Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on October 24th, 2024
Samsung Electronics Co., Ltd.: 144 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (9), H10B12/00 (8), H01L23/522 (7), H01L25/065 (7), H01L23/31 (7) H10B12/482 (3), H01L25/105 (2), H01L29/0673 (2), G06T9/00 (2), G06T19/006 (2)
With keywords such as: device, layer, configured, semiconductor, structure, including, portion, substrate, surface, and based in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongdae LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungmoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28
CPC Code(s): A47L9/2889
Abstract: a vacuum cleaner includes a battery module configured to supply power to a cleaner body, a motor assembly including a printed circuit board (pcb), a suction motor, and an impeller arranged in this order along a direction of a flow path in the cleaner body, a moisture detection circuit provided on the pcb of the motor assembly and configured to detect moisture introduced through the flow path, and at least one processor configured to, when it is determined, through the moisture detection circuit, that moisture has been introduced into the cleaner body, stop driving of the suction motor.
20240349976. DISHWASHER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeeun HUH of Suwon-si (KR) for samsung electronics co., ltd., Johannes BÜSING of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/48, A47L15/42
CPC Code(s): A47L15/486
Abstract: a dishwasher includes a tub, a blower fan configured to blow air into the tub, and a blower duct configured to guide air blown by the blower fan to flow. the blower duct includes an inlet and an outlet. the dishwasher includes an outlet cap to cover the outlet, and configured to guide a direction of the air discharged through the outlet, the outlet cap comprising a first outlet cap and a second outlet cap. the outlet includes a first outlet and a second outlet spaced apart from the first outlet. the blower duct further includes an outlet cap coupling portion configured to guide the first outlet cap to a first seating position where the first outlet cap is coupled to the first outlet and to guide the second outlet cap to a second seating position where the outlet cap is coupled to the second outlet.
Inventor(s): Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Haeri Park HANANIA of San Gabriel CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/024, G02B27/28, G02B27/30, G02B27/42
CPC Code(s): A61B5/02427
Abstract: an electronic device including a light source is provided. the light source includes an electromagnetic spectral emission source configured to output an electromagnetic spectral emission, and at least one of a polarization optical element configured to polarize the electromagnetic spectral emission, and a collimation optical element configured to focus or collimate the electromagnetic spectral emission.
Inventor(s): Keehong SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/11, A61B5/00, A61B5/107
CPC Code(s): A61B5/112
Abstract: a method for estimating a walking index of a user, and/or an electronic device and a wearable device for performing the same. the electronic device may include: a communication module for receiving sensor data including movement information of a user wearing the wearable device from the wearable device; a processor(s) for estimating a walking index indicating a walking state of the user on the basis of the sensor data; and a display module for outputting physical ability information including the walking index. the processor(s) may estimate the user's walking speed by using a walking speed estimation model which takes the sensor data as an input, and may estimate the user's step time on the basis of the sensor data, and estimate another walking index on the basis of the walking speed and the step time.
Inventor(s): Sanguk KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B6/00, A61B6/42
CPC Code(s): A61B6/542
Abstract: provided are an x-ray detector automatically correcting an automatic exposure control (aec) sensing area, based on an image obtained using an aec sensor array, and a method of operating the x-ray detector. the x-ray detector may detect, using an aec sensor array, x-rays that have passed through an object, obtain a one-dimensional (1d) image by quantifying a dose of the detected x-rays into a signal value, identify a symmetric point from the 1d image, based on a signal value for each pixel of the 1d image, and adjust respective locations of a plurality of aec sensing areas so that the plurality of aec sensing areas are symmetrical to each other with respect to the identified symmetric point.
Inventor(s): Myungsoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyongsoo NOH of Suwon-si (KR) for samsung electronics co., ltd., Myungseob SONG of Suwon-si (KR) for samsung electronics co., ltd., Kyuho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Joonoh SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B03C3/47
CPC Code(s): B03C3/47
Abstract: a dust collection sheet includes: a first electrode extending in a first direction from an upper stream of an air flow path toward a lower stream of the air flow path, the first electrode including a first electrode layer to which a first voltage is applied and a first dielectric layer covering the first electrode layer; a second electrode disposed in a second direction orthogonal to the first direction, the second electrode including a second electrode layer to which a second voltage is applied and a second dielectric layer covering the second electrode layer, wherein the second voltage is different from the first voltage; and a third electrode disposed parallel to the second electrode in the first direction, the third electrode including a third electrode layer to which a third voltage is applied and a third dielectric layer covering the third electrode layer, wherein the third voltage is different from the second voltage, wherein the second electrode further includes a discharge portion, the discharge portion including a portion of the second electrode layer that is not covered by the second dielectric layer, and the third electrode includes a corresponding portion facing the discharge portion, the corresponding portion including a portion of the third electrode layer that is not covered by the third dielectric layer, wherein the corresponding portion is configured to cause a charging action to occur with the discharge portion.
[[20240352268. METAL OXIDE NANOPARTICLE DISPERSIBLE IN NON-POLAR SOLVENT, ELECTRON TRANSPORT LAYER-FORMING INK COMPOSITION FOR INKJET PRINTING INCLUDING THE SAME, PREPARATION METHOD THEREOF, AND LIGHT-EMITTING DEVICE AND DISPLAY INCLUDING THE SAME_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Yeseul PARK of Suwon-si (KR) for samsung electronics co., ltd., Dohyeong KIM of Seoul (KR) for samsung electronics co., ltd., Somang KIM of Seoul (KR) for samsung electronics co., ltd., Jaehong NOH of Seoul (KR) for samsung electronics co., ltd., Sanghyun SOHN of Suwon-si (KR) for samsung electronics co., ltd., Deahee LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungnam KIM of Seoul (KR) for samsung electronics co., ltd., Chunrae NAM of Seoul (KR) for samsung electronics co., ltd., Gyucheol YOON of Seoul (KR) for samsung electronics co., ltd., Sungmin HA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C09D11/322, C07F3/06, C09D11/36, C09D11/52, H10K50/16, H10K71/13
CPC Code(s): C09D11/322
Abstract: a metal oxide nanoparticle for inkjet printing, where the metal oxide nanoparticle is surface modified and is dispersible in a non-polar solvent; an electron transport layer-forming ink composition for inkjet printing including the same; a preparation method for the metal oxide nanoparticle; and a light-emitting device and a display that are prepared with the metal oxide nanoparticle.
Inventor(s): Jongmin YUN of Suwon-si (KR) for samsung electronics co., ltd., Jihoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/22, D06F23/02, D06F33/48, D06F37/26, D06F39/12, D06F103/24, D06F105/46
CPC Code(s): D06F37/22
Abstract: a washing machine and a method for controlling the washing machine are disclosed. the washing machine comprises: a case; a tub positioned inside the case; a drum rotatably provided in the tub; and a damper provided to reduce vibration between the case and the tub. the damper includes: a cylinder coupled to either the case or the tub; a piston movably inserted into the cylinder, which is coupled to the other of the case and the tub; a friction member encompassing a portion of the outer surface of the piston; an elastic member encompassing the friction member, and having a reduced inner periphery such that elastic force is applied to the friction member to be pressed toward the piston; and a pusher that spaces the elastic member from the cylinder to reduce the elastic force applied by the elastic member to the friction member.
Inventor(s): Jungyoon HAHM of Suwon-si (KR) for samsung electronics co., ltd., Donggeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Songjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/14, D06F37/04, D06F37/42
CPC Code(s): D06F39/14
Abstract: a clothing processing device comprises a cabinet, a front panel including a first surface, a second surface, and an opening, a drum inside the cabinet to communicate with the opening, and a door connected to the first surface. the front panel includes a seating groove protruding toward the inside of the cabinet along a circumference of the opening to seat the door in response to closing the opening by the door, and an extension surface extending toward the inside of the cabinet from an upper part of the front panel. the extension surface includes curved nose to form a gap with the seating groove, and the clothing processing device includes an insulation between the curved nose and the seating groove, and a heat dissipation sheet attached to the second surface to enclose at least a part of the insulation along the circumference of the insulation.
Inventor(s): Sunghwan HONG of Suwon-si (KR) for samsung electronics co., ltd., Hochae LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungsoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Ansook SUL of Suwon-si (KR) for samsung electronics co., ltd., Yunjoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyoung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Donok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F43/08, D06F43/02, D06L1/00, D06L1/04, D06L1/10
CPC Code(s): D06F43/081
Abstract: provided is a washing machine including: a storage chamber configured to store carbon dioxide in a gaseous state; an additive container configured to store an additive; a mixing chamber configured to mix the carbon dioxide in the gaseous state supplied from the storage chamber with the additive supplied from the additive container and pressurize the carbon dioxide and the additive, which are mixed with each other, to generate a mixed solution in a liquid state; a washing chamber configured to wash laundry using the mixed solution supplied from the mixing chamber; and a distillation chamber configured to accommodate the mixed solution discharged from the washing chamber and vaporize the carbon dioxide from the mixed solution therein, wherein the additive lowers a vapor pressure of the mixed solution to maintain the mixed solution in a liquid state at pressures of 10 bar or less.
Inventor(s): Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F16H55/26, F16C19/50, F16H19/04
CPC Code(s): F16H55/26
Abstract: an electronic apparatus according to an embodiment comprises: a first housing; a second housing coupled to the first housing to be slidable; a flexible display disposed on a surface formed by the first housing and the second housing, and is configured to be expanded or contracted according to the slide-in or slide-out movement of the second housing; a rack gear fastened with the first housing; a pinion gear which is configured to be driven while engaging with the rack gear; a motor driver fastened with the second housing and configured to rotate the pinion gear; a bracket which surrounds part of the motor driver and the pinion gear, and is fastened with the second housing; and a rack gear case surrounding a first surface and both side surfaces of the rack gear.
Inventor(s): Bohyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihong KIM of Suwon-si (KR) for samsung electronics co., ltd., Juwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyeongae LEE of Suwon-si (KR) for samsung electronics co., ltd., Changsik LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunghyun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Wonhee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/031
CPC Code(s): F24F1/031
Abstract: a mounting device configured to mount an air conditioner on a window frame, includes: a fixing frame configured to hold the air conditioner and be fixable to a lower portion of the window frame; a moving frame configured to move up and down with respect to the fixing frame and to be fixable to an upper portion of the window frame; and an indicator disposed on the moving frame and configured to contact the upper portion of the window frame, wherein the indicator includes: a first indicating portion configured to be visible from an outside of the moving frame when the moving frame is not fixed to the upper portion of the window frame; and a second indicating portion different from the first indicating portion, and configured to be visible from the outside of the moving frame when the moving frame is fixed to the upper portion.
20240353121. CEILING-TYPE AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hayoung YOON of Suwon-si (KR) for samsung electronics co., ltd., Jeonguk KOH of Suwon-si (KR) for samsung electronics co., ltd., Hyoyoup NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/56, F24F13/20
CPC Code(s): F24F1/56
Abstract: various embodiments disclosed herein relate to a bracket structure for fastening pipes in an outdoor unit of an air conditioner. to this end, the outdoor unit of the air conditioner may include: a bracket configured by fastening a right-side part of an upper plate and a left-side part of a lower plate so that the surfaces thereof partially overlap, wherein one or a plurality of first service valves are mounted on the right-side part of the upper plate and one or a plurality of second service valves are mounted on the left-side part of the lower plate; and a housing configured so that the bracket is fastened to the lower end of one surface.
Inventor(s): Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongtae KANG of Seoul (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Minjae KIM of Seoul (KR) for samsung electronics co., ltd., Seonggon KIM of Seoul (KR) for samsung electronics co., ltd., Jaewon LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): F24F7/003, F24F7/08, F24F8/158, F24F8/90
CPC Code(s): F24F7/003
Abstract: an air conditioning device configured so that, in a circulation operation state, a first air passage connecting a first intake port and a first discharge port is formed to move indoor air through the first intake port, through a carbon dioxide suction filter, and through the first discharge port to the indoor area, and, in a ventilation operation state, a second air passage connecting the first intake port and a second discharge port is formed to move indoor air from through the first intake port, through the carbon dioxide suction filter, and through the second discharge port to the outdoor area while a heater heats the carbon dioxide suction filter, and a third air passage connecting a second intake port to the first discharge port is formed to move outdoor air from the outdoor area through the second intake port, and through the first discharge port to the indoor area.
Inventor(s): Beomseok SEO of Suwon-si (KR) for samsung electronics co., ltd., Youngjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyokyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngju JOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F13/22, F24F1/027, F24F11/70, F24F110/10, F24F110/20, F24F140/30
CPC Code(s): F24F13/224
Abstract: disclosed herein is an air conditioner and a control method thereof. the air conditioner includes: a housing including a base, a first heat exchanger disposed inside the housing and configured to exchange heat with outdoor air, a second heat exchanger disposed inside the housing and configured to exchange heat with indoor air, a compressor configured to compress a refrigerant for a heat exchange operation performed by the first heat exchanger and the second heat exchanger, a first fan disposed inside the housing and configured to move air along a flow path passing through the first heat exchanger, a drainage device configured to move condensed water condensed on the second heat exchanger inside the housing and collected in the base to the first heat exchanger, and a controller including at least one processor, comprising processing circuitry, individually and/or collectively, configured to, based on the stop of the operation of the compressor, control the drainage device to move the condensed water collected in the base to the first heat exchanger during a drainage time determined based on an operation time of the compressor, and to control the first fan to move air during the drainage time.
Inventor(s): Kihong CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Gucheol KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaejoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Haemin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minjae HUH of Suwon-si (KR) for samsung electronics co., ltd., Hidong KWAK of Suwon-si (KR) for samsung electronics co., ltd., Taejung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jihye LEE of Suwon-si (KR) for samsung electronics co., ltd., Choonshik LEEM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/95, G01N21/21, G01N21/88, H01L21/66
CPC Code(s): G01N21/9501
Abstract: a wafer abnormality detection method including: calculating a residual spectrum between a measured spectrum for a wafer and a predicted spectrum for the wafer; and performing machine learning to determine whether measurement data, which corresponds to the residual data, is abnormal.
Inventor(s): Moonil Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Junnyeong Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R1/04, G01R1/067
CPC Code(s): G01R1/045
Abstract: provided are a probe card and a semiconductor device inspection system including the same. a probe card includes a socket structure including at least one socket, and a plane structure located on the socket structure. the at least one socket includes at least one rf signal pin through which a signal of a radio frequency (rf) band is transmitted, and at least one ground pin. the plane structure includes an rf plane including at least one rf signal line electrically connected to the at least one rf signal pin, and a ground plane electrically connected to the at least one ground pin, the ground plane being located between the rf plane and the socket structure.
Inventor(s): Jinhyuk Choi of Suwon-si (KR) for samsung electronics co., ltd., Sumin Park of Suwon-si (KR) for samsung electronics co., ltd., Myungki Song of Suwon-si (KR) for samsung electronics co., ltd., Kongwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyusang Lee of Suwon-si (KR) for samsung electronics co., ltd., Beomsoo Hwang of Suwon-si (KR) for samsung electronics co., ltd., Jayul Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/28
CPC Code(s): G01R31/2891
Abstract: a measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.
Inventor(s): Ganggyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Insup KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/317, G01R31/3185
CPC Code(s): G01R31/31724
Abstract: a storage system including: a storage device; a diagnosis circuit that generates a test pattern, transmits the test pattern to the storage device, receives result data corresponding to the test pattern from the storage device, and tests whether the storage device normally operates by comparing the test pattern with the result data; and a debugging port that is connected to the diagnosis circuit, receives auxiliary power from an external device, supplies the auxiliary power to the diagnosis circuit, and transmits data in the storage device to the external device.
Inventor(s): Gwangho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jeongseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaedeok LIM of Suwon-si (KR) for samsung electronics co., ltd., Daekwang JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481
CPC Code(s): G01S7/4813
Abstract: an electronic device is provided. the electronic device includes a housing including a first surface, a second surface facing in a direction opposite to the first surface, and a lateral surface surrounding a space between the first surface and the second surface, a distance measuring sensor disposed in the space between the first surface and the second surface, configured to detect the distance to an external object through the second surface, and including a light emitter and a first light receiver, a substrate on which the distance measuring sensor is disposed, a sensor housing disposed on the substrate, and a shielding sheet attached to the inner surface of the sensor housing to surround the light emitter and the first light receiver and electrically connected to a ground disposed to surround the outer periphery of the substrate.
Inventor(s): Hokeun KWAK of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongok CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Min HEU of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G03B30/00, H04N23/51, H04N23/54, H04N23/55
CPC Code(s): G02B13/0065
Abstract: according to certain aspects of the disclosure, a camera module comprises: a camera housing; a plurality of lenses at least partially disposed inside the camera housing, the plurality of lenses having an optical axis; an image sensor disposed on one side of the camera housing, the image sensor forming an image plane, the image plane having a dimension parallel to the optical axis; and a reflective member aligned with the plurality of lenses in a direction of the optical axis and positioned to reflect light from the plurality of lenses to the image sensor.
Inventor(s): Kwangseok BYON of Suwon-si (KR) for samsung electronics co., ltd., Bongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaekyu SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/64, G01D5/14, G03B5/00, G03B13/36, H04N23/54, H04N23/68
CPC Code(s): G02B27/646
Abstract: at least one camera module disposed in an electronic device is provided. the at least one camera module includes a lens assembly aligned along an optical axis, an image sensor for changing an image to an electrical signal, an optical image stabilization (ois) driving unit for providing force for the lens assembly or the image sensor to move in a direction perpendicular to the optical axis or to rotate about the optical axis, and a housing for accommodating the lens assembly, the image sensor and the ois driving unit, wherein the ois driving unit includes an ois carrier for moving in the direction perpendicular to the optical axis or rotating about the optical axis, the ois carrier transports the lens assembly or the image sensor based on the movement of the ois driving unit, a plurality of first axis drive coils disposed on a first side of the housing, a first magnet having at least two polarities, and disposed on the ois carrier to face the plurality of the first axis drive coils, at least two first position sensors disposed at coil centers of at least two drive coils respectively among the plurality of the first axis drive coils, and configured to acquire first information for measuring a position of the first magnet for a first axis direction of the ois driving unit, and at least one second position sensor configured to acquire second information for measuring a position of the first magnet for a second axis direction of the ois driving unit, and wherein the at least one second position sensor be disposed on the first side of the housing to face one or more neutral zones of the first magnet.
Inventor(s): Byoungjung Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsik Kim of Suwon-si (KR) for samsung electronics co., ltd., Eunbi Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyu Park of Suwon-si (KR) for samsung electronics co., ltd., Hokweon Song of Suwon-si (KR) for samsung electronics co., ltd., Mingyu Yoon of Suwon-si (KR) for samsung electronics co., ltd., Taeyoun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Junsu Jung of Suwon-si (KR) for samsung electronics co., ltd., Seungsan Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1333, H04R1/02
CPC Code(s): G02F1/133314
Abstract: provided is a display apparatus including a display module, a cover frame provided in a frame shape and coupled to a rear side of the display module to cover the display module, and a cover sheet coupled to a rear side of the cover frame and configured to form an appearance of the display apparatus. the cover frame includes an edge portion having a quadrangular-shape, a reinforcing portion extending inward from the edge portion, and openings formed between the edge portion and the reinforcing portion.
Inventor(s): Sang Chul YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36, G03F1/70, G03F1/86, G03F7/00
CPC Code(s): G03F1/36
Abstract: a method for correcting an optical proximity correction (opc) model is provided. the method comprises measuring a first target cd value at a first measurement point of an sem image for a target pattern and measuring a second target cd value at a second measurement point, simulating the opc model by using the first target cd value with respect to a first evaluation point corresponding to the first measurement point on a contour of the opc model for the target pattern, simulating the opc model by using the second target cd value with respect to a second evaluation point corresponding to the second measurement point on the contour, and fitting the opc model with respect to each of the first evaluation point and the second evaluation point.
20240353764. LITHOGRAPHY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyung Chin YI of Suwon-si (KR) for samsung electronics co., ltd., Dong Sik Jeong of Suwon-si (KR) for samsung electronics co., ltd., Sun Ho Kim of Suwon-si (KR) for samsung electronics co., ltd., Woo-Hyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Seung Uk Park of Suwon-si (KR) for samsung electronics co., ltd., Yong Hee Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70916
Abstract: provided is a lithography apparatus including a wafer stage, a cable connected to the wafer stage, the cable being configured to bend based on the wafer stage moving, a support unit configured to prevent the cable from sagging, the support unit including a plurality of clamps configured to restrict movement of the cable and a connection member connecting the plurality of clamps to each other, and a protective unit under the cable, the protective unit being configured to collide with the support unit based on the wafer stage moving, wherein the protective unit includes ultra-high molecular weight polyethylene (uhmwpe).
Inventor(s): Seungbeom PARK of Gwangju (KR) for samsung electronics co., ltd., Sungmin Park of Seoul (KR) for samsung electronics co., ltd., Jaehyeon Son of Hwaseong-si (KR) for samsung electronics co., ltd., Heejun Ahn of Seoul (KR) for samsung electronics co., ltd., Myungjun Lee of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03H1/00, G01N21/95, G02B21/00, G03H1/04, G03H1/16, H01L21/66
CPC Code(s): G03H1/0005
Abstract: provided is a holographic microscope including an input optical system configured to emit polarized input beam, a first beam splitter configured to emit an object beam by reflecting a portion of the polarized input beam, and emit a reference beam by transmitting a remaining portion of the polarized input beam, a reference optical system configured to separate the reference beam into a first reference beam and a second reference beam, a camera configured to receive the first reference beam and the second reference beam and the object beam that is reflected by an inspection object, the camera including a micro polarizer array, wherein a first polarization axis of the first reference beam is perpendicular to a second polarization axis of the second reference beam.
Inventor(s): Jungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Jongkuck SON of Suwon-si (KR) for samsung electronics co., ltd., Junhui LEE of Suwon-si (KR) for samsung electronics co., ltd., Jonggwan JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sungnam KANG of Suwon-si (KR) for samsung electronics co., ltd., Soonwan CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G04G17/02, G04G21/02
CPC Code(s): G04G17/02
Abstract: a wearable electronic device is provided. the wearable electronic device includes a metal frame, a plurality of electrodes positioned on the metal frame so as to be in contact with a body of a user and configured to acquire biometric information by forming an electrical signal path together with the body of the user being in contact, a metal strap connected to the metal frame, and an insulating structure, wherein the insulating structure may be configured to electrically separate the metal strap from the metal frame to reduce leaking of the electrical signal to the metal frame through the metal strap.
Inventor(s): Yunjeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Takahiro Nomiyama of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/28, G06F1/08, G06F1/14
CPC Code(s): G06F1/28
Abstract: a system-on-chip includes a functional circuit, a voltage droop detection circuit, a clock generation circuit, and a clock modulation. the voltage droop detection circuit includes a voltage droop detection controller, a reference voltage generator, and a detection signal generator.
Inventor(s): Changhyun ROH of Suwon-si (KR) for samsung electronics co., ltd., Younbaek Lee of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Lee of Suwon-si (KR) for samsung electronics co., ltd., Bokman Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3212, A61B5/11, A61H3/00, G06F1/3296
CPC Code(s): G06F1/3212
Abstract: a control method of a walking assistance apparatus is disclosed. the control method of the walking assistance apparatus includes estimating an operable time of the walking assistance apparatus based on an amount of remaining power and power consumption of the walking assistance apparatus, determining whether the operable time satisfies a preset criterion, and generating a torque profile based on an algorithm of a power saving mode when the preset criterion is satisfied.
Inventor(s): Francois Robert HOGAN of St-Jean-Sur-Richelieu (CA) for samsung electronics co., ltd., Trevor Ablett of Toronto (CA) for samsung electronics co., ltd., Xue Liu of Montreal (CA) for samsung electronics co., ltd., Gregory Lewis Dudek of Westmount (CA) for samsung electronics co., ltd., Amal Feriani of Winnipeg (CA) for samsung electronics co., ltd.
IPC Code(s): G06F3/042, G06F3/03, G06T3/02, G06T7/73
CPC Code(s): G06F3/0425
Abstract: a method performed by an electronic device, includes: obtaining an image of a set of markers; based on the image, detecting an arrangement of the set of markers; based on the arrangement of the set of markers, performing a measurement about a deformation of the set of markers; based on the measurement about the deformation of the set of markers, generating a plurality of signals; transforming the plurality of signals to a plurality of input commands. the plurality of input commands are used to control the electronic device.
Inventor(s): Seongjoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Jongyoub RYU of Suwon-si (KR) for samsung electronics co., ltd., Woocheol SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04845, G06F3/01, G06T7/62
CPC Code(s): G06F3/04845
Abstract: an electronic device includes a sensor, a display, and at least one processor configured to control the display to display a virtual reality content corresponding to a virtual reality environment, identify a gaze direction of a user based on data acquired through the sensor, identify a point on the virtual reality environment based on the gaze direction, identify a distance between the user and the identified point in the virtual reality environment, control the display to display a first object at a position corresponding to the identified point in the virtual reality content, identify, based on a user command received while the first object is displayed, whether a virtual object is present within a second object positioned at the identified point in the virtual reality environment, and control the virtual object according to the user command if the virtual object being identified as present.
Inventor(s): Sanghyun HAN of Suwon-si (KR) for samsung electronics co., ltd., Hyewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngsik LEE of Suwon-si (KR) for samsung electronics co., ltd., Daesoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04883, B60K35/10, B60K35/22
CPC Code(s): G06F3/04883
Abstract: an electronic device mounted in a vehicle, and an method performed thereby are provided. the electronic device may include a touch screen, memory storing at least one instruction, and at least one processor communicatively coupled to the touch screen and the memory. the at least one instruction, when executed by the at least one processor individually or collectively, may cause the electronic device to recognize an input event, based on receiving a multi-touch input or a hover input, of a user with respect to the touch screen, may identify a function corresponding to the input event, based on shape information of a plurality of points and position information of the plurality of points at which the input event is recognized, may change a function value with respect to the identified function, based on a gesture input being recognized via the touch screen, and may display a user interface (ui) indicating the changed function value.
20240354004. MULTITENANCY SSD CONFIGURATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daniel Lee HELMICK of Thornton CO (US) for samsung electronics co., ltd., Mark Allen GAERTNER of Fort Myers FL (US) for samsung electronics co., ltd., Chun-Chu Chen-Jhy Archie WU of San Carlos CA (US) for samsung electronics co., ltd., Siamak ARYA of Cupertino CA (US) for samsung electronics co., ltd., Vipin Kumar AGRAWAL of San Jose CA (US) for samsung electronics co., ltd., Vasili ZHDANKIN of Prior Lake MN (US) for samsung electronics co., ltd., Sumanth JANNYAVULA VENKATA of Pleasanton CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/061
Abstract: provided are systems, methods, and apparatuses for multitenancy ssd configuration. in one or more examples, the systems, devices, and methods include identifying an identifier of a first tenant of a storage device and assigning a first performance level to the first tenant. in one or more examples, the systems, devices, and methods include generating a first performance parameter based on the first performance level and sending, to the storage device, a configuration message comprising the first performance parameter and the identifier of the first tenant.
Inventor(s): Jin-Hee MA of Suwon-si (KR) for samsung electronics co., ltd., Kyuho SON of Suwon-si (KR) for samsung electronics co., ltd., Yunho YANG of Suwon-si (KR) for samsung electronics co., ltd., Sangyoon OH of Suwon-si (KR) for samsung electronics co., ltd., Wonchul LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaigyun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/064
Abstract: the present disclosure provides methods and apparatuses for a storage system. in some embodiments, a storage system includes a plurality of storage devices and a host device. each storage device of the plurality of storage devices includes a plurality of blocks classified into first type blocks, second type blocks, and third type blocks, and is configured to generate internal state information items indicating information on a first number of first type blocks, a second number of second type blocks, and a third number of third type blocks. the host device is configured to receive, from the plurality of storage devices, the internal state information items, generate target state information such that the plurality of storage devices include a same number or substantially same number of first type blocks, based on the internal state information items, and transmit, to the plurality of storage devices, the target state information.
Inventor(s): Youngjoon JANG of Hwaseong-si (KR) for samsung electronics co., ltd., Minji KIM of Seoul (KR) for samsung electronics co., ltd., Seungil KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyung-Kyun BYUN of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0656
Abstract: an operation method of a universal flash storage (ufs) host configured to control a ufs device includes configuring a turbo write buffer of the ufs device; sending a first query request ufs protocol information unit (upiu) including reconfiguration information about the turbo write buffer to the ufs device, during driving the ufs device; and receiving a first response upiu associated with the first query request upiu from the ufs device, wherein, the first query request upiu is a request that causes a size of the turbo write buffer of the ufs device to be changed from a first size to a second size different from the first size.
Inventor(s): Jae-geun PARK of Suwon-si (KR) for samsung electronics co., ltd., Phil-yong JUNG of Hwaseong-si (KR) for samsung electronics co., ltd., Ho-jun SHIM of Yongin-si (KR) for samsung electronics co., ltd., Sang-young YE of Osan-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F13/16
CPC Code(s): G06F3/0658
Abstract: a storage device set includes a storage device configured to communicate with a host, the storage device including a controller configured to generate encrypted input data by encrypting data; and a reconfigurable logic chip configured to receive the encrypted input data from the storage device, generate processed data by processing the encrypted input data according to a configuration, and generate encrypted output data by encrypting the processed data.
Inventor(s): Youngsin MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyungseoung YOO of Suwon-si (KR) for samsung electronics co., ltd., Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Juyeon JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/16, G06F3/04847, H04B17/318, H04W4/80
CPC Code(s): G06F3/165
Abstract: an audio providing method is provided. the audio providing method includes receiving a first signal strength of a first signal including information on a first audio source device from a first audio output device establishing a wireless link with an electronic device, outputting the first signal strength in association with the information on the first audio source device, and controlling, when the first audio source device is selected, the first audio output device to receive a first audio broadcast stream transmitted by the first audio source device.
Inventor(s): Sungmeen MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangjoon KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Seungchul JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/544, G01R19/00, G06F13/40, G06F13/42, G06N3/04, G11C11/16, G11C11/54
CPC Code(s): G06F7/5443
Abstract: a neuromorphic device includes a plurality of resistor lines, each comprising a plurality of resistors that are serially connected to each other; one or more current sources configured to control a current flowing in each of the resistor lines to a respective current value; a plurality of capacitors configured to be electrically connected to each of the resistor lines and to sample respective voltage of each of the resistor lines representing results of neuromorphic operations; and a switch configured to connect the plurality of the capacitors in parallel after the sampling the respective voltage of each of the resistor lines, to output a sum of the results of neuromorphic operations.
Inventor(s): William MARTIN of Roseville CA (US) for samsung electronics co., ltd., Oscar P. PINTO of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F9/30, G06F9/38
CPC Code(s): G06F9/5066
Abstract: a method may include creating an association identifier based on an association between a computational device function and a compute engine of a computational device, and invoking an execute command to perform an execution of the computational device function using the compute engine, wherein the execute command uses the association identifier. the compute engine may be a first compute engine, and the association may be further between the computational device function and a second compute engine of the computational device. the execute command may perform an execution of the computational device function using the second compute engine. the execution of the computational device function using the first compute engine and the execution of the computational device function using the second compute engine may overlap. the execute command may include the association identifier. the creating the association identifier may include invoking a create association command.
Inventor(s): Daniel Lee Helmick of Broomfield CO (US) for samsung electronics co., ltd., Vipin Kumar Agrawal of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0868
CPC Code(s): G06F12/0868
Abstract: systems and methods for processing commands from a host computing device to a storage device are disclosed. the method includes identifying, by the storage device, a command from the host computing device, the command including a logical address; detecting a condition; based on detecting the condition, requesting, by the storage device, translation of the logical address into a physical address; storing, by the storage device, the physical address in a cache; and transferring data according to the command based on the physical address.
Inventor(s): Naresh PURRE of Bengaluru (IN) for samsung electronics co., ltd., Sriram Shashank of Bengaluru (IN) for samsung electronics co., ltd., Sri Lakshmi Punuru of Bengaluru (IN) for samsung electronics co., ltd., Barath Raj Kandur Raja of Bengaluru (IN) for samsung electronics co., ltd., Vanraj Vala of Bengaluru (IN) for samsung electronics co., ltd., Aayush Yadav of Bengaluru (IN) for samsung electronics co., ltd., Aditi Anil Kagane of Bengaluru (IN) for samsung electronics co., ltd., Sudeep Kumar Kodali of Bengaluru (IN) for samsung electronics co., ltd., Rishabh Kumar of Bengaluru (IN) for samsung electronics co., ltd., Srinivasa Rao Siddi of Bengaluru (IN) for samsung electronics co., ltd., Manjunath Bhimappa Ujjinakoppa of Bengaluru (IN) for samsung electronics co., ltd., Mansoor Variyathapara Mohammed of Bengaluru (IN) for samsung electronics co., ltd., Hemant Tiwari of Bengaluru (IN) for samsung electronics co., ltd., Dwakara Bhamidipati Sreevatsa of Bengaluru (IN) for samsung electronics co., ltd., Ankita Bhardwaj of Bengaluru (IN) for samsung electronics co., ltd., Vipin Rao of Bengaluru (IN) for samsung electronics co., ltd., Likhith Amarvaj of Bengaluru (IN) for samsung electronics co., ltd., Vibhav Agarwal of Bengaluru (IN) for samsung electronics co., ltd., Yashwant Singh Saini of Bengaluru (IN) for samsung electronics co., ltd., Himanshu Arora of Bengaluru (IN) for samsung electronics co., ltd., Muthu Kumaran of Bengaluru (IN) for samsung electronics co., ltd., Seungseok Kang of Suwon-si (KR) for samsung electronics co., ltd., Sanguk Jeon of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon Park of Suwon-si (KR) for samsung electronics co., ltd., Pilsik Choi of Suwon-si (KR) for samsung electronics co., ltd., Hojun Jaygarl of Suwon-si (KR) for samsung electronics co., ltd., Shweta Ratanpura of Bengaluru (IN) for samsung electronics co., ltd., Mritunjai Chandra of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F16/9535, G06F16/901, G06F16/9538, G06N5/022
CPC Code(s): G06F16/9535
Abstract: example systems and methods provide input suggestions to a user to improve user experience on user devices. the input suggestions can be fill information from another app on device to the present app being used by user, information for performing a search (without the user having to copy-paste data or entering the data manually), responses to a message/notification received by the user, information/content/data to be shared between apps (without switching between apps), and emojis/gifs that can be used by the user. the method includes analyzing one or more content of one or more screen displayed on device, generating at least one of a logical tree structure and a data mashup model of the one or more analyzed content for each screen, and providing a recommendation to a user. the recommendation can be a connected action or an input suggestion.
Inventor(s): Myeongjong Lee of Suwon-si (KR) for samsung electronics co., ltd., Seongchan Jo of Suwon-si (KR) for samsung electronics co., ltd., Jisoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungsup Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/78, G06F21/60, G06F21/64
CPC Code(s): G06F21/78
Abstract: a method of writing data in a replay protected memory block (rpmb) area of a storage device in response to a request of a host device includes receiving a write request, including a message authentication code, data, and a bitmap index, from the host device and verifying the write request based on the message authentication code and the bitmap index. the verifying the write request may include calculating a message authentication code based on data and a bitmap index received from the host device, comparing a message authentication code, calculated in the storage device, with the message authentication code of the write request, and comparing the bitmap index of the write request with bitmap indexes, stored in the storage device, to check whether a replay attack has been made.
Inventor(s): Donghun Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/81, G06F21/78
CPC Code(s): G06F21/81
Abstract: a glitch detector, a glitch detection method, and a security device including the glitch detector. the glitch detector includes: a sensing unit configured to generate a glitch voltage and at least one reference voltage based on a power supply voltage; a clock generator configured to receive a monitoring voltage corresponding to at least one from among the power supply voltage and the glitch voltage, and to output a clock signal including a plurality of pulse signals while a voltage change occurs in the monitoring voltage, wherein the plurality of pulse signals have a predetermined period; and a comparison unit configured to operate based on each of the plurality of pulse signals, and to compare the glitch voltage with the at least one reference voltage and output a detection voltage based on determining that a glitch has occurred.
Inventor(s): Ayelet Hen of Tel-Aviv (IL) for samsung electronics co., ltd., Omer Shabtai of Tel-Aviv (IL) for samsung electronics co., ltd., Eilon Regev of Tel-Aviv (IL) for samsung electronics co., ltd., Yotam Platner of Tel-Aviv (IL) for samsung electronics co., ltd., Or Davidi of Tel-Aviv (IL) for samsung electronics co., ltd., Oren Kaikov of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): G06N5/04
CPC Code(s): G06N5/04
Abstract: systems and techniques of the present disclosure enable a compiler to optimize such tradeoffs, and further enable optimization for a specific user cost function (e.g., optimization of a complex multi-dimensional and non-linear problem). moreover, the techniques described herein can optimize in polynomial time. accordingly, inference tasks may be optimized (e.g., based on specific applications) in terms of power consumption, idle time, the efficiency of computation, system resources, etc. for instance, by leveraging the systems and techniques described in the present disclosure, hardware designers can balance the tradeoff between runtime, power consumption, and resource usage, which are critical factors in the efficient processing of specialized tasks.
Inventor(s): Byung-Kwon Kong of Suwon-si (KR) for samsung electronics co., ltd., Soon-Mi Cho of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q20/32, G06Q20/04
CPC Code(s): G06Q20/3274
Abstract: an apparatus and a method manage a received mobile transaction coupon in a mobile terminal. the apparatus includes a communication unit, an information analyzer, a schedule manager, an output unit, and a controller. the communication unit receives a mobile transaction coupon. the information analyzer obtains the received mobile transaction coupon information. the schedule manager registers the obtained mobile transaction coupon information in an alarm program. the output unit outputs the registered mobile transaction coupon information on a relevant date via the alarm program. the controller controls to register the mobile transaction coupon information in the alarm program, and controls to store the received mobile transaction coupon in a storage area corresponding to a reception type or a folder for a widget function.
Inventor(s): Gal Bitan of Tel-Aviv (IL) for samsung electronics co., ltd., Eitan Lavi of Tel-Aviv (IL) for samsung electronics co., ltd., Yoram Furth of Tel-Aviv (IL) for samsung electronics co., ltd., Shai Shamir of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G02B5/20, G06T1/20, G06T3/40, H04N25/46
CPC Code(s): G06T5/50
Abstract: aspects of the method, apparatus, non-transitory computer readable medium, and system include obtaining first sensor data and second sensor data. the aspects further include processing the first sensor data using a first processing mode to obtain first image data, wherein the first processing mode is based on a first pixel pattern. the aspects further include processing the second sensor data using a second processing mode to obtain second image data, wherein the second processing mode is based on a second pixel pattern different from the first pixel pattern, and generating an image by combining the first image data and the second image data.
Inventor(s): Seungwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Deoksoo Park of Suwon-si (KR) for samsung electronics co., ltd., Byoung-Ju Song of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/92, G06T5/40, G06T5/50
CPC Code(s): G06T5/92
Abstract: an image processing device is provided. the device includes: a processor configured to: perform first tone mapping on an input image frame using a brightness enhancement tone curve corresponding to a current ambient illuminance value to obtain a first result; obtain histogram tone curves by applying a variable contrast limit to a plurality of histograms respectively corresponding to a plurality of sub-images, constituting a previous image frame; perform second tone mapping on the input image frame by interpolating the histogram tone curves to obtain a second result; and provide output image data by performing third tone mapping on the input image frame based on the first result and the second result. the brightness enhancement tone curve corresponds to a first human vision system (hvs) response to a reference ambient illuminance value and a second hvs response to a target ambient illuminance value.
Inventor(s): Kilsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeeun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00
CPC Code(s): G06T7/0002
Abstract: an electronic apparatus, a server computer, and an operating method of the electronic apparatus are provided. the electronic apparatus is configured to receive, from a server computer, at least one frame including image quality setting information and/or at least one frame not including the image quality setting information, according to a frame processing mode selected from among an image quality priority mode and an input lag priority mode. the at least one frame including the image quality setting information is processed by referring to the image quality setting information included in the at least one frame and displayed, and the at least one frame not including the image quality setting information is processed by referring to image quality setting information about a previous frame processed prior to the at least one frame not including the image quality setting information, and displayed.
Inventor(s): Hongsuk Choi of Jersey City NJ (US) for samsung electronics co., ltd., Hyun Soo Park of Saint Paul MN (US) for samsung electronics co., ltd., Ibrahim Volkan Isler of Saint Paul MN (US) for samsung electronics co., ltd.
IPC Code(s): G06T7/73
CPC Code(s): G06T7/75
Abstract: an computing system includes: receiving an image that captures a hand and an object; estimating a three-dimensional (3d) mesh of the hand based on the image; estimating a two-dimensional (2d) segment of the object based on the image; estimating a 3d feature representing a correlation of the hand and the object, based on the 3d mesh of the hand and the 2d segment of the object; and generating a first set of output parameters for a first 3d query point, based on the 3d feature representing the correlation of the hand and the object.
Inventor(s): Varun Menon of Mountain View CA (US) for samsung electronics co., ltd., Siddarth Ravichandran of Santa Clara CA (US) for samsung electronics co., ltd., Ankur Gupta of San Jose CA (US) for samsung electronics co., ltd., Hyun Jae Kang of Mountain View CA (US) for samsung electronics co., ltd., Sajid Sadi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T9/00, G06V10/764
CPC Code(s): G06T9/00
Abstract: autoregressive content rendering for temporally coherent video generation includes generating, by an autoencoder, a plurality of predicted images. the plurality of predicted images is fed back to the autoencoder network. the plurality of predicted images may be encoded by the autoencoder network to generate a plurality of encoded predicted images. the autoencoder network encodes a plurality of keypoint images to generate a plurality of encoded keypoint images. one or more predicted images of the plurality of predicted images are generated by the autoencoder network by decoding a selected encoded keypoint image of the plurality of encoded keypoint images with an encoded predicted image of the plurality of encoded predicted images of a prior iteration of the autoencoder network.
Inventor(s): Dimitar Petkov Dinev of Sunnyvale CA (US) for samsung electronics co., ltd., Siddarth Ravichandran of Santa Clara CA (US) for samsung electronics co., ltd., Hyun Jae Kang of Mountain View CA (US) for samsung electronics co., ltd., Ondrej Texler of San Jose CA (US) for samsung electronics co., ltd., Anthony Sylvain Jean-Yves Liot of San Jose CA (US) for samsung electronics co., ltd., Sajid Sadi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T9/00, G06T3/40, G06T11/00, G06V10/771
CPC Code(s): G06T9/00
Abstract: generating images includes generating encoded data by encoding input data into a latent space. the encoded data is decoded through a first decoder having first decoder layers by processing the encoded data through one or more of the first decoder layers. the encoded data is decoded through a second decoder having second decoder layers by processing the encoded data through one or more of the second decoder layers. an updated feature map is generated by replacing at least a portion of a feature map output from a selected layer of the first decoder layers with at least a portion of a feature map output from a selected layer of the second decoder layers. an image is generated by further decoding the updated feature map through one or more additional layers of the first decoder layers.
Inventor(s): Youngkwon Lim of McKinney TX (US) for samsung electronics co., ltd., Rajan Laxman Joshi of San Diego CA (US) for samsung electronics co., ltd., Madhukar Budagavi of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T9/00
CPC Code(s): G06T9/001
Abstract: an apparatus includes a communication interface configured to receive a compressed bitstream including a base mesh sub-bitstream and a processor operably coupled to the communication interface. the processor is configured to decode a plurality of submeshes from the base mesh sub-bitstream. the processor is also configured to subdivide a submesh of the plurality of submeshes according to a subdivision iteration count to generate at least one subdivided submesh, including determine a number of vertex positions for the at least one subdivided submesh by use of a number of vertices associated with an original submesh and by use of distortion information between the original submesh and a base mesh at each subdivision iteration associated with the subdivision iteration count. the processor is also configured to reconstruct at least a portion of a mesh-frame using the vertex positions corresponding to the at least one subdivided submesh.
20240355041. SURROUND VIEW SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Doron Sabo of Tel-Aviv (IL) for samsung electronics co., ltd., Aviad Cohen of Tel-Aviv (IL) for samsung electronics co., ltd., Aya Wolf of Tel-Aviv (IL) for samsung electronics co., ltd., Liran Azaria of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): G06T15/20, G06T5/00, G06T5/50, G06T7/50, G06T7/80, G06V10/56, G06V10/74
CPC Code(s): G06T15/205
Abstract: aspects of the method, apparatus, non-transitory computer readable medium, and system include estimating extrinsic camera parameters of a plurality of cameras based on detection of corners in a camera calibration arrangement by projecting an image of the detected corners onto an image plane of at least one of the plurality of cameras. the aspects further include incrementally tuning a location estimate for the detected corners based on pixels of the projected image, and adjusting the extrinsic camera parameters of the at least one of the plurality of cameras based on the tuned location estimate. the aspects further include generating a virtual image based on the pixels of the projected image mapped to a virtual image plane.
Inventor(s): Kun Jin of San Jose CA (US) for samsung electronics co., ltd., Siva Penke of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T17/20
CPC Code(s): G06T17/20
Abstract: a method includes obtaining, using at least one processing device of an electronic device, an identification of multiple three-dimensional (3d) objects of interest. the method also includes generating, using the at least one processing device, multiple intermediate 3d objects based on the 3d objects of interest using optimal transport, where the intermediate 3d objects are generated using interpolation or extrapolation based on shapes of the 3d objects of interest. the method further includes presenting, using the at least one processing device, one or more of the intermediate 3d objects to a user.
Inventor(s): Yeonju LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngsun RYU of Suwon-si (KR) for samsung electronics co., ltd., Sehee HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, H04W76/10, H04W76/30
CPC Code(s): G06T19/006
Abstract: the present disclosure proposes a method of a user terminal for grouping a plurality of augmented reality (ar) glasses in a wireless communication system, the method comprising the steps in which: a first user terminal is wirelessly connected to first ar glasses, and the first user terminal executes an application for connection to second ar glasses; the first user terminal recognizes that the second ar glasses are located within a preconfigured distance and angle range; connection information for connection to the first user terminal is transmitted to the second ar glasses; the user terminal is wirelessly connected to the second ar glasses and receives information on the second ar glasses; and the application displays that the first ar glasses, the second ar glasses, and the first user terminal are grouped.
Inventor(s): Ji Youn HAN of Suwon-si (KR) for samsung electronics co., ltd., Min Sun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/0482, G06F3/04845, G06T19/20, G06V20/20, H04N23/60
CPC Code(s): G06T19/006
Abstract: a mobile device includes a display, a camera to capture an image of a space in which an image device can be installed, a user interface, and a controller. the controller can identify a plane from the image captured by the camera, control the display so as to display a grid on a virtual plane corresponding to the plane, adjust the grid based on an input of a user received via the user interface, and control the display so as to display, on the grid, the virtual image of the image device.
Inventor(s): Behnam Babagholami Mohamadabadi of Escondido CA (US) for samsung electronics co., ltd., Mostafa El-Khamy of San Diego CA (US) for samsung electronics co., ltd., Kee-Bong Song of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G10L15/06, G10L15/16, G10L15/20
CPC Code(s): G10L15/063
Abstract: a system including: one or more processors; and memory including instructions that, when executed by the one or more processors, cause the one or more processors to: generate augmented input data by mixing noise components of training data; train a first neural network based on the augmented input data and ground truth data of the training data to output a first prediction of clean speech; lock trainable parameters of the first neural network as a result of the training of the first neural network; and train a second neural network according to the augmented input data and predictions of the first neural network to output a second prediction of the clean speech.
20240355362. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Han Seong Shin of Suwon-si (KR) for samsung electronics co., ltd., Ki Seok Lee of Suwon-si (KR) for samsung electronics co., ltd., Keun Nam Kim of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung Kim of Suwon-si (KR) for samsung electronics co., ltd., Chan-Sic Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C5/06, H10B12/00
CPC Code(s): G11C5/063
Abstract: a semiconductor memory device includes a substrate comprising an element isolation layer, a bit line that extends on the substrate in a first direction, a cell buffer insulating layer between the bit line and the substrate and comprising an upper cell buffer insulating layer and a lower cell buffer insulating layer, a lower storage contact disposed on a plurality of sides of the bit line and comprising a semiconductor epitaxial pattern, a storage pad on the lower storage contact and connected to the lower storage contact and an information storage unit on the storage pad and connected to the storage pad, wherein the upper cell buffer insulating layer is between the lower cell buffer insulating layer and the bit line, and each of the lower cell buffer insulating layer and the upper cell buffer insulating layer comprises an upper surface and a lower surface that are opposite to each other.
Inventor(s): CHANG SEOK LEE of Suwon-si (KR) for samsung electronics co., ltd., Yohan KIM of Ulju-gun (KR) for samsung electronics co., ltd., Hyung-Joon SHIN of Ulju-gun (KR) for samsung electronics co., ltd., KYUNGEUN BYUN of Suwon-si (KR) for samsung electronics co., ltd., KEUN WOOK SHIN of Suwon-si (KR) for samsung electronics co., ltd., HYEON JIN SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo SON of Ulju-gun (KR) for samsung electronics co., ltd., Zonghoon LEE of Ulju-gun (KR) for samsung electronics co., ltd.
IPC Code(s): H01B1/04, C23C16/26, C23C16/50, H01L21/285, H01L21/768, H01L23/48, H01L23/522, H01L23/532, H01L25/065
CPC Code(s): H01B1/04
Abstract: spiral graphene nanocrystals having electrical conductivity in a vertical direction due to interlayer covalent bonds, a graphene thin film including the spiral graphene nanocrystals, an interconnect structure manufactured from the spiral graphene nanocrystals or the graphene thin film, and a method of manufacturing the interconnect structure and an electronic device including the interconnect structure.
Inventor(s): Yeny YIM of Suwon-si (KR) for samsung electronics co., ltd., Dongok KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Subong SHON of Suwon-si (KR) for samsung electronics co., ltd., Hansaem PARK of Suwon-si (KR) for samsung electronics co., ltd., Byeongkyu CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/26, G06T5/50, G06T7/13, G06T7/60, G06V20/70
CPC Code(s): H01J37/26
Abstract: a method of operating a transmission electron microscope (tem) image processing apparatus, includes acquiring a tem image from a tem facility, performing weak labeling of the tem image, generating ground truth for a partially labeled tem image using a guide model, performing segmentation using training data consisting of a pair of the tem image and the ground truth; measuring a device core structure according to a result of the segmentation, and visualizing a measurement result according to the device core structure, and storing the same in a database.
20240355583. PLASMA PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Naohiko OKUNISHI of Suwon-si (KR) for samsung electronics co., ltd., Hyeong Mo KANG of Suwon-si (KR) for samsung electronics co., ltd., Nam Kyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seong Sik NAM of Suwon-si (KR) for samsung electronics co., ltd., Seung Bo SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, C23C16/455, C23C16/458, C23C16/509, C23C16/52
CPC Code(s): H01J37/32137
Abstract: a plasma processing apparatus comprises a shower head configured to receive an electrode therein, and a variable impedance controller on the shower head. the variable impedance controller includes a first member spaced apart from the shower head and arranged along a circumference of the shower head, and a second member on the first member and configured to rotate. the variable impedance controller is configured to control an impedance by changing the impedance resulting from the first member and the second member as at least one contact point between the first member and the second member is changed according to rotation of the second member.
Inventor(s): John Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Gwan Ho Kim of Suwon-si (KR) for samsung electronics co., ltd., Ji Yoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Heung Sik Park of Suwon-si (KR) for samsung electronics co., ltd., Keun Hee Bai of Suwon-si (KR) for samsung electronics co., ltd., Jong Min Baek of Suwon-si (KR) for samsung electronics co., ltd., Do Haing Lee of Suwon-si (KR) for samsung electronics co., ltd., Jong Sun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/32, H01L21/02, H01L21/027, H01L21/033, H01L21/3065, H01L21/768
CPC Code(s): H01L21/32
Abstract: a for fabricating a semiconductor device comprises forming a mask layer on a substrate, the mask layer defining a through hole that exposes an upper surface of the substrate, the mask layer comprising a first mask layer and a second mask layer, wherein the second mask layer is between the substrate and the first mask layer, and wherein the second mask layer comprises carbon. the method includes forming a liner layer on side walls of the through hole inside the second mask layer.
Inventor(s): Youngja Kim of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48, B23K1/012, B23K101/40, H01L21/67
CPC Code(s): H01L21/4853
Abstract: in a method of manufacturing an electronic device, a substrate including a plurality of bonding pads on a first surface thereof is provided. solder members are attached on the plurality of bonding pads respectively. an airflow control cover is positioned on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes that allows air to flow toward the solder members. the substrate on which the airflow control cover is positioned is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. the heat transfer fluid is heated to place the heat transfer fluid in a vapor state within the chamber. the solder members are soldered by supplying the heat transfer fluid in the vapor state to surfaces of the solder members through the vapor passage holes of the airflow control cover.
20240355666. SUBSTRATE TRANSFERRING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sung-Il Choi of Suwon-si (KR) for samsung electronics co., ltd., Seong-Eun Kang of Suwon-si (KR) for samsung electronics co., ltd., Kyung Beom Kim of Suwon-si (KR) for samsung electronics co., ltd., Sung Yoon Ryu of Suwon-si (KR) for samsung electronics co., ltd., Mi Ra Park of Suwon-si (KR) for samsung electronics co., ltd., Yong Kyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeung Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Ju Hyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Nam Young Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H01L21/687
CPC Code(s): H01L21/6838
Abstract: a substrate transferring apparatus includes a support plate including an upper surface on which a substrate is configured to be seated, and a vacuum pad detachably coupled to the support plate and configured to vacuum suction the substrate to fix the substrate on the upper surface of the support plate, wherein the vacuum pad includes a suction area and a support protrusion surrounding the suction area, an upper surface of the support protrusion is at a higher vertical level than an upper surface of the suction area to support the substrate, and the upper surface of the support protrusion is inclined relative to horizontal.
Inventor(s): Junho Yoon of Suwon-si (KR) for samsung electronics co., ltd., Junyun Kweon of Suwon-si (KR) for samsung electronics co., ltd., Haemin Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangyong Lee of Suwon-si (KR) for samsung electronics co., ltd., Jesung Kim of Suwon-si (KR) for samsung electronics co., ltd., Dayoung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/78, H01L23/00
CPC Code(s): H01L21/78
Abstract: a semiconductor chip includes an active layer on a top surface of an underlying base substrate. the active layer has: bonding surface therein that delineates an interface between a bottom active layer and a top active layer extending on the bottom active layer, and a chamfered edge that extends entirely through the top active layer to fully expose a sidewall thereof but only partially through the bottom active layer, such that the chamfered edge has a vertical height greater than a thickness of the top active layer but less than a combined thickness of the top and bottom active layers. a protective layer is also provided, which covers at least a portion of a top surface of the active layer. a vertical level of a bottom of the chamfered edge may be higher than a vertical level of the top surface of the base substrate.
20240355709. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kitae Park of Suwon-si (KR) for samsung electronics co., ltd., Seonkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungmin Baek of Suwon-si (KR) for samsung electronics co., ltd., Joonseok Oh of Suwon-si (KR) for samsung electronics co., ltd., Joohyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Junghyun Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/31, H01L23/544, H01L25/065
CPC Code(s): H01L23/481
Abstract: a semiconductor package includes a base chip, a first semiconductor chip on the base chip, and a first fillet layer between the base chip and the first semiconductor chip. the base chip includes a base substrate, a plurality of through-electrodes penetrating through the base substrate, a protective layer surrounding the plurality of through-electrodes and covering an upper surface of the base substrate, and a plurality of trenches vertically penetrating the protective layer. the plurality of through-electrodes form a transistor area on the base substrate, and the plurality of trenches include first trenches disposed between adjacent through-vias in the transistor area and second trenches disposed in an outer side portion of the transistor area.
Inventor(s): JAEMYUNG CHOI of Niskayuna NY (US) for samsung electronics co., ltd., Kang -Ill Seo of Springfield VA (US) for samsung electronics co., ltd., Se Jung Park of Watervliet NY (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L21/768, H01L23/532
CPC Code(s): H01L23/5226
Abstract: integrated circuit devices and methods of forming the same are provided. the integrated circuit devices may include a lower metal wire, an upper metal wire on the lower metal wire, a metal via between the lower metal wire and the upper metal wire, the metal via including a lower surface and an upper surface that respectively contact the lower metal wire and the upper metal wire, and a barrier layer extending on a side surface of the metal via. an upper portion of the barrier layer may extend upwardly beyond a lower surface of the upper metal wire.
Inventor(s): Hyemi LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Heesuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangjae Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Juyoung Lim of Suwon-si (KR) for samsung electronics co., ltd., Minkyu Chung of Suwon-si (KR) for samsung electronics co., ltd., Sanghun Chun of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a plate layer, gate electrodes and interlayer insulating layers alternately stacked on the plate layer in a first direction perpendicular to an upper surface of the plate layer and forming a first stack structure and a second stack structure on the first stack structure, a channel structure penetrating through the gate electrodes and extending in the first direction, and a contact plug extending in the first direction and electrically connected to one of the gate electrodes, wherein the second stack structure includes a first gate electrode on a lowermost portion, a first interlayer insulating layer on the first gate electrode, and a second interlayer insulating layer on the first interlayer insulating layer, and the first interlayer insulating layer has a first thickness, and the second interlayer insulating layer has a second thickness smaller than the first thickness.
Inventor(s): Jeonghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaesuk Park of Suwon-si (KR) for samsung electronics co., ltd., Yigwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Changmin Park of Suwon-si (KR) for samsung electronics co., ltd., Hyungju Ryu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544
CPC Code(s): H01L23/544
Abstract: the present disclosure relates to semiconductor devices and their fabrication methods. an example semiconductor device comprises a substrate including a logic cell region and a key region, a dummy active pattern on the key region, and a key pattern in the dummy active pattern. the key pattern includes a key cell that is recessed at an upper portion of the substrate. the key cell includes a bottom surface lower than a top surface of the dummy active pattern, and a plurality of inner lateral surfaces that surround the bottom surface. the inner lateral surfaces include a first inner lateral surface and a second inner lateral surface opposite to the first inner lateral surface. a ratio of a silicon atom surface density of the second inner lateral surface to a silicon atom surface density of the first inner lateral surface is in a range of about 0.9 to about 1.1.
Inventor(s): YOUNG-DEUK KIM of Suwon-si (KR) for samsung electronics co., ltd., MI-NA CHOI of Suwon-si (KR) for samsung electronics co., ltd., HEEJUNG HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48
CPC Code(s): H01L24/16
Abstract: a semiconductor package includes a first semiconductor chip. a second semiconductor chip is disposed on the first semiconductor chip. a bump structure is disposed between the first semiconductor chip and the second semiconductor chip. the bump structure electrically connects the first semiconductor chip and the second semiconductor chip to each other. the bump structure includes a first bump pad and a second bump pad disposed on a same plane as each other, and a solder bump disposed between the first bump pad and the second bump pad. the solder bump abuts on a side of the first bump pad and a side of the second bump pad.
Inventor(s): Seunghyun Baik of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a substrate, a first semiconductor chip on an upper surface of the substrate, and electrically conductive bumps extending between and electrically connected to the substrate and the first semiconductor chip. a non-conductive film layer is provided, which has at least a portion extending between the electrically conductive bumps. a second semiconductor chip is provided, which extends on the upper surface of the substrate. electrically conductive wires are provided that electrically connect respective portions of the second semiconductor chip to respective portions of the upper surface of the substrate. in addition, the upper surface of the substrate includes a dam, which protrudes between one of: (i) a region overlapping the second semiconductor chip, and (ii) a region connected to the wires and a region overlapping the first semiconductor chip. the upper surface of the substrate may also include a trench recessed alongside at least a portion of the dam.
20240355779. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeonseok LEE of Pyeongtaek-si (KR) for samsung electronics co., ltd., Jongyoun KIM of Seoul (KR) for samsung electronics co., ltd., Seokhyun LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498, H01L23/522, H01L23/528
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a redistribution substrate having first and second surfaces, a first semiconductor chip on the first surface, external terminals on the second surface, a second semiconductor chip above the first semiconductor chip, external connection members below the second semiconductor chip, conductive pillars electrically connecting the external connection members to the redistribution substrate. the second semiconductor chip includes a device layer, a wiring layer, and a redistribution layer on a semiconductor substrate. the wiring layer includes intermetallic dielectric layers, wiring lines, and a conductive pad connected to an uppermost wiring line. the redistribution layer includes a first redistribution dielectric layer, a first redistribution pattern, and a second redistribution dielectric layer. a vertical distance between the semiconductor substrate and the conductive pillars is less than that between the first semiconductor chip and the external terminals.
Inventor(s): Juhyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Chajea JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/522, H01L23/528
CPC Code(s): H01L25/0657
Abstract: semiconductor packages and fabrication methods thereof are provided. a semiconductor package includes first and second structures. the first structure includes: a first semiconductor substrate that has an active surface on which a first semiconductor device is configured to be provided, and an inactive surface opposite to the active surface; a first through via that vertically penetrates the first semiconductor substrate and protrudes from the inactive surface of the first semiconductor substrate; a first protection layer that covers the inactive surface of the first semiconductor substrate and buries the first through via; and a first pad that penetrates at least a portion of the first protection layer and is coupled to the first through via. the second structure includes a second pad, the first structure and the second structure are bonded to each other, and the first pad and the second pad are in contact with each other.
Inventor(s): Choongbin Yim of Suwon-si (KR) for samsung electronics co., ltd., Jongkook Kim of Suwon-si (KR) for samsung electronics co., ltd., Chengtar Wu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L23/373, H01L23/498, H10B80/00
CPC Code(s): H01L25/105
Abstract: a semiconductor package may include: a redistribution layer structure; a semiconductor structure on the redistribution layer structure; a printed circuit board on the redistribution layer structure and extending around a side surface of the semiconductor structure; a molding material extending around the semiconductor structure on the redistribution layer structure; and a silicon interposer on the printed circuit board and the molding material.
20240355796. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DAEHO LEE of Hwaseong-si (KR) for samsung electronics co., ltd., JINHYUN KIM of Yongin-si (KR) for samsung electronics co., ltd., WANSOO PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/498
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a first redistribution substrate, a first semiconductor chip disposed on the first redistribution substrate, a first mold layer that covers the first semiconductor chip and the first redistribution substrate, a second redistribution substrate disposed on the first mold layer, a second semiconductor chip disposed on the second redistribution substrate, where the second semiconductor chip includes a second-chip first conductive bump that does not overlap the first semiconductor chip, a first sidewall that overlaps the first semiconductor chip, and a second sidewall that does not overlap the first semiconductor chip, wherein the first sidewall and the second sidewall are opposite to each other, and a first mold via that penetrates the first mold layer connects the second-chip first conductive bump to the first redistribution substrate, and overlaps the second-chip first conductive bump.
20240355798. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeonjeong HWANG of Suwons-si (KR) for samsung electronics co., ltd., Kyung Don MUN of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Lim SUK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/31, H01L23/367, H01L23/498, H10B80/00
CPC Code(s): H01L25/16
Abstract: a semiconductor package including a first semiconductor structure on a first redistribution layer structure; first conductive posts on the first redistribution layer structure and next to the first side of the first semiconductor structure; second conductive posts on the first redistribution layer structure and next to a second side opposite to the first side of the first semiconductor structure; a molding material molding the first semiconductor structure, the first conductive posts, and the second conductive posts on the first redistribution layer structure; a second redistribution layer structure on the molding material; a second semiconductor structure on the second redistribution layer structure; a heat dissipation structure on the second redistribution layer structure; and a 3d solenoid inductor including some of the second conductive posts, the redistribution lines at the uppermost of the first redistribution layer structure, and the redistribution lines at the lowermost of the second redistribution layer structure.
20240355802. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chengtar WU of Suwon-si (KR) for samsung electronics co., ltd., Jongkook Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/31, H01L23/48, H01L23/538, H10B80/00
CPC Code(s): H01L25/18
Abstract: a three-dimensional integrated circuit structure includes: a first semiconductor die; and a second semiconductor die disposed on the first semiconductor die, wherein the first semiconductor die includes: a plurality of through-silicon vias (tsv); and a plurality of integrated stack capacitor (isc) chips, wherein each of the plurality of isc chips is disposed between adjacent through-silicon vias among the plurality of through-silicon vias.
Inventor(s): BYOUNGHAK HONG of Albany NY (US) for samsung electronics co., ltd., SEUNGHYUN SONG of Albany NY (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/8238, H01L25/07, H01L27/06, H01L29/06, H01L29/423
CPC Code(s): H01L27/0922
Abstract: integrated circuit devices may include a lower transistor and an upper transistor stacked on a substrate, and the upper transistor may overlap the lower transistor. the upper transistor may include an upper gate structure, and the lower transistor may include a lower gate structure, and the upper gate structure and the lower gate structure may have different widths in a horizontal direction.
Inventor(s): Kyoungeun Chang of Suwon-si (KR) for samsung electronics co., ltd., Sungin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jameyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Incheol Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14603
Abstract: provided are an image sensor and an electronic system including the same. an image sensor includes a substrate having a pixel region in which an active region is defined, a gate electrode on the active region, and a source region and a drain region formed in the active region on both sides of the gate electrode, wherein the active region includes an edge portion extending along an outline of a top surface thereof, the edge portion including a local round edge portion having a first radius of curvature that is greater than a second radius of curvature of other portions of the edge portion, and a distance from the local round edge portion to the drain region is less than a distance from the local round edge portion to the source region, wherein the gate electrode includes a round inner corner portion facing the local round edge portion.
Inventor(s): Jinsu PARK of Suwon-si (KR) for samsung electronics co., ltd., Nosan PARK of Suwon-si (KR) for samsung electronics co., ltd., Jae-Kwan SEO of Suwon-si (KR) for samsung electronics co., ltd., Wonchun YANG of Suwon-si (KR) for samsung electronics co., ltd., Kookki LEE of Suwon-si (KR) for samsung electronics co., ltd., Seul-Young JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/13
CPC Code(s): H01L27/14621
Abstract: a manufacturing method of an image sensor includes inputting a substrate in an equipment, wherein a sensor array and a plurality of pads are on the substrate; forming a plurality of vortex generating patterns at regular intervals between the plurality of pads and the sensor array; and coating a photo resist while rotating the substrate based on operating the equipment.
Inventor(s): Dusik JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14636
Abstract: an image sensor includes: a first structure including a first side, a second side opposite to the first side, a pixel region where a plurality of pixels are disposed, and a penetration electrode region disposed adjacent to the pixel region; a second structure in which a driving circuit for driving the plurality of pixels is disposed, and stacked on the second side of the first structure; a plurality of penetration electrodes that penetrate the first structure and the second structure to electrically connect the first structure and the second structure to each other, and are disposed in the penetration electrode region; and a protective layer that is disposed on the plurality of penetration electrodes, and divided into a plurality of cells, wherein the protective layer covers the penetration electrode region.
Inventor(s): SEUNG MIN SONG of Halfmoon NY (US) for samsung electronics co., ltd., Panjae Park of Clifton Park NY (US) for samsung electronics co., ltd., Kang-Ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L21/8234, H01L25/07, H01L27/088, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: integrated circuit devices may include an upper transistor structure on a substrate, the upper transistor structure comprising an upper channel region and an upper gate electrode on the upper channel region; a lower transistor structure between the substrate and the upper transistor structure, the lower transistor structure comprising a lower channel region and a lower gate electrode on the lower channel region; and an intergate contact between the lower gate electrode and the upper gate electrode. the lower gate electrode may be electrically connected to the upper gate electrode through the intergate contact, and a portion of a lower surface of the intergate contact may protrude beyond a side surface of the lower gate electrode.
Inventor(s): SEUNG MIN SONG of hALFMOON NY (US) for samsung electronics co., ltd., JAEHONG LEE of Latham NY (US) for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L25/11, H01L27/092, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: an integrated circuit device comprising: an upper transistor structure on a substrate, the upper transistor structure comprising a pair of upper source/drain regions spaced apart from each other in a first horizontal direction and an upper gate electrode between the pair of upper source/drain regions; a lower transistor structure between the substrate and the upper transistor structure, the lower transistor structure comprising a lower gate electrode; an upper insulating layer on the lower transistor structure, wherein the upper gate electrode is in the upper insulating layer; and a lower gate contact extending through the upper insulating layer and contacting the lower gate electrode, a center of the upper gate electrode in a second horizontal direction and a center of the lower gate electrode in the second horizontal direction are offset from each other in the second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction.
Inventor(s): Hyumin YOO of Suwon-si (KR) for samsung electronics co., ltd., Myung Gil KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Byeonghee SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L21/8238, H01L27/092, H01L29/775, H01L29/786
CPC Code(s): H01L29/0847
Abstract: a semiconductor device includes a substrate including an active pattern; a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns, which are stacked to be spaced apart from each other; a source/drain pattern connected to the plurality of semiconductor patterns; a gate electrode on the plurality of semiconductor patterns; and a blocking layer between the source/drain pattern and the active pattern, wherein the source/drain pattern includes a protruding side surface protruding toward the semiconductor patterns, the blocking layer includes silicon-germanium (sige), and a germanium concentration of the blocking layer is higher than a germanium concentration of the source/drain pattern.
Inventor(s): Sungyeol Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Chunsoon Park of Suwon-si (KR) for samsung electronics co., ltd., Hyukjun Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/10, C01B33/12, C01G23/047, G02F1/13357, H01L25/075
CPC Code(s): H01L33/10
Abstract: a display apparatus includes a liquid crystal panel; and a backlight unit configured to provide light to the liquid crystal panel, wherein the backlight unit includes: a substrate; and a plurality of light emitting diode groups provided on an upper surface of the substrate, wherein each of the plurality of light emitting diode groups includes a red light emitting diode, a green light emitting diode, and a blue light emitting diode, wherein each of the red light emitting diode, the green light emitting diode, and the blue light emitting diode includes: a light emitting layer; and a distributed bragg reflector (dbr) provided on the light emitting layer, and wherein reflectivities of the distributed bragg reflectors of the red light emitting diode, the green light emitting diode, and the blue light emitting diode are within a same range of reflectivity according to an incident angle of light incident on the dbrs.
Inventor(s): KyuJung Jun of Albany CA (US) for samsung electronics co., ltd., Gerbrand Ceder of Orinda CA (US) for samsung electronics co., ltd., Yingzhi Sun of Albany CA (US) for samsung electronics co., ltd., Yan Wang of Brookline MA (US) for samsung electronics co., ltd., Lincoln Miara of Lincoln MA (US) for samsung electronics co., ltd., Yan Zeng of Albany CA (US) for samsung electronics co., ltd., Yihan Xiao of Berkeley CA (US) for samsung electronics co., ltd.
IPC Code(s): H01M4/58, H01M4/02, H01M10/0525
CPC Code(s): H01M4/5825
Abstract: a solid-state ion conductor including a compound of formula 1:
Inventor(s): KyuJung Jun of Albany CA (US) for samsung electronics co., ltd., Gerbrand Ceder of Orinda CA (US) for samsung electronics co., ltd., Yingzhi Sun of Albany CA (US) for samsung electronics co., ltd., Yan Wang of Brookline MA (US) for samsung electronics co., ltd., Lincoln Miara of Lincoln MA (US) for samsung electronics co., ltd., Yan Zeng of Albany CA (US) for samsung electronics co., ltd., Yihan Xiao of Berkeley CA (US) for samsung electronics co., ltd.
IPC Code(s): H01M4/58, H01M4/02, H01M10/0525
CPC Code(s): H01M4/5825
Abstract:
lib(pa1o) formula 1
Inventor(s): KyuJung Jun of Albany CA (US) for samsung electronics co., ltd., Gerbrand Ceder of Orinda CA (US) for samsung electronics co., ltd., Yingzhi Sun of Albany CA (US) for samsung electronics co., ltd., Yan Wang of Brookline MA (US) for samsung electronics co., ltd., Lincoln Miara of Lincoln MA (US) for samsung electronics co., ltd., Yan Zeng of Albany CA (US) for samsung electronics co., ltd., Yihan Xiao of Berkeley CA (US) for samsung electronics co., ltd.
IPC Code(s): H01M4/58, H01M4/02, H01M10/0525
CPC Code(s): H01M4/5825
Abstract: wherein, in formula 1, a1 is an element of groups 4, 14, or a combination thereof, and has an oxidation state of +4, and 0<y1<1.
Inventor(s): Ruoming WANG of Shenzhen (CN) for samsung electronics co., ltd.
IPC Code(s): H01P1/20, H01P5/08, H01P7/10
CPC Code(s): H01P1/2002
Abstract: a mixed-mode dielectric waveguide filter is provided. the mixed-mode dielectric waveguide filter includes a first multi-mode resonant cavity having at least two resonant modes, and a pair of first single-mode resonant cavities, wherein the pair of first single-mode resonant cavities correspond to the first multi-mode resonant cavity, and are directly coupled to a respective resonant mode of the first multi-mode resonant cavity to form a series topology with the first multi-mode resonant cavity, and wherein a parallel topology is formed between resonant modes of the first multi-mode resonant cavity.
Inventor(s): Jaehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghoon SUH of Suwon-si (KR) for samsung electronics co., ltd., Dongjun OH of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JO of Suwon-si (KR) for samsung electronics co., ltd., Nakchung CHOI of Suwon-si (CN) for samsung electronics co., ltd., Jaewon CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/27, G02C11/00, H01Q1/50
CPC Code(s): H01Q1/273
Abstract: a wearable electronic device may comprise: a lens frame configured to accommodate a lens; a front frame including a connection frame extending from the lens frame; a temple rotatably connected to the connection frame and configured to rotate about a rotary shaft, and to operate to be in a first state of being folded to form a first angle with respect to the lens frame or a second state of being unfolded to form a second angle with respect to the lens frame; a printed circuit board disposed in the temple, and on which a wireless communication circuit is disposed; and an antenna structure including an antenna electrically connected to the wireless communication circuit. the antenna structure may comprise: a coupling terminal disposed at an end of the temple at which the rotary shaft is located; a first antenna disposed on the front frame and including a first connection portion having at least a portion of a surface facing the coupling terminal; and a feeder configured to apply an electrical signal to the first antenna member through the coupling terminal. the coupling terminal may comprise: a first terminal portion configured to be coupled to the first connection portion in the first state; and a second terminal portion configured to be coupled to the first connection portion in the second state.
Inventor(s): Doohyun Yang of Suwon-si (KR) for samsung electronics co., ltd., Dooseok Choi of Suwon-si (KR) for samsung electronics co., ltd., Youngki Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon Jung of Suwon-si (KR) for samsung electronics co., ltd., Woncheol Jeong of Suwon-si (KR) for samsung electronics co., ltd., Dongkwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Joonhoi Hur of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/48, H01Q1/22, H01Q9/04
CPC Code(s): H01Q1/48
Abstract: an antenna module is provided. the antenna module includes: antenna module including: a ground layer; and an antenna structure on the ground layer and including: a plurality of layers including a first layer, a second layer and a third layer, wherein the second layer and the third layer are between the ground layer and the first layer; one or more vias extending through at least a portion of the plurality of layers; a radiating element in the first layer, a first stub in the second layer and extending from the one or more vias; and a second stub in the third layer and extending from the one or more vias.
Inventor(s): Jehun JONG of Suwon-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Keumsu SONG of Suwon-si (KR) for samsung electronics co., ltd., Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/24, H01Q1/24, H01Q21/30
CPC Code(s): H01Q21/245
Abstract: an electronic device, according to an embodiment, may comprise: a housing including a front plate, a rear plate oriented in a direction opposite to the front plate, and a side bezel surrounding a space between the front plate and the rear plate; a hole formed on the side bezel; an antenna module comprising a substrate disposed inside the housing and spaced apart from the hole, and a first conductive member comprising a conductive material disposed on a surface of the substrate facing the hole and configured to emit a signal having first polarization or second polarization; and a second conductive member comprising a conductive material disposed on a non-conductive member while facing the first conductive member, and coupled to the first conductive member.
Inventor(s): Youngjae KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/0013
Abstract: an electronic apparatus may include: batteries; a charger configured to charge the batteries; a switch network electrically connected to the batteries; and a charging controller configured to control the switch network to change a connection relationship between the batteries and to control the charger to charge the batteries while the batteries are in the changed connection relationship.
Inventor(s): Dam YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jehyung YOON of Suwon-si (KR) for samsung electronics co., ltd., Sangik CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158, H02M1/00
CPC Code(s): H02M3/1582
Abstract: a bi-directional direct current to direct current (dc-dc) converter includes: an inductor; a first switching transistor configured to switch a power supply voltage to one end of the inductor, in response to a first driving signal; a second switching transistor configured to switch between one end of the inductor and a ground voltage, in response to a second driving signal; and a bi-directional current sensor configured to sense a bi-directional current flowing through the second switching transistor in a boost mode and a buck mode, based on a switching node voltage at a drain of the second switching transistor, wherein the bi-directional current sensor is further configured to generate a virtual voltage of a positive voltage in a negative feedback method regardless of the sign of the switching node voltage to copy the bi-directional current.
Inventor(s): Dongsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Junsuk Bang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F3/24
CPC Code(s): H03F1/0238
Abstract: a communication circuit includes a first supply modulator configured to provide a first supply voltage; a second supply modulator configured to provide a second supply voltage; a switch configured to switch between output terminals of the first and second supply modulators; a first power amplifier configured to receive the first supply voltage and amplify a first input signal; a second power amplifier configured to receive the second supply voltage and amplify a second input signal; a third power amplifier configured to use third power higher than first power of the first power amplifier and second power of the second power amplifier, receive the first and second supply voltages, and amplify a third input signal; and a control circuit configured to control a switching operation of the switch based on an operation mode and activate at least one of the first to third power amplifiers based on the operation mode.
20240356553. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mingyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungjin Park of Suwon-si (KR) for samsung electronics co., ltd., Doobock Lee of Suwon-si (KR) for samsung electronics co., ltd., Youngchul Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K19/0185, H03K3/356, H03K17/22, H03K19/003
CPC Code(s): H03K19/018521
Abstract: a semiconductor device includes a first power node configured to supply a first power supply voltage, a pull-up circuit electrically connected between the first power node and an output node that is configured to output a signal, and a controller configured to output a pull-up control code to the pull-up circuit. the pull-up circuit includes a plurality of unit circuits electrically connected to each other in parallel between the first power node and the output node, and the plurality of unit circuits include a first unit circuit and a second unit circuit. the number of current paths provided by the first unit circuit between the first power node and the output node is different from the number of current paths provided by the second unit circuit between the first power node and the output node.
Inventor(s): Sein OH of Daejeon (KR) for samsung electronics co., ltd., Minkyu JE of Daejeon (KR) for samsung electronics co., ltd., Gichan YUN of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/46
CPC Code(s): H03M1/466
Abstract: an analog-to-digital converter includes a first input unit configured to quantize an input signal to generate a quantized input signal, a second input unit configured to generate a residue signal corresponding to a difference between the input signal and a previous digital value output during a previous analog-to-digital conversion cycle, a loop filter configured to generate an integrated residue signal, a comparator configured to output a digital value corresponding to the input signal in units of bits based on the quantized input signal and the integrated residue signal, and a controller configured to apply the previous digital value to the second input unit such that the residue signal is generated during quantization of the input signal and to control the first input unit such that the input signal is quantized in a successive approximation scheme based on an output of the comparator.
[[20240356565. ERROR CORRECTION CODE (ECC) CIRCUIT INCLUDING LOW-DENSITY PARITY-CHECK DECODER IN ADAPTIVE OPERATION MODE, OPERATING METHOD OF THE ECC CIRCUIT, AND MEMORY CONTROLLER INCLUDING THE ECC CIRCUIT_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Kangseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Bohwan Jun of Suwon-si (KR) for samsung electronics co., ltd., Youngjun Hwang of Suwon-si (KR) for samsung electronics co., ltd., Dongmin Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M13/11, H03M13/15, H03M13/37
CPC Code(s): H03M13/1174
Abstract: an example operating method of an error correction code (ecc) circuit includes receiving a codeword from a memory device, calculating a syndrome vector based on the codeword and a parity-check matrix indicating whether messages are exchanged between check nodes and variable nodes, performing, when the syndrome vector is not a zero vector, sequential decoding on a plurality of columns of the parity-check matrix by decoding a first column in a first operation mode, the first column having a first variable node degree, decoding a second column in a second operation mode, the second column having a second variable node degree, and decoding a third column in a third operation mode, the third column having a third variable node degree, and calculating the syndrome vector whenever the sequential decoding of the plurality of columns is completed and iteratively performing the sequential decoding until the syndrome vector is the zero vector.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Abhishek Sehgal of Frisco TX (US) for samsung electronics co., ltd., Hao-Hsuan Chang of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0654
Abstract: methods and apparatuses for wifi csi preprocessing for sensing applications are provided. a method of wireless communication performed by a sta comprises: receiving a sequence of frames; obtaining a csi set, comprising the csi for each of the frames; determining one or more variations in the csi set caused by at least one of a device impairment, a synchronization issue, or an unintended signal; performing a preprocessing procedure configured to: correct one or more errors in gain and phase of each csi of the csi set caused by at least one of the device impairment or the synchronization issue, and filter at least one variation caused by the unintended signal; and identifying at least one of an outlier or a variation in csi set that affects a sensing task, and performing at least one preprocessing operation configured to filter the outlier or the variation in csi set.
Inventor(s): Gapkyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeok Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongki Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongmook Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/06
CPC Code(s): H04L9/0631
Abstract: an encryption device includes an encryption core circuit configured to generate output data by performing an encryption operation on input data, and an encryption controller circuit configured to control an operation of the encryption core. the encryption core circuit includes a shiftrow circuit configured to generate shift data by performing a shiftrow operation on the input data, a security circuit configured to generate permutation data by performing a permutation operation including a mixcolumn multiplication operation on the shift data, a mixcolumn addition circuit configured to generate first mid data by performing a mixcolumn addition operation on the permutation data, and a round key addition operation circuit configured to generate the output data by performing a round key addition operation on the first mid data.
Inventor(s): Jan KIENIG of Warszawa (PL) for samsung electronics co., ltd., Przemyslaw WYSZKOWSKI of Warszawa (PL) for samsung electronics co., ltd., Mateusz ZAWADZKI of Warszawa (PL) for samsung electronics co., ltd.
IPC Code(s): H04L41/082, H04L41/0895
CPC Code(s): H04L41/082
Abstract: a management node and its operating method in a wireless communication system with a network slicing environment are disclosed. the management node may, as one or more of multiple higher-level entities sharing a lower-level entity managed by the management node are activated, receive an activation request of the shared lower-level entity, and activate the shared lower-level entity for the one or more activated higher-level entities, in response to the activation request.
Inventor(s): Wonbo LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngki HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L47/43, H04L43/0882, H04L47/2475
CPC Code(s): H04L47/43
Abstract: an electronic device and an operation method of the electronic device are provided. the electronic device includes memory storing pieces of mapping data to which different maximum numbers of packets, which can be aggregated according to data throughput, are mapped according to the link capacity of a link used to receive data, the memory further storing one or more computer programs, a communication circuit, and one or more processors communicatively coupled to the memory and the communication circuit, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to receive a plurality of packets through the communication circuit, identify the link capacity of a link used to receive the plurality of packets, select, from among pieces of mapping data, mapping data corresponding to the identified link capacity, on the basis of the throughput measured while receiving the plurality of packets and the selected mapping data, determine the maximum number of some packets to be aggregated among the plurality of packets, and transmit, to a network stack, packets aggregated on the basis of the determined number.
Inventor(s): Donghyun CHO of Suwon-si (KR) for samsung electronics co., ltd., Yongje LEE of Suwon-si (KR) for samsung electronics co., ltd., Yungyu GIM of Suwon-si (KR) for samsung electronics co., ltd., Eunsang JANG of Suwon-si (KR) for samsung electronics co., ltd., Seungjoo NA of Suwon-si (KR) for samsung electronics co., ltd., Rakyoung YOON of Suwon-si (KR) for samsung electronics co., ltd., Inchul HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
CPC Code(s): H04L63/10
Abstract: an apparatus and a method for operating a security device in an electronic device are provided. the electronic device includes an application processor, a communication processor, a security subsystem configured to process a security function, an authority assignment device configured to assign authority to access the security subsystem to the application processor or the communication processor, and a processor key management device configured to provide the security subsystem with a first key related to the application processor or a second key related to the communication processor assigned the authority to access the security subsystem from the authority assignment device, wherein the security subsystem is configured to process a security function related to the application processor or the communication processor by using the first key or the second key provided from the processor key management device, based on the authority assignment device assigning the authority to access the security subsystem to the application processor or the communication processor, and initialize data related to the application processor or the communication processor, based on returning the authority to access the security subsystem assigned to the application processor or the communication processor.
Inventor(s): Vijay SANGAMESHWARA of Bangalore (IN) for samsung electronics co., ltd., Kiran Gurudev KAPALE of Bangalore (IN) for samsung electronics co., ltd., Paarisha NARULA of Bangalore (IN) for samsung electronics co., ltd., Siva Prasad GUNDUR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L65/613, H04L65/1089, H04W76/40
CPC Code(s): H04L65/613
Abstract: the disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). in an embodiment, a method performed by a user equipment (ue) in a wireless communication system is provided, which includes receiving, from a mission critical video (mcvideo) server, a live video stream in an mcvideo group call; recording the live video stream received from the mcvideo server; and transmitting, to the mcvideo server, a transmission control message including a record media status message for indicating that the live video stream is being recorded while participating in the mcvideo group call. the ue is at least one among a plurality of ues participating in the mcvideo group call.
Inventor(s): Kyungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungkoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd., Junwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/24, H01Q5/335
CPC Code(s): H04M1/026
Abstract: an electronic device according to an embodiment comprises: a housing which includes a first conductive portion disposed at a first edge, a second conductive portion disposed at the first edge and a second edge perpendicular to the first edge, and a third conductive portion disposed at the second edge; a feeder which feeds power to a feeding point disposed in at least one of the first conductive portion and the second conductive portion; a connection element which can electrically connect the first conductive portion, the second conductive portion, and the third conductive portion to each other; and a processor. a first electrical path from the feeding point to one position of the first conductive portion may be different from a second electrical path from the feeding point to one position of the third conductive portion.
Inventor(s): Jinju LEE of Suwon-si (KR) for samsung electronics co., ltd., Hwamok PAK of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwook BAIK of Suwon-si (KR) for samsung electronics co., ltd., Minyee AN of Suwon-si (KR) for samsung electronics co., ltd., Dongik LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunggun CHO of Suwon-si (KR) for samsung electronics co., ltd., Wonhee CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H05K5/00, H05K5/02
CPC Code(s): H04M1/0269
Abstract: an electronic device includes a first housing; a second housing that can be drawn into and out of the first housing; a guide rail connected; and a display module supported by at least one of the first housing or the second housing and having a display region that varies according to the movement of the second housing relative to the first housing. the display module includes a display panel, a support plate positioned on the rear surface of the display panel, and support structures positioned on the rear surface of the support plate. the support structures include a support bar and a guide head positioned at one end of the support bar. the guide head includes a guide portion, which can slide along the guide rail, and an extension portion, which extends from the guide portion and is positioned between one end of the support bar and the support plate.
Inventor(s): Rajan Laxman Joshi of San Diego CA (US) for samsung electronics co., ltd., Madhukar Budagavi of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04N19/64, G06T9/00, H04N19/126, H04N19/129, H04N19/167, H04N19/176
CPC Code(s): H04N19/64
Abstract: an apparatus receives a compressed bitstream including an encoded displacements bitstream and packing method information indicating whether the displacement component samples are packed in ascending order or in descending order. the apparatus video-decodes the encoded displacements bitstream to generate a displacement video frame, wherein padding is added at a bottom of the displacement video frame irrespective of whether the displacement component samples are packed in ascending order or in descending order. the apparatus image-unpacks the displacement video frame to generate an array of quantized displacement wavelet coefficients, inverse-quantizes the array of quantized displacement wavelet coefficients to generate displacement wavelet coefficients, and inverse-wavelet-transforms the displacement wavelet coefficients to generate displacement component samples.
Inventor(s): Neha Dawar of McKinney TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Rebal Al Jurdi of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd., Qiang Xie of Suwon-si (KR) for samsung electronics co., ltd., Sejong Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/029, G01C21/16, G01C21/20, H04W64/00
CPC Code(s): H04W4/029
Abstract: a method includes receiving at least one wireless signal measurement and motion sensor measurements. the method also includes generating a location estimate based on the at least one wireless signal measurement. the method also includes determining whether a step is present based on the motion sensor measurements. the method also includes, in response to determining that a step is present, determining a step heading offset based on the location estimate and the motion sensor measurements, and determining a step length and heading based on the motion sensor measurements and the step heading offset. the method also includes determining a location of an object based on at least one of (i) the at least one wireless signal measurement or (ii) the step length and heading.
Inventor(s): Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W8/24
CPC Code(s): H04W8/24
Abstract: disclosed is a method of reporting capability signaling of a user equipment (ue) in consideration of a first telecommunications standard release and a second telecommunications standard release. the method includes determining that the capability signaling of the ue may be reported according to the first telecommunications standard release and the second telecommunication standard release; and reporting the capability signaling of the ue according to the second telecommunication standard release instead of the first telecommunication standard release, wherein a level of controllability of the ue in the second telecommunication standard release is greater than or equal to a level of controllability of the ue in the first telecommunication standard release.
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04B17/336, H04L5/00, H04W88/08
CPC Code(s): H04W24/10
Abstract: a method for operating a user equipment (ue) comprises receiving configuration information about a channel state information (csi) report associated with n>1 remote radio heads (rrhs), wherein: n=a number of rrhs, each rrh r=1, . . . , ncomprises a group of csi reference signal (csi-rs) ports, and the configuration information includes, for each rrh r=1, . . . , n, information about at least one csi-rs resource; and for each rrh r=1, . . . , n: measuring the at least one csi-rs resource, and determining, based on the measured at least one csi-rs resource, whether a csi-rs resource for rrh r is a channel measurement resource (cmr) or an interference measurement resource (imr); generating the csi report based on whether each csi-rs resource among the measured at least one csi-rs resource for each rrh is determined as a cmr or an imr; and transmitting the csi report.
Inventor(s): Uday TRIVEDI of Bangalore (IN) for samsung electronics co., ltd., Raviraj BHAT of Bangalore (IN) for samsung electronics co., ltd., Ajith Kumar KUPPAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04L9/40, H04L41/16, H04L47/2483
CPC Code(s): H04W28/0215
Abstract: the present disclosure relates to field of telecommunication network and discloses method and apparatus e.g., network entity for network traffic management. the network entity may be associated with a deep packet inspection system (dpi), the network entity receives an encrypted quick user datagram protocol (udp) internet connection (quic) data packet flow from a source. further, network entity predicts using an artificial intelligence (ai) model, a relevancy of decryption for an encrypted quic initial handshake packet of the quic data packet flow based on at least one of pre-stored user equipment (ue) context parameters, pre-stored server context parameters and flow context parameters of the encrypted quic data packet flow. the network entity decrypts the encrypted quic initial handshake packet based on the relevancy of the decryption being predicted to be useful. the present disclosure helps to optimize deep packet inspection (dpi) operation.
Inventor(s): Cuiwei TANG of Beijing (CN) for samsung electronics co., ltd., Di SU of Beijing (CN) for samsung electronics co., ltd., Chen QIAN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W40/16, H04B17/345, H04W24/08
CPC Code(s): H04W40/16
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). the present disclosure provides a method performed by a first node in a wireless communication system comprising: acquiring first information on a first interference to a first terminal, and second information related to node(s) associated with the first node; determining interfering base station related information and interference management related information based on the first information and the second information, wherein the first interference is formed by forwarding a signal sent from an interfering base station by a second node; sending the interference management related information to the second base station and/or the interfering base station, wherein the second base station is a base station of a serving cell of the second node.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/08, H04W48/18, H04W84/04
CPC Code(s): H04W48/08
Abstract: the disclosure relates to 5th generation (5g) and/or 6th generation (6g) communication system for supporting a higher data transmission rate. embodiments herein provide a method of controlling an user equipment (ue) transmitting data over a control plane (cp) including prohibiting the ue from transmitting the data over the cp when a 5g session management (5gs.m) timer is running.
Inventor(s): Jaewon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngbum KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Junyung YI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W8/22, H04W72/1273, H04W72/232
CPC Code(s): H04W52/0206
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. the disclosure provides a method performed by a terminal in a wireless communication system, including receiving, from a base station while operating in a normal mode, an indicator indicating a base station energy saving mode, and operating in the base station energy saving mode based on the indicator.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/15
CPC Code(s): H04W52/0248
Abstract: methods and apparatuses for facilitating selection between operating modes of mlds. a non-ap mld comprises a processor and stas having first and second links operating in the 5 and 2.4 ghz bands, respectively, with aps of an ap mld. the processor determines: based on traffic latency/throughput requirements, to operate in str mode using both links, or, based on power saving requirements, to operate in a single link mode using the second link, or, based on the power savings requirements having a higher priority than the latency/throughput requirements, to operate in emlsr mode using both links or in the single link mode using the first link. if the power savings and latency/throughput requirements are balanced, the processor determines: in a high contention environment, to operate in emlsr mode using both links or, in a low contention environment, to operate in str mode using both links.
Inventor(s): Jaemoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Kyunghoon MOON of Suwon-si (KR) for samsung electronics co., ltd., Jungsuk WOO of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jaegon GHIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04W52/16, H04W52/38
CPC Code(s): H04W52/367
Abstract: according to various embodiments, an electronic device configures a first maximum transmission power limit for a first rf path, transmits, through the first rf path, a first rf signal using transmission power configured based on the first maximum transmission power limit, configures a second maximum transmission power limit for a second rf path, transmits, through the second rf path, a second rf signal using transmission power configured based on the second maximum transmission power limit; identifies whether an rf path change condition is satisfied, transmits, through a third rf path, the second rf signal using transmission power configured based on a third maximum transmission power limit and transmits, through the first rf path, the first rf signal using the transmission power configured based on the first maximum transmission power limit. various other embodiments are possible.
Inventor(s): Seungbeom JEONG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W76/28
CPC Code(s): H04W68/02
Abstract: an embodiment of the present disclosure provides an operating method of a user equipment (ue) in a wireless communication system. the operating method may include: establishing a radio resource control (rrc) connection with a camped-on cell; receiving, in an rrc connected mode, a first extended discontinuous reception (edrx) parameter for core network (cn) paging from a cn; receiving a second edrx parameter for radio access network (ran) paging from a base station (bs); transitioning to an rrc idle mode or an rrc inactive mode; calculating a length of a first paging time window (ptw) and a length of a second ptw, based on identity information of the ue, the first edrx parameter, and the second edrx parameter; determining a paging monitoring cycle, based on at least one of an rrc mode of the ue, information of a frame being currently monitored, information of the first ptw, or information of the second ptw; and performing paging monitoring, based on the determined paging monitoring cycle.
20240357594. METHOD PERFORMED BY NETWORK NODE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Danye WU of Beijing (CN) for samsung electronics co., ltd., Yuhan HU of Beijing (CN) for samsung electronics co., ltd., Jian YANG of Beijing (CN) for samsung electronics co., ltd., Ming JIN of Beijing (CN) for samsung electronics co., ltd., Yelong ZHANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/20, H04W72/12, H04W72/512
CPC Code(s): H04W72/20
Abstract: a method performed by a first network node in a communication system for supporting ultra-reliable and low latency communication (urllc) in open radio access network (o-ran) is provided. the method includes receiving a control plane message of a first communication from a second network node, wherein the control plane message comprises preemption type information and information related to the first communication preempting resource layers of a second communication, and determining resources for the first communication based on the control plane message.
Inventor(s): Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/50, G06F7/499, H04W72/0453, H04W72/21, H04W72/23, H04W72/53, H04W72/54
CPC Code(s): H04W72/535
Abstract: methods and apparatuses for pdcch reception and transmission. a method for pdcch reception includes transmitting a capability for receptions of pdcchs on a downlink (dl) cell. pdcch receptions on the dl cell are according to (x, y) or (x, y) when any two pdcch receptions are within yor ysymbols or have first symbols separated by at least xor xsymbols, respectively. the method further includes receiving a configuration of search space sets for pdcch receptions on the dl cell; determining, based on the configuration of the search space sets, whether pdcch receptions are according to (x, y); and receiving on the dl cell: a maximum number of m pdcchs within ysymbols when pdcch receptions are not according to (x, y), and a maximum number of m pdcchs within ysymbols when pdcch receptions are according to (x, y).
Inventor(s): Hyunseok RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jonghyun BANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/56, H04W56/00, H04W72/044, H04W72/20, H04W92/18
CPC Code(s): H04W72/56
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides a method and a device for allocating transmission power in a wireless communication system.
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/00, H04W74/0833
CPC Code(s): H04W74/002
Abstract: apparatuses and methods for uplink timing adjustment in a wireless communication system. a method for operating a user equipment (ue) includes receiving a first uplink (ul) timing advance (ta) command for a first link associated with a first physical cell identity (pci); receiving a second ul ta command for a second link associated with a second pci; and determining, based on the first and second ul ta commands, first and second ul timing adjustments for the first and second links associated with the first and second pcis, respectively. the method further includes transmitting a physical uplink control channel (pucch), a physical uplink shared channel (pusch), or a sounding reference signal (srs) associated with the first pci according to the first ul timing adjustment; and transmitting a pucch, a pusch, or a srs associated with the second pci according to the second ul timing adjustment. the second pci is different from a serving cell pci.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Yi WANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W74/0808, H04W92/18
CPC Code(s): H04W74/0808
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the application discloses a method for determining sidelink resource, the method comprising: applying a sidelink communication system on a shared spectrum by a first node; and determining a sidelink transmission resource based on the sidelink communication system being applied on the shared spectrum.
20240357649. QOS PROCEDURES FOR WLAN_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W74/0816, H04W36/08, H04W74/08
CPC Code(s): H04W74/0816
Abstract: methods and apparatuses for facilitating quality of service (qos) enhancements to support low latency operations in a wireless local area network (wlan). a station (sta) comprises a processor and a transceiver operably coupled to the processor. the transceiver is configured to obtain a transmission opportunity (txop). the processor is configured to determine that at least a portion of the txop will go unused by the sta and handover the unused portion of the txop to an access point (ap).
20240357669. PUSCH AND PRACH ENHANCEMENTS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Mohammed KARMOOSE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W72/0446, H04W72/1268, H04W74/00
CPC Code(s): H04W74/0841
Abstract: a method for pusch repetition or prach aggregation. in some embodiments, the method includes transmitting, by a user equipment (ue), in a first slot, a first physical uplink shared channel (pusch) transmission including a set of coded bits selected from a circular buffer of the ue based on a first redundancy version (rv); determining, by the ue, that a second slot is available for an earliest repetition of the first pusch transmission, the second slot being later than the slot immediately following the first slot; determining, by the ue, based on the second slot, a second redundancy version; and transmitting, by the ue, in the second slot, a second pusch transmission including a set of coded bits selected from the circular buffer of the ue based on the second redundancy version, the second pusch transmission being a repetition of the first pusch transmission.
Inventor(s): Youngkyo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/27, H04W68/00, H04W76/40
CPC Code(s): H04W76/27
Abstract: the present disclosure, pertaining to a 5g or 6g communication system for supporting a higher data transmission rate, provides a method for operating an apparatus having an access and management function (amf) for waking a terminal to activate a multicast/broadcast service (mbs) session in a mobile communication system.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Philippe SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04B7/06, H04W72/1273, H04W74/0833
CPC Code(s): H04W76/28
Abstract: methods and apparatuses are provided in which a user equipment (ue) is configured with a cell discontinuous transmission (dtx)/discontinuous reception (drx) configuration defined by a dtx/drx periodicity, a dtx/drx starting slot or offset, and a dtx/drx active period. the cell dtx/drx configuration is enabled or disabled at the ue.
Inventor(s): Gyu Sik LIM of Suwon-si (KR) for samsung electronics co., ltd., Sun Hee KOO of Seoul (KR) for samsung electronics co., ltd., Chang Min BAEK of Seoul (KR) for samsung electronics co., ltd., In Young CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/64, A23L3/01, A23L5/10, A23L5/30, H05B1/02, H05B6/68
CPC Code(s): H05B6/6485
Abstract: a cooking apparatus has a cooking chamber, a microwave unit to radiate microwaves to the cooking chamber, a convection unit to supply hot air to the cooking chamber, a grill unit to supply radiant heat to the cooking chamber, an input unit to receive a cooking command and a control unit to perform a cooking corresponding to the received cooking command by performing one of a first heating stage and a second heating stage, and after performing the one of the first heating stage and the second heating stage, performing the other one of the first heating stage and the second heating stage. in the first heating stage, the control unit operates the microwave unit and at least one of the convection unit and the grill unit, and in the second heating stage, the control unit operates the grill unit and the convection unit while not operating the microwave unit.
Inventor(s): Jaeyong PARK of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangha SHIN of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K1/18
CPC Code(s): H05K1/0271
Abstract: an electronic device includes a first circuit board and a second circuit board spaced apart from each other, a flexible circuit board connecting the first circuit board to the second circuit board, the flexible circuit board including an extension portion which extends between the first circuit board and the second circuit board in an extending direction of the flexible circuit board, and a shock absorber facing the extension portion of the flexible circuit board in a facing direction, the shock absorber moveable along the facing direction by movement of the extension portion of the flexible circuit board along the extending direction.
Inventor(s): Yeonkyung CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Jinyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Chulwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongjae SONG of Suwon-si (KR) for samsung electronics co., ltd., Sangwon HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/03
CPC Code(s): H05K1/036
Abstract: an electronic device according to an embodiment of the disclosure may comprise: a housing and a printed circuit board disposed in the housing and comprising an alternately stacked plurality of insulation layers and plurality of conductive layers. the plurality of insulation layers may include at least one first insulation layer and at least one second insulation layer. the at least one first insulation layer may include a first insulator including a resin having a tg value of 200 degrees or more and a filler having a content of 50% to 70%. the at least one second insulation layer may include a second insulator including a glass fiber.
Inventor(s): Inchan HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyung Hee CHO of Suwon-si (KR) for samsung electronics co., ltd., Seunghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B10/00, H01L23/522, H01L23/528, H01L29/423
CPC Code(s): H10B10/12
Abstract: a semiconductor memory device comprising a substrate having first and second surfaces opposite to each other, a lower active region on the first surface and including a first lower gate electrode and a first lower active contact, an upper active region on the lower active region and including a first upper gate electrode and a first upper active contact that vertically overlap at least a part of the first lower active contact, a first connection structure vertically connecting the first upper active contact to the first lower active contact, a first metal layer on the first surface, and a backside metal layer on the second surface. the first upper gate electrode and the first lower gate electrode are connected and form a first gate electrode. the first metal layer includes a first node line electrically connecting the first gate electrode to the first upper active contact.
Inventor(s): Tae Jin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Jae PARK of Suwon-si (KR) for samsung electronics co., ltd., Ki Seok LEE of Suwon-si (KR) for samsung electronics co., ltd., Myeong-Dong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: there is provided a semiconductor memory device comprising: a substrate; a base insulating film on an upper surface of the substrate; a plurality of first conductive patterns on the base insulating film and spaced apart from each other, wherein the plurality of first conductive patterns extend in a first direction; a spacer structure on a side surface of each of the plurality of first conductive patterns; a barrier metal film on a side surface of the spacer structure, wherein the barrier metal film extends through the base insulating film to be electrically connected to the substrate; a filling metal film on the barrier metal film, wherein the filling metal film fills at least a portion of a space between adjacent ones of the plurality of first conductive patterns; and a capacitor structure on the filling metal film, wherein the capacitor structure is electrically connected to the filling metal film.
20240357796. SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Han Jin Lim of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo Han of Suwon-si (KR) for samsung electronics co., ltd., Ki Seok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H10B53/30
CPC Code(s): H10B12/377
Abstract: provided is a semiconductor memory device. the semiconductor memory device includes a substrate, a channel region on the substrate, first and second source/drain regions electrically connected to the channel region, a gate electrode that extends in a first direction and is on the channel region, a conductive line that extends in a second direction intersecting the first direction and is electrically connected to the second source/drain region, and a capacitor structure electrically connected to the first source/drain region on the substrate. the capacitor structure may include a plurality of first electrodes stacked and spaced apart from each other in a third direction perpendicular to an upper surface of the substrate, a plurality of trenches extending into the plurality of first electrodes, a capacitor dielectric film that extends along side walls of each of the plurality of trenches, and a plurality of second electrodes in the plurality of trenches, respectively.
20240357799. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Choong Hyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Joon Cheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Kang-Uk KIM of Suwon-si (KR) for samsung electronics co., ltd., Jin A KIM of Suwon-si (KR) for samsung electronics co., ltd., Byoung Wook JANG of Suwon-si (KR) for samsung electronics co., ltd., Young-Seung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, G11C5/06
CPC Code(s): H10B12/482
Abstract: there is provided a semiconductor memory device capable of improving performance and reliability of an element. the semiconductor memory device includes a substrate including a cell region and a peripheral region, a cell region isolation layer in the substrate, isolating the cell region from the peripheral region, an isolation active region surrounded by the cell region isolation layer, a bit line structure on the cell region, including a cell conductive line and a cell gate electrode in the substrate of the cell region, crossing the cell conductive line.
Inventor(s): SANGHO LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung Jeong of Suwon-si (KR) for samsung electronics co., ltd., Sihyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Yoongi Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a first bit line extending in a first direction, a first semiconductor pattern extending in a second direction and including first and second ends opposite to each other, the first end of the first semiconductor pattern being in contact with the first bit line, a first word line on the first semiconductor pattern and extending in a third direction, a selection line adjacent to the second end of the first semiconductor pattern and parallel to the third direction, a second semiconductor pattern interposed between the selection line and the first semiconductor pattern and having first end and second ends opposite to each other, a second bit line extending in the first direction and in contact with the first end of the second semiconductor pattern, and a source line extending in the first direction and in contact with the second end of the second semiconductor pattern.
20240357801. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hanjin Lim of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Han of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Keunnam Kim of Suwon-si (KR) for samsung electronics co., ltd., Seokhan Park of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/28, H01L29/51
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device includes a bit line extending in a first direction, an active pattern on the bit line, the active pattern including first and second vertical portions facing each other in the first direction and a horizontal portion connecting the first and second vertical portions, first and second word lines on the horizontal portion between the first and second vertical portions, the first and second word lines extending in a second direction crossing the first direction, a gate insulating pattern between the first and second word lines and the active pattern, and a capacitor connected to each of the first and second vertical portions, the capacitor including a first electrode pattern connected to one of the first and second vertical portions, a second electrode pattern on the first electrode pattern, and a ferroelectric pattern between the first electrode pattern and the second electrode pattern.
20240357802. SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Tae Jin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hui Jung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor memory device comprising: a substrate including active patterns; a gate structure intersecting the active patterns; bit-line structures on the substrate; first contacts, wherein the bit-line structures and the first contacts are alternately arranged with each other; insulating patterns respectively disposed on the bit-line structures, wherein an insulating pattern among the insulating patterns is disposed in a first trench exposing a sidewall of a first contact among the first contacts and at least a portion of the gate structure; and second contacts disposed on the first contacts, wherein a second contact among the second contacts is disposed in a second trench exposing a sidewall of the insulating pattern and an upper surface of the first contact, wherein the insulating pattern overlaps an upper surface of a bit-line structure among the bit-line structures and extends along sidewalls of the first and second trenches and contacts the first and second contacts.
Inventor(s): Dongmin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyo-sub KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu SUN of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok AHN of Suwon-si (KR) for samsung electronics co., ltd., Jay-bok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device may include a substrate including a cell block region and a peripheral region, which are adjacent to each other in a first direction, an active pattern on the cell block region, a bit line provided on the active pattern and extended in the first direction, a first insulating structure in contact with the bit line, and a contact plug electrically connected to the bit line. the bit line may include a first curved portion, a first linear portion connected to the first curved portion, and a first intervening portion connected to the first curved portion. the contact plug may be overlapped with the first curved portion.
Inventor(s): JEA-YEON LEE of Suwon-si (KR) for samsung electronics co., ltd., YOUNGHO KWON of Suwon-si (KR) for samsung electronics co., ltd., SEONKYUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., HYUNKOOK LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, H01L23/522, H01L23/528, H01L25/065, H10B41/35, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B41/27
Abstract: the present disclosure relates to a semiconductor device and an electronic system including the same, and the semiconductor device according to an embodiment includes: a first substrate; a wire portion disposed on the first substrate and including a wire layer and an insulation layer covering the wire layer; a second substrate disposed on the wire portion; a first gate stacking structure including an interlayer insulating layer and a gate electrode alternately stacked on the second substrate; a second gate stacking structure including an interlayer insulating layer and a gate electrode alternately stacked on the first gate stacking structure; and a channel structure passing through the first gate stacking structure and the second gate stacking structure and connected to the second substrate, wherein the second substrate includes a first material layer and a second material layer disposed on the first material layer, the first material layer includes polysilicon including a first material, the second material layer includes polysilicon including a second material that is different from the first material, and the insulation layer is disposed between the wire layer and the second substrate, and a first side of the first material layer contacts the insulation layer.
20240357810. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyung Hwan LEE of Seoul (KR) for samsung electronics co., ltd., Yong Seok KIM of Suwon-si (KR) for samsung electronics co., ltd., Il Gweon KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hyun Cheol KIM of Seoul (KR) for samsung electronics co., ltd., Hyeoung Won SEO of Yongin-si (KR) for samsung electronics co., ltd., Sung Won YOO of Hwaseong-si (KR) for samsung electronics co., ltd., Jae Ho HONG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/20, H10B43/10
CPC Code(s): H10B43/20
Abstract: a semiconductor memory device having improved electrical characteristics is provided. the semiconductor memory device comprises a first semiconductor pattern separated from a substrate in a first direction, a first gate structure extending in the first direction and penetrating the first semiconductor pattern, a first conductive connecting line connected to the first semiconductor pattern and extending in a second direction different from the first direction, and a second conductive connecting line connected to the first semiconductor pattern. the first gate structure is between the first conductive connecting line and the second conductive connecting line, the first gate structure includes a first gate electrode and a first gate insulating film, and the first gate insulating film includes a first charge holding film contacting with the first semiconductor pattern.
Inventor(s): Byong Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Dong Sung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Won Jun PARK of Suwon-si (KR) for samsung electronics co., ltd., Dong Hwa LEE of Suwon-si (KR) for samsung electronics co., ltd., Jae Min JUNG of Suwon-si (KR) for samsung electronics co., ltd., Chang Heon CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/35, H10B43/10, H10B43/27
CPC Code(s): H10B43/35
Abstract: there is provided a semiconductor memory device having improved reliability. the semiconductor memory device includes a cell substrate, a mold stack including mold insulating layers and gate electrodes, which are alternately stacked on the cell substrate, a semiconductor layer extended in a vertical direction crossing an upper surface of the cell substrate to pass through the mold stack, a blocking insulating pattern between the semiconductor layer and each of the gate electrodes, a charge storage layer including a charge trap portion between the semiconductor layer and the blocking insulating pattern and a first charge blocking portion between the semiconductor layer and each of the mold insulating layers, and a tunnel insulating layer between the semiconductor layer and the charge storage layer, wherein an oxygen concentration of the first charge blocking portion is higher than that of the charge trap portion.
Inventor(s): Jaeryong Sim of Suwon-si (KR) for samsung electronics co., ltd., Shinhwan Kang of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/50, H01L23/48, H10B43/27
CPC Code(s): H10B43/50
Abstract: a semiconductor device includes a lower structure including a peripheral circuit, a lower insulating structure covering the peripheral circuit, and a pattern structure on the lower insulating structure; a stack structure including interlayer insulating layers and horizontal layers alternately stacked on the lower structure, wherein the horizontal layers include gate horizontal layers in a gate region of the stack structure and first insulating horizontal layers in a first insulating region of the stack structure; a memory vertical structure including a portion penetrating the gate horizontal layers; dummy vertical structures including a portion penetrating the gate horizontal layers; a first peripheral contact plug including a portion penetrating the first insulating region; and gate contact plugs on gate pads of the gate horizontal layers, wherein upper surface of the gate contact plugs and the first peripheral contact plugs are coplanar with each other, wherein the memory vertical structure and the dummy vertical structure are contacting the pattern structure, and wherein at least one of the dummy vertical structures extend further into the pattern structure than the memory vertical structure in a downward direction.
Inventor(s): Seryeun Yang of Suwon-si (KR) for samsung electronics co., ltd., Jeon Il Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyeran Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Mook Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/20, H01L21/28, H01L29/51, H01L29/78, H10B51/10, H10B51/20, H10B53/10
CPC Code(s): H10B53/20
Abstract: a semiconductor device may include a substrate; semiconductor patterns that are stacked on the substrate, extend in a first direction parallel to a top surface of the substrate, and are spaced apart from each other; a gate electrode including horizontal portions, that extend in a second direction crossing the first direction, and a vertical portion, that is in contact with the horizontal portions and extends in a third direction perpendicular to the top surface of the substrate; a gate dielectric layer between the semiconductor patterns and the gate electrode; and a ferroelectric layer between the gate dielectric layer and the gate electrode. each of the semiconductor patterns may include impurity regions and a channel region between the impurity regions, the vertical portion may be on a first side surface of the channel region, and the horizontal portions may be on a top and bottom surface of the channel region.
20240357832. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Han of Suwon-si (KR) for samsung electronics co., ltd., Hanjin Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/30, H10B53/40
CPC Code(s): H10B53/30
Abstract: a semiconductor device includes a bit line structures on a substrate, extending in a first direction, and being spaced apart from each other in a second direction; channels contacting upper surfaces of the bit line structures and being spaced apart from each other in the first and second directions; upper gate structures extending in the second direction and surrounding the channels disposed in the second direction, the upper gate structures being spaced apart in the first direction; and a capacitor structure including first capacitor electrodes respectively on the channels; a dielectric layer on the first capacitor electrodes, the dielectric layer including a ferroelectric material or an anti-ferroelectric material; a second capacitor electrode layer on the dielectric layer; and capacitor plate electrodes on the second capacitor electrode layer, the capacitor plate electrodes each extending in the second direction and being spaced apart from each other in the first direction.
Inventor(s): Moon Gyu HAN of Suwon-si (KR) for samsung electronics co., ltd., Himchan CHO of Daejeon (KR) for samsung electronics co., ltd., Tae Ho KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongkyu MAENG of Daejeon (KR) for samsung electronics co., ltd., Sun Jae PARK of Daejeon (KR) for samsung electronics co., ltd., Shin Ae JUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/115, G03F7/027, G03F7/32, H10K50/15, H10K50/16, H10K85/10
CPC Code(s): H10K50/115
Abstract: a method of manufacturing a patterned film includes forming a first film including a semiconductor nanoparticle and an additive, wherein the additive includes a polythiol compound, the semiconductor nanoparticle includes an organic ligand (for example, on a surface thereof), and the organic ligand includes a first functional group bonded to the surface of the semiconductor nanoparticle and a carbon-carbon unsaturated bond; exposing a portion of the first film to a radiation to cause a change in a solubility of the semiconductor nanoparticle in the exposed area with respect to a first solvent; contacting the radiation treated film with the first solvent to remove at least a portion of an unexposed area of the radiation treated film to obtain a patterned film. a light emitting device includes such a patterned film as a light emitting layer.
Inventor(s): Eigo MIYAZAKI of Yokohama-city (JP) for samsung electronics co., ltd., Rie SAKURAI of Yokohama-city (JP) for samsung electronics co., ltd., Atsushi IMAMURA of Yokohama-city (JP) for samsung electronics co., ltd., Mitsunori ITO of Yokohama-city (JP) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D487/22, C07F7/08, C09K11/06, H10K50/12, H10K85/40
CPC Code(s): H10K85/6572
Abstract: a compound represented by formula (1):
Inventor(s): Eigo MIYAZAKI of Yokohama-city (JP) for samsung electronics co., ltd., Rie SAKURAI of Yokohama-city (JP) for samsung electronics co., ltd., Atsushi IMAMURA of Yokohama-city (JP) for samsung electronics co., ltd., Mitsunori ITO of Yokohama-city (JP) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D487/22, C07F7/08, C09K11/06, H10K50/12, H10K85/40
CPC Code(s): H10K85/6572
Abstract:
Inventor(s): Eigo MIYAZAKI of Yokohama-city (JP) for samsung electronics co., ltd., Rie SAKURAI of Yokohama-city (JP) for samsung electronics co., ltd., Atsushi IMAMURA of Yokohama-city (JP) for samsung electronics co., ltd., Mitsunori ITO of Yokohama-city (JP) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D487/22, C07F7/08, C09K11/06, H10K50/12, H10K85/40
CPC Code(s): H10K85/6572
Abstract: wherein in formula (1) groups are variables are the same as described in the specification.
Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Samsung Electronics Co., Ltd.
- A47L9/28
- CPC A47L9/2889
- Samsung electronics co., ltd.
- A47L15/48
- A47L15/42
- CPC A47L15/486
- A61B5/024
- G02B27/28
- G02B27/30
- G02B27/42
- CPC A61B5/02427
- A61B5/11
- A61B5/00
- A61B5/107
- CPC A61B5/112
- A61B6/00
- A61B6/42
- CPC A61B6/542
- B03C3/47
- CPC B03C3/47
- C09D11/322
- C07F3/06
- C09D11/36
- C09D11/52
- H10K50/16
- H10K71/13
- CPC C09D11/322
- D06F37/22
- D06F23/02
- D06F33/48
- D06F37/26
- D06F39/12
- D06F103/24
- D06F105/46
- CPC D06F37/22
- D06F39/14
- D06F37/04
- D06F37/42
- CPC D06F39/14
- D06F43/08
- D06F43/02
- D06L1/00
- D06L1/04
- D06L1/10
- CPC D06F43/081
- F16H55/26
- F16C19/50
- F16H19/04
- CPC F16H55/26
- F24F1/031
- CPC F24F1/031
- F24F1/56
- F24F13/20
- CPC F24F1/56
- F24F7/003
- F24F7/08
- F24F8/158
- F24F8/90
- CPC F24F7/003
- F24F13/22
- F24F1/027
- F24F11/70
- F24F110/10
- F24F110/20
- F24F140/30
- CPC F24F13/224
- G01N21/95
- G01N21/21
- G01N21/88
- H01L21/66
- CPC G01N21/9501
- G01R1/04
- G01R1/067
- CPC G01R1/045
- G01R31/28
- CPC G01R31/2891
- G01R31/317
- G01R31/3185
- CPC G01R31/31724
- G01S7/481
- CPC G01S7/4813
- G02B13/00
- G03B30/00
- H04N23/51
- H04N23/54
- H04N23/55
- CPC G02B13/0065
- G02B27/64
- G01D5/14
- G03B5/00
- G03B13/36
- H04N23/68
- CPC G02B27/646
- G02F1/1333
- H04R1/02
- CPC G02F1/133314
- G03F1/36
- G03F1/70
- G03F1/86
- G03F7/00
- CPC G03F1/36
- CPC G03F7/70916
- G03H1/00
- G02B21/00
- G03H1/04
- G03H1/16
- CPC G03H1/0005
- G04G17/02
- G04G21/02
- CPC G04G17/02
- G06F1/28
- G06F1/08
- G06F1/14
- CPC G06F1/28
- G06F1/3212
- A61H3/00
- G06F1/3296
- CPC G06F1/3212
- G06F3/042
- G06F3/03
- G06T3/02
- G06T7/73
- CPC G06F3/0425
- G06F3/04845
- G06F3/01
- G06T7/62
- CPC G06F3/04845
- G06F3/04883
- B60K35/10
- B60K35/22
- CPC G06F3/04883
- G06F3/06
- CPC G06F3/061
- CPC G06F3/064
- CPC G06F3/0656
- G06F13/16
- CPC G06F3/0658
- G06F3/16
- G06F3/04847
- H04B17/318
- H04W4/80
- CPC G06F3/165
- G06F7/544
- G01R19/00
- G06F13/40
- G06F13/42
- G06N3/04
- G11C11/16
- G11C11/54
- CPC G06F7/5443
- G06F9/50
- G06F9/30
- G06F9/38
- CPC G06F9/5066
- G06F12/0868
- CPC G06F12/0868
- G06F16/9535
- G06F16/901
- G06F16/9538
- G06N5/022
- CPC G06F16/9535
- G06F21/78
- G06F21/60
- G06F21/64
- CPC G06F21/78
- G06F21/81
- CPC G06F21/81
- G06N5/04
- CPC G06N5/04
- G06Q20/32
- G06Q20/04
- CPC G06Q20/3274
- G06T5/50
- G02B5/20
- G06T1/20
- G06T3/40
- H04N25/46
- CPC G06T5/50
- G06T5/92
- G06T5/40
- CPC G06T5/92
- G06T7/00
- CPC G06T7/0002
- CPC G06T7/75
- G06T9/00
- G06V10/764
- CPC G06T9/00
- G06T11/00
- G06V10/771
- CPC G06T9/001
- G06T15/20
- G06T5/00
- G06T7/50
- G06T7/80
- G06V10/56
- G06V10/74
- CPC G06T15/205
- G06T17/20
- CPC G06T17/20
- G06T19/00
- H04W76/10
- H04W76/30
- CPC G06T19/006
- G06F3/0482
- G06T19/20
- G06V20/20
- H04N23/60
- G10L15/06
- G10L15/16
- G10L15/20
- CPC G10L15/063
- G11C5/06
- H10B12/00
- CPC G11C5/063
- H01B1/04
- C23C16/26
- C23C16/50
- H01L21/285
- H01L21/768
- H01L23/48
- H01L23/522
- H01L23/532
- H01L25/065
- CPC H01B1/04
- H01J37/26
- G06T7/13
- G06T7/60
- G06V20/70
- CPC H01J37/26
- H01J37/32
- C23C16/455
- C23C16/458
- C23C16/509
- C23C16/52
- CPC H01J37/32137
- H01L21/32
- H01L21/02
- H01L21/027
- H01L21/033
- H01L21/3065
- CPC H01L21/32
- H01L21/48
- B23K1/012
- B23K101/40
- H01L21/67
- CPC H01L21/4853
- H01L21/683
- H01L21/687
- CPC H01L21/6838
- H01L21/78
- H01L23/00
- CPC H01L21/78
- H01L23/31
- H01L23/544
- CPC H01L23/481
- CPC H01L23/5226
- H01L23/528
- H10B41/10
- H10B41/27
- H10B41/35
- H10B43/10
- H10B43/27
- H10B43/35
- H10B80/00
- CPC H01L23/5283
- CPC H01L23/544
- CPC H01L24/16
- CPC H01L25/0652
- H01L23/498
- CPC H01L25/0655
- CPC H01L25/0657
- H01L25/10
- H01L21/56
- H01L23/373
- CPC H01L25/105
- H01L25/16
- H01L23/367
- CPC H01L25/16
- H01L25/18
- H01L23/538
- CPC H01L25/18
- H01L27/092
- H01L21/8238
- H01L25/07
- H01L27/06
- H01L29/06
- H01L29/423
- CPC H01L27/0922
- H01L27/146
- CPC H01L27/14603
- H04N25/13
- CPC H01L27/14621
- CPC H01L27/14636
- H01L21/8234
- H01L27/088
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H01L29/0673
- H01L25/11
- H01L29/08
- CPC H01L29/0847
- H01L33/10
- C01B33/12
- C01G23/047
- G02F1/13357
- H01L25/075
- CPC H01L33/10
- H01M4/58
- H01M4/02
- H01M10/0525
- CPC H01M4/5825
- H01P1/20
- H01P5/08
- H01P7/10
- CPC H01P1/2002
- H01Q1/27
- G02C11/00
- H01Q1/50
- CPC H01Q1/273
- H01Q1/48
- H01Q1/22
- H01Q9/04
- CPC H01Q1/48
- H01Q21/24
- H01Q1/24
- H01Q21/30
- CPC H01Q21/245
- H02J7/00
- CPC H02J7/0013
- H02M3/158
- H02M1/00
- CPC H02M3/1582
- H03F1/02
- H03F3/24
- CPC H03F1/0238
- H03K19/0185
- H03K3/356
- H03K17/22
- H03K19/003
- CPC H03K19/018521
- H03M1/46
- CPC H03M1/466
- H03M13/11
- H03M13/15
- H03M13/37
- CPC H03M13/1174
- H04B7/06
- CPC H04B7/0654
- H04L9/06
- CPC H04L9/0631
- H04L41/082
- H04L41/0895
- CPC H04L41/082
- H04L47/43
- H04L43/0882
- H04L47/2475
- CPC H04L47/43
- H04L9/40
- CPC H04L63/10
- H04L65/613
- H04L65/1089
- H04W76/40
- CPC H04L65/613
- H04M1/02
- H01Q5/335
- CPC H04M1/026
- H05K5/00
- H05K5/02
- CPC H04M1/0269
- H04N19/64
- H04N19/126
- H04N19/129
- H04N19/167
- H04N19/176
- CPC H04N19/64
- H04W4/029
- G01C21/16
- G01C21/20
- H04W64/00
- CPC H04W4/029
- H04W8/24
- CPC H04W8/24
- H04W24/10
- H04B17/336
- H04L5/00
- H04W88/08
- CPC H04W24/10
- H04W28/02
- H04L41/16
- H04L47/2483
- CPC H04W28/0215
- H04W40/16
- H04B17/345
- H04W24/08
- CPC H04W40/16
- H04W48/08
- H04W48/18
- H04W84/04
- CPC H04W48/08
- H04W52/02
- H04W8/22
- H04W72/1273
- H04W72/232
- CPC H04W52/0206
- H04W76/15
- CPC H04W52/0248
- H04W52/36
- H04W52/16
- H04W52/38
- CPC H04W52/367
- H04W68/02
- H04W76/28
- CPC H04W68/02
- H04W72/20
- H04W72/12
- H04W72/512
- CPC H04W72/20
- H04W72/50
- G06F7/499
- H04W72/0453
- H04W72/21
- H04W72/23
- H04W72/53
- H04W72/54
- CPC H04W72/535
- H04W72/56
- H04W56/00
- H04W72/044
- H04W92/18
- CPC H04W72/56
- H04W74/00
- H04W74/0833
- CPC H04W74/002
- H04W74/0808
- CPC H04W74/0808
- H04W74/0816
- H04W36/08
- H04W74/08
- CPC H04W74/0816
- H04W72/0446
- H04W72/1268
- CPC H04W74/0841
- H04W76/27
- H04W68/00
- CPC H04W76/27
- CPC H04W76/28
- H05B6/64
- A23L3/01
- A23L5/10
- A23L5/30
- H05B1/02
- H05B6/68
- CPC H05B6/6485
- H05K1/02
- H05K1/18
- CPC H05K1/0271
- H05K1/03
- CPC H05K1/036
- H10B10/00
- CPC H10B10/12
- CPC H10B12/315
- H10B53/30
- CPC H10B12/377
- CPC H10B12/482
- H01L21/28
- H01L29/51
- CPC H10B12/485
- CPC H10B12/50
- CPC H10B41/27
- H10B43/20
- CPC H10B43/20
- CPC H10B43/35
- H10B43/50
- CPC H10B43/50
- H10B53/20
- H01L29/78
- H10B51/10
- H10B51/20
- H10B53/10
- CPC H10B53/20
- H10B53/40
- CPC H10B53/30
- H10K50/115
- G03F7/027
- G03F7/32
- H10K50/15
- H10K85/10
- CPC H10K50/115
- H10K85/60
- C07D487/22
- C07F7/08
- C09K11/06
- H10K50/12
- H10K85/40
- CPC H10K85/6572
