is transmitted to the host device based on the temperature of the flash memory device and a threshold operating temperature of the flash memory device.
Inventor(s): YooJin Nam of Suwon-si (KR) for samsung electronics co., ltd., Woongdai Kang of Seongnam-si (KR) for samsung electronics co., ltd., Seung-Jun Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Dongyeong Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0632
Abstract: disclosed is an operation method of a memory device which performs a self-refresh operation. the method includes receiving a deep-sleep mode enter command from a memory controller, changing a magnitude of an internal voltage of the memory device from a first voltage to a second voltage smaller than the first voltage, in response to the deep-sleep mode enter command, and entering a self-refresh mode under control of the memory controller, and the internal voltage is maintained at the second voltage during the self-refresh mode.
Inventor(s): Krishna T. Malladi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: a method for in-memory computing. in some embodiments, the method includes: executing, by a first function-in-memory circuit, a first instruction, to produce, as a result, a first value, wherein a first computing task includes a second computing task and a third computing task, the second computing task including the first instruction; storing, by the first function-in-memory circuit, the first value in a first buffer; reading, by a second function-in-memory circuit, the first value from the first buffer; and executing, by a second function-in-memory circuit, a second instruction, the second instruction using the first value as an argument, the third computing task including the second instruction, wherein: the storing, by the first function-in-memory circuit, of the first value in the first buffer includes directly storing the first value in the first buffer.
Inventor(s): Manoj Kumar TANGELLA of Bengaluru (IN) for samsung electronics co., ltd., Rakesh BALAKRISHNAN of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: there is provided a method and memory controller for managing memory operations in storage device. the memory controller receives plurality of requests from a user. the memory controller switches operating mode of storage device dynamically based on time interval between each of the plurality of requests and predefined threshold. the switching comprises notifying first cores to switch second cores from active state to power down state while switching to scaled down mode and restarting second cores while switching to striping ftl mode. thereby, managing memory operations of storage device. thus, the present disclosure manages the memory operations and optimises power consumption of the storage device.
Inventor(s): Daehoon NA of Seoul (KR) for samsung electronics co., ltd., Jeongdon IHM of Seongnam-si (KR) for samsung electronics co., ltd., Jangwoo LEE of Seoul (KR) for samsung electronics co., ltd., Byunghoon JEONG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F1/06, G11C16/04, G11C16/10, G11C16/26, G11C16/32
CPC Code(s): G06F3/0659
Abstract: a memory system includes a memory device including a plurality of non-volatile memories and an interface circuit connected to each of the plurality of non-volatile memories, and a memory controller connected to the interface circuit and configured to transmit/receive data according to a first clock, wherein the interface circuit is configured to divide the first clock into a second clock, according to the number of the plurality of non-volatile memories, and transmit/receive data to/from each of the plurality of non-volatile memories, according to the second clock.
Inventor(s): Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongjin Kwon of Sueon-si (KR) for samsung electronics co., ltd., Myunghoon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Raetae Kim of Suwon-si (KR) for samsung electronics co., ltd., Yangwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Jihea Park of Suwon-si (KR) for samsung electronics co., ltd., Hyunju Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G09G3/00
CPC Code(s): G06F3/1454
Abstract: according to various embodiments, there may be provided an electronic device comprising: a housing, a flexible display having a resizable region visible to an outside of the housing by at least a portion being moved from the inside to the outside of the housing, a communication circuit configured to enable transmitting or receiving data to or from an external electronic device, at least one sensor configured to identify a size of a region where the flexible display is visible to the outside of the housing, a memory, and at least one processor, wherein the at least one processor is configured to: control the display to display a first content on first region of the flexible display visible to the outside of the housing, establish communication connection with an external electronic device through the communication circuit, transmit, based on the establishing of the communication connection, first information on the first content to the external electronic device through the communication circuit so that the external electronic device displays the first content, when a second region where the flexible display located inside the housing is visible to the outside of the housing, display second content on a third region including the first region and the second region, based on at least one value obtained using the at least one sensor, identify second information on the second content, to be transmitted to the external electronic device, based on the obtained at least one value, and transmit the identified second information to the external electronic device through the communication circuit so that the external electronic device displays the second content.
Inventor(s): Abhay Raj Kumar GUPTA of Mountain View CA (US) for samsung electronics co., ltd., Wilson Wai Lun FUNG of Milpitas CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/30, G06F9/38, G06F16/172, G06T1/20
CPC Code(s): G06F9/30036
Abstract: a method for performing opportunistic write-back discard of single-use vector register values. the method includes executing instructions of a gpu in a default mode, detecting a beginning of a single-use section that includes instructions that produce single-use vector register values, and executing instructions in a single-use mode. the method includes discarding the write-back of a single-use vector register value if the single-use value gets forwarded either via a bypass path or via register file cache. the method includes inserting hint instructions into an executable program code that demarcates single-use sections. a system includes a microprocessor to execute instructions in the default mode. the microprocessor detects a beginning and an ending of a single-use section that includes instructions that produce single-use vector register values.
Inventor(s): MINDONG ZHAO of SHAANXI (CN) for samsung electronics co., ltd., DONG KOU of SHAANXI (CN) for samsung electronics co., ltd., TIANJIE ZHAO of SHAANXI (CN) for samsung electronics co., ltd.
IPC Code(s): G06F9/455
CPC Code(s): G06F9/45558
Abstract: a method for implementing a virtual machine introspection includes: receiving a read request to access a memory area of a virtual machine through a hypervisor for data reading; the hypervisor accessing the memory area of the virtual machine to perform an operation of reading data according to the read request to return an operation result; and reconstructing semantic information based on the operation result, on an apparatus located outside a virtualization system that includes the hypervisor.
Inventor(s): Jaemin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jimin Lee of Suwon-si (KR) for samsung electronics co., ltd., Junho Huh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F9/30, G06F9/46
CPC Code(s): G06F9/4818
Abstract: the present disclosure provides methods and apparatuses for interrupt processing. an interrupt processing method includes executing a first interrupt by using a common register, receiving a second interrupt and a second priority of the second interrupt during execution of the first interrupt, comparing a first priority of the first interrupt with the second priority of the second interrupt, generating a first register index corresponding to the second priority of the second interrupt by using a look-up table based on the second priority of the second interrupt being greater than the first priority, and, based on the first register index being a dedicated index, maintaining a context of the first interrupt stored in the common register, assigning a dedicated register for execution of the second interrupt, and executing an interrupt program corresponding to the second interrupt by using the assigned dedicated register. the interrupt program is saved in a memory.
Inventor(s): Nidhi SHUKLA of Bengaluru (IN) for samsung electronics co., ltd., Preeti JOSEPH of Bengaluru (IN) for samsung electronics co., ltd., Hyunbum CHO of Bengaluru (IN) for samsung electronics co., ltd., Yongjae SHIN of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F11/20
CPC Code(s): G06F11/2094
Abstract: various example embodiments are directed to a method, device, and system for repairing a dynamic random access memory (dram) memory device. the method includes reserving a memory space within the dram memory device, the reserved memory space including a plurality of spare rows, identifying one or more faulty rows within the dram memory device using at least one memory testing method, updating an error information table based on information of a respective classified correctable faulty row, in response to an error count for the respective classified correctable faulty row exceeding a desired threshold value, mapping the respective classified correctable faulty row to an available spare row of the plurality of spare rows, storing the mapping of the respective correctable faulty row and the mapped spare row in a row repair translation table, and copying data stored in the respective correctable faulty row into the mapped spare row.
Inventor(s): Wonchol KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Moonwook OH of Suwon-si (KR) for samsung electronics co., ltd., Jaegyu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/36
CPC Code(s): G06F11/3676
Abstract: an electronic device includes: a memory in which software code, including a plurality of test positions is loaded; and a processor configured to execute the software code in order according to a control flow, wherein the processor is configured to allocate a test coverage data region in the memory, execute the software code based on a test scenario, when an execution position reaches a target test position among the plurality of test positions, mark a memory position corresponding to the target test position in the test coverage data region in response to a test coverage marking instruction associated with the target test position, and output test coverage data of the test coverage data region in response to an external command.
Inventor(s): Jaeyoung Heo of Seoul (KR) for samsung electronics co., ltd., Byeongho Kim of Suwon-si (KR) for samsung electronics co., ltd., Yuhwan Ro of Suwon-si (KR) for samsung electronics co., ltd., Sungjoo Yoo of Seoul (KR) for samsung electronics co., ltd., Suk Han Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/023
Abstract: disclosed is a memory device which includes a plurality of memory chips. each of the plurality of memory chips includes a plurality of memory banks and a logic circuit. in a first operation mode, the logic circuit writes first data in the plurality of memory banks based on a first command and a first address received from the host, and performs a first processing-in-memory (pim) operation based on third data received from the host and the first data. in a second operation mode, the logic circuit writes second data in the plurality of memory banks based on the first command and the first address received from the host, and performs a second pim operation based on fourth data different from the third data received from the host and the second data.
Inventor(s): Hyung-Kyun BYUN of Suwon-si (KR) for samsung electronics co., ltd., Byung June SONG of Suwon-si (KR) for samsung electronics co., ltd., Song Ho YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F3/06, G06F12/1009, G06F16/28
CPC Code(s): G06F12/0253
Abstract: a storage device includes: a buffer to receive first data and second data from outside, and store the first data and the second data on a first page; a non-volatile memory to store the first data and the second data in a first block; and a controller to perform a program operation that programs the first and second data in free blocks different from each other through a garbage collection. the first data may include a first stream class number identifying characteristics of the first data, and the second data may include a second stream class number identifying characteristics of the second data and is different from the first stream class number. the controller may transmit information of the program operation to the outside before performing the program operation. the controller may perform the program operation when receiving a program execution permission command from the outside.
Inventor(s): Abhinav Kumar SINGH of Bengaluru (IN) for samsung electronics co., ltd., Saugata DAS PURKAYASTHA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0292
Abstract: the disclosure relates to a method and data storage device for managing host requests in the data storage device. the method includes receiving, from a host device, a read request for reading data from the data storage device, identifying a type of the read request, and based on the type of the read request being a random read request, performing one or more first operations related to processing of the read request in parallel with one or more second operations including: fetching a logical block address of the data from the read request; and obtaining a logical-to-physical (l2p) mapping table from a first memory associated with the data storage device, based on the logical block address, the l2p mapping table used for reading the data from the data storage device.
Inventor(s): Jai Dayal of Aloha OR (US) for samsung electronics co., ltd., Douglas Joseph of Leander TX (US) for samsung electronics co., ltd., Samantika Sury of Westford MA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/084, G06F9/54
CPC Code(s): G06F12/084
Abstract: provided is a method for data processing, the method including generating, by a host, a work request in a queue in a shared memory, reading, by an accelerator circuit, the work request from the queue in the shared memory, the shared memory being a physical memory that is common to the host and the accelerator circuit, and performing, by the accelerator circuit, an operation on data in the shared memory based on the work request.
Inventor(s): Susav Lal SHRESTHA of College Station TX (US) for samsung electronics co., ltd., Zongwang LI of Dublin CA (US) for samsung electronics co., ltd., Rekha PITCHUMANI of Oak Hill VA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0891, G06F16/903, G06F16/93
CPC Code(s): G06F12/0891
Abstract: a system is disclosed. a processor may include a local memory. a memory may be connected to the processor. a cache-coherent interconnect storage device may also be connected to the processor. an embedded management unit (emu) may be configured to manage the storage of a document embedding vector in the local memory, the memory, or the cache-coherent interconnect storage device.
Inventor(s): Alan Gara of Palo Alto CA (US) for samsung electronics co., ltd., Robert Wisniewski of Ossining NY (US) for samsung electronics co., ltd., Douglas Joseph of Leander TX (US) for samsung electronics co., ltd., Samantika Sury of Westford MA (US) for samsung electronics co., ltd., Jai Dayal of Aloha OR (US) for samsung electronics co., ltd., Rolf Riesen of Forest Grove OR (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/1027
CPC Code(s): G06F12/1027
Abstract: a system and method for address translation in a multi-node computing system. in some embodiments, the system includes a first node. the first node may include: a core; and a global address translation circuit, the core including: a core processing circuit; and a memory management unit configured to map local virtual addresses to global virtual addresses, the global address translation circuit being configured to map global virtual addresses to global physical addresses.
Inventor(s): Susav Lal SHRESTHA of College Station TX (US) for samsung electronics co., ltd., Zongwang LI of Dublin CA (US) for samsung electronics co., ltd., Rekha PITCHUMANI of Oak Hill VA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/2453
CPC Code(s): G06F16/24545
Abstract: a system is disclosed. a storage device may store a document embedding vector. an accelerator connected to the storage device may be configured to process a query embedding vector and the document embedding vector. a processor connected to the storage device and the accelerator may be configured to transmit the query embedding vector to the accelerator.
Inventor(s): Sungjong SEO of Suwon-si (KR) for samsung electronics co., ltd., Yeongjin GIL of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojoong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F16/33, G06F16/335
CPC Code(s): G06F16/334
Abstract: an electronic device in an example embodiment may include a communication interface configured to receive an original file, a memory, and a processor. the processor may generate bit information corresponding to uppercase and lowercase letters included in a filename of the original file. the processor may generate a case insensitive (ci) filename in which the filename of the original file is expressed by characters of a first type. the processor may encrypt the ci filename and may calculate a first hash value corresponding to the encrypted ci filename. the processor may record filename metadata including at least one of the encrypted ci filename, a length of the encrypted ci filename, the first hash value, and the bit information, in the memory. the processor may search for a target file to be found based on the filename metadata.
Inventor(s): Seung-Ho LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjoo MOON of Suwon-si (KR) for samsung electronics co., ltd., Jiman JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/56, G06F11/14
CPC Code(s): G06F21/566
Abstract: disclosed is an operation method of a storage device, which includes detecting a ransomware attack on one or more tenants executed in a host, updating a tenant status table including a status of each of the one or more tenants based on a result of the detection, writing recovery information for data recovery in a non-volatile memory depending on whether a status value of a tenant corresponding to the write request from among the one or more tenants is a status value corresponding to a warning status from among a plurality of status values, when a write request is received from the host, and performing the data recovery depending on the recovery information, when a recovery signal is received from the host.
Inventor(s): Minhyeok KANG of Suwon-si (KR) for samsung electronics co., ltd., Sanghyo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06K7/016, G06K7/00
CPC Code(s): G06K7/0166
Abstract: the present disclosure provides systems and devices including reception circuits for communications between smart cards and card readers. in some embodiments, a reception circuit of a smart card includes a first circuit and a second circuit. the first circuit is configured to receive a wireless signal including a pause, and restore the wireless signal to a clock signal. the second circuit is configured to charge a voltage of a first node based on a first logic level of the clock signal, compare the voltage of the first node with a predefined reference voltage, and output, based on the comparison of the voltage of the first node, a synchronization signal indicating a rising starting time point of the pause of the wireless signal.
Inventor(s): JI-EUN JANG of Suwon-si (KR) for samsung electronics co., ltd., HUIJUN YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06K19/073, G06K7/00
CPC Code(s): G06K19/07354
Abstract: a smart card includes a frequency measurement circuit configured to measure a first clock frequency of an external clock signal, a sensor clock output circuit configured to select a first range from a plurality of first clock ranges based on the first clock frequency and to output a sensor clock signal having a second clock frequency corresponding to the first range, and a sensor circuit configured to output sensing data for biometric authentication based on the sensor clock signal and first compensation image data.
Inventor(s): Minyoung KIM of Staines (GB) for samsung electronics co., ltd., Timothy HOSPEDALES of Staines (GB) for samsung electronics co., ltd., Da LI of Staines (GB) for samsung electronics co., ltd., Xu HU of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
CPC Code(s): G06N3/08
Abstract: the present application relates to a computer-implemented method for an improved technique for optimising the loss function during deep learning. the method includes receiving a training data set comprising a plurality of data items, initialising weights of at least one neural network layer of the ml model, and training, using an iterative process, the at least one neural network layer of the ml model by inputting, into the at least one neural network layer, the plurality of data items, processing the plurality of data items using the at least one neural network layer and the weights, optimising a loss function of the weights by simultaneously minimising a loss value and a loss sharpness using weights that lie in a neighbourhood having a similar low loss value, wherein the neighbourhood is determined by a geometry of a parameter space defined by the weights of the ml model, and updating the weights of the at least one neural network layer using the optimised loss function.
Inventor(s): Kyungsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Chang Dong YOO of Daejeon (KR) for samsung electronics co., ltd., Junyeong KIM of Daejeon (KR) for samsung electronics co., ltd., Minuk MA of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/084, G06N3/08, G06V10/766, G06V10/774, G06V10/776, G06V10/82, G06V40/16
CPC Code(s): G06N3/084
Abstract: provided are an artificial intelligence (ai) system using a machine learning algorithm such as deep learning, and applications thereof. a method, performed by an electronic apparatus, of processing images includes obtaining a plurality of training image sets corresponding to a plurality of types of target objects, wherein training images in the training image sets are labeled with feature points forming a preset structure, generating a first artificial intelligence (ai) model for determining a standard structure based on the labeled feature points, by using the training images in the training image sets, identifying a face in a training image transformed based on the standard structure, and training a second ai model for verifying the first ai model, based on an image regressed from the transformed training image, and the training image before being transformed.
Inventor(s): Rahul Lokesh of Sunnyvale CA (US) for samsung electronics co., ltd., Sandipan Banerjee of Boston MA (US) for samsung electronics co., ltd., Hyun Jae Kang of Mountain View CA (US) for samsung electronics co., ltd., Ondrej Texler of San Jose CA (US) for samsung electronics co., ltd., Sajid Sadi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T3/4053, G06T3/4046
CPC Code(s): G06T3/4053
Abstract: an ultralight rendering system is capable of generating first content locally within a first data processing system. the first data processing system is capable of monitoring for second content conveyed from a second data processing system. the first data processing system plays a version of the first content. the first data processing system is capable of dynamically switching, by the first data processing system, between playing the version of the first content and playing a version of the second content based on receipt of the second content by the first data processing system.
Inventor(s): Akshat RAMACHANDRAN of Bengaluru (IN) for samsung electronics co., ltd., Ankit Dhiman of Bengaluru (IN) for samsung electronics co., ltd., Basavaraja Shanthappa Vandrotti of Bengaluru (IN) for samsung electronics co., ltd., Jooyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Lokesh Rayasandra Boregowda of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06T7/50, G06T5/50, G06V10/141, G06V10/25
CPC Code(s): G06T7/50
Abstract: a method for determining depth information of objects in a scene, includes: generating rgb images having a first pixel density using an rgb camera; generating a depth image having a second pixel density using a depth camera, the second pixel density being lower than the first pixel density; generating an attention map using the rgb images with a high pixel density; merging the rgb images and the depth image to generate a merged image; determining an uncertainty score of each pixel of a plurality of pixels in the merged image; determining a threshold for the uncertainty score based on a level of uncertainty in the plurality of pixels; determining a depth value for each pixel of the plurality of pixels exceeding the threshold of the uncertainty score; applying the depth value of each pixel of the plurality of pixels in the merged image; and generating the scene with the depth information based on the depth value.
Inventor(s): Junhee HAN of Gyeonggi-do (KR) for samsung electronics co., ltd., Pilwon SEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiwoo LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Inho SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiyoung LIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, H04B5/72, H04W64/00, H05K5/00, H05K5/02
CPC Code(s): G09G3/035
Abstract: an electronic device and method are disclosed. the electronic device includes a display an extended screen area that is exposed or stowed, according to a change in a state of the display of the electronic device, communication circuitry configured to transceive a signal to or using an angle-of-arrival (aoa) antenna disposed within the extended screen area, a memory, and a processor. the processor implements the method, including: determining a position of the electronic device relative to an external electronic device, using the communication circuitry, executing a sharing operation with the external electronic device, identifying whether the display of the electronic device is disposed in a first state or a second state, based on detecting that the display is disposed in the first state, perform a first positioning operation for the external electronic device, and displaying a sharing interface according to the first positioning operation on the display.
Inventor(s): Chanhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Chansik BOK of Suwon-si (KR) for samsung electronics co., ltd., Hyundon YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L21/02
CPC Code(s): G10L15/22
Abstract: a method, an electronic device, and a non-transitory computer-readable medium storing instructions may be provided. the method may include receiving an audio signal; based on at least one preset trigger word being included in the received audio signal, determining whether the at least one trigger word included in the audio signal is misrecognized; based on the determining that the at least one preset trigger word is misrecognized, requesting an additional input from a user; and based on the additional input received in response to the request and the audio signal, executing a function corresponding to audio recognition.
Inventor(s): Jaehwan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G06F3/01
CPC Code(s): G10L15/22
Abstract: an electronic device is provided. the electronic device includes a communication circuit, memory storing one or more computer programs, and one or more processors communicatively coupled to the communication circuit and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic to receive, from an external electronic device, information indicating detection of user's gaze on a specified virtual object displayed on a display of the external electronic device wearable on at least part of a user's body through the communication circuit, receive information from analysis of the user's gaze, receive, from the external electronic device, first information from analysis of the user's face, second information from analysis of a user's gesture, or third information from analysis of whether the user started utterance, corresponding to the point in time at which the user's gaze has been detected, determine a user's intention to utter a voice command based on whether at least one of the first information, the second information, or the third information, and the information from analysis of the user's gaze satisfy a specified condition, execute a voice recognition application stored in the memory upon determining that there is the intention to utter and control the voice recognition application to be in a state of being capable of receiving a voice command of the user.
Inventor(s): Ching-Hua Lee of Mountain View CA (US) for samsung electronics co., ltd., Chou-Chang Yang of San Jose CA (US) for samsung electronics co., ltd., Yilin Shen of San Jose CA (US) for samsung electronics co., ltd., Hongxia Jin of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G10L21/0224
CPC Code(s): G10L21/0224
Abstract: a method includes receiving, during a first time window, a set of noisy audio signals from a plurality of audio input devices. the method also includes generating a noisy time-frequency representation based on the set of noisy audio signals. the method further includes providing the noisy time-frequency representation as an input to a mask estimation model trained to output a mask used to predict a clean time-frequency representation of clean speech audio from the noisy time-frequency representation. the method also includes determining beamforming filter weights based on the mask. the method further includes applying the beamforming filter weights to the noisy time-frequency representation to isolate the clean speech audio from the set of noisy audio signals. in addition, the method includes outputting the clean speech audio.
Inventor(s): Gangmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaehue Shin of Suwon-si (KR) for samsung electronics co., ltd., Daeseok Byeon of Suwon-si (KR) for samsung electronics co., ltd., Yongsung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/04, G11C16/24, G11C16/26, G11C16/30, G11C29/10
CPC Code(s): G11C16/0491
Abstract: a nonvolatile memory device may include a page buffer, a control signal generator, and a current mirror. the page buffer may be connected to a bitline and may allow a replicated current to flow through a ground terminal in response to a first control signal and a second control signal. the control signal generator may output the first control signal and the second control signal to the page buffer. the current mirror may output, in a virtual cell mode, a control voltage corresponding to a bias current. the control voltage may correspond to the first control signal.
Inventor(s): Yongsung CHO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/24, G11C16/26
CPC Code(s): G11C16/24
Abstract: a memory device includes a memory cell array, and a page buffer circuit connected to the memory cell array through a plurality of bit lines, including a plurality of page buffers arranged in correspondence with the bit lines and each of which includes a sensing node. the plurality of page buffers include a first page buffer, and the first page buffer includes: a first sensing node configured to sense data by corresponding to a first metal wire at a lower metal layer; and a second metal wire electrically connected to the first metal wire and at an upper metal layer located above the lower metal layer, and a boost node corresponding to a third metal wire adjacent to the second metal wire of the upper metal layer and configured to control a boost-up and a boost-down of a voltage of the first sensing node.
Inventor(s): Junyeong Seok of Suwon-si (KR) for samsung electronics co., ltd., Beomkyu Shin of Suwon-si (KR) for samsung electronics co., ltd., Eunchu Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C16/04, G11C16/16, H01L23/00, H01L25/065, H01L25/18, H10B80/00
CPC Code(s): G11C16/3431
Abstract: a memory block is divided into sub blocks including a first sub block and a second sub block that are disposed in a vertical direction where the memory block includes a plurality of cell strings and each cell string includes a plurality of memory cells that are disposed in the vertical direction. a normal erase operation is performed independently with respect to each of the sub blocks. a disturbance verification read operation with respect to the first sub block is performed to determine whether a threshold voltage of memory cells connected to a wordline in an erased state of the first sub block is increased higher than a reference level. a post erase operation is selectively performed based on a result of the disturbance verification read operation to decrease the threshold voltage of memory cells in the erased state of the first sub block.
Inventor(s): Taeyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Yohan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C7/08, G11C16/10, G11C16/26
CPC Code(s): G11C16/3459
Abstract: the present disclosure relates to semiconductor memory devices and methods of operating a semiconductor memory device. one example method includes setting a sensing node of a page buffer to a first voltage, detecting a deviation in operating characteristics of a first sense amplifier and a second sense amplifier with respect to the first voltage, and sequentially repeating a first internal operation for at least two different operating times in the first sense amplifier, the second sense amplifier, or the first sense amplifier and the second sense amplifier based on the deviation in operating characteristics of the first sense amplifier and the second sense amplifier.
Inventor(s): Kyung-Min KANG of Suwon-Si (KR) for samsung electronics co., ltd., Dongku KANG of Suwon-Si (KR) for samsung electronics co., ltd., Su Chang JEON of Suwon-Si (KR) for samsung electronics co., ltd., Won-Taeck JUNG of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C16/08, G11C16/10, G11C16/28, G11C16/30
CPC Code(s): G11C16/3481
Abstract: a nonvolatile memory device includes a peripheral circuit region and a memory cell region vertically connected with the peripheral circuit region, the peripheral circuit region including at least one first metal pad, and the memory cell region including at least one second metal pad directly connected with the at least one first metal pad. a method of programming the nonvolatile memory device incudes: receiving a programming command, data for a plurality of pages, and an address corresponding to a selected word-line; programming the data for one of the pages to an unselected word-line; reading data of a previously programmed page from the selected word-line; and programming the data for the remaining pages and the data of the previously programmed page to the selected word-line.
Inventor(s): Shubham Raj SINGH of Bangalore (IN) for samsung electronics co., ltd., Arvind THAKUR of Bangalore (IN) for samsung electronics co., ltd., Subodh Prakash TAIGOR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G11C29/02, G11C29/52
CPC Code(s): G11C29/021
Abstract: various example embodiments relate to a capacitor action-based start-up circuit for bandgap reference (bgr) generation. the start-up circuit comprises a start-up capacitor connected to a vbg node of a bgr sub-circuit. the start-up capacitor determines if a state of operation of the bgr sub-block is one of normal, and failure. the start-up circuit comprises an output transistor connected to an nb node of the bgr. the output transistor charges the nb node to maintain normal operation of the bgr sub-block, if the state of operation of the bgr sub-block is failure, thereby facilitating dynamic behavior.
Inventor(s): HYUNGSIK KO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32449
Abstract: the present disclosure relates to showerheads, substrate processing apparatuses, and semiconductor fabrication methods. one example showerhead comprises an inner plate, and an outer plate combined with the inner plate and surrounding the inner plate. the inner plate includes a disk-shaped central member that comprises a gas hole extending in a first direction, and a ring-shaped first coupling member outside the central member and surrounding the central member. the outer plate includes an outer ring body and a ring-shaped second coupling member inside the outer ring body. a bottom surface of the first coupling member is in contact with a top surface of the second coupling member. a first angle between the first direction and an outer surface of the first coupling member is different from a second angle between the first direction and an inner surface of the outer ring body.
Inventor(s): HOCHAN LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngon Oh of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/677
CPC Code(s): H01L21/67706
Abstract: a rotational interface includes a base column extending in a first direction, a rotary unit, and a carrier plate extending from the base column in a second direction and connected to the rotary unit, the carrier plate includes a plate body extending in the second direction and coupled to the base column, and a storage pot disposed on the plate body and having an upper surface, and the storage pot includes a fixing pin located on the upper surface of the storage pot and that fixes a semiconductor carrier to the plate body.
Inventor(s): Youngin KIM of Suwon-si (KR) for samsung electronics co., ltd., BYOUNGHO KWON of Suwon-si (KR) for samsung electronics co., ltd., Yeil KIM of Suwon-si (KR) for samsung electronics co., ltd., JONGHYUK PARK of Suwon-si (KR) for samsung electronics co., ltd., JIN-WOO BAE of Suwon-si (KR) for samsung electronics co., ltd., KYOUNGJOON SONG of Suwon-si (KR) for samsung electronics co., ltd., MYUNGJAE JANG of Suwon-si (KR) for samsung electronics co., ltd., Byungsoo JOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/762, H01L21/306, H01L21/308, H01L21/768
CPC Code(s): H01L21/762
Abstract: a method of fabricating a semiconductor device includes forming, in a semiconductor substrate, a device isolation trench defining active regions, forming a first liner dielectric layer covering a top surface of the semiconductor substrate and an inner wall of the device isolation trench, forming a second liner dielectric layer covering the first liner dielectric layer, forming a buried dielectric layer filling the device isolation trench, performing a polishing process on the second liner dielectric layer and the buried dielectric layer to form a device isolation structure, forming a mask pattern running across the active regions, and partially patterning the active regions and the device isolation structure to form gate trenches. after the polishing process, the first liner dielectric layer, the second liner dielectric layer, and the buried dielectric layer have their top surfaces formed by the polishing process coplanar with each other.
Inventor(s): Ju Youn KIM of Suwon-si (KR) for samsung electronics co., ltd., Myung Soo SEO of Suwon-si (KR) for samsung electronics co., ltd., Joong Gun OH of Suwon-si (KR) for samsung electronics co., ltd., Seul Gi YUN of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/8238, H01L27/092, H01L29/06, H01L29/423, H01L29/66
CPC Code(s): H01L21/823807
Abstract: a method for fabricating a semiconductor device includes providing a substrate having first to fourth regions defined thereon. first to fourth active patterns are formed in the first to fourth regions, respectively. each of the first to fourth active patterns extends in a first horizontal direction. a gate insulating layer is formed on each of the first to fourth active patterns. a first gate electrode is formed in the first region and includes first and fifth layers, a second gate electrode is formed in the second region and includes first, second and fifth layers, a third gate electrode is formed in the third region and includes first, third, fourth and fifth layers and a fourth gate electrode is formed in the fourth region and includes first, second, third, fourth and fifth layers.
Inventor(s): In Seok PARK of Suwon-si (KR) for samsung electronics co., ltd., WAN-SIK NAM of Suwon-si (KR) for samsung electronics co., ltd., SOUK KIM of Suwon-si (KR) for samsung electronics co., ltd., YOUNGHOON SOHN of Suwon-si (KR) for samsung electronics co., ltd., JAEHYUNG AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66
CPC Code(s): H01L22/12
Abstract: a critical dimension prediction system includes a measuring device configured to acquire sample data from a sample semiconductor chip, the sample data including a plurality of spectrums, a training data selection device configured to select a training data set based on the sample data, a critical dimension predicting model generating device configured to generate a critical dimension predicting model by training an artificial intelligence model based on the training data set, and a critical dimension predicting device configured to predict a critical dimension of a target layer by inputting input data into the critical dimension predicting model, the input data including information about the target layer, where the training data selection device is further configured to assign a sparsity score to each of the plurality of spectrums and select at least one of the plurality of spectrums as the training data set based on the sparsity score.
Inventor(s): JINTAE KIM of Clifton Park NY (US) for samsung electronics co., ltd., Keumseok Park of Slingerlands NY (US) for samsung electronics co., ltd., Kang-Ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/8234, H01L27/06, H01L27/088, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: integrated circuit devices may include a power switch cell including an upper transistor on a substrate and a lower transistor between the substrate and the upper transistor. the upper transistor may include an upper channel region, first and second upper source/drain regions, and an upper gate electrode on the upper channel region. the lower transistor may include a lower channel region, first and second lower source/drain regions, and a lower gate electrode on the lower channel region. the first and second upper source/drain regions and the first and second lower source/drain regions may have the same conductivity type, the first upper source/drain region and the first lower source/drain region may be electrically connected to each other, the second upper source/drain region and the second lower source/drain region may be electrically connected to each other, and the upper and lower gate electrodes may be electrically connected to each other.
Inventor(s): Hwanjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunggu KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaechoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/367, H01L23/48, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes a first redistribution wiring layer having first redistribution wirings; a first lower semiconductor chip and a second lower semiconductor chip spaced apart from each other on the first redistribution wiring layer; a sealing member covering the first lower semiconductor chip and the second lower semiconductor chip on the first redistribution wiring layer; a plurality of conductive vias penetrating the sealing member between the first lower semiconductor chip and the second lower semiconductor chip; a second redistribution wiring layer disposed on the sealing member and having second redistribution wirings electrically connected to the plurality of conductive vias; an upper semiconductor chip disposed on the second redistribution wiring layer and electrically connected to the second redistribution wirings; and a first heat dissipation block and a second heat dissipation block respectively disposed on the first lower semiconductor chip and the second lower semiconductor chip.
Inventor(s): Sangjin Baek of Suwon-si (KR) for samsung electronics co., ltd., Kyungdon Mun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a redistribution structure including an insulating layer. a plurality of redistribution layers are disposed within the insulating layer. a recess extends from an upper surface of the insulating layer and exposes at least a portion of a first uppermost redistribution layer. a first pad structure is disposed on a bottom and an inner wall of the recess. the first pad structure defines a cavity that is open upwardly. a semiconductor chip is disposed on the upper surface of the redistribution structure and includes a connection terminal electrically connected to the plurality of redistribution layers. a connection bump is disposed within the cavity and electrically connects the connection terminal of the semiconductor chip to the first pad structure of the redistribution structure. an encapsulant covers at least a portion of the semiconductor chip.
Inventor(s): TAE SUN KIM of Ballston Spa NY (US) for samsung electronics co., ltd., WONHYUK HONG of Clifton Park NY (US) for samsung electronics co., ltd., JONGJIN LEE of Clifton Park NY (US) for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L29/417
CPC Code(s): H01L23/5286
Abstract: integrated circuit devices and methods of forming the same are provided. the integrated circuit devices may include a backside power distribution network structure (bspdns), a logic device region and a passive device region on the bspdns, a backside insulating layer including a first portion extending between the bspdns and the logic device region and a second portion extending between the bspdns and the passive device region, the passive device region including a semiconductor layer that is in the backside insulating layer, and a dam separating the first portion of the backside insulating layer from the semiconductor layer of the passive device region.
20240332186. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/48, H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/5286
Abstract: a semiconductor device includes a substrate having opposite first and second surfaces, a fin-type active pattern on the first surface of the substrate, a gate structure intersecting the fin-type active pattern, a source/drain region on the fin-type active pattern at a side of the gate structure, a contact structure connected to the source/drain region, a buried conductive structure electrically connected to the contact structure and extending in a direction perpendicular to the first surface, and a conductive through structure extending from the second surface of the substrate toward the first surface of the substrate and contacting with the buried conductive structure, the conductive through structure has a first width at a level adjacent to the first surface, narrower than a second width at a level adjacent to the second surface.
Inventor(s): Kiwon Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L25/065, H01L27/08
CPC Code(s): H01L23/5384
Abstract: a semiconductor device and semiconductor package, the device including a lower semiconductor chip including a lower through-electrode; an interposer mounted on the lower semiconductor chip, the interposer including an interposer substrate; a plurality of interposer through-electrodes penetrating through at least a portion of the interposer substrate in a vertical direction and electrically connected to the lower through-electrode; and at least one capacitor in the interposer substrate and electrically connected to at least one interposer through-electrode of the plurality of interposer through-electrodes; and an upper semiconductor chip mounted on the interposer and electrically connected to the interposer through-electrode.
20240332200. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Young Lyong Kim of Anyang-si (KR) for samsung electronics co., ltd., Hyunsoo Chung of Hwaseong-si (KR) for samsung electronics co., ltd., Inhyo Hwang of Asan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/31, H01L25/065
CPC Code(s): H01L23/5385
Abstract: a semiconductor package includes a package substrate with a first vent hole, a first semiconductor chip mounted the package substrate, an interposer including supporters on a bottom surface of the interposer and a second vent hole, wherein the supporters contact a top surface of the first semiconductor chip, and the interposer is electrically connected to the package substrate through connection terminals. the semiconductor package further include a second semiconductor chip mounted on the interposer, and a molding layer disposed on the package substrate to cover the first semiconductor chip, the interposer, and the second semiconductor chip.
20240332221. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungyoung AHN of Daejeon (KR) for samsung electronics co., ltd., Seonghi LEE of Daejeon (KR) for samsung electronics co., ltd., Hyunwoong KIM of Daejeon (KR) for samsung electronics co., ltd., Jiseong KIM of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/64, H01L23/00, H01L23/498, H01L23/538, H01L25/065, H10B80/00
CPC Code(s): H01L23/64
Abstract: a semiconductor package includes a package substrate, an interposer die disposed on the package substrate, semiconductor chips disposed on the interposer die and electrically connected to the package substrate via the interposer die, first connection bumps electrically connecting the semiconductor chips to the interposer die, second connection bumps electrically connecting the interposer die to the package substrate, and third connection bumps disposed below the package substrate, wherein the interposer die includes spiral matching structures adjacent to upper portions of the second connection bumps, and the package substrate includes trace-shaped matching structures adjacent to lower portions of the second connection bumps.
Inventor(s): Joongwon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yeonjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jimin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L23/522, H01L25/065
CPC Code(s): H01L24/05
Abstract: a semiconductor device includes an insulating structure on a semiconductor substrate, lower conductive patterns in the insulating structure, upper conductive patterns on the insulating structure, conductive vias in the insulating structure and connecting at least one of the upper conductive patterns to at least one of the lower conductive patterns, a protective layer covering the insulating structure and the upper conductive patterns, an etch stop layer covering the protective layer, a first passivation layer on portions of the etch stop layer between the upper conductive patterns, and an upper passivation layer on the first passivation layer.
Inventor(s): Dae Seo PARK of Suwon-si (KR) for samsung electronics co., ltd., Woon Chun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/75
Abstract: the present disclosure relates to a semiconductor chip bonding device and a semiconductor chip bonding method using the same, the semiconductor chip bonding device bonds semiconductor chips on a substrate, and includes a bonding head disposed on the semiconductor chip; a substrate support disposed below the substrate; a dam member for surrounding an edge of the bonding head and contacting an upper side of the substrate; and a gas blower spaced and disposed on the substrate support, disposed between the bonding head and the dam member, and supplying gas to the substrate direction.
Inventor(s): KWANYEOB CHAE of Suwon-si (KR) for samsung electronics co., ltd., Ji-Yeon Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/538, H10B80/00
CPC Code(s): H01L25/0652
Abstract: a system on chip includes a processor and an input and output circuit including a plurality of input and output elements connected to the processor, wherein the plurality of input and output elements includes: a first input and output element spaced apart from the processor by a first distance; and a second input and output element spaced apart from the processor by a second distance, greater than the first distance, and connected to the processor by a first electrical path extending through a first region of the first input and output element, and wherein the first input and output element is connected to the processor by at least one first terminal provided in a second region that is separate from the first region.
Inventor(s): HYUEKJAE LEE of Hwaseong-si (KR) for samsung electronics co., ltd., JIHOON KIM of Asan-si (KR) for samsung electronics co., ltd., JiHwan SUH of Suwon-si (KR) for samsung electronics co., ltd., SO YOUN LEE of Hwaseong-si (KR) for samsung electronics co., ltd., JIHWAN HWANG of Hwaseong-si (KR) for samsung electronics co., ltd., TAEHUN KIM of Asan-si (KR) for samsung electronics co., ltd., JI-SEOK HONG of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/56, H01L23/00, H01L25/00, H01L25/18
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. the second molding layer is formed of a second molding material different from the first molding material. a top surface of the first semiconductor chip and a top surface of the first molding layer are flat and are coplanar with each other, and a ratio of the difference between the coefficient of thermal expansion between the second molding layer and the first molding layer to the difference between the coefficient of thermal expansion between the second molding layer and the substrate is between 5:1 and 20:1.
20240332256. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Young Kun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/538
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a package substrate including a mounting region and an edge region at least partially surrounding the mounting region, a bridge chip on a top surface of the mounting region of the package substrate, a first connection pad and a second connection pad on the mounting region of the package substrate and spaced apart from the bridge chip, a third connection pad on the edge region of the package substrate, a first mold layer on the package substrate and at least partially surrounding the bridge chip, the first connection pad, the second connection pad and the third connection pad, a first semiconductor chip on the first connection pad and the bridge chip, a second semiconductor chip on the second connection pad and the bridge chip, and a conductive post on the third connection pad.
Inventor(s): KYOUNG LIM SUK of Suwon-si (KR) for samsung electronics co., ltd., SEOKHYUN LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L23/498, H01L23/522, H01L23/528
CPC Code(s): H01L25/105
Abstract: a method of fabricating a semiconductor package includes providing a semiconductor chip, forming a redistribution substrate, and fabricating a package including the semiconductor chip disposed on the redistribution substrate. the forming of the redistribution substrate may include forming a first insulating layer on a substrate, the first insulating layer having a first opening formed therein, forming an integrally formed first redistribution pattern in the first opening and on the first insulating layer, forming a second insulating layer on the first insulating layer to cover the first redistribution pattern, and performing a planarization process on the second insulating layer to expose the first redistribution pattern.
Inventor(s): Sangjin Baek of Suwon-si (KR) for samsung electronics co., ltd., Kyung Don Mun of Suwon-si (KR) for samsung electronics co., ltd., Ji Hwang Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Lim Suk of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L21/56, H01L23/00, H01L23/31
CPC Code(s): H01L25/16
Abstract: the present disclosure relates to semiconductor packages and methods for manufacturing semiconductor packages. an example semiconductor package includes a top die, first and second bottom dies attached on a lower surface of the top die and being apart from each other by a preset distance, and at least one decoupling capacitor connected to the lower surface of the top die between the first bottom die and the second bottom die. the top die, the first bottom die, and the second bottom die are chiplets.
Inventor(s): Sanghoon BAEK of Seoul (KR) for samsung electronics co., ltd., Jungho DO of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo SEO of Seoul (KR) for samsung electronics co., ltd., Jisu YU of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/118, H01L23/48, H01L27/02
CPC Code(s): H01L27/11807
Abstract: a semiconductor device includes a first standard cell disposed on a substrate in a first row and having a first cell height; a second standard cell disposed on the substrate in a second row, adjacent to the first row, second standard cell having a second cell height, different from the first cell height; and a power line extending in a first direction along a boundary between the first standard cell and the second standard cell.
Inventor(s): Seungmin CHA of Suwon-si (KR) for samsung electronics co., ltd., Jinkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Yunsuk NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L23/48, H01L27/092, H01L29/08, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes: a first substrate that includes a first region and a second region; an active pattern disposed on the first region; a source/drain pattern disposed on the active pattern; a through contact disposed on the second region; a first metal layer disposed on the through contact; a second substrate disposed on the first metal layer, wherein the second substrate includes an impurity region; a lower bonding pad disposed between the first metal layer and the second substrate; an upper bonding pad disposed on the lower bonding pad; and a power delivery network layer disposed on a bottom surface of the first substrate, wherein the lower bonding pad and the upper bonding pad are in contact with each other, wherein the through contact is connected to the lower bonding pad, and wherein the impurity region is connected to the upper bonding pad.
20240332378. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younggwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung Geun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Myung Gil KANG of Suwon-si (KR) for samsung electronics co., ltd., Gyeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/768, H01L23/522, H01L29/08, H01L29/40
CPC Code(s): H01L29/41733
Abstract: a semiconductor device may include a substrate, a lower pattern on the substrate, a channel pattern on the lower pattern, a source/drain pattern on both sides of the channel pattern, a gate structure surrounding the channel pattern, a contact electrode electrically connected to the source/drain pattern, an etch stop layer between the gate structure and the contact electrode, and a contact interface layer on the source/drain pattern. the contact interface layer may include a first region between the source/drain pattern and the contact electrode and a second region between the source/drain pattern and the etch stop layer.
Inventor(s): Ji Won KANG of Suwon-si (KR) for samsung electronics co., ltd., Chung Hwan SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seong Heum CHOI of Suwon-si (KR) for samsung electronics co., ltd., Rak Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/40, H01L29/423, H01L29/45, H01L29/775, H01L29/78
CPC Code(s): H01L29/41791
Abstract: a semiconductor device may include an active pattern extending in a first direction, a gate structure which is placed on the active pattern to be spaced apart from each other in the first direction, and includes a gate electrode and a gate spacer, the gate electrode extending in a second direction intersecting the first direction, a gate contact on the gate structure, a source/drain pattern on the active pattern, a source/drain contact on the source/drain pattern, and a via plug on the source/drain contact. an upper surface of the gate contact and a second upper surface of the via plug may be placed on the same plane. a lower surface of the gate contact and a lower surface of the via plug may be different in height, on the basis of an upper surface of the active pattern.
Inventor(s): Bonyeop Kim of Gwangmyeong-si (KR) for samsung electronics co., ltd., Taehyung Kim of Yongin-si (KR) for samsung electronics co., ltd., Sangshin Han of Suwon-si (KR) for samsung electronics co., ltd., Sangyeop Baeck of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/092, H01L29/06, H10B10/00
CPC Code(s): H01L29/42392
Abstract: an integrated circuit includes: a memory cell block including a plurality of bitcells; and an input and output (i/o) block including a plurality of gate-all-around (gaa) transistors connected to the bitcells, wherein the i/o block includes a plurality of active regions disposed separately from one another in a first direction, each of which extends in a second direction that is vertical to the first direction, and in which the gaa transistors are formed, a plurality of power rails disposed separately from one another in the first direction, and configured to provide power to the gaa transistors, and a plurality of signal lines disposed between the power rails, and configured to provide signals to the gaa transistors, a first number of bitcells among the bitcells are connected to the gaa transistors formed in a second number of active regions among the active regions, and the second number is twice the first number.
20240332424. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yang XU of Suwon-si (KR) for samsung electronics co., ltd., Nam Kyu CHO of Yongin-si (KR) for samsung electronics co., ltd., Seok Hoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yong Seung KIM of Seongnam-si (KR) for samsung electronics co., ltd., Pan Kwi PARK of Incheon (KR) for samsung electronics co., ltd., Dong Suk SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sang Gil LEE of Ansan-si (KR) for samsung electronics co., ltd., Si Hyung LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L27/088, H01L29/06, H01L29/417
CPC Code(s): H01L29/7851
Abstract: a semiconductor device including first fin-shaped patterns in a first region of a substrate and spaced apart from each other in a first direction, second fin-shaped patterns in a second region of the substrate and spaced apart from each other in a second direction, a first field insulating film on the substrate and covering sidewalls of the first fin-shaped patterns, a second field insulating film on the substrate and covering sidewalls of the second fin-shaped patterns, a first source/drain pattern on the first field insulating film, connected to the first fin-shaped patterns, and including a first silicon-germanium pattern, and a second source/drain pattern on the second field insulating film, connected to the second fin-shaped patterns, and including a second silicon-germanium pattern, the second source/drain pattern and the second field insulating film defining one or more first air gaps therebetween may be provided.
Inventor(s): Jungmin Seo of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd., Cheonan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Chanho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/861, H01L27/02
CPC Code(s): H01L29/8611
Abstract: a semiconductor device according to an embodiment of the present inventive concept comprises: a first power supply pad configured to receive a first power supply voltage; a second power supply pad configured to receive a second power supply voltage, the second power supply voltage having a level lower than a level of the first power supply voltage; a signal pad configured to exchange a signal; and a first electrostatic discharge (esd) diode comprising a first impurity region doped with impurities of a first conductivity type and connected to the first power supply pad, and a second impurity region doped with impurities of a second conductivity type different from the first conductivity type and connected to the signal pad, wherein a lower surface of at least one of the first impurity region and the second impurity region has an uneven structure.
Inventor(s): Changmin KEUM of Suwon-si (KR) for samsung electronics co., ltd., Jungkweon BAE of Suwon-si (KR) for samsung electronics co., ltd., Chanyul KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokjae CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L25/075, H01L27/15, H01L33/60
CPC Code(s): H01L33/502
Abstract: disclosed are a display device and a display panel including a substrate, a first subpixel array including first subpixels arranged in a first region on the substrate, a second subpixel array including second subpixels arranged in a second region on the substrate, and a third subpixel array including third subpixels arranged in a third region on the substrate. the first region, the second region, and the third region are spatially separated and provided side by side on a same surface of the substrate. the first subpixels are grouped by a first primary color and are patterned as the first subpixel array in the first region. the second subpixels are grouped by a second primary color and are patterned as the second subpixel array in the second region. the third subpixels are grouped by a third primary color and patterned as the third subpixel array in the third region.
Inventor(s): Sangbok Ma of Suwon-si (KR) for samsung electronics co., ltd., Joonhee Kim of Seoul (KR) for samsung electronics co., ltd., Jonghoon Ka of Suwon-si (KR) for samsung electronics co., ltd., Sungjin Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M4/58, H01M4/02, H01M4/04, H01M4/36, H01M10/0562
CPC Code(s): H01M4/5825
Abstract: a positive electrode active material includes a lithium-transition metal composite phosphate including a first crystalline phase having a composition represented by formula 1 and having an olivine structure, and a second crystalline phase having a composition represented by formula 2 and having a pyrophosphate-containing structure, wherein the second crystalline phase is in an amount of greater than 0 mole percent and not greater than 50 mole percent with respect to a total number of moles of the first crystalline phase and the second crystalline phase, a positive electrode, a secondary battery: lim1po(formula 1), lim2(po)(formula 2), where 0.9≤x≤1.1, 0.9≤y≤1.1, 5.5≤a≤6.5, and 4.8≤b≤5.2, and m1 and m2 are each independently an element from groups 3 to 11 in the 4th period of the periodic table of the elements, or a combination thereof.
Inventor(s): Woosup LEE of Suwon-si (KR) for samsung electronics co., ltd., Taejun Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q7/00, H01Q1/02, H04B5/26
CPC Code(s): H01Q7/00
Abstract: an electronic device includes: a battery; a main circuit board operatively connected to the battery; and an antenna structure operatively connected to the main circuit board, the antenna structure including: a base board; a first flexible printed circuit board (fpcb) electrically connected to the main circuit board; a first coil including a first end portion and a second end portion, wherein the first end portion is electrically connected to the first fpcb; a second coil including a third end portion and a fourth end portion, wherein the third end portion is electrically connected to the first fpcb and at least a part of the second coil is disposed inside the first coil; and a conductive member electrically connected to the second end portion of the first coil and the fourth end portion of the second coil.
20240332819. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/06, H01Q1/24, H01Q5/25, H01Q9/04, H01Q21/24
CPC Code(s): H01Q21/065
Abstract: according to an embodiment of the present disclosure, an electronic device may include: a housing; an antenna structure positioned in the housing and including a printed circuit board, multiple first antenna elements, multiple second antenna elements, and multiple electrical paths; and a wireless communication circuit electrically connected to the multiple first antenna elements through the electrical paths, wherein: the printed circuit board includes a first surface oriented in a first direction and a second surface oriented in a second direction opposite to the first direction; the multiple first antenna elements are positioned in the printed circuit board on the first surface or to be closer to the first surface than the second surface, configured to generate circular polarization, and include, when seen from above the first surface, a first border and a third border spaced apart from each other and extending in parallel to each other, a second border and a fourth border spaced apart from each other by a distance between the first border and the third border, extending in parallel to each other, and disposed to be perpendicular to the first border or the third border, and multiple first notches formed on the first border, the second border, the third border, and the fourth border and arranged at a 90-degree angle with reference to a center of each of the multiple first antenna elements; the multiple second antenna elements are positioned in the printed circuit board to be closer to the second surface than the multiple first antenna elements, overlap with, when seen from above the first surface, the multiple first antenna elements one-to-one, configured to generate circular polarization, and include, when seen from above the first surface, a fifth border and a seventh border spaced apart from each other and extending in parallel to each other, a sixth border and an eighth border spaced apart from each other by a distance between the fifth border and the seventh border, and disposed to be perpendicular to the fifth border or the seventh border, and multiple second notches formed on the fifth border, the sixth border, the seventh border, and the eighth border, arranged at a 90-degree angle with reference to the center, and overlapping with at least some of the multiple first notches one-to-one; and the multiple electrical paths are positioned on the printed circuit board and include multiple conductive vias electrically connected to the multiple first antenna elements; the printed circuit board includes a first conductive layer including the multiple first antenna elements, a second conductive layer including the multiple second antenna elements, a first dielectric positioned between the first conductive layer and the second conductive layer, a third conductive layer configured to electrically connect the multiple conductive vias to the wireless communication circuit and positioned in the printed circuit board to be closer to the second surface than the second conductive layer, a fourth conductive layer including a ground plane and positioned in the printed circuit board to be closer to the second surface than the third conductive layer, and a second dielectric positioned between the third conductive layer and the fourth conductive layer and having a greater dielectric constant than the first dielectric; each of the multiple second antenna elements includes a hole; each of the multiple conductive vias is positioned to extend through the hole; the multiple second antenna elements are configured to be indirectly fed by the multiple conductive vias; and the multiple first notches have different shapes from the multiple second notches.
Inventor(s): Hareesh A V of Bengaluru (IN) for samsung electronics co., ltd., Pradipta Patra of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H02M1/00, H02M1/32, H02M3/158
CPC Code(s): H02M1/009
Abstract: a method for operating multiple output switching converters includes determining, by a pulse width modulation (pwm) duty split controller, a plurality of balanced reference signals including a first balanced reference signal and a second balanced reference signal, generating, by the pwm duty split controller, based on the plurality of balanced reference signals, a third balanced reference signal, the generating of the third balanced reference signal including limiting, using a limiter, the first balanced reference signal and the second balanced reference signal and accumulating the limited first balanced reference signal and the limited second balanced reference signal, using an accumulator, and operating, by the pwm duty split controller, a first switch and a plurality of second switches associated with the multiple output switching converters, based on the plurality of balanced reference signals, the third balanced reference signal, and one or more circuit parameters.
Inventor(s): Hyunsang KANG of Suwon-si (KR) for samsung electronics co., ltd., Juho VAN of Suwon-si (KR) for samsung electronics co., ltd., Yongjun AN of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Yohan MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/52, H03F1/02, H03F3/24, H04B1/04
CPC Code(s): H03F1/52
Abstract: according to an embodiment, an electronic device may include: a first modulator, a second modulator, a first power amplifier (pa) electrically connected to the first modulator and the second modulator through a switch, and at least one processor, comprising processing circuitry, operatively connected to the first pa, the first modulator, and the second modulator, wherein the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to: activate the first modulator and the second modulator, based on identifying a first event associated with satellite communication, supply power of a first voltage or higher to the first pa, based on controlling at least one switch among a plurality of switches included in each of the activated first modulator and second modulator, and activate a ground switch connected to a ground included in any one modulator of the first modulator or the second modulator, based on a first period, based on a first signal associated with the satellite communication being input to the first pa supplied with the power.
Inventor(s): Hyochang Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K5/02, H03F1/26, H03F3/45, H03K3/0233, H03K5/08
CPC Code(s): H03K5/02
Abstract: disclosed is a differential chopper comparator, which includes an input terminal circuit that receives a first input signal and a second input signal and selectively switches the first and second input signals to intermediate circuit, at least one chopper circuit that generates a first amplified signal and a second amplified signal by amplifying a difference between the first and second input signals at the intermediate circuit points, a comparison circuit that compares the first amplified signal with the second amplified signal, digitizes the comparison result, and outputs a digital signal at a logic level, and a compensation circuit that offsets the first amplified signal and the second amplified signal and thereby removes kickback noise induced in the input terminal circuit. the differential chopper comparator of the present disclosure may shorten the settling time and may operate at high speed.
Inventor(s): Hyohyun NAM of Suwon-si (KR) for samsung electronics co., ltd., Jungsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Daeyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Heesung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H04B1/04
CPC Code(s): H04B1/0078
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a low noise amplifier (lna) in a wireless communication system according to an embodiment of the disclosure includes a first transistor and a first feedback transformer in which a gate of the first transistor is connected to a primary coil of the first feedback transformer and a source of the first transistor is connected to a secondary coil of the first feedback transformer. the first feedback transformer is configured to implement positive feedback to maintain an in-phase signal at the gate of the first transistor and the source of the first transistor.
Inventor(s): Jaehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheolhong SON of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/40, H01Q1/24, H01Q5/50
CPC Code(s): H04B1/40
Abstract: according to various embodiments, an electronic device may include: a housing comprising a conductive portion and non-conductive portion forming a portion of an exterior side surface, a circuit board disposed in the housing, a communication circuit disposed on the circuit board, and a connection circuit board electrically connecting the communication circuit to the conductive portion, wherein the connection circuit board may comprise a first layer including a conductive area and a non-conductive area, the non-conductive area being located within a proximity of the non-conductive portion, and the communication circuit may be configured to transmit or receive signals via the conductive portion.
Inventor(s): JOOIK CHUNG of SUWON-SI (KR) for samsung electronics co., ltd., BYUNG-WOOK MIN of SEOUL (KR) for samsung electronics co., ltd., YOUNGJOO LEE of SEOUL (KR) for samsung electronics co., ltd., JUNHYEOK YANG of SUWON-SI (KR) for samsung electronics co., ltd., JOUNG HYUN YIM of SUWON-SI (KR) for samsung electronics co., ltd., CHANYOUNG JEONG of SUWON-SI (KR) for samsung electronics co., ltd., MICHAEL CHOI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H01Q3/26
CPC Code(s): H04B7/0617
Abstract: an antenna device includes an antenna array including a plurality of first antenna elements, arranged in a 2-by-2 array, a plurality of second antenna elements arranged in a 2-by-2 array, a first switching circuit, a second switching circuit connected to the first switching circuit and the first antenna elements, a third switching circuit connected to the first switching circuit and the second antenna elements, and a processor connected to the switching circuits. the processor is configured to control at least one of the switching circuits to operate in a single mode, among the plurality of modes, based on a single beam pattern among a plurality of predetermined beam patterns and to feed power to the antenna array through the first switching circuit, the second switching circuit, and the third switching circuit, to transmit a signal having the beam pattern.
Inventor(s): R A Nadisanka Perera Rupasinghe of Mckinney TX (US) for samsung electronics co., ltd., Yang Li of Plano TX (US) for samsung electronics co., ltd., Thuy Van Nguyen of Dallas TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00
CPC Code(s): H04B7/0639
Abstract: a method of operating a network entity includes receiving, from a ue, via a first trp and a second trp, a srs, and estimating a channel based on the received srs. the method further includes, for n iterations: transmitting, via the first trp, a csi-rs with a first polarization; transmitting, via the second trp, the csi-rs with a second polarization and a controlled phase offset; receiving, from the user equipment ue, a pmi report associated with the csi-rs including co-phasing information between the first polarization and the second polarization; and updating the controlled phase offset, based on the co-phasing information. after the n iterations, the method further includes, based on the controlled phase offset and the co-phasing information, determining a phase mis-match for phase calibration between the first trp and the second trp.
Inventor(s): Chance Anthony Tarver of Arlington TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd., Shadi Abu-Surra of Plano TX (US) for samsung electronics co., ltd., Won Suk Choi of McKinney TX (US) for samsung electronics co., ltd., Young Han Nam of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0426, H04B17/12, H04B17/21
CPC Code(s): H04B7/0686
Abstract: a hybrid mimo system comprises n digital transceiver chains and n analog beamformers, each coupled to one of the digital transceiver chains and comprising m analog transmitter (tx) chains and m analog receiver (rx) chains. one of the analog rx chains is an rx reference node and one of the analog tx chains is a tx reference node. a processor is coupled to a calibration transceiver, the transceiver chains, and the beamformers. for each beamformer the processor measures, using the corresponding transceiver chain and the calibration transceiver, tx and rx phase responses and tx and rx magnitude responses of the tx and rx reference nodes, respectively, determines a reciprocity calibration based on a phase difference between the tx and rx phase responses and a magnitude difference between the tx and rx magnitude responses, and applies the reciprocity calibration to stored beam definitions to correct for the phase and magnitude differences.
Inventor(s): Ahmad AlAmmouri of Richardson TX (US) for samsung electronics co., ltd., Rajesh Kumar Mishra of Dallas TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Young Han Nam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0426, H04B7/0452, H04L5/00
CPC Code(s): H04B7/06952
Abstract: a method includes selecting a set of orthogonal beams to be used for srs full-channel reconstruction in a multi-user multiple-input multiple-output (mu-mimo) system. the method also includes generating an analog precoding matrix for hybrid analog-digital precoding in the mu-mimo system. the method further includes communicating with multiple users using the mu-mimo system and the analog precoding matrix.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd., Yi WANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L1/1812, H04L5/00, H04W72/21, H04W72/23, H04W76/27
CPC Code(s): H04L1/1812
Abstract: a method performed by a terminal in a wireless communication system is provided, the method includes receiving, from a base station, a sidelink configured grant for a sidelink transmission, transmitting, to another terminal, a sidelink signal based on the sidelink configured grant, generating a second hybrid automatic repeat request (harq) acknowledgement (harq-ack) information based on whether first harq-ack information corresponding to the sidelink signal is received from the another terminal, and reporting on an uplink channel, to a base station, the second harq-ack information.
Inventor(s): Seyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Byungseung Kim of Suwon-si (KR) for samsung electronics co., ltd., Gowoon Yang of Suwon-si (KR) for samsung electronics co., ltd., Heesu Im of Suwon-si (KR) for samsung electronics co., ltd., Eun-Jun Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W28/06, H04W80/06
CPC Code(s): H04L5/0053
Abstract: the communication device includes: an interface configured to receive packets; and at least one processing core configured to: based on first network information satisfying a first condition, identify transmission control protocol (tcp) session information and acknowledgment (ack) numbers of a plurality of first ack packets that are read from the interface during an aggregation period, transmit a second ack packet having a greatest ack number among a plurality of second ack packets on an uplink, the plurality of second ack packets having same tcp session information among the plurality of first ack packets, and discard remaining second ack packets among the plurality of second ack packets.
Inventor(s): Myeongjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Wookbong Lee of San Jose CA (US) for samsung electronics co., ltd., Jinmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Eunsung Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/51, H04W84/12
CPC Code(s): H04L5/0064
Abstract: a wireless communication method of a first device, includes: receiving, from a second device through a channel having a bandwidth of 20 megahertz (mhz), a physical layer protocol data unit (ppdu), based on a non-orthogonal frequency-division multiple access (non-ofdma); based on values of a plurality of fields being related to resource allocation of the channel and included in a signal field of a preamble included in the ppdu, identifying whether a multi-resource unit (mru) to replace a resource unit (ru) including a 242-tone is allocated to the first device; and based on a result of the identifying, decoding a payload included in the ppdu.
Inventor(s): Jungyeong SEO of Suwon-si (KR) for samsung electronics co., ltd., Jooyeol Yang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/03, H03M13/39, H04L1/00
CPC Code(s): H04L25/03318
Abstract: an operating method of a modem chip includes receiving a first euclidean distance (ed) set including an ed of first symbol vector candidates, comparing magnitudes of the eds of the first ed set, calculating each of a first minimum ed corresponding to a bit value of a first bit being 1 and a second minimum ed corresponding to the bit value of the first bit being 0, the first bit being from among a plurality of bits of a plurality of layers of the transmission symbol, based on first index information including results of the comparing the magnitudes of the eds of the first ed set, updating the first minimum ed and the second minimum ed with a smallest first minimum ed and a smallest second minimum ed, respectively, and detecting the transmission symbol based on the updated first minimum ed and the updated second minimum ed.
Inventor(s): Jaijin LIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyoup HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L41/5009, H04W24/08
CPC Code(s): H04L41/5009
Abstract: a method performed by a central unit-user plane (cu-up) in a wireless communication system is provided. the method includes receiving information related to packet transmission from a user plane function (upf), the information related to the packet transmission including a quality of service (qos) flow provided, a slice provided with the qos flow, an indicator indicating a terminal for receiving the qos flow and a time parameter related to latency quality measurement, identifying a quality measurement value based on the received information related to the packet transmission, updating the received information related to the packet transmission based on the identified quality measurement value, and transmitting the updated information related to the packet transmission to a distributed unit (du).
Inventor(s): Russell Ford of Campbell CA (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04L43/045, H04L41/142, H04L43/55
CPC Code(s): H04L43/045
Abstract: methods and apparatuses for automating configuration management in cellular networks. a method of a computing device comprises: assigning, based on a correlation analysis, contexts to different time intervals of data, wherein the correlation analysis is performed based on historic time-series data; grouping, based on the assigned contexts, the historic time-series data; identifying context and compute an anomaly score comparing new data and the grouped historic-time series data of the context; indicating an event of anomaly based on a determination that the computed anomaly score exceeds a first threshold that is identified based on a function of per-context data; and computing, based on the event of the anomaly, an aggregate anomaly score or indicate using a value of mean or moving average of a set of latest anomaly scores, for a context-based multivariate anomaly detection.
Inventor(s): Kiran Gurudev KAPALE of Bangalore (IN) for samsung electronics co., ltd., Arunprasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L67/06, H04L67/12
CPC Code(s): H04L67/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a method for handling non-mandatory download procedure for fd over a media plane in a mcdata network () by at least one terminating mcdata client device (). the method includes receiving a mcdata fd request comprising a non-mandatory download indication for file download from a mcdata server (). further, the method includes generating the user consent for the file download.
Inventor(s): Stanislav PEDAN of Kyiv (UA) for samsung electronics co., ltd., Oleg KOPYSOV of Kyiv (UA) for samsung electronics co., ltd., Oleksandr POPOV of Kyiv (UA) for samsung electronics co., ltd., Oleksandr CHALYI of Kyiv (UA) for samsung electronics co., ltd., Andrii ASTRAKHANTSEV of Kyiv (UA) for samsung electronics co., ltd.
IPC Code(s): H04M1/72463, G06F3/0346, H04M1/02
CPC Code(s): H04M1/724631
Abstract: a foldable device and method for executing an application are provided. the foldable device includes a motion sensor, memory storing one or more computer programs, and one or more processors communicatively coupled to the motion sensor and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the foldable device to receive, via the motion sensor, a user input for unfolding the foldable device, in response to receiving the user input for unfolding the foldable device, identify, based on sensor values from the motion sensor of the foldable device, a user who has unfolded the foldable device from among at least one user registered with the foldable device, and provide an application for the foldable device based on the identified user.
Inventor(s): Jinwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sujin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seungkwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kyoungjong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/51, H04N23/55, H04N23/57
CPC Code(s): H04N23/51
Abstract: an electronic device is provided. the electronic device includes a housing including a support member and a rear plate, a camera support member disposed between the support member and the rear plate, a camera module disposed on the support member, a camera window covering at least a part of the camera module, and a compression member disposed between the camera window and the camera module. the camera module may include a first area facing the camera support member, a second area facing the compression member, and a third area facing the camera window and at least partially surrounded by the compression member.
Inventor(s): Liubov Vladimirovna STEPANOVA of Angarsk (RU) for samsung electronics co., ltd., Vladimir Petrovich BOGACHEV of Moscow (RU) for samsung electronics co., ltd., Maxim Alexeevich SHIKUNOV of Moscow (RU) for samsung electronics co., ltd., Aleksandr Aleksandrovich KHAKHMOVICH of Moscow (RU) for samsung electronics co., ltd., Kira Sergeevna KIRILLOVA of Moscow Oblast (RU) for samsung electronics co., ltd., Petr POHL of Lobnya (RU) for samsung electronics co., ltd.
IPC Code(s): H04N23/667, G06T7/246, G06T7/593, H04N23/61
CPC Code(s): H04N23/667
Abstract: according to an embodiment of the disclosure, the method may include obtaining an image of a scene including an object of interest to be tracked in at least one camera mode, obtaining image data of at least two consecutive frames in the at least one camera mode based on the image, estimating a disparity and a reliability of the scene including the object of interest based on the image data, estimating a camera-to-object distance based on the disparity and the reliability, switching the camera mode based on the camera-to-object distance.
Inventor(s): Kioh JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jiyeon JO of Suwon-si (KR) for samsung electronics co., ltd., Dongyoul PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungpa SEO of Suwon-si (KR) for samsung electronics co., ltd., Soonkyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/68
CPC Code(s): H04N23/687
Abstract: according to an embodiment of the disclosure, an electronic device may include: a camera module including an optical image stabilization (ois) driver which is shiftable within an ois driving range; and at least one processor electrically connected with the camera module. the at least one processor may control the camera module to fix the ois driver at a position that is biased away from a center of the ois driving range in a first direction, may obtain image frames through the camera module while fixing the ois driver, and may obtain a moving image by performing at least one of video digital image stabilization (vdis) or electronic image stabilization (eis) with respect to the image frames. various other embodiments that are understood through the specification are possible.
Inventor(s): MANISH GOEL of BENGALURU (IN) for samsung electronics co., ltd., GIRISH KALYANASUNDARAM of BENGALURU (IN) for samsung electronics co., ltd., PUNEET PANDEY of BENGALURU (IN) for samsung electronics co., ltd., MANJIT HOTA of BENGALURU (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/80
CPC Code(s): H04N23/80
Abstract: a method of performing image signal processing includes: determining whether at least one neighbor pixel is available for each of a plurality of current pixels in a current block, wherein each of the plurality of current pixels has a current pixel value; estimating a predict pixel value for each of the plurality of current pixels in the current block based on a pixel value of the at least one neighbor pixel corresponding to each of the plurality of current pixels, using at least one of a plurality of predefined prediction modes; determining a difference metric between the predict pixel value and the current pixel value for each of the plurality of current pixels; and obtaining a processed pixel value for each of the plurality of current pixels based on the difference metric.
Inventor(s): Chang Hoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunyup Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jaeuk Ahn of Suwon-si (KR) for samsung electronics co., ltd., Yongmi Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungwon Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/683
CPC Code(s): H04N25/683
Abstract: a defective pixel correction device is provided. the defective pixel correction device includes: a pixel grading circuit configured to output a grade map including a plurality of grades indicating defect levels and respectively corresponding to a plurality of pixels included in an input image; a pixel selection circuit configured to select one or more candidate pixels from among the plurality of pixels, based on whether the plurality of grades correspond to a correction level, in the grade map; and a correction circuit configured to correct the one or more candidate pixels.
Inventor(s): JINHWA HAN of Suwon-si (KR) for samsung electronics co., ltd., HEESANG KWON of Suwon-si (KR) for samsung electronics co., ltd., WONCHUL CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/78, H04N25/46, H04N25/772
CPC Code(s): H04N25/78
Abstract: a pixel array includes: unit pixel groups; and two column lines provided for each column. each of the unit pixel groups includes rows, a first pixel group comprising a plurality of pixels, a second pixel group comprising a plurality of pixels. the first pixel group and the second pixel group are arranged in a row direction. a pixel signal is output by simultaneously reading out: unit pixel groups that are connected to a first column line and that do not share a first floating diffusion region, and unit pixel groups that are connected to a second column line different from the first column line and that do not share a second floating diffusion region. at least one of the first floating diffusion region and the second floating diffusion region is between a dual conversion transistor and a reset transistor.
Inventor(s): Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W4/90, H04W12/06, H04W74/08
CPC Code(s): H04W4/90
Abstract: a wireless communication network includes an access point (ap) device, the ap device may receive an emergency preparedness communication services (epcs) authorization status for one or more station (sta) devices; and transmit a frame including the epcs authorization status to the one or more sta devices, wherein the frame has higher priority for transmission than a frame for non-epcs.
Inventor(s): Sujung KANG of Suwon-si (KR) for samsung electronics co., ltd., Kangjin YOON of Suwon-si (KR) for samsung electronics co., ltd., Duckey LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/18
CPC Code(s): H04W8/183
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure relates to a method performed by a first device in a wireless communication system, the method comprises transmitting, to a terminal, a first message for a request of a process of a profile, receiving, from the terminal, a second message including a result of the process of the profile, generating a bound profile package (bpp) loading report based on the result of the process of the profile, and transmitting, to a profile server, the bpp loading report, wherein the bpp loading report is generated based on a profile order identity (id).
Inventor(s): Sujung KANG of Suwon-si (KR) for samsung electronics co., ltd., Duckey LEE of Suwon-si (KR) for samsung electronics co., ltd., Jonghoe KOO of Suwon-si (KR) for samsung electronics co., ltd., Kangjin YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/18, H04W8/22, H04W12/45
CPC Code(s): H04W8/183
Abstract: the disclosure relates to 5g or 6g communication systems to support a higher data rate after 4g communication systems, e.g., lte. the disclosure provides a method performed by a user equipment (ue) in a wireless communication system, the method comprising: receiving, by a modem from an embedded universal integrated circuit card (euicc), a first message including at least one of information related to whether euicc functionality is supported and information related to whether multiple enabled profiles (meps) are supported; and determining, by the modem, to operate with an mep function based on at least one of the received information related to whether the euicc functionality is supported and information related to whether the meps are supported. further, various embodiments of the disclosure provide a method and device for providing a dual-sim function even in a ue equipped with a single euicc in a wireless communication system.
Inventor(s): Kangjin YOON of Suwon-si (KR) for samsung electronics co., ltd., Jonghan PARK of Bucheon-si (KR) for samsung electronics co., ltd., Duckey LEE of Seoul (KR) for samsung electronics co., ltd., Sangsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyewon LEE of Seoul (KR) for samsung electronics co., ltd., Jinkyu HAN of Yongin-si (KR) for samsung electronics co., ltd., Sujung KANG of Suwon-si (KR) for samsung electronics co., ltd., Youngsun RYU of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04L67/303, H04W4/50, H04W4/70, H04W88/02
CPC Code(s): H04W8/245
Abstract: the present disclosure relates to a communication scheme and system for the convergence of a 5g communication system for supporting a higher data transfer rate after the 4g system and the iot technology. the present disclosure may be applied to intelligent services (e.g., a smart home, a smart building, a smart city, a smart car or connected car, healthcare, digital education, retain business, security and safety-related service) based on the 5g communication technology and iot-related technology. the present disclosure provides methods and apparatus for supporting a profile transfer between terminals and methods and apparatus for supporting easy use of a communication product.
Inventor(s): Samuel Albert of Robbinsville NJ (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/02
CPC Code(s): H04W24/02
Abstract: a method includes partitioning a set of configuration management (cm) data for one or more cellular network devices into multiple distinct time intervals. the method also includes determining one or more temporal points of interest in each time interval based on whether cm changes exist during that time interval. the method also includes, for each temporal point of interest in each time interval, identifying a first set of data samples before that temporal point of interest and a second set of data samples after that temporal point of interest, and averaging features and a target key performance indicator (kpi) in the first set of data samples and in the second set of data samples. the method also includes performing regression analysis to determine an impact of the features on the target kpi.
Inventor(s): Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Yeongeun LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W8/22, H04W24/08
CPC Code(s): H04W24/02
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system is provided. the method includes transmitting, by the ue to a base station, capability information indicating a set of artificial intelligence (ai)/machine learning (ml) functionalities, receiving, by the ue from the base station, configuration information associated with an ai/ml inference, wherein the configuration information indicates at least one of a measurement configuration or a reporting configuration, receiving, by the ue from the base station, information to indicate activation of an ai/ml functionality, and performing, by the ue, an ai/ml based operation based on the configuration information.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/04, H04W40/02, H04W84/04
CPC Code(s): H04W24/04
Abstract: a method performed by a network controlled repeater (ncr) including an ncr mobile termination (ncr-mt) and an ncr forwarding (ncr-fwd) in a wireless communication system is provided. the method includes receiving, by the ncr-mt, side control information from a base station, detecting a beam failure for the ncr-mt, ceasing, by the ncr-fwd, a forwarding based on a detection of the beam failure, identifying a completion of a beam failure recovery, and resuming the forwarding using the side control information received before the detection of the beam failure based on the completion of the beam failure recovery.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04L67/131, H04W76/38
CPC Code(s): H04W28/0268
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein is to provide a method for handling packet discard for extended reality in wireless communication network. the method includes receiving a configuration message including information of a first discard timer for low importance, a second discard timer, and a pdu set discard parameter, wherein the first discard timer is set to a value that is shorter than a value of the second discard timer, obtaining at least one packet data convergence protocol (pdcp) service data unit (sdu) from at least one upper layer, and performing, for the at least one pdcp sdu, a transmit operation including a pdcp sdu discard based on the first discard timer, the second discard timer, and the pdu set discard parameter.
Inventor(s): Sunghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W28/24, H04W36/00, H04W36/14
CPC Code(s): H04W28/0268
Abstract: the disclosure relates to a method and apparatus for monitoring and changing information about quality of service (qos) allowed to be supported to a user equipment (ue) in a mobile communication system, and an operating method of a target base station (bs) in the mobile communication system includes receiving, from a source bs, alternative quality of service (qos) profile (aqp) information, determining whether information matching qos information allowed to be supported for a ue to be served is included in the aqp information, and when the information matching the qos information allowed to be supported for the ue to be served is included in the aqp information, transmitting the matching information to an access and mobility management function (amf).
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04B17/318, H04W56/00, H04W72/1268
CPC Code(s): H04W36/00725
Abstract: methods and apparatuses for a rach-less handover for a mobility operation in a wireless communication system. a method of a ue comprises: receiving a first message including configuration information for a rach-less ho; determining whether the configuration information includes the cg configuration or the beam indication; identifying: a cg pusch occasion based on a determination that the configuration information includes the cg configuration, or a tci state id or a ssb index based on a determination that the configuration information includes the beam indication; and transmitting, to the target cell: an uplink signal including a second message in response to the first message at the identified cg pusch occasion when the configuration information includes the cg configuration, or the uplink signal based on an uplink grant received in a pdcch, the pdcch being monitored based on the beam indication when the configuration information includes the beam indication.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/04, H04W36/00, H04W36/24
CPC Code(s): H04W36/04
Abstract: a method performed by a terminal in a communication system is provided. the method includes receiving, from a gnodeb (gnb), a radio resource control (rrc) message including at least one layer /layer triggered mobility (ltm) candidate configuration, receiving, from the gnb, a medium access control (mac) control element (ce) associated with an ltm, identifying that an ltm is triggered based on the mac ce, and applying an ltm candidate configuration for the ltm in case that the ltm candidate configuration includes information indicating that the ltm candidate configuration is a complete configuration.
Inventor(s): Koustav ROY of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Jagadeesh GANDIKOTA of Bangalore (IN) for samsung electronics co., ltd., Krishnamurthy D R of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W40/24, H04W60/00
CPC Code(s): H04W40/24
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the principal object of the embodiments herein is to disclose methods and systems for evaluating and re-evaluating a user-equipment route selection policy (ursp) rule in a wireless network. a method for re-evaluating at least one user-equipment route selection policy (ursp) rule in a wireless network, the method comprising: initiating, by a user equipment (ue), re-evaluation of the at least one usrp rule; and checking, by the ue, for a correct route selection descriptor (rsd) for an application, on one of the ue moving to a tracking area (ta) where single-network slice selection assistance information (s-nssai) is allowed, and the ue receiving a partially allowed network slice selection assistance information (nssai).
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan Hashmi of Bangalore (IN) for samsung electronics co., ltd., Jagadeesh Gandikota of Bangalore (IN) for samsung electronics co., ltd., Krishnamurthy D R of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar Nayak of Bangalore (IN) for samsung electronics co., ltd., Koustav Roy of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/04
CPC Code(s): H04W48/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. methods and systems are provided in which control plane data is blocked for partially allowed network slice selection assistance information (nssai) and network slice area of service (ns-aos) when a user equipment (ue) is in an area/cell/tracking area (ta) where the s-nssai is not available/supported. the ue initiates the nas transport procedure for a cellular internet of things (ciot) user data container when the ue is in an area/cell/ta where the s-nssai is not available/supported of ns-aos area. the ue initiates the nas transport procedure for the ciot user data container when the ue is in an area/cell/ta where the s-nssai is not available/supported of s-nssai supported area.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Chen QIAN of Beijing (CN) for samsung electronics co., ltd., Yingjie ZHANG of Beijing (CN) for samsung electronics co., ltd., Bin YU of Beijing (CN) for samsung electronics co., ltd., Qi XIONG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W52/14, H04L5/00, H04W52/36, H04W72/23, H04W80/08
CPC Code(s): H04W52/146
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides a method for uplink power control, which is applied to a user equipment (ue), and the method includes: determining a timing between a power control command and a physical uplink control channel (pucch), which adopts the power control command to control power. the present disclosure also provides a corresponding device.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04B17/318, H04B17/336, H04L27/10, H04W76/28
CPC Code(s): H04W56/0015
Abstract: apparatuses and methods for measurement based on a low power signal. a method of a user equipment (ue) in a wireless communication system includes determining an on off keying (ook) waveform for a low-power synchronization signal (lp-ss) and determining, based on the lp-ss, at least one of a lp-ss reference signal received power (lp-rsrp), a lp-ss reference signal received quality (lp-rsrq), a lp-ss received signal strength indicator (lp-rssi), and a lp-ss signal to noise and interference ratio (lp-sinr). the determined at least one of the lp-rsrp, the lp-rsrq, the lp-rssi, and the lp-sinr is based on segments with non-zero values in the ook waveform of the lp-ss. the method further includes performing a first radio resource management (rrm) measurement based on the lp-ss using a low-power receiver (lr) of the ue.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L1/1812, H04L5/00, H04W74/0833, H04W76/20, H04W80/02
CPC Code(s): H04W56/0045
Abstract: methods and apparatuses for a multiple timing advance groups for a multi-trp operation in a wireless communication system. a method of a ue comprises: determining whether a serving cell is configured with more than one tag and a timer of a tag associated with a tci state stops or expires for a first harq feedback in a first harq process on the serving cell or a second harq feedback in a second harq process on the serving cell; determining to not generate a first indication indicating a lower layer to generate an ack corresponding to a data transmission in a tb in the first harq process; and determining to not generate a second indication indicating the lower layer to generate an ack corresponding to a data transmission in a tb in the second harq process when the serving cell is configured with a sl-pucch-config.
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Koustav ROY of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Jagadeesh GANDIKOTA of Bangalore (IN) for samsung electronics co., ltd., Krishnamurthy D R of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W60/06
CPC Code(s): H04W60/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments disclosed herein provide method for managing a network slice selection assistance information (nssai) list in a wireless network by a ue. the method includes receiving at least one event. the at least one event includes: receiving a deregistration request message from a network function (nf) entity, performing a deregistration event at the ue, or successfully completing a tracking area update procedure, a successful registration procedure, or an unsuccessful registration procedure. further, the method includes deleting: a partially rejected nssai list or a partially allowed nssai list based on the at least one received event.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W48/16, H04W72/0457
CPC Code(s): H04W72/0446
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method and apparatus of ue for supporting a higher date transmission rate. the method of ue comprises: receiving, from a base station, cell group configuration information including first information indicating a maximum number of uplink (ul) slots for denying an ul transmission; counting a number of denied ul slots within a same cell group; and in case that the counted number of denied ul slots is less than the maximum number of the ul slots indicated by the first information, denying the ul transmission in a ul slot.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/231, H04L1/1812, H04W72/1268, H04W76/20
CPC Code(s): H04W72/231
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system is provided. the method includes receiving a medium access control (mac) control element (ce), wherein the mac ce maps transmission configuration indication (tci) states to codepoints of a tci field in downlink control information (dci), receiving the dci including the tci field, and identifying, based on the mac ce, whether at least one of a first tci state of the ue and a second tci state of the ue is updated by a codepoint of the tci field in the received dci, and in case that one of the first tci state and the second tci state is identified as updated by the codepoint, updating the one of the first tci state and the second tci state that is identified as updated by the codepoint, and keeping other of the first tci state and the second tci state that is identified as not updated by the codepoint.
Inventor(s): Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Younsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04L5/14
CPC Code(s): H04W74/0833
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment of the present disclosure, a method performed by user equipment of a wireless communication system is provided. the method comprises the steps of: receiving, from a base station, first configuration information related to time division duplex (tdd), and second configuration information related to duplex in which some frequency resources corresponding to downlink time resources are used for an uplink; identifying at least one valid physical random access channel (prach) transmission occasion on the basis of the first configuration information and the second configuration information; and transmitting, on the basis of the at least one valid prach occasion, a random access preamble to the base station.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04B7/155, H04L41/0806, H04W28/02, H04W72/20, H04W72/56, H04W80/02
CPC Code(s): H04W76/15
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). according to the present application, a method for transmitting control signaling in a relay network comprises: a second relay node acquires a first control signaling and a second control signaling, wherein the first control signaling contains an f1ap message; the second relay node processes the first control signaling and the second control signaling in the same manner or different manners; and the second relay node transmits the first control signaling and the second control signaling to a first relay node.
20240334522. BEAM FAILURE RECOVERY IN SIDELINK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Dalin Zhu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W24/08, H04W72/40
CPC Code(s): H04W76/19
Abstract: methods and apparatuses for beam failure recovery in sidelink (sl). a method of operating a user equipment (ue) includes receiving, from a second ue a first instance of a first sl channel and m sl signals for identification of new beams, where m>1 and measuring a metric based on the first sl channel. the method further includes declaring, based on the metric, a beam failure; identifying, based on the declaration of the beam failure, a sl signal from the m sl signals for identification of a new beam; and transmitting a second sl channel with a first beam indication based on the sl signal.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd., Byounghoon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04B7/155
CPC Code(s): H04W76/19
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a network-controlled repeater (ncr) node in a wireless communication system is provided. the method includes determining, by an ncr-mobile termination (ncr-mt) entity of the ncr node, degradation of a backhaul link beam, while the ncr-mt entity is in inactive state, based on the determination, ceasing, by an ncr-forwarding (ncr-fwd) entity of the ncr node, amplifying and forwarding of radio frequency (rf) signals, and performing, by the ncr-mt entity, a connection resume procedure.
Inventor(s): Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04W8/22, H04W28/06, H04W80/02
CPC Code(s): H04W76/20
Abstract: the disclosure relates to a 5th generation (5g) communication system or a 6th generation (6g) communication system for supporting higher data rates. more particularly, the disclosure relates to a method performed by a terminal in a communication system comprising receiving, from a base station, a radio resource control (rrc) message including a first value of a first timer and a second value of a second timer for low importance; receiving, from the base station, a medium access control (mac) control element (ce) for activating a protocol data unit (pdu) set importance (psi) based discard; starting the second timer based on reception of a packet data convergence protocol (pdcp) service data unit (sdu) belonging to a low importance pdu set; and discarding the pdcp sdu belonging to the low importance pdu set based on an expiration of the second timer.
Inventor(s): Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/27, H04W76/10
CPC Code(s): H04W76/27
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, first system information including information on at least one stand-alone non-public network (snpn), receiving, from the base station, second system information including information on a first list of at least one group identifier for network selection (gin) to support an access using credentials from a credentials holder or to enable a ue onboarding and information on a second list of associations between the at least one gin and the at least one snpn in the first system information, selecting an snpn based on the first system information and the second system information; and performing, with the base station, a radio resource control (rrc) establishment for the selected snpn.
Inventor(s): Naveen KOLATI of Bangalore (IN) for samsung electronics co., ltd., Vinayak GOYAL of Bangalore (IN) for samsung electronics co., ltd., Kiran Gurudev KAPALE of Bangalore (IN) for samsung electronics co., ltd., Siva Prasad GUNDUR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/50, H04N21/6332, H04W76/38
CPC Code(s): H04W76/50
Abstract: the disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a system and a method to handle media transmission in the mission critical (mc) systems or mc video system are provided. according to the system and the method, wastage of network resources can be avoided and other participants in the group can be given chance to transmit important data as maximum number of transmissions at a time in a group call are limited by network capacity. accordingly, efficiency of the mc video system can be improved.
Inventor(s): Jichul KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeheung YE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwangho JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K1/14, H05K1/18, H05K7/20
CPC Code(s): H05K1/0203
Abstract: an electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.
Inventor(s): Ki Seok LEE of Suwon-si (KR) for samsung electronics co., ltd., Hong Jun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun Geun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Keun Nam KIM of Suwon-si (KR) for samsung electronics co., ltd., In Cheol NAM of Suwon-si (KR) for samsung electronics co., ltd., Bo Won YOO of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/038
Abstract: a semiconductor device includes a lower substrate, a memory cell structure including a wordline on the lower substrate, a bitline disposed on the lower substrate and intersecting the wordline, and a cell capacitor connected to the lower substrate, an upper substrate having a back side adjacent to the lower substrate and a front side opposite to the back side, a circuit element disposed on the front side of the upper substrate and overlapping the memory cell structure in a vertical direction, and a through via penetrating the upper substrate and electrically connecting the memory cell structure and the circuit element with each other.
20240334677. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Ilgweon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoongi HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device includes a bit line, first and second word lines spaced apart from each other on the bit line, a back gate electrode between the first and second word lines, a first active pattern between the first word line and the back gate electrode, a second active pattern between the second word line and the back gate electrode, contact patterns connected to the first and second active patterns, respectively, and a first gate insulating pattern between the first active pattern and the first word line and between the second active pattern and the second word line. a top surface of the first gate insulating pattern is located at substantially a same height as top surfaces of the first and second word lines. the first gate insulating pattern includes a high-k dielectric material.
20240334678. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jong In KANG of Hwaseong-si (KR) for samsung electronics co., ltd., Jun Young CHOI of Seoul (KR) for samsung electronics co., ltd., Yoon Gi HONG of Seoul (KR) for samsung electronics co., ltd., Tae Hoon KIM of Seoul (KR) for samsung electronics co., ltd., Sung-Jin YEO of Yongin-si (KR) for samsung electronics co., ltd., Sang Yeon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device is provided. the semiconductor device includes a substrate which includes a cell region and a core region, a boundary element separation film which is placed inside the substrate, and separates the cell region and the core region, and a bit line which is placed on the cell region and the boundary element separation film and extends along a first direction, in which the boundary element separation film includes a first region and a second region, a height of an upper side of the first region of the boundary element separation film is different from a height of an upper side of the second region of the boundary element separation film, on a basis of a bottom side of the boundary element separation film, and the bit line is placed over the first region and the second region of the boundary element separation film.
Inventor(s): MYUNGHUN JUNG of Suwon-si (KR) for samsung electronics co., ltd., KYUWON WOO of Suwon-si (KR) for samsung electronics co., ltd., DONGHWA SHIN of Suwon-si (KR) for samsung electronics co., ltd., SUNG-JIN YEO of Suwon-si (KR) for samsung electronics co., ltd., HO-IN RYU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a substrate including a cell block region and a peripheral region adjacent to each other in a first direction, first and second active patterns adjacent to each other in a second direction that is different from the first direction on the cell block region, a first bit line extending in the first direction on the first active pattern, a second bit line extending in the first direction on the second active pattern, a bit line connector connecting the first bit line and the second bit line to each other and adjacent to the peripheral region, an inner spacer on an inner surface of the bit line connector, and an outer spacer on an outer surface of the bit line connector. the inner spacer extends on (e.g., covers) the inner surface of the bit line connector and extends onto (e.g., continuously extends onto) inner surfaces of the first bit line and the second bit line.
20240334682. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bo Won YOO of Suwon-si (KR) for samsung electronics co., ltd., Seok Han PARK of Suwon-si (KR) for samsung electronics co., ltd., Ki Seok LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun Geun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device with improved integration and electrical characteristics. the semiconductor memory device includes a peri-gate structure, a first peri-connecting structure on the peri-gate structure, a data storage pattern on the first peri-connecting structure, an active pattern that includes a first surface and a second surface opposite to each other in a first direction, and a first side wall and a second side wall opposite to each other in a second direction, the first surface of the active pattern connected to the data storage pattern and facing a substrate, a bit line on the active pattern, connected to the second surface of the active pattern, and extends in the second direction, a word line on the first side wall of the active pattern and extending in a third direction, a second peri-connecting structure connected to the bit line and a connecting pad connected to the second peri-connecting wiring.
20240334684. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Yoongoo Kang of Suwon-si (KR) for samsung electronics co., ltd., Jaehong Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor memory device includes an active pattern on a substrate and at least partially surrounded by a device isolation pattern, a bit line that extends on a center portion of the active pattern in a first direction that is parallel to a bottom surface of the substrate, and a bit line contact between the bit line and the active pattern. the bit line contact includes a metallic material. a width of the bit line contact at a first level and in a second direction is greater than a width of a bottom surface of the bit line contact in the second direction. the second direction intersects the first direction. the first level is between a top surface of the device isolation pattern and the substrate.
20240334699. THREE-DIMENSIONAL MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younghak Son of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwa Yun of Suwon-si (KR) for samsung electronics co., ltd., Chanho Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H01L25/00, H01L25/065, H01L25/18, H10B41/27, H10B80/00
CPC Code(s): H10B43/27
Abstract: an example memory device includes a plurality of memory blocks, each including a cell region and a cell wiring region. at least one memory block includes a wordline pattern portion and a channel structure. the wordline pattern portion is provided in the cell region and the cell wiring region, and includes wordlines spaced apart from each other and stacked in a first direction. the channel structure is provided in the cell region to extend in the first direction. the wordline pattern portion extends a second direction, perpendicular to the first direction, when viewed from above, and has at least one staircase portion including a first staircase pattern, having sequentially descending staircases, and a second staircase pattern, having sequentially ascending staircases. the first staircase pattern and the second staircase pattern are provided in different numbers in the at least one memory block.
Inventor(s): Moorym Choi of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo Paek of Suwon-si (KR) for samsung electronics co., ltd., Sunil Shim of Suwon-si (KR) for samsung electronics co., ltd., Yunsun Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a semiconductor device includes a first semiconductor structure including circuit elements on a first substrate, a lower interconnection structure on the circuit elements, and a lower bonding structure on the lower interconnection structure; and a second semiconductor structure including a second substrate on the first semiconductor structure, separation insulating patterns separating the second substrate, and disposed to be spaced apart from each other, gate electrodes stacked to be spaced apart from each other, separation regions passing through the gate electrodes, and disposed to be spaced apart from each other, channel structures passing through the gate electrodes, an upper interconnection structure below the gate electrodes, and an upper bonding structure bonded to the lower bonding structure, wherein the separation insulating patterns include first separation insulating patterns on the separation regions, and second separation insulating patterns between the channel structures and passing through the second substrate.
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K85/40, H10K50/12
CPC Code(s): H10K85/342
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K85/40, H10K50/12
CPC Code(s): H10K85/342
Abstract:
m(l)(l) formula 1
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K85/40, H10K50/12
CPC Code(s): H10K85/342
Abstract:
Inventor(s): Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Aram Jeon of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yuri Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Seokhwan Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07F15/00, C09K11/06, H10K50/15, H10K50/16, H10K50/17, H10K50/18
CPC Code(s): H10K85/656
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Aram Jeon of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yuri Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Seokhwan Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07F15/00, C09K11/06, H10K50/15, H10K50/16, H10K50/17, H10K50/18
CPC Code(s): H10K85/656
Abstract:
()() formula 1
Inventor(s): Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Aram Jeon of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yuri Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Seokhwan Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07F15/00, C09K11/06, H10K50/15, H10K50/16, H10K50/17, H10K50/18
CPC Code(s): H10K85/656
Abstract: wherein, in formula 1, m, l, l, n1, and n2 may be understood by referring to the descriptions of m, l, l, n1, and n2 respectively as disclosed herein.
Inventor(s): Kwangseok KIM of Seoul (KR) for samsung electronics co., ltd., Seonggeon PARK of Seongnam-si (KR) for samsung electronics co., ltd., Seungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Naoki HASE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/10, G11C11/16, H01F10/32, H10B61/00, H10N50/85
CPC Code(s): H10N50/10
Abstract: provided are a magnetic tunneling junction device having more stable perpendicular magnetic anisotropy (pma) and/or increased operating speed, and/or a memory device including the magnetic tunneling junction device. the magnetic tunneling junction device includes a free layer having a first surface and a second surface opposite the first surface; a pinned layer facing the first surface of the free layer; a first oxide layer between the pinned layer and the free layer; and a second oxide layer on the second surface of the free layer. the free layer includes a magnetic material x doped with a non-magnetic metal. the second oxide layer includes zowhich is an oxide of a metal z. an oxygen affinity of the metal z is greater than an oxygen affinity of the non-magnetic metal x.
Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd.
- A61L2/10
- CPC A61L2/10
- Samsung electronics co., ltd.
- B08B9/087
- A46B13/00
- A46B13/02
- B08B9/46
- CPC B08B9/087
- B65D5/44
- CPC B65D5/44
- B65G47/90
- H01L21/677
- H01L21/687
- CPC B65G47/90
- B66B11/04
- B66B9/00
- B66B9/04
- B66B11/02
- CPC B66B11/0407
- C07C309/58
- C07C309/42
- G03F7/004
- G03F7/029
- G03F7/20
- CPC C07C309/58
- C07F15/00
- H10K50/11
- H10K50/15
- H10K50/16
- H10K85/30
- H10K85/60
- CPC C07F15/0033
- D06F58/22
- B01D46/00
- B01D46/42
- CPC D06F58/22
- D06F73/02
- D06F58/10
- D06F58/20
- CPC D06F73/02
- G01C21/16
- CPC G01C21/1656
- G01D5/20
- G01R19/00
- G01R25/00
- H05B6/12
- CPC G01D5/20
- G01N33/574
- G01N33/50
- CPC G01N33/574
- G01S13/56
- H04B17/309
- CPC G01S13/56
- G02B27/42
- G02B6/34
- G02B27/01
- CPC G02B27/4205
- G05D1/648
- CPC G05D1/648
- G06F1/16
- CPC G06F1/163
- CPC G06F1/1652
- G06F3/041
- G06F3/16
- H04M1/02
- CPC G06F1/1681
- G06F3/01
- G06F3/0488
- G06T11/00
- CPC G06F3/016
- G06F3/038
- G06F3/0354
- CPC G06F3/038
- G06F3/044
- CPC G06F3/0416
- G06F3/04815
- G06T19/00
- G06V40/20
- CPC G06F3/04815
- G06F3/0484
- CPC G06F3/0484
- G06F3/06
- CPC G06F3/0611
- G06F11/30
- CPC G06F3/0616
- CPC G06F3/0632
- CPC G06F3/0655
- CPC G06F3/0659
- G06F1/06
- G11C16/04
- G11C16/10
- G11C16/26
- G11C16/32
- G06F3/14
- G09G3/00
- CPC G06F3/1454
- G06F9/30
- G06F9/38
- G06F16/172
- G06T1/20
- CPC G06F9/30036
- G06F9/455
- CPC G06F9/45558
- G06F9/48
- G06F9/46
- CPC G06F9/4818
- G06F11/20
- CPC G06F11/2094
- G06F11/36
- CPC G06F11/3676
- G06F12/02
- CPC G06F12/023
- G06F12/1009
- G06F16/28
- CPC G06F12/0253
- CPC G06F12/0292
- G06F12/084
- G06F9/54
- CPC G06F12/084
- G06F12/0891
- G06F16/903
- G06F16/93
- CPC G06F12/0891
- G06F12/1027
- CPC G06F12/1027
- G06F16/2453
- CPC G06F16/24545
- G06F16/33
- G06F16/335
- CPC G06F16/334
- G06F21/56
- G06F11/14
- CPC G06F21/566
- G06K7/016
- G06K7/00
- CPC G06K7/0166
- G06K19/073
- CPC G06K19/07354
- G06N3/08
- CPC G06N3/08
- G06N3/084
- G06V10/766
- G06V10/774
- G06V10/776
- G06V10/82
- G06V40/16
- CPC G06N3/084
- G06T3/4053
- G06T3/4046
- CPC G06T3/4053
- G06T7/50
- G06T5/50
- G06V10/141
- G06V10/25
- CPC G06T7/50
- H04B5/72
- H04W64/00
- H05K5/00
- H05K5/02
- CPC G09G3/035
- G10L15/22
- G10L21/02
- CPC G10L15/22
- G10L21/0224
- CPC G10L21/0224
- G11C16/24
- G11C16/30
- G11C29/10
- CPC G11C16/0491
- CPC G11C16/24
- G11C16/34
- G11C16/16
- H01L23/00
- H01L25/065
- H01L25/18
- H10B80/00
- CPC G11C16/3431
- G11C7/08
- CPC G11C16/3459
- G11C16/08
- G11C16/28
- CPC G11C16/3481
- G11C29/02
- G11C29/52
- CPC G11C29/021
- H01J37/32
- CPC H01J37/32449
- CPC H01L21/67706
- H01L21/762
- H01L21/306
- H01L21/308
- H01L21/768
- CPC H01L21/762
- H01L21/8238
- H01L27/092
- H01L29/06
- H01L29/423
- H01L29/66
- CPC H01L21/823807
- H01L21/66
- CPC H01L22/12
- H01L23/48
- H01L21/8234
- H01L27/06
- H01L27/088
- H01L29/417
- H01L29/775
- H01L29/786
- CPC H01L23/481
- H01L23/498
- H01L23/367
- CPC H01L23/49822
- H01L23/31
- CPC H01L23/49838
- H01L23/528
- CPC H01L23/5286
- H01L23/538
- H01L27/08
- CPC H01L23/5384
- CPC H01L23/5385
- H01L23/64
- CPC H01L23/64
- H01L23/522
- CPC H01L24/05
- CPC H01L24/75
- CPC H01L25/0652
- H01L21/56
- H01L25/00
- CPC H01L25/0655
- H01L25/10
- H01L21/48
- CPC H01L25/105
- H01L25/16
- CPC H01L25/16
- H01L27/118
- H01L27/02
- CPC H01L27/11807
- H01L29/08
- CPC H01L29/0673
- H01L29/40
- CPC H01L29/41733
- H01L29/45
- H01L29/78
- CPC H01L29/41791
- H10B10/00
- CPC H01L29/42392
- CPC H01L29/7851
- H01L29/861
- CPC H01L29/8611
- H01L33/50
- H01L25/075
- H01L27/15
- H01L33/60
- CPC H01L33/502
- H01M4/58
- H01M4/02
- H01M4/04
- H01M4/36
- H01M10/0562
- CPC H01M4/5825
- H01Q7/00
- H01Q1/02
- H04B5/26
- CPC H01Q7/00
- H01Q21/06
- H01Q1/24
- H01Q5/25
- H01Q9/04
- H01Q21/24
- CPC H01Q21/065
- H02M1/00
- H02M1/32
- H02M3/158
- CPC H02M1/009
- H03F1/52
- H03F1/02
- H03F3/24
- H04B1/04
- CPC H03F1/52
- H03K5/02
- H03F1/26
- H03F3/45
- H03K3/0233
- H03K5/08
- CPC H03K5/02
- H04B1/00
- CPC H04B1/0078
- H04B1/40
- H01Q5/50
- CPC H04B1/40
- H04B7/06
- H01Q3/26
- CPC H04B7/0617
- H04L5/00
- CPC H04B7/0639
- H04B7/0426
- H04B17/12
- H04B17/21
- CPC H04B7/0686
- H04B7/0452
- CPC H04B7/06952
- H04L1/1812
- H04W72/21
- H04W72/23
- H04W76/27
- CPC H04L1/1812
- H04W28/06
- H04W80/06
- CPC H04L5/0053
- H04W72/51
- H04W84/12
- CPC H04L5/0064
- H04L25/03
- H03M13/39
- H04L1/00
- CPC H04L25/03318
- H04L41/5009
- H04W24/08
- CPC H04L41/5009
- H04L43/045
- H04L41/142
- H04L43/55
- CPC H04L43/045
- H04L67/06
- H04L67/12
- CPC H04L67/06
- H04M1/72463
- G06F3/0346
- CPC H04M1/724631
- H04N23/51
- H04N23/55
- H04N23/57
- CPC H04N23/51
- H04N23/667
- G06T7/246
- G06T7/593
- H04N23/61
- CPC H04N23/667
- H04N23/68
- CPC H04N23/687
- H04N23/80
- CPC H04N23/80
- H04N25/683
- CPC H04N25/683
- H04N25/78
- H04N25/46
- H04N25/772
- CPC H04N25/78
- H04W4/90
- H04W12/06
- H04W74/08
- CPC H04W4/90
- H04W8/18
- CPC H04W8/183
- H04W8/22
- H04W12/45
- H04W8/24
- H04L67/303
- H04W4/50
- H04W4/70
- H04W88/02
- CPC H04W8/245
- H04W24/02
- CPC H04W24/02
- H04W24/04
- H04W40/02
- H04W84/04
- CPC H04W24/04
- H04W28/02
- H04L67/131
- H04W76/38
- CPC H04W28/0268
- H04W28/24
- H04W36/00
- H04W36/14
- H04B17/318
- H04W56/00
- H04W72/1268
- CPC H04W36/00725
- H04W36/04
- H04W36/24
- CPC H04W36/04
- H04W40/24
- H04W60/00
- CPC H04W40/24
- H04W48/04
- CPC H04W48/04
- H04W52/14
- H04W52/36
- H04W80/08
- CPC H04W52/146
- H04B17/336
- H04L27/10
- H04W76/28
- CPC H04W56/0015
- H04W74/0833
- H04W76/20
- H04W80/02
- CPC H04W56/0045
- H04W60/04
- H04W60/06
- CPC H04W60/04
- H04W72/0446
- H04W48/16
- H04W72/0457
- CPC H04W72/0446
- H04W72/231
- CPC H04W72/231
- H04L5/14
- CPC H04W74/0833
- H04W76/15
- H04B7/155
- H04L41/0806
- H04W72/20
- H04W72/56
- CPC H04W76/15
- H04W76/19
- H04W72/40
- CPC H04W76/19
- CPC H04W76/20
- H04W76/10
- CPC H04W76/27
- H04W76/50
- H04N21/6332
- CPC H04W76/50
- H05K1/02
- H05K1/14
- H05K1/18
- H05K7/20
- CPC H05K1/0203
- H10B12/00
- CPC H10B12/038
- CPC H10B12/315
- CPC H10B12/482
- CPC H10B12/485
- H10B43/27
- H10B41/27
- CPC H10B43/27
- CPC H10B80/00
- C09K11/06
- H10K85/40
- H10K50/12
- CPC H10K85/342
- H10K50/17
- H10K50/18
- CPC H10K85/656
- H10N50/10
- G11C11/16
- H01F10/32
- H10B61/00
- H10N50/85
- CPC H10N50/10
