Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on June 27th, 2024
Samsung Electronics Co., Ltd.: 198 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (13), H01L25/065 (12), H01L23/498 (10), H04L5/00 (9), H10B43/27 (8) H04W24/10 (3), H10B43/35 (3), G09G3/035 (2), G09G3/32 (2), H04W72/1268 (2)
With keywords such as: device, layer, data, based, including, configured, structure, memory, portion, and circuit in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Jeonghee CHO of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihye SEO of Suwon-si (KR) for samsung electronics co., ltd., Kiyong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L9/00
CPC Code(s): A47L9/2842
Abstract: a vacuum cleaner system is provided. the vacuum cleaner includes a wireless vacuum cleaner for discharging dust to a station device, wherein the wireless vacuum cleaner is configured to, when performing a dust discharge operation to the station device, determine a state of a dust collection part included in the station device, based on a pressure ratio between pressure values measured by a sensor mounted on the wireless vacuum cleaner, and output a notification indicating the determined state.
Inventor(s): Hyogil KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongmin Je of Suwon-si (KR) for samsung electronics co., ltd., Seongho Cho of Suwon-si (KR) for samsung electronics co., ltd., Minhee Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/145
CPC Code(s): A61B5/486
Abstract: an electronic device includes a housing; a sensor module in the housing; a display; a memory; and a processor configured to monitor a blood glucose level of a user by using the sensor module; determine that the user is eating; record, in the memory, both a timepoint, of confirming that the blood glucose level exceeds the specific level, and the blood glucose level at the timepoint; determine, based on blood glucose records, a first timepoint, after the first meal, and a second timepoint, before the second meal; calculate an average value of blood glucose levels between the first timepoint and the second timepoint; obtain accumulated average value records daily; calculate a baseline blood glucose level of the user by using the plurality of accumulated average value records; and determine a low blood glucose reference level of the user based on the calculated baseline blood glucose level.
20240206817.INTEGRATED SENSING PLATFORM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byung Hoon KO of Suwon-si (KR) for samsung electronics co., ltd., Jae Min KANG of Suwon-si (KR) for samsung electronics co., ltd., Sang Kon BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/01, A61B5/0531, A61B5/318
CPC Code(s): A61B5/72
Abstract: an integrated sensing platform is provided. the integrated sensing platform may include a first sensor configured to obtain a first signal from a measurement target; at least one calibration temperature sensor configured to obtain a temperature signal around the first sensor, and a circuit layer electrically connected to the first sensor and the calibration temperature sensor and configured to correct the first signal obtained from the first sensor on the basis of the temperature signal obtained from the calibration temperature sensor.
Inventor(s): Minkyu JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B21/00, A63B71/06
CPC Code(s): A63B21/00069
Abstract: a wearable device is provided. the wearable device includes memory storing one or more computer programs, an actuator, at least one sensor, an output circuit, and one or more processors, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the wearable device to, acquire motion data of a user through the at least one sensor, set the operation mode of the wearable device to a first operation mode, after setting the operation mode to the first operation mode, provide a notification on the basis that a time point to provide the notification is identified, identify whether a designated user input is received, and change the operation mode from the first operation mode to a second operation mode on the basis that the reception of the designated user input is identified.
Inventor(s): Kilsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongwoo Shin of Suwon-si (KR) for samsung electronics co., ltd., Jongin Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyeeun Park of Suwon-si (KR) for samsung electronics co., ltd., Junyoung Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63F13/533, A63F13/24, A63F13/335, A63F13/42
CPC Code(s): A63F13/533
Abstract: a method for displaying operation information of a gamepad by an electronic device is provided. the method includes: obtaining gamepad manufacturer information of the gamepad connected to the electronic device; obtaining game provider information from a cloud server, which is providing, through a network, a game operating on the electronic device; based on identifying that the gamepad manufacturer information is not associated with the game provider information, controlling to display a guide screen on a display based on the gamepad manufacturer information, and guiding, using the guide screen, game operations associated with key inputs of the gamepad.
20240207766.AIR CLEANER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngseok LIM of Suwon-si (KR) for samsung electronics co., ltd., Nakhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Juyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Euysung CHU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01D46/00, A61L9/20
CPC Code(s): B01D46/0004
Abstract: an air cleaner including a first housing including a first suction port and a first discharge port; a first fan inside the first housing; a coupling duct on an upper portion of the first housing; a second housing including a second suction port and a second discharge port; a second fan inside the second housing; and a coupling base on a lower portion of the second housing and including a guide surface sloping outwardly in an upward direction, wherein the coupling base is separably couplable to the coupling duct. when the coupling base and coupling duct are coupled, a portion of air discharged through the first discharge port is guided by the guide surface and discharged outside of the second housing, and when the coupling base and coupling duct are separated, air is guided by the guide surface into the second housing.
20240207961.BALL ATTACHMENT APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngja Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B23K3/06, H05K3/34
CPC Code(s): B23K3/0623
Abstract: a ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.
Inventor(s): Jubong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongki PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsun PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hoseop CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B53/017, B24B37/005, B24B37/04
CPC Code(s): B24B53/017
Abstract: a cleaner for a cmp apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. the cleaning body may be arranged under a polishing head of the cmp apparatus configured to hold a substrate. the cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. the cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. the vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. the controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. thus, a scratch caused by a defect may not be generated at the substrate.
Inventor(s): Hosoon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Gyejoon YOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Wonsun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinsoo CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): C03C21/00, H04M1/02
CPC Code(s): C03C21/002
Abstract: according to certain embodiments, a glass substrate comprises: a first portion; a second portion; and a third portion disposed between the first portion and the second portion, wherein the first portion, the second portion, and the third portion form a first layer having first ions, and a second layer having second ions; wherein an average thickness of the first portion is greater than an average thickness of the second portion, wherein an average of a depth of the first layer of the first portion is greater than an average of a depth of the first layer of the second portion, and wherein a depth of the first layer of the third portion gradually decreases from the average of the depth of the first layer of the first portion to the average of the depth of the second layer of the second portion.
Inventor(s): Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract: an organometallic compound, represented by formula 1:
Inventor(s): Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract:
m(l)(l) formula 1
Inventor(s): Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract: wherein, m is a transition metal, lis a ligand represented by formula 2-1, lis a ligand represented by formula 2-2, n1 and n2 are each independently 1 or 2, and land lare different from each other
Inventor(s): Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract:
Inventor(s): Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract: wherein xis ge, xis o, s, se, n(r), c(r)(r), or si(r)(r), ais c or n, ais c or n, ais c or n, and ais c or n, wherein one of ato ais c bonded to a neighboring pyridine group, and another of ato ais c bonded to m in formula 1, and the remaining substituent groups are as defined herein.
Inventor(s): Suhwan Kim of Seoul (KR) for samsung electronics co., ltd., Hyunjun Kim of Seoul (KR) for samsung electronics co., ltd., Younglim Park of Seoul (KR) for samsung electronics co., ltd., Dongkwan Baek of Anyang-si (KR) for samsung electronics co., ltd., Hyungsuk Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/02, C23C16/44, C23C16/448, C23C16/52
CPC Code(s): C23C16/0245
Abstract: a deposition system, includes: a reaction chamber; a first gas supply unit supplying a first precursor in a liquid state stored in a first main tank to the reaction chamber in a gaseous state; a reactant supply unit supplying a reactant to the reaction chamber; and an exhaust unit discharging an exhaust material, wherein the first gas supply unit includes a first sub tank, a first liquid mass flow controller, and a first vaporizer, the first precursor is supplied to the reaction chamber by passing through the first sub tank, the first liquid mass flow controller, and the first vaporizer, a first automatic refill system operates to periodically fill the first sub tank with the liquid first precursor stored in the first main tank, and the exhaust unit comprises a processing chamber, a pump, and a scrubber to which a plasma pretreatment system is applied.
Inventor(s): Byeongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Doyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Geonhui JO of Suwon-si (KR) for samsung electronics co., ltd., Jonghun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwangmin CHUN of Suwon-si (KR) for samsung electronics co., ltd., Youngchul JO of Suwon-si (KR) for samsung electronics co., ltd., Woojin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/02, F16K15/06
CPC Code(s): D06F39/022
Abstract: disclosed herein is a detergent supply device for a clothes treating apparatus including a detergent container, a detergent pump module including a detergent pump and configured to communicate with a valve opening, a valve body configured to communicate with the detergent container at one end thereof, a plunger provided to be movable within the valve body, an opening and closing member provided on the plunger to open or close the valve opening in response to a movement of the plunger, and a sealing member including an outer circumferential sealing portion covering an outer circumferential surface of the valve body, an opening sealing portion extending from the outer circumferential sealing portion to cover at least a portion of an end of the valve body and forming the valve opening, and a sub-sealing portion provided integrally with the valve opening at an end of the opening sealing portion and contacting the opening and closing member when the valve opening is closed.
20240209562.WASHING MACHINE WITH DRYER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younghyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/20, D06F25/00, D06F58/24, F26B21/00
CPC Code(s): D06F58/203
Abstract: a washing machine with a dryer is disclosed. the washing machine includes a cabinet wherein a laundry inlet is provided on a front surface thereof, a tub arranged inside the cabinet, and including a front opening and a rear opening connected with the laundry inlet, a drum configured to rotate inside the tub, a heat pump including an evaporator, a compressor, a condenser, and an expansion valve so as to heat air provided to an inside of the drum, a steam generator configured to spray water to the condenser and generate steam by heat generated from the condenser, and a blast fan arranged on a steam supply flow channel continued from the condenser to the drum, and configured to transfer the steam generated at the steam generator to the inside of the drum.
Inventor(s): Yeoreum YOON of Suwon-si (KR) for samsung electronics co., ltd., Byoungho LEE of Seoul (KR) for samsung electronics co., ltd., Hanjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Yongsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Siwoo LEE of Seoul (KR) for samsung electronics co., ltd., Jiyong JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F21V5/00, F21V19/00, G01B11/24, F21Y115/10
CPC Code(s): F21V5/00
Abstract: a method of designing an optical system including a dome light and coaxial light, includes: determining a distance between the dome light and the coaxial light based on a radius reduction according to a hole of the dome light; determining a size of the coaxial light based on an optical path of a light ray emitted from the coaxial light; and determining a structure of a printed circuit board (pcb) in the dome light based on an optical path through which the light ray emitted from the coaxial light is reflected by an object.
20240210045.OUTDOOR UNIT OF AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kwangnam SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kwangdeuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungjin YUN of Suwon-si (KR) for samsung electronics co., ltd., Jeonguk KOH of Suwon-si (KR) for samsung electronics co., ltd., Jaechan PARK of Suwon-si (KR) for samsung electronics co., ltd., Woong SUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/36, F24F1/0003
CPC Code(s): F24F1/36
Abstract: disclosed herein is an outdoor unit of an air conditioner including a heat exchanger, a base disposed on a lower side of the heat exchanger to support the heat exchanger and having a drain channel to collect condensed water flowing from the heat exchanger, and a support disposed on an upper side of the drain channel to support the heat exchanger, wherein the support includes a support plate detachably coupled to the base at one end and extending from an one end to cover a portion of the drain channel to support the heat exchanger, and an outer plate extending upward from the other end of the support plate to support an outer side of the heat exchanger.
20240210091.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngmin YOU of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Byungkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Jaehyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D17/06, F25D11/02, F25D23/06
CPC Code(s): F25D17/065
Abstract: a refrigerator includes: an outer case; an inner case; an evaporator; a partition detachably mounted inside the inner case to define a refrigerating compartment and a freezing compartment below the refrigerating compartment; a cold air duct at the rear of the partition, the cold air duct being configured to guide cold air inside the inner case; and a cold air connector connected to the cold air duct from an outside of the inner case, the cold air connector being configured to deliver the cold air inside the refrigerating compartment to the evaporator. the cold air duct includes: a first discharge hole; a second discharge hole; and a return flow path extending from the refrigerating compartment to the cold air connector.
20240210097.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngil SONG of Suwon-si (KR) for samsung electronics co., ltd., Byoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisu RHIE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02
CPC Code(s): F25D23/028
Abstract: a refrigerator includes a main body including a storage room, and a door coupled to the main body to open and close the storage room, and including a door body coupled to the main body and a panel detachably coupled to a front surface of the door body to cover the front surface of the door body. the panel includes a display including a screen configured to display an image, and a glass panel provided in front of the display such that trims, allowing the glass panel to be detachably assembled with the front surface of the door body, are fixed to an upper portion and a lower portion of a rear surface of the glass panel. the panel includes a display cover fixed to the rear surface of the glass panel to allow the display to be mounted, such that assembly hooks, allowing the display cover to be detachably assembled with the front surface of the door body, are integrally formed with left and right sides of a rear surface of the display cover.
Inventor(s): Sangyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jueon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyung HA of Suwon-si (KR) for samsung electronics co., ltd., Jangwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungah CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00, E05F15/73
CPC Code(s): F25D29/00
Abstract: a refrigerator capable of automatically opening and closing a door is provided. in particular, there is provided a refrigerator that detects a gaze point of a user by using image data of the user obtained by an image obtaining sensor, determines a door corresponding to the gaze point of the user, and opens the determined door by controlling a door driving unit.
20240210165.STRAIN MEASURING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jauk GU of Suwon-si (KR) for samsung electronics co., ltd., Ilbum KWON of Daejeon (KR) for samsung electronics co., ltd., Yongseok KWON of Daejeon (KR) for samsung electronics co., ltd., Gunhyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongwoon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01B11/16
CPC Code(s): G01B11/16
Abstract: a strain measuring device includes a first sensing optical fiber disposed on a surface of a measurement target. a second sensing optical fiber is spaced apart from the first sensing optical fiber and arranged parallel to the first sensing optical fiber. the second sensing optical fiber is spaced apart from the surface of the measurement target. an optical fiber guide has an inner cavity. the optical fiber guide is bonded to the surface of the measurement target to be positioned on the surface of the measurement target. the second sensing optical fiber is disposed in the inner cavity. a controller receives measured values from the first sensing optical fiber and the second sensing optical fiber. the first sensing optical fiber and the second sensing optical fiber include optical fibers for measuring strain.
Inventor(s): Seaeun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/3185, G06F30/333
CPC Code(s): G01R31/318547
Abstract: disclosed is a method of testing an electronic device, which includes receiving, by a computer, a circuit layout, generating, by the computer, a design for test (dft) layout from the circuit layout, generating, by the computer, a test pattern by using an electronic design automation (eda) tool, based on the dft layout, and generating, by the computer, a hybrid layout from the dft layout, and the electronic device manufactured by using the hybrid layout is tested by using the test pattern.
Inventor(s): Jangmok Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jaeyong Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/3187, G01R31/317, G06F1/10
CPC Code(s): G01R31/3187
Abstract: a semiconductor chip includes a wiring structure arranged along an edge of the semiconductor chip; a clock counter configured to output a test signal to a first node of the wiring structure and receive the test signal from a second node of the wiring structure; and an oscillator configured to output a first clock signal to the clock counter, where the clock counter is configured to count a number of clocks of the first clock signal as a first count value from a first time in which the test signal is output to the first node of the wiring structure to a second time in which the test signal is received from the second node of the wiring structure, and output a first resultant signal to a controller based on the first count value.
Inventor(s): Pawel KIES of Warsaw (PL) for samsung electronics co., ltd.
IPC Code(s): G02B27/00, G02B27/01
CPC Code(s): G02B27/0093
Abstract: a head-mounted display apparatus is provided. the head-mounted display apparatus includes at least one camera, at least one sensor, and at least one processor operatively connected to the at least one camera and the at least one sensor. the at least one processor may be configured to acquire information about head pose and head-based gaze direction of a user, based on data input from the at least one sensor and multiple key points input from the at least one camera according to recognizing rotation of a user's head, estimate gaze lines of the user, based on the acquired information about head pose and head-based gaze direction, and estimate a distance to a target point, based on the gaze lines of the user, according to identifying that vestibulo-ocular reflex is activated based on the gaze lines of the user.
Inventor(s): Kyunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jean HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03B21/20, G03B21/14, G03B21/56
CPC Code(s): G03B21/208
Abstract: an electronic device including a first light source and a second light source; a total internal reflection prism to refract the first light and the second light; a first image former adjacent to the total internal reflection prism to form the first light refracted by the total internal reflection prism as a first image light and reflect the first image light to the total internal reflection prism; a second image former adjacent to the total internal reflection prism to form the second light refracted by the total internal reflection prism as a second image light and reflect the second image light to the total internal reflection prism; a beam reducer prism configured to adjust a distance between the first and the second image lights emitted from the total internal reflection prism; and a projection lens configured to project the distance adjusted first and second image lights onto a screen.
Inventor(s): Chawon KOH of Suwon-si (KR) for samsung electronics co., ltd., Sungkun KANG of Suwon-si (KR) for samsung electronics co., ltd., Tsunehiro NISHI of Suwon-si (KR) for samsung electronics co., ltd., Young Joo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/16, G03F7/004, G03F7/039, G03F7/38
CPC Code(s): G03F7/168
Abstract: disclosed photoresist topcoat compositions including a polymer including at least one of the first structural units represented by chemical formula 1 or chemical formula 2, a thermal acid generator (tag), and a solvent; and a method of forming patterns using the photoresist topcoat composition.
Inventor(s): Yujeong SIN of Suwon-si (KR) for samsung electronics co., ltd., Daehyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sunggon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/705
Abstract: a mask layout design method includes designing a preliminary mask layout, designing a plurality of target mask layouts by inserting a plurality of preliminary assist patterns into the preliminary mask layout, generating an optical proximity correction (opc) model based on the plurality of target mask layouts, obtaining a plurality of mask design images by using the opc model, extracting a plurality of mask contour images, selecting a plurality of target patterns, producing a mask based on the plurality of target mask layouts, forming a real pattern on a substrate based on the mask, and selecting a final pattern from among the plurality of target patterns based on the formed real pattern. the preliminary mask layout includes a mask layout defining a pixel isolation structure that isolates a plurality of pixels, and the preliminary assist pattern has at least one of a cross or rectangular shape.
Inventor(s): Dong Jin JI of Suwon-si (KR) for samsung electronics co., ltd., Kaeweon YOU of Suwon-si (KR) for samsung electronics co., ltd., Jiung LEE of Suwon-si (KR) for samsung electronics co., ltd., Seok Hyun HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B19/418
CPC Code(s): G05B19/41865
Abstract: a method including generating sequence data based on measured values of respective one or more process factors of each of a plurality of processes of a semiconductor fabrication process for a wafer within the semiconductor fabrication process, generating a temporary quality index of the wafer using a second neural network connected to a first neural network that is provided the sequence data, training the first neural network and the second neural network based on a loss between the temporary quality index and a set actual quality index of the wafer, selecting a control process from among the plurality of processes using at least one of the trained first neural network and/or the trained second neural network, and selecting a control factor from among multiple process factors of the selected process using the trained second neural network.
Inventor(s): Hyunseok NAM of Suwon-si (KR) for samsung electronics co., ltd., Seongmun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05F1/565, G05F1/575
CPC Code(s): G05F1/565
Abstract: a regulator circuit includes a first linear regulator circuit, configured to control a voltage on an output node based on a first reference voltage and to provide first current to the output node, and a second linear regulator circuit, connected in parallel to the first linear regulator circuit and configured to provide second current to the output node, and the second linear regulator circuit is further configured to control a magnitude of the second current based on a magnitude of the first current.
Inventor(s): Byunghoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Joohoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Changbyung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongwu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0354, H02J7/00, H02J50/10, H02J50/12, H02J50/80, H02J50/90
CPC Code(s): G06F3/03545
Abstract: an electronic device is provided. the electronic device includes a housing including an inner space, a hole formed through the housing to the internal space, a stylus pen insertable into the internal space through the hole, wherein the stylus pen includes a first wireless communication circuit and a wireless charging receiver circuit, a wireless charging transmitter circuit positioned inside the housing and configured to provide charging to the wireless charging receiver circuit when the stylus pen is inserted into the inner space, a second wireless communication circuit positioned inside the housing, at processor operatively connected to the wireless charging transmitter circuit and the second wireless communication circuit, and at least one memory operatively connected to the processor, wherein when executed, cause the processor to detect whether the stylus pen is inserted into the inner space, and start to provide charging for a first duration.
Inventor(s): Hoyoung SEOC of Suwon-si (KR) for samsung electronics co., ltd., Iksang KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Junghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/039, G06F3/044, G06F3/046, G06F3/04886
CPC Code(s): G06F3/0393
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing, a hinge configured to foldably connect one side of the first housing to one side of the second housing, a display including a first display area disposed in the first housing and a second display area disposed in the second housing, one or more processors, and memory storing instructions that, when executed by the one or more processors, cause the electronic device to, in case that attachment of an external accessory for displaying a user interface is detected in the second display area, display a user interface corresponding to a type of the external accessory in an area of the second display area to which the external accessory is attached.
Inventor(s): Je-Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Jee-Seok HYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/061
Abstract: a controller of a storage device includes a plurality of performance units for controlling performance of the storage device, and controls a non-volatile memory device. a host device receives a plurality of first operating parameter values of each performance unit from the controller, generates a plurality of combinations for the plurality of performance units based on the plurality of first operating parameter values, and inputs the plurality of combinations into a machine learning model to infer a plurality of performance indices respectively corresponding to the plurality of combinations.
Inventor(s): Jaeseon SIM of Suwon-si (KR) for samsung electronics co., ltd., Chulmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Ohoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sooyong SUK of Suwon-si (KR) for samsung electronics co., ltd., Yongtaek LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0611
Abstract: various embodiments of the disclosure relate to a device and a method for managing a memory in an electronic device. an electronic device may include: first memory configured to store data related to a file, a second memory configured to temporarily store at least part of the data related to the file, and a processor operatively connected to the first memory and the second memory, wherein the processor may be configured to: monitor access to the data related to the file stored in the first memory for a specified time based on performing of an application program, configure a first access pattern for a first group including the at least part of the data related to the file stored in the first memory based on a monitoring result, and load data of the first group related to the file stored in the first memory into the second memory based on the first access pattern, based on the application program requesting access to the data included in the first group.
Inventor(s): Dimin Niu of Sunnyvale CA (US) for samsung electronics co., ltd., Shuangchen Li of Goleta CA (US) for samsung electronics co., ltd., Bob Brennan of San Jose CA (US) for samsung electronics co., ltd., Krishna T. Malladi of San Jose CA (US) for samsung electronics co., ltd., Hongzhong Zheng of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F15/78, G11C11/4096
CPC Code(s): G06F3/0631
Abstract: a processor includes a plurality of memory units, each of the memory units including a plurality of memory cells, wherein each of the memory units is configurable to operate as memory, as a computation unit, or as a hybrid memory-computation unit.
Inventor(s): Kwansuk JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sungwon KO of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung CHANG of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F11/10
CPC Code(s): G06F3/0658
Abstract: an operation method of a memory controller includes sequentially transmitting a first read command for the first plane and a second read command for the second plane to the nonvolatile memory device, transmitting a first status read command corresponding to the first read command to the nonvolatile memory device, transmitting a first memory access command corresponding to the first read command to the nonvolatile memory device based on first status information, receiving first read data that is output from the nonvolatile memory device, skipping issuing of a status read command corresponding to the second read command and transmitting a second memory access command corresponding to the second read command to the nonvolatile memory device, after receiving the first read data, and receiving second read data that is output from the nonvolatile memory device.
Inventor(s): Sangwon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Insoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Choongki CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a storage controller includes: (i) a queue monitoring circuit configured to generate monitoring information about a queue depth (qd) for each of a write command and a read command, (ii) a surge detection circuit configured to generate command-by-command surge information based on the monitoring information, (iii) a priority determination circuit configured to generate priority determination information indicating any one of the write command, the read command, and a default according to the command-by-command surge information, and (iv) a priority reflection circuit configured to variably set each of a priority of the write command and a priority of the read command according to the priority determination information.
Inventor(s): Wonik SEO of Suwon-si (KR) for samsung electronics co., ltd., Dong-Uk RYU of Suwon-si (KR) for samsung electronics co., ltd., Sungduk CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0665
Abstract: a method including updating memory allocation information of a uvm based on block information of model data blocks used for an execution of a deep learning model by a deep learning framework, and performing a least recently used (lru) eviction based on the updated memory allocation information.
Inventor(s): Hoang Minh QUAN of Bac Ninh province (VN) for samsung electronics co., ltd., Vu Van DIEU of Bac Ninh province (VN) for samsung electronics co., ltd., Nguyen Dang TUNG of Bac Ninh province (VN) for samsung electronics co., ltd., Nong Thi Thu HA of Bac Ninh province (VN) for samsung electronics co., ltd., Tong Ngan HA of Bac Ninh province (VN) for samsung electronics co., ltd., Tran Thi Ngoc HOA of Bac Ninh province (VN) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G02B27/01, G06F3/01, G06F21/84
CPC Code(s): G06F3/1431
Abstract: an electronic device is provided. the electronic device includes a communication interface, a display, and at least one processor. the at least one processor is configured to establish a communication connection to a head-mounted device according to a designated communication scheme through the communication interface, identify, based on a first content (c) to be displayed on the display, a second content (c) to be displayed in the head-mounted device, display, on the display based on identifying of the second content (c), first display data in which at least part of the identified second content (c) in the first content (c) is corrected, and transmit second display data related to the identified second content (c) to the head-mounted device through the communication interface.
Inventor(s): Jaerok KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonmyung LEE of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/544, G11C11/418, G11C11/419
CPC Code(s): G06F7/5443
Abstract: an apparatus and method with in-memory computing (imc) is provided. an apparatus includes a memory including rows; a self-timed circuit including sub-circuits corresponding to the respective rows, and operates asynchronously with a clock; and a control circuit configured to control the self-timed circuit. based on input to a first sub-circuit being a first value, the first sub-circuit skips accessing a first row of memory, corresponding to the first sub-circuit and transfer a first output signal received from a first neighboring sub-circuit, to a second neighboring sub-circuit among the sub-circuits. based on input to the first sub-circuit being a second value, the first sub-circuit accesses the first row of memory, performs an operator-based operation on the second value and weights stored in the first row, generates a second output signal based on the performed operation, and transfers the second output signal to the second neighboring sub-circuit.
Inventor(s): Jaehoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Byungjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Haksoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Heonjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Taeheum LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/4401
CPC Code(s): G06F9/4401
Abstract: a printed circuit board may include a plurality of printed board assemblies (pbas) and an interface configured to connect the plurality of pbas and an external device, wherein the interface includes terminals having an n*m array, and terminals having an n*k array among the terminals having the n*m array are electrically connected to each pba included in the plurality of pbas, wherein the each pba includes a volatile memory, a nonvolatile memory, and at least one processor, and wherein each of the pbas is configured to: in case that power is supplied from a first terminal among the terminals having the n*k array, transmit a first parameter signal to a second terminal among the terminals having the n*k array; in response to the transmission of the first parameter signal, store boot-loader data received from the external device in the volatile memory; in response to the storing of the boot-loader data, transmit a second parameter signal to a third terminal among the terminals having the n*k array; and in response to the transmission of the second parameter signal, store binary data received from the external device in the nonvolatile memory.
Inventor(s): Younsung CHU of Suwon-si (KR) for samsung electronics co., ltd., Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/4401, G06F21/57
CPC Code(s): G06F9/4403
Abstract: a storage device includes a device identification module configured to generate a device identifier, a bootloader configured to generate a device identification key pair based on the device identifier and perform booting of the storage device, attester firmware configured to generate a device certificate based on the device identification key pair and report security information on the device to a host, and a measurement manager configured to perform a measurement operation for the device identification module, the bootloader, and the attester firmware, store a first measurement value of the device identification module in response to determining that the first measurement value matches first information, determine whether a second measurement value of the bootloader matches second information in response to storing the first measurement, store the second measurement value in response to determining that the second measurement value matches the second information, determine whether a third measurement value of the attester firmware matches third information in response to the second measurement value being stored, store the third measurement value in response to determining that the second measurement value matches the second information, and transmit the stored first measurement value, the stores second measurement value, and the stored third measurement value to the attester firmware.
Inventor(s): Jeangsu HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/445, G06F9/448
CPC Code(s): G06F9/44526
Abstract: provided is a storage device. the storage device is configured to communicate with a host according to a predetermined protocol, and includes at least one nonvolatile memory, and a memory controller configured to control a firmware load operation of the at least one nonvolatile memory, wherein the memory controller includes an execution region where main firmware and custom firmware in a form of an add-on to the main firmware are loaded, and is configured to receive a commit command from the host, and to load and execute the custom firmware in the execution region based on the commit command.
Inventor(s): Hyunsoo Cho of Suwon-si (KR) for samsung electronics co., ltd., Jaesub Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunho Seo of Suwon-si (KR) for samsung electronics co., ltd., Yoonsu Jo of Suwon-si (KR) for samsung electronics co., ltd., Hanchan Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/02
Abstract: a storage device for migrating data to a destination storage device is provided. the storage device includes: a memory device; and a memory controller configured to: generate an identification command according to a migration request received from a host, transmit the identification command to the destination storage device, transmit first data stored in the memory device to the destination storage device according to a response signal of the destination storage device, based on whether an input/output (io) signal indicating an operation to generate second data based on the first data is received from the host, transmit the second data to the destination storage device, and transmit a migration completion signal to the host after completing transmission of the first data and the second data to the destination storage device
Inventor(s): Jin-Hee MA of Suwon-si (KR) for samsung electronics co., ltd., Kyuho SON of Suwon-si (KR) for samsung electronics co., ltd., Sangyoon OH of Suwon-si (KR) for samsung electronics co., ltd., Wonchul LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaigyun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/023
Abstract: disclosed is an electronic device including a processor configured to receive a command requesting an operation for a plurality of group zones from a host, transmit a completion response to the command to the host, and perform a background operation for the command; and a plurality of storage devices, the processor configured to control the plurality of storage devices, each of the plurality of group zones including a plurality of zones included in one or more storage devices among the plurality of storage devices, and the processor being configured to perform the background operation including generating a plurality of distribution commands for each of the plurality of storage devices from the command, and issuing one or more distribution commands among the plurality of distribution commands to one or more storage devices corresponding to the one or more distribution commands, respectively.
Inventor(s): Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd., Chanik PARK of San Jose CA (US) for samsung electronics co., ltd., Sungwook RYU of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0877, G06F12/0804
CPC Code(s): G06F12/0877
Abstract: an apparatus may include a storage node including a first interface to communicate with a first memory medium, a second interface to communicate with a second memory medium, and at least one control circuit configured to transmit, from the storage node, location information for data stored in the first memory medium, and transfer, from the storage node, using a memory access scheme, the data. the at least one control circuit may be configured to operate at least a portion of the first memory medium as a cache for at least a portion of the second memory medium. the at least one control circuit may be configured to transmit the location information using the memory access scheme. the at least one control circuit may be configured to update the location information to generate updated location information, and perform a transmission, from the storage node, of the updated location information.
Inventor(s): Ramdas P. KACHARE of Pleasanton CA (US) for samsung electronics co., ltd., Hingkwan HUEN of Daly City CA (US) for samsung electronics co., ltd., Jimmy LAU of Santa Clara CA (US) for samsung electronics co., ltd., Howard R. BUTLER of San Jose CA (US) for samsung electronics co., ltd., Xuebin YAO of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F13/42, G06F15/173, H04L67/104, H04L67/1097
CPC Code(s): G06F13/1673
Abstract: a multi-function device is disclosed. a first port may be used to communicate with a host processor. a second port may be used to communicate with a storage device. a third port may be used to communicate with a computational storage unit. circuit may be used to route a message from the host processor to at least one of the storage device or the computational storage unit.
Inventor(s): Kyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinin SO of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk KWON of Suwon-si (KR) for samsung electronics co., ltd., Jin JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/40, G06F11/07, G11C5/14
CPC Code(s): G06F13/4022
Abstract: a memory expander includes memory sub-modules, power management integrated circuits, a controller, and a power controller. the memory sub-modules store data, and each of the memory sub-modules includes one or more memories. the power management integrated circuits independently supply powers to the memory sub-modules, respectively. the controller communicates with an external device through an interface (e.g., compute express link (cxl)), controls operations of the memory sub-modules, and checks whether the memory sub-modules are abnormal. the power controller controls operations of the power management integrated circuits. in response to a first memory sub-module becoming abnormal, the power controller controls a first power management integrated circuit to block a first power supplied to the first memory sub-module.
Inventor(s): Hsin-Hsuan Sung of Cary NC (US) for samsung electronics co., ltd., David Thorsley of Morgan Hill CA (US) for samsung electronics co., ltd., Joseph H. Hassoun of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F17/16, G06N20/00
CPC Code(s): G06F17/16
Abstract: systems and methods for matrix operation selector are disclosed. a selection engine receives a matrix as an input and extracts one or more features from the matrix. a machine learning model selects an action based on the one or more features. the action is for performing a matrix operation based on the matrix, and is predicted to satisfy a criterion with respect to a reward. the action is applied for the matrix operation, and a reward is computed based on the applying of the action. the machine learning model is retrained based on the reward.
Inventor(s): Jaeseok PARK of Suwon-si (KR) for samsung electronics co., ltd., Junggeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Donggeon PARK of Suwon-si (KR) for samsung electronics co., ltd., Minkyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/62
CPC Code(s): G06F21/6227
Abstract: a method of operating a big data analysis device is provided. the method includes receiving a user query, decomposing the received user query into multiple subqueries, identifying first subqueries configured to refer to personal information among the multiple subqueries, reconfiguring the first subqueries into second subqueries independent of the personal information based on a component accessible to the personal information, and generating a reconfigured query by merging the second subqueries with subqueries other than the first subqueries configured to refer to the personal information among the multiple subqueries.
Inventor(s): Joosung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Bogyeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaemyung CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/3308, G06F30/31
CPC Code(s): G06F30/3308
Abstract: a method of augmenting training data for a semiconductor process modeling includes obtaining a simulation input data set and a measurement data set, obtaining a simulation output data set generated based on performing simulation based on the simulation input data set, extracting reference noise information associated with the measurement data set from the measurement data set, extracting distribution information associated with each simulation case included in the simulation output data set based on synthesizing the reference noise information and the simulation output data set, generating a noise simulation data set based on sampling data based on the distribution information, and generating a synthesized data set based on synthesizing the simulation input data set, the noise simulation data set, and the measurement data set.
Inventor(s): Minjin SONG of Suwon-si (KR) for samsung electronics co., ltd., Jongyoub Ryu of Suwon-si (KR) for samsung electronics co., ltd., Elmurod Talipov of Suwon-si (KR) for samsung electronics co., ltd., Keehwan Ka of Suwon-si (KR) for samsung electronics co., ltd., Kyoungchoon Park of Suwon-si (KR) for samsung electronics co., ltd., Jayoung Yang of Suwon-si (KR) for samsung electronics co., ltd., Jeongwon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/04
CPC Code(s): G06N3/04
Abstract: a method of providing, by a device, an artificial intelligence service, includes: identifying neural network requirements related to a purpose of the artificial intelligence service and an execution environment of the device; selecting at least one neural network model satisfying the neural network requirements, based on neural network model information about a plurality of preregistered neural network models; obtaining a neural network model for providing the artificial intelligence service, by using the at least one neural network model; and providing the artificial intelligence service through the obtained neural network model.
Inventor(s): Minchul Park of Suwon-si (KR) for samsung electronics co., ltd., Satbyul Kim of Suwon-si (KR) for samsung electronics co., ltd., Seongryeol Kim of Suwon-si (KR) for samsung electronics co., ltd., Younggu Kim of Suwon-si (KR) for samsung electronics co., ltd., Yeji Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae Jang of Suwon-si (KR) for samsung electronics co., ltd., In Huh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0464, G06F11/00, G06N3/08
CPC Code(s): G06N3/0464
Abstract: provided are an apparatus and a method of inferring semiconductor measurement results. the method of inferring semiconductor measurement results is based on artificial intelligence techniques and includes receiving layout data representing a layout of a semiconductor, generating a plurality of partial layouts based on the layout data, selecting a representative partial layout among the plurality of partial layouts, and generating, using a machine learning model, a predicted measurement result for the semiconductor based on the representative partial layout.
Inventor(s): Jong Seon NO of Seoul (KR) for samsung electronics co., ltd., Yongjune KIM of Daegu (KR) for samsung electronics co., ltd., Eun Sang LEE of Seoul (KR) for samsung electronics co., ltd., Jung Hyun LEE of Seoul (KR) for samsung electronics co., ltd., Young Sik KIM of Gwangju (KR) for samsung electronics co., ltd., Joon Woo LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/048, G06F17/17, H04L9/00
CPC Code(s): G06N3/048
Abstract: an apparatus includes one or more processors configured to execute instructions; and one or more memories storing the instructions; wherein the execution of the instructions by the one or more processors configures the one or more processors to generate an approximate polynomial, approximating a neural network operation, of a portion of a deep neural network model that is configured to receive input data, by using weighted least squares based on parameters corresponding to the generation of the approximate polynomial, a mean of the input data, and a standard deviation of the input data; and generate a homomorphic encrypted data operation result based on the input data and the approximate polynomial that approximates the neural network operation.
Inventor(s): Jong-Seon NO of Seoul (KR) for samsung electronics co., ltd., Junghyun LEE of Seoul (KR) for samsung electronics co., ltd., Yongjune KIM of Daegu (KR) for samsung electronics co., ltd., Joon-Woo LEE of Seoul (KR) for samsung electronics co., ltd., Young Sik KIM of Gwangju (KR) for samsung electronics co., ltd., Eunsang LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/048, G06N3/08
CPC Code(s): G06N3/048
Abstract: an apparatus and method with encrypted data neural network operation is provided. the apparatus includes one or more processors configured to execute instructions and one or more memories storing the instructions, wherein the execution of the instructions by the one or more processors configures the one or more processors to generate a target approximate polynomial, approximating a neural network operation, of a portion of a neural network model, using a determined target approximation region, for the target approximate polynomial, based on a first approximate polynomial generated based on parameters corresponding to a generation of the first approximate polynomial, a maximum value of input data to the portion of the neural network layer, and a minimum value of the input data, and generate a neural network operation result using the target approximate polynomial and the input data.
Inventor(s): Hyukjin JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0495
CPC Code(s): G06N3/0495
Abstract: an electronic apparatus is provided. the electronic apparatus includes a memory and a processor, wherein the processor is configured to acquire a neural network model, test data for the neural network model, and information on required performance condition, quantize a layer among a plurality of layers comprised in the neural network model and acquire a first quantized neural network model, transmit the first quantized neural network model and the test data to a target apparatus, receive, from the target apparatus, result data acquired from the first quantized neural network model with the test data as an input, and profile information of the target apparatus related to the first quantized neural network model, and based on the result data and the profile information, based on the first quantized neural network model satisfying the required performance condition, add the first quantized neural network model to available quantized neural network model candidates.
Inventor(s): Sung Min LEE of Yongin-si (KR) for samsung electronics co., ltd., Sangbum KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/065, G06N3/049
CPC Code(s): G06N3/065
Abstract: a neuron circuit includes: a membrane circuit configured to receive a weighted synaptic current from a synaptic array and receive an adaptive current from an adaptive circuit; a comparator circuit configured to control a pulse generation circuit in response to a voltage of the membrane circuit exceeding a predetermined threshold voltage; the pulse generation circuit configured to control the membrane circuit and the adaptive circuit based on an output signal from the comparator circuit and generate a pulse comprising a firing pattern; and the adaptive circuit, connected to the membrane circuit and the pulse generation circuit, and configured to determine the firing pattern of the pulse generation circuit.
Inventor(s): Hanwoong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Soonhoi HA of Seoul (KR) for samsung electronics co., ltd., Keonjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Changjae YI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/065, G06F15/80
CPC Code(s): G06N3/065
Abstract: an apparatus includes: memories storing data to perform a neural network operation; processors to generate a neural network operation result by performing a neural network operation by reading the data; and crossbars processing data transmission between the processors and the memories, wherein the crossbars include: a first crossbar of a first group processing data transmission between a first group of the processors and a first group of the memories, a second crossbar of a second group processing data transmission between a second group of the processors and a second group of the memories, wherein the first group of processors does not include any processors that are in the second group of processors and wherein the first group of memories does not include any memories that are in the second group of memories, and a third crossbar connecting the first crossbar to the second crossbar.
Inventor(s): Sujin JANG of Suwon-si (KR) for samsung electronics co., ltd., Dae Ung JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
CPC Code(s): G06N3/08
Abstract: a method and apparatus with object estimation model training is provided. the method include generating a cross-correlation loss based on a first feature vector, generated using an interim first neural network (nn) model provided an input based on first input data about a target object, and a second feature vector generated using a trained second neural network provided another input based on second input data about the target object; and generating a trained first nn model, including training the interim first nn model based on the cross-correlation loss.
Inventor(s): Sunghee LEE of Suwon-si (KR) for samsung electronics co., ltd., QHwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Minkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Ami MA of Suwon-si (KR) for samsung electronics co., ltd., Jinkook PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyubaik CHANG of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
CPC Code(s): G06N3/08
Abstract: provided are a method of providing an artificial intelligence (ai) algorithm, an operation method of an ai algorithm, an electronic device, a recording medium, and a computer program. the method of providing the ai algorithm includes loading data sets with respect to a spectrum of a semiconductor and a structure of the semiconductor, calculating an out of distribution (ood) index with respect to the spectrum of the semiconductor, performing data split by clustering sampling the data sets into at least one learning data set with respect to ood indexes according to semiconductors, and providing an optimal ai algorithm from among a plurality of ai algorithms that have learned the at least one learning data set.
Inventor(s): Inwoo HA of Suwon-si (KR) for samsung electronics co., ltd., Nahyup KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseung YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/00, G06T3/40, G06T5/00, G06T15/06
CPC Code(s): G06T3/0093
Abstract: a method and apparatus with image processing is provided. the processor-implemented method includes generating a warped image frame by warping a first reconstructed image frame of a first time point based on first change data corresponding to a change between first rendered image frame of the first time point and second rendered image frame of a second time point that is different from the first time point; generating, using a neural reconstruction model based on the second rendered image frame and the warped image frame, a confidence map representing a second reconstructed image frame of the second time point and confidence scores of pixels of the second reconstructed image frame; and generating a third rendered image frame of a third time point, different from the first and second time points, by ray tracing for each of plural pixels of the third rendered image frame based on the confidence map.
Inventor(s): Jeongmoon BYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06F3/01, G06T5/50
CPC Code(s): G06T3/40
Abstract: according to at least one example embodiment, a display device includes at least one sensor, and processing circuitry, wherein the processing circuitry may be configured to generate a first image based on a gaze region of a user tracked using the at least one sensor, generate a second image based on a desired section of a background image, the desired section corresponding to the user's gaze region on the background image, obtain residual data from the first image and the second image, the obtaining the residual data including subtracting pixel values of the first image from pixel values of the second image, and generate a third image based on the residual data, the generating the third image including performing filtering of the residual data by applying at least one desired weight to the residual data.
Inventor(s): Namyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Doory KIM of Seoul (KR) for samsung electronics co., ltd., Wookrae KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Changhoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Dokyung JEONG of Seoul (KR) for samsung electronics co., ltd., Uidon JEONG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G02B21/00, G06T5/30, G06T7/13
CPC Code(s): G06T7/0004
Abstract: a fluorescence microscopy metrology system includes an optical system configured to generate first light and second light having different wavelengths, a microscope body configured to irradiate a sample, coated with a fluorescent material, with the first light and the second light received from the optical system, and to receive fluorescence reflected from the sample, an image detection device configured to detect a fluorescence image corresponding to the received fluorescence, and a nanostructure analysis device configured to measure line edge roughness (ler) from the detected fluorescence image, to analyze power spectral density (psd), or to detect a nanoparticle defect.
Inventor(s): Jan HANCA of Warsaw (PL) for samsung electronics co., ltd.
IPC Code(s): G06T7/50, G06T7/90, G06V10/56
CPC Code(s): G06T7/50
Abstract: an electronic device is provided. the electronic device includes a camera, at least one sensor, memory, and at least one processor operatively connected to the camera, the at least one sensor, and the memory, wherein the at least one processor is configured to obtain at least one piece of location information about the electronic device through the at least one sensor, obtain color data of a voxel structure, based on color data about an image obtained through the camera and the at least one piece of location information, obtain truncated signed distance field (tsdf) data of a voxel structure, based on depth data about the image obtained through the camera and the at least one piece of location information, and obtain color data and tsdf data about at least one voxel within a truncation distance, based on the color data of the voxel structure and the tsdf data of the voxel structure.
Inventor(s): Wonseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungil Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T9/00
CPC Code(s): G06T9/00
Abstract: an image processing device includes an interface configured to receive compressed data obtained by compressing image data corresponding to an output of at least one pixel and a decoder configured to generate at least two different pieces of compensation data based on loss data included in the compressed data and generate decompressed data by decompressing the compressed data based on any one piece of compensation data among the at least two different pieces of compensation data, where the loss data corresponds to data lost due to compression of the image data.
Inventor(s): Sukun YOON of Suwon-si (KR) for samsung electronics co., ltd., Jie CHEN of Nanjing (CN) for samsung electronics co., ltd., Longhai WU of Nanjing (CN) for samsung electronics co., ltd., Juan LIU of Nanjing (CN) for samsung electronics co., ltd., Minji KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinho KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/20, G06T7/13, G06T11/60, G06V10/74
CPC Code(s): G06T11/203
Abstract: an electronic device includes: a memory storing at least one instruction; and at least one processor configured to execute the at least one instruction to: change a plurality of non-straight lines in a handwritten image to a plurality of straight lines, identify, based on the plurality of straight lines, a first corner in the handwritten image, identify, based on the first corner, a plurality of spaces in the handwritten image, and obtain a floor map image including the plurality of spaces.
Inventor(s): Junkwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Dongjin Jung of Suwon-si (KR) for samsung electronics co., ltd., Kyuchun Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/44, G06V10/74, G06V40/16, G06V40/20
CPC Code(s): G06V10/44
Abstract: an electronic apparatus is provided. the electronic apparatus includes: a camera; a processor configured to control the camera; and a memory configured to be electrically connected to the processor and to store a network model trained to determine a degree of matching between an input image frame and predetermined feature information, wherein the processor is configured to: identify a representative image frame based on a degree of matching obtained by applying image frames, selected from among a plurality of image frames, to the trained network model, while the plurality of image frames are captured through the camera, identify a best image frame based on a degree of matching obtained by applying image frames within a specific section including the identified representative image frame, to the trained network model, and provide the identified best image frame.
Inventor(s): Bonkon KOO of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Ko of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/10, G02B27/01, G06F3/01, G06V40/20, G06V40/40
CPC Code(s): G06V40/107
Abstract: provided is a method of identifying a hand of a genuine user wearing a wearable device. according to an embodiment, the method includes using a sensor included in the wearable device to recognize a hand located in a detection area of the sensor; estimating a position of a shoulder connected to the recognized hand based on a positional relation between the orientation of the recognized hand and at least one body part connected to the recognized hand; and using information about a probability of a shoulder of the genuine user being present in the estimated position to determine whether the recognized hand is a hand of the genuine user.
Inventor(s): Junhyung PARK of Suwon-si (KR) for samsung electronics co., ltd., Adam FIJALKOWSKI of Warsaw (PL) for samsung electronics co., ltd., Dominik SETNIEWSKI of Warsaw (PL) for samsung electronics co., ltd., Chaigil LIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo JEON of Suwon-si (KR) for samsung electronics co., ltd., Nojoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Sunkey LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G08C17/02, G06F3/041, G06F3/0487
CPC Code(s): G08C17/02
Abstract: an electronic device that provides user experience for controlling at least one ultra-wideband (uwb) device, and a control method are provided. the electronic device includes at least one antenna, a touch screen display, memory storing one or more computer programs, and one or more processors communicatively coupled to the at least one antenna, the memory, and the touchscreen display, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to receive an ultra-wideband (uwb) signal from an external electronic device through the at least one antenna, in response to reception of the uwb signal, compute an orientation angle of the electronic device with respect to the external electronic device, a distance between the external electronic device and the electronic device, and an orientation time, when each of the calculated orientation angle, the distance, and the orientation time satisfies a first predesignated criterion, display a user interface corresponding to the external electronic device, and when any one of the calculated orientation angle, the distance, and the orientation time does not satisfy the first criterion, display a user interface corresponding to the external electronic device.
Inventor(s): Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06F3/0354, G06F3/041
CPC Code(s): G09G3/035
Abstract: an electronic device includes: a variable display having a main display region visible out of the electronic device, wherein a size of the main display region may be reduced from a first display region to a second display region, and including a touch screen panel serving as a first input device, and at least one processor, comprising processing circuitry, electrically connected to the variable display. at least one processor, individually and/or collectively, is configured to control the display to: display a cursor in the main display region and move the cursor into the second display region and display the cursor, based on identifying the main display region being reduced in size from the first display region to the second display region, based on the cursor being positioned in the first display region other than the second display region, in the state that the size of the main display region corresponds to the first display region.
Inventor(s): Byungwoo MIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Bokyou KO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jihea PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06F1/16
CPC Code(s): G09G3/035
Abstract: an electronic device includes a housing including a first housing and a second housing movably coupled to the first housing, a battery, a flexible display, wherein a size of a display area of the flexible display, which is exposed to outside of the electronic device, is changed from a first size to a second size based on a movement of the second housing, at least one processor comprising processing circuitry, and memory including one or more storage mediums storing instructions which, when executed by the at least one processor, cause the electronic device to identify a power level of the battery, display a first screen including an object in the display area corresponding to the first size, when the power level of the battery is within a first specified range, while the size of the display area is changed from the first size to the second size, display a second screen by redrawing the object included in the first screen according to the size of the display area, and when the power level of the battery is within a second specified range, while the size of the display area is changed from the first size to the second size, display a second screen without redrawing the object included in the first screen, and display, if the size of the display area is the second size, a third screen by redrawing the object included in the first screen.
20240212581.DISPLAY MODULE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonkeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngki JUNG of Suwon-si (KR) for samsung electronics co., ltd., Donghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32, H01L25/16, H01L27/12
CPC Code(s): G09G3/32
Abstract: a display module includes: a substrate; a first driving circuit provided in a center area on the substrate in a vertical form; a first pixel array formed on a left area of the substrate relative to the first driving circuit, wherein the first pixel array may include a first plurality of pixels disposed in a matrix form; and a second pixel array formed on a right area of the substrate relative to the first driving circuit, wherein the second pixel array may include a second plurality of pixels disposed in the matrix form, wherein each pixel of the first plurality of pixels and each pixel of the second plurality of pixels may include a plurality of inorganic light emitting devices, and wherein each of the first pixel array and the second pixel array are separated from the first driving circuit by a pre-set distance.
Inventor(s): Hwasun LEE of Suwon-si (KR) for samsung electronics co., ltd., Doyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32, G09G3/34
CPC Code(s): G09G3/32
Abstract: disclosed is a display apparatus. the display apparatus includes an input interface, a display panel, at least one memory configured to store instructions, and at least one processor configured to execute the instructions to identify an object included in an image corresponding to the image signal, adjust a dimming value of an area of the display panel corresponding to the object so that a brightness of the object is increased, and control the display panel to display the image based on the adjusted dimming value.
Inventor(s): Hyunki KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyuntaek NA of Suwon-si (KR) for samsung electronics co., ltd., Wunkil LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongchul LEE of Suwon-si (KR) for samsung electronics co., ltd., Gucheol JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/34
CPC Code(s): G09G3/3426
Abstract: a display apparatus comprising: a first power supply unit; a second power supply unit; a first switching unit; a second switching unit; a display panel; a backlight unit for providing light to the display panel by means of the first light emitting elements and second light emitting elements; a first driver for driving the first light emitting elements using the supplied power; a second driver for driving the second light emitting elements using supplied power; and at least one processor, individually and/or collectively, configured to provide power supplied from the first power supply unit and the second power supply unit to the first driver and the second driver, or provide power supplied from only the first power supply to the first driver and the second driver, by controlling the first switching unit and the second switching unit based on user input for adjusting luminance of the display panel.
Inventor(s): Jaemyung HUR of Suwon-si (KR) for samsung electronics co., ltd., Minsup KIM of Suwon-si (KR) for samsung electronics co., ltd., Hojune YOO of Suwon-si (KR) for samsung electronics co., ltd., Kyoungshin JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/10, G06F3/01, G06F3/16, G06T7/50, G06T7/60, G06V20/52, H04B17/27
CPC Code(s): G09G5/10
Abstract: an electronic apparatus including: a display; a sensor; a memory; and a processor configured to: obtain first distance information regarding a distance between a user of the electronic apparatus and the electronic apparatus through the sensor; identify a space in which the user is located from among a plurality of spaces predefined according to a distance from the electronic apparatus based on the first distance information; and control at least one of a resolution or a brightness of content displayed through the display based on control information corresponding to the identified space from among predetermined control information for each of the plurality of spaces.
Inventor(s): Youngmin KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hwidong NA of Seongnam-si (KR) for samsung electronics co., ltd., Min-joong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hodong LEE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/183, G10L15/00
CPC Code(s): G10L15/183
Abstract: a real-time processor-implemented translation method and apparatus is provided. the real-time translation method includes receiving a content, determining a delay time for real-time translation based on a silence interval of the received content and an utterance interval of the received content, generating a translation result by translating a language used in the received content, and synthesizing the translation result and the received content.
Inventor(s): Taekwang UM of Suwon-si (KR) for samsung electronics co., ltd., Namhoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyounghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngki LEE of Suwon-si (KR) for samsung electronics co., ltd., Heeyoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/19
CPC Code(s): G10L15/22
Abstract: an electronic device includes: memory storing instructions; and at least one processor. wherein the instructions which when executed by at least one processor, cause at least one processors to perform control to: receive a first signal corresponding to a first utterance of a user; provide a first response corresponding to the first utterance; obtain cross-domain data based on the first utterance or the first response; receive a second signal corresponding to a second utterance following the first utterance; and provide a second response corresponding to the second utterance based on the cross-domain data when the second utterance includes anaphora. the first utterance and the second utterance respectively correspond to different domains.
Inventor(s): Seongbok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinho KIM of Suwon-si (KR) for samsung electronics co., ltd., Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Euibum HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11B27/10, G06F3/0482, G06F3/16, H04N23/63, H04N23/661, H04R1/10
CPC Code(s): G11B27/10
Abstract: an electronic device is provided. the electronic device includes a first camera, a second camera, a display, a communication circuit, memory storing one or more computer programs, and one or more processors communicatively coupled to the first camera, the second camera, the display, the communication circuit, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to display a first image obtained from the first camera and a second image obtained from the second camera through the display in a multiple camera recording mode, display an audio input selection screen related to a plurality of audio inputs through the display, wherein the audio input selection screen includes an item to select a microphone of the electronic device and an item to select an external electronic device connected to the electronic device through at least one bluetooth communication link, receive a first user input for selecting an external electronic device through the audio input selection screen, in response to the first user input, establish first and second communication links for supporting binaural recording with first and second ear buds included in the external electronic device, through the communication circuit, receive first and second audio data obtained from the first and second ear buds through the first and second communication links, respectively, while performing a recording using the first camera and the second camera simultaneously, and store first and second images obtained from the first and second cameras in synchronization with the first and second audio data.
Inventor(s): Garam Choi of Suwon-si (KR) for samsung electronics co., ltd., Yonghun Kim of Suwon-si (KR) for samsung electronics co., ltd., Kihan Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10
CPC Code(s): G11C7/1048
Abstract: provided are a memory device and a method for training per-pin operation parameters. a memory device includes a plurality of on-die termination (odt) circuits, an impedance control (zq) calibration circuit configured to output a first code signal and a second code signal, and a per-pin calibration circuit. the per-pin calibration circuit may be configured to select one signal pin from among the plurality of signal pins, to compare a first input voltage level of the selected signal pin with a second input voltage level of each of the other ones of the plurality of signal pins, to generate a per-pin odt code signal for each of the plurality of signal pins, to combine the per-pin odt code signal with the first code signal or the second code signal, and to provide the combined per-pin odt code signal to the respective odt circuits.
Inventor(s): Jungmin SEO of Suwon-si (KR) for samsung electronics co., ltd., Cheonan LEE of Daejeon (KR) for samsung electronics co., ltd., Sukkang SUNG of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10
CPC Code(s): G11C7/1048
Abstract: a device includes an input/output circuit, wherein the input/output circuit includes: a control circuit configured to receive a signal indicating whether the device is activated; a variable voltage source configured to generate a variable voltage according to a control operation of the control circuit based on the signal received by the control circuit; an output driver including a first transistor and a second transistor; and a pad configured to output a current that is generated by the output driver, and wherein the variable voltage source is configured to provide the variable voltage to a body of the first transistor and a body of the second transistor.
Inventor(s): Tongsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seonkyoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungjun BAE of Suwon-si (KR) for samsung electronics co., ltd., Taesung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10
CPC Code(s): G11C7/222
Abstract: a storage device includes a first chip and a second chip configured to exchange data with the first chip. the first chip may transmit a data strobe signal and a plurality of data signals, applied with different delay times, to the second chip. the second chip may sample the plurality of data signals, applied with the different delay times, using the data strobe signal received from the first chip during data training.
Inventor(s): Minsu JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jindo BYUN of Suwon-si (KR) for samsung electronics co., ltd., Joohwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Eun Seok SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Yoon CHO of Suwon-si (KR) for samsung electronics co., ltd., Junghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4096, G11C11/4093, H03K19/017
CPC Code(s): G11C11/4096
Abstract: disclosed is a memory device which includes a pull-up driver that is connected between a power supply voltage and a first node, a t-coil circuit that is connected between the first node and a second node, an external resistor, and a zq controller that performs a zq calibration operation on the pull-up driver. the zq controller includes a path selecting circuit that selects one node among the first node and the second node, a comparing circuit that compares a voltage of the one node selected by the path selecting circuit with a pull-up reference voltage and outputs a comparison result, and a code generating circuit that generates a pull-up code for driving the pull-up driver, based on the comparison result. while the pull-up code is generated, the external resistor is connected between the second node and a ground voltage.
20240212756.VERTICAL TYPE MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunmook Choi of Suwon-si (KR) for samsung electronics co., ltd., Jihong Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/04, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): G11C16/0483
Abstract: a vertical type memory device includes a first pillar structure in a channel hole inside a word line mold, and a second pillar structure in a string select line hole overlapping the channel hole inside a string select line mold. the first pillar structure includes a first gate insulating layer and a cell channel layer on an inner wall of the channel hole, a variable resistance layer on one side of the cell channel layer, a first filling insulating layer filling the channel hole, and a connection pad in an upper portion of the first filling insulating layer. the second pillar structure includes a second gate insulating layer on an inner wall of the string select line hole, a select channel layer on one side of the second gate insulating layer, and a second filling insulating layer filling the string select line hole on the select channel layer.
Inventor(s): Hyun Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/10, G11C16/04, G11C16/08, G11C16/24, G11C16/32
CPC Code(s): G11C16/10
Abstract: in a method of programming data in a nonvolatile memory device including memory cells and a page buffer, the memory cells are electrically connected to wordlines and bitlines, and the page buffer controls the memory cells. in a first program time period of a first program loop, a program voltage having a first program voltage is applied to a selected wordline that is electrically connected to a target memory cell, and a bitline shut-off signal having a first delay is applied to the page buffer. the program voltage is applied to the selected wordline multiple times during one program loop while a magnitude of the program voltage is changed. the delay of the bitline shut-off signal corresponds to a time period during which the bitline shut-off signal maintains a ground voltage.
Inventor(s): Junyoung Ko of Suwon-si (KR) for samsung electronics co., ltd., Jungmin Bak of Suwon-si (KR) for samsung electronics co., ltd., Changhwi Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12
CPC Code(s): G11C29/12005
Abstract: a volatile memory device includes an array of memory cells electrically coupled to a plurality of word lines and a plurality of bitlines, and a bitline sense amplifier electrically coupled to the plurality of bitlines. control logic is provided, which is configured to control: (i) consecutive self-refresh operations within the array of memory cells that are spaced apart from each other by a first period, (ii) storage of dummy data within the array of memory cells during operations to predict life expectancy of memory cells therein, (iii) consecutive test refresh operations within the array of memory cells that are spaced apart from each other by a second period greater than the first period, and (iv) performance of a test sensing operation on selected memory cells within the array using the bitline sense amplifier. a deterioration detection circuit is provided, which is configured to receive sensing results associated with the selected memory cells from the bitline sense amplifier, and to output multi-bit-count current having a magnitude proportional to a number of deteriorated memory cells among the selected memory cells, based on the sensing results.
Inventor(s): Jongpil SON of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12, G11C29/14, G11C29/42, G11C29/46
CPC Code(s): G11C29/1201
Abstract: a memory system includes a plurality of stacked memory dies. each of the plurality of memory dies includes a first memory device connected to a first channel and a second memory device connected to a second channel. in a mirroring mode, when the first memory device performs a first write operation on write data, the second memory device performs a second write operation on the write data.
Inventor(s): Changho YUN of Suwon-si (KR) for samsung electronics co., ltd., Sungjoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yukyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Chaeeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/46, G11C29/12, G11C29/44
CPC Code(s): G11C29/46
Abstract: a memory system including: a memory module including a plurality of memory chips; a mirror memory module including a plurality of mirror memory chips corresponding to the plurality of memory chips, a first mirror memory chip of the plurality of mirror memory chips being storing same data as a first memory chip of the plurality of memory chips; and a memory controller configured to, in a system running state in which an operation according to a request of a user is capable of being performed after the memory system is booted, provide the memory module with a command for instructing a normal operation to be performed and provide the mirror memory module with a command for instructing a memory built-in self-test (mbist) to be performed.
20240212980.PLASMA PROCESS APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaesuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangwook PARK of Suwon-si (KR) for samsung electronics co., ltd., Gukrok YUN of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwhan OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01J37/34
CPC Code(s): H01J37/3211
Abstract: provided a plasma process apparatus including a chamber including a plasma processing space, a substrate stage included in the chamber, the substrate stage including a seating surface, a target including deposition particles to be deposited on the substrate, a gas supplier configured to supply gas into the chamber, a plasma generator configured to generate plasma from the gas, the plasma generator configured to deposit the deposition particles on the substrate through the plasma, at least one permanent magnet on the target being rotatable and configured to distribute the plasma on the target through a magnetic field, and a coil assembly on an outer wall of the chamber and assembly including first through third side coils inclined and being configured to generate first through third vectors, respectively, and the coil assembly being configured to generate a magnetic field vector guiding the plasma through a combination of the first through third vectors.
Inventor(s): Changheon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangki Nam of Suwon-si (KR) for samsung electronics co., ltd., Kuihyun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Kiho Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangho Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangheun Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaemin Rhee of Suwon-si (KR) for samsung electronics co., ltd., Junghyun Cho of Suwon-si (KR) for samsung electronics co., ltd., Seoyeon Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/683
CPC Code(s): H01J37/32642
Abstract: provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. in addition, provided is a plasma processing method using the plasma processing apparatus.
Inventor(s): Younghun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Sunhye HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sangho RHA of Suwon-si (KR) for samsung electronics co., ltd., Seungjae SIM of Suwon-si (KR) for samsung electronics co., ltd., Younseok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byungkeun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Youn Joung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, C23C16/34, C23C16/40, C23C16/50, C23C16/56, H01L21/311
CPC Code(s): H01L21/02164
Abstract: a method of manufacturing an integrated circuit device, the method including forming a doped silicon oxide film on a substrate by supplying, onto the substrate, a silicon precursor, an oxidant, and at least two dopant sources including dopant elements that are different from each other such that the doped silicon oxide film includes at least two dopant elements; forming a vertical hole in the doped silicon oxide film by dry-etching the doped silicon oxide film; and forming a vertical structure in the vertical hole, wherein the silicon precursor includes a monosilane compound, a disilane compound, a siloxane compound, or a combination thereof, and the silicon precursor includes a si—h functional group, and a c1-c10 oxy group or a c1-c10 organoamino group.
Inventor(s): Doo Gyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeong Jin LEE of Suwon-si (KR) for samsung electronics co., ltd., Min-Cheol KWAK of Suwon-si (KR) for samsung electronics co., ltd., Seung Yoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Chan HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/027, H01L21/311, H01L21/3213, H01L21/66
CPC Code(s): H01L21/0273
Abstract: a method for fabricating a semiconductor device using an overlay measurement and a semiconductor device fabricated by the method are provided. the method includes forming a lower pattern including a lower overlay key pattern having a first pitch, on a substrate, forming an upper pattern including an upper overlay key pattern having a second pitch different from the first pitch, on the lower pattern, measuring an overlay between the lower overlay key pattern and the upper overlay key pattern, removing the upper overlay key pattern, and after removing the upper overlay key pattern, performing an etching process using the upper pattern as an etching mask.
Inventor(s): Kangmin Park of Suwon-si (KR) for samsung electronics co., ltd., Hyungho Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo Wi of Hwaseong-si (KR) for samsung electronics co., ltd., Hyunsoo Chun of Suwon-si (KR) for samsung electronics co., ltd., Jiho Uh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, F16K3/02, F16K3/18, F16K3/314, F16K51/02, H01L21/677
CPC Code(s): H01L21/67126
Abstract: a process chamber door for closing or opening an entrance of a process chamber through which a substrate to be process is loaded includes a seal plate including a front surface and a rear surface opposite to each other in a first direction, a connection block connected to the rear surface of the seal plate and including a central portion and two side portions connected to the rear surface of the seal plate, and a shaft connected to the central portion of the connection block. the connection block includes a first hinge groove and a second hinge groove. the first hinge groove is exposed at a bottom surface and a side surface of the connection block and the second hinge groove is exposed at an upper surface and the side surface of the connection block.
Inventor(s): Youngsik OH of Suwon-si (KR) for samsung electronics co., ltd., Sunghoon KIM of Suwon-so (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67
CPC Code(s): H01L21/67138
Abstract: a method and a computing system, for manufacturing a three-dimensional semiconductor device including first and second semiconductor device layers, are provided. the method includes: identifying candidate locations in a via area of the first semiconductor layer; identifying nets of the second semiconductor layer to be connected to through-via structures corresponding to the candidate locations; identifying a plurality of connection costs respectively corresponding to connections between the through-via structures and the nets; identifying pairs of the nets and the through-via structures, based on the plurality of connection costs; allocating the through-via structures according to the pairs; forming the through-via structures at the candidate locations; and forming electrical connections between the through-via structures.
20240213055.PHOTORESIST COATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Heeyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwhan OH of Suwon-si (KR) for samsung electronics co., ltd., Hokyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Junhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Yohan CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, G03F7/16
CPC Code(s): H01L21/6715
Abstract: a photoresist coating apparatus includes a photoresist trap tank temporarily storing a photoresist. a photoresist supply pipe is connected to the photoresist trap tank. a pump is connected to the photoresist supply pipe. a photoresist pressing device is connected to the photoresist supply pipe at a rear of the pump. a photoresist circulation pipe is at a rear of the photoresist pressing device. the photoresist circulation pipe connects the photoresist supply pipe to the photoresist trap tank. a photoresist discharge pipe is connected to the photoresist supply pipe at a rear of the photoresist circulation pipe. a photoresist discharge valve is connected to the photoresist discharge pipe. a photoresist discharge nozzle is connected to the photoresist discharge valve.
Inventor(s): Jongha Hwang of Suwon-si (KR) for samsung electronics co., ltd., Yusung Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L33/50
CPC Code(s): H01L21/67271
Abstract: a light-emitting diode (led)-chip sorting device includes a wafer stage configured to load a wafer including a plurality of led chips thereon, a film stage configured to load a film thereon, a pick-up unit configured to arrange, on the film loaded on the film stage, the plurality of led chips loaded on the wafer stage, and a controller configured to control the pick-up unit to sequentially pick up the plurality of led chips from the wafer stage in a preset pick-up direction. the preset pick-up direction is one of a first pick-up direction defined from a center portion of the wafer toward an edge of the wafer, and a second pick-up direction defined from the edge of the wafer toward the center portion of the wafer.
20240213071.ELECTROSTATIC CHUCK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junho IM of SUWON-SI (KR) for samsung electronics co., ltd., Younseon Wang of SUWON-SI (KR) for samsung electronics co., ltd., Yongwoo Kim of SUWON-SI (KR) for samsung electronics co., ltd., Taehwa Kim of SUWON-SI (KR) for samsung electronics co., ltd., Inseok Seo of SUWON-SI (KR) for samsung electronics co., ltd., Kiseok Lee of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H01J37/32
CPC Code(s): H01L21/6833
Abstract: an electrostatic chuck includes an electrostatic chuck body having a step portion protruding from a lower end, an adhesive layer disposed on an upper surface of the electrostatic chuck body, a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body, and a sealant disposed between the step portion and the edge of the ceramic puck and configured to block reaction gas from permeating into the adhesive layer. the sealant includes a coating layer disposed on an external surface thereof, and the coating layer includes a metal oxide including a single rare earth oxide and/or a multilayer heterogeneous metal oxide.
Inventor(s): Youngbae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G01R31/28, H03K3/03
CPC Code(s): H01L22/34
Abstract: provided is a semiconductor package, including a first semiconductor chip, and a second semiconductor chip on the first semiconductor chip, wherein the first semiconductor chip includes a test pattern, and wherein a frequency based on stress being exerted on the first semiconductor chip is measured based on the test pattern.
Inventor(s): Yeongkwon Ko of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Soyeon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Chungsun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/29, H01L25/065
CPC Code(s): H01L23/3178
Abstract: provided is a semiconductor package including a first semiconductor device including a first semiconductor substrate, a first interconnect structure on the first semiconductor substrate, and a trench extending into the first interconnect structure and a portion of the first semiconductor substrate, a second semiconductor device on the first semiconductor device, and a cover insulating layer on the first semiconductor device and a side surface of the second semiconductor device, the cover insulating layer including a first portion filling the trench included in the first semiconductor device and contacting the first semiconductor substrate.
Inventor(s): Yi Eok Kwon of Suwon-si (KR) for samsung electronics co., ltd., Wooyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jingu Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L25/00, H01L25/18, H10B80/00
CPC Code(s): H01L23/3675
Abstract: a semiconductor package includes: a first redistribution layer; at least one lower die on the first redistribution layer; a first through-via on the first redistribution layer; a first molding material that molds the first redistribution layer, the at least one lower die, and the first through-via; a second redistribution layer on the at least one lower die, the first through-via, and the first molding material; at least one upper die on the second redistribution layer and having a thickness between 1.2 and 1.7 times, including endpoints, greater than a thickness of the at least one lower die; a second through-via on the second redistribution layer; a second molding material that molds the second redistribution layer, the at least one upper die, and the second through-via; and a heat dissipation member on the at least one upper die and the second through-via, wherein the heat dissipation member contacts the second through-via.
20240213128.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jihyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongsung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31, H05K1/18
CPC Code(s): H01L23/49816
Abstract: a semiconductor package includes a wiring substrate, a solder ball on a lower surface of the wiring substrate, a ball land between the lower surface of the wiring substrate and the solder ball and having an upper surface having a circular shape, and a mask layer covering the lower surface of the wiring substrate and including an opening through which a portion of the ball land is exposed. the ball land includes a first land region which is exposed via the opening and has an upper surface having a semicircular shape with a first radius and a second land region which is integrated with a flat side surface of the first land region and has an upper surface having a semicircular shape with a second radius that is less than the first radius.
Inventor(s): Hyungjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Gyuho Kang of Suwon-si (KR) for samsung electronics co., ltd., Seong-Hoon Bae of Suwon-si (KR) for samsung electronics co., ltd., Sang-Hyuck Oh of Suwon-si (KR) for samsung electronics co., ltd., Kwangok Jeong of Suwon-si (KR) for samsung electronics co., ltd., Ju-Il Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H05K1/11, H05K3/46
CPC Code(s): H01L23/49838
Abstract: a redistribution substrate includes first and second insulating layers; a wiring layer, and a metal layer. the wiring pattern includes a via portion penetrating the first insulating layer and a pad portion on the via portion, the pad portion extending onto an upper surface of the first insulating layer. the metal layer covers an upper surface of the wiring pattern. the second insulating layer is provided on the first insulating layer and covers the pad portion and the metal layer. the wiring pattern includes a first metal. the metal layer includes the first metal and a second metal. the metal layer includes a first portion vertically overlapping the pad portion, and a second portion surrounding the first portion, and a concentration of the first metal in the first portion of the metal layer is greater than a concentration of the first metal in the second portion of the metal layer.
20240213138.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Tae Yeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jun Hong MIN of Suwon-si (KR) for samsung electronics co., ltd., Eun Suk JUNG of Suwon-si (KR) for samsung electronics co., ltd., So Hye CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/14
CPC Code(s): H01L23/49894
Abstract: a semiconductor package includes a first substrate including silicon, a first insulating layer in contact with the first substrate, the first insulating layer including silicon oxide, the first insulating layer having a first concentration of silicon, a second insulating layer in contact with the first insulating layer, the second insulating layer including silicon oxide, the second insulating layer having a second concentration of silicon, the second concentration lower than the first concentration, and a structure on the second insulating layer. the first concentration is a ratio of a weight of silicon in the first insulating layer to a total weight of the first insulating layer, the second concentration is a ratio of a weight of silicon in the second insulating layer to a total weight of the second insulating layer, and the first concentration is in a range from 20 wt % to 50 wt %.
Inventor(s): Eunseok SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/00, H01L23/498, H01L25/065
CPC Code(s): H01L23/5223
Abstract: a semiconductor package includes a package substrate, an interposer above the package substrate, a connection terminal between the package substrate and the interposer, a first semiconductor chip and a second semiconductor chip above the interposer, a bridge in the interposer, the bridge connected to the first semiconductor chip and the second semiconductor chip, a capacitor structure in the interposer, the capacitor structure including an upper structure including an upper capacitor and a lower structure including a lower capacitor, and a chip connection terminal including at least one first chip connection terminal between the interposer and the first semiconductor chip and at least one second chip connection terminal between the interposer and the second semiconductor chip.
20240213146.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): HYUNGJUNE KIM of Suwon-si (KR) for samsung electronics co., ltd., BYUNGYUN KANG of Suwon-si (KR) for samsung electronics co., ltd., DONGHYUN KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/528
CPC Code(s): H01L23/5226
Abstract: a semiconductor device according to the disclosure includes: a substrate including a first side and a second side opposite each other with a thickness therebetween, a first wire disposed on the first side of the substrate, a first dummy wire disposed on the first side of the substrate and spaced apart from the first wire, a second wire disposed on the second side of the substrate, a second dummy wire disposed on the second side of the substrate and spaced apart from the second wire, a through via passing through the substrate and connecting the first wire and the second wire, and a plurality of dummy through vias passing through the substrate , wherein the plurality of dummy through vias are laterally offset and physically separated from the first wire and the second wire, wherein a center of at least one of the plurality of dummy through vias is laterally offset from an edge of at least one of the first dummy wire and the second dummy wire.
Inventor(s): Taeyong BAE of Albany NY (US) for samsung electronics co., ltd., Hoonseok SEO of Niskayuna NY (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L23/522
CPC Code(s): H01L23/5283
Abstract: provided is a semiconductor device including a a front-end-of-line (feol) structure and a back-end-of-line (beol) structure connected to the feol structure, wherein the feol structure includes at least one source/drain region and at least one gate structure, and the beol structure includes: a plurality of 1fine metal lines arranged in a row with a same pitch, each of the plurality of 1fine metal lines having a same width; and at least one 1wide metal line formed at a side of the plurality of 1fine metal lines, the 1wide metal line having a width greater than the width of the 1fine metal line, and wherein each of the plurality of 1fine metal lines includes a material different from a material included in the 1wide metal line
Inventor(s): Kyoungpil PARK of Suwon-si (KR) for samsung electronics co., ltd., Doohwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonmin JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/532, H01L23/522
CPC Code(s): H01L23/5329
Abstract: a semiconductor device includes a first wiring level layer including a lower wiring layer, a second wiring level layer on the first wiring level layer and including an upper wiring layer, a via level layer positioned between the first wiring level layer and the second wiring level layer and including a via connecting the lower wiring layer to the upper wiring layer, and a reinforcing insulating layer positioned between the lower wiring layer and the upper wiring layer in the via level layer.
Inventor(s): Se-Ho YOU of Suwon-si (KR) for samsung electronics co., ltd., Byeong Uk JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L25/065
CPC Code(s): H01L23/5381
Abstract: a semiconductor package including a package substrate, a bridge structure stacked on the package substrate, a first molding member surrounding a side surface of the bridge structure, a trace pattern extending along an upper surface of the bridge structure and an upper surface of the first molding member, a via pattern penetrating through the first molding member and electrically connecting the package substrate and the trace pattern to each other, and a first semiconductor chip and a second semiconductor chip each stacked on the upper surface of the first molding member and electrically connected to each other by the bridge structure. the first semiconductor chip and the second semiconductor chip are arranged along a first direction parallel to an upper surface of the package substrate and the trace pattern extends in the first direction and is electrically connected to at least one of the first semiconductor chip and the second semiconductor chip.
Inventor(s): Junghoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Jinsu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungwan Shin of Suwon-si (KR) for samsung electronics co., ltd., Byoungwook Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L23/31, H01L23/498, H01L25/065, H01L25/10
CPC Code(s): H01L23/544
Abstract: a semiconductor package includes a lower redistribution wiring layer having a first region and a second region adjacent the first region and including first redistribution wirings; a semiconductor chip on the first region of the lower redistribution wiring layer and electrically connected to the first redistribution wirings; a sealing member on a side surface of the semiconductor chip and on the lower redistribution wiring layer; a plurality of vertical conductive structures penetrating the sealing member on the second region of the lower redistribution wiring layer and electrically connected to the first redistribution wirings; a marking pattern on the semiconductor chip; seed layer pads on respective end portions of the vertical conductive structures that are exposed by the sealing member at an upper surface thereof; and an upper redistribution wiring layer on the sealing member and the marking pattern and including second redistribution wirings.
Inventor(s): Daewoong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L23/498
CPC Code(s): H01L23/544
Abstract: a semiconductor package includes a substrate including an upper pad and an alignment pad on an upper surface thereof, a first bonding pad disposed on the upper pad, the first bonding pad including a first trench extending in one direction on an upper surface thereof, at least one first alignment pattern disposed on the alignment pad and disposed to be adjacent to the first bonding pad, a semiconductor chip disposed on the substrate, and a first bonding wire connecting the semiconductor chip to the first bonding pad, wherein the at least one first alignment pattern is aligned with the first trench in a direction in which the first trench extends, and the first bonding wire contacts the first bonding pad and partially fills an inner wall of the first trench.
Inventor(s): Young-Woo Park of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/552, H01L21/48, H01L21/56, H01L23/00, H01L23/053, H01L23/31, H01L23/498, H01L25/00, H01L25/065, H01L25/10
CPC Code(s): H01L23/552
Abstract: a method of fabricating a semiconductor package includes mounting at least one semiconductor chip to a package substrate, forming a shielding wall around the at least one semiconductor chip, forming a molded body on the package substrate in a space surrounded by the shielding wall, and forming a shielding cover covering the molding unit and in contact with the shielding wall.
Inventor(s): Jaewoo Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L25/065
CPC Code(s): H01L23/562
Abstract: a semiconductor package comprising a stack structure disposed on a package substrate and that includes a lower structure and an upper structure on the lower structure, the upper structure including a plurality of semiconductor chips offset from each other in a first horizontal direction and stacked in a cascade structure, a reinforcing structure on the upper structure and including a reinforcing chip and an interfacial layer covering an upper surface of the reinforcing chip, and an encapsulant covering the package substrate. the plurality of semiconductor chips include a first semiconductor chip disposed directly below the reinforcing structure and a second semiconductor chip disposed directly below the first semiconductor chip. the reinforcing structure covers an overhanging portion of the first semiconductor chip in which the first semiconductor chip does not overlap the second semiconductor chip in a vertical direction, and the interfacial layer and the encapsulant include the same material.
Inventor(s): Kyongsoon Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L27/146
CPC Code(s): H01L24/05
Abstract: a semiconductor package includes a silicon substrate including a plurality of through openings, and a redistribution wiring layer including a first surface and a second surface opposite the first surface, the second surface facing the silicon substrate, the redistribution wiring layer including a first pad area and a second pad area. the redistribution wiring layer includes a plurality of bonding pads on the first pad area at the first surface, a plurality of test pads on the second pad area at the first surface, a plurality of landing pads on the second pad area at the second surface, the plurality of landing pads in communication with the plurality of through openings, respectively, and a plurality of redistribution wires electrically connected to the plurality of bonding pads and the plurality of landing pads.
Inventor(s): Sungwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Heonwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung-Kwan RYU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498, H01L25/065
CPC Code(s): H01L24/13
Abstract: the present disclosure provides semiconductor packages and methods of fabricating the same. in some embodiments, a semiconductor package includes a substrate including first and second regions, a first pad on the first region, a second pad on the second region, a first dielectric layer on the first region and including a first opening exposing the first pad, a second dielectric layer on the second region and including a second opening exposing the second pad, a first bump structure on the first pad and in the first opening, and a second bump structure on the second pad and in the second opening. a thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. a distance between the substrate and an uppermost end of the first bump structure is longer than a distance between the substrate and an uppermost end of the second bump structure.
Inventor(s): Yeunhee HUH of Suwon-si (KR) for samsung electronics co., ltd., Chisung BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L25/00
CPC Code(s): H01L25/0657
Abstract: an integrated circuit (ic) system including a first substrate comprising passive components, a first power managing ic chip including a first power managing ic stacked on the first substrate, first ic chip group including a ic stacked on top of the first power managing ic chip, a control ic chip, stacked on top of the first ic group, including a control ic configured to control the first ic and a second ic of a second ic chip group, the second ic chip group including the second ic stacked on top of the control ic chip, a second power managing ic chip including a second power managing ic stacked on top of the second ic chip group, and a second substrate comprising passive components stacked on top of the second power managing ic chip.
Inventor(s): Jaemok JUNG of Suwon-si (KR) for samsung electronics co., ltd., Dowan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungkeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongho PARK of Suwon-si (KR) for samsung electronics co., ltd., Juil CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/522
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a first redistribution wiring layer having a first region and a second region surrounding the first region, a semiconductor chip disposed on the first region of the first redistribution wiring layer, a sealing member covering the semiconductor chip on the first redistribution wiring layer, vertical conductive wires penetrating the sealing member on the second region of the first redistribution wiring layer, a second redistribution wiring layer disposed on the sealing member and including second redistribution wirings electrically connected to the vertical conductive wires, and bonding pads provided on an upper surface of the first redistribution wiring layer or a lower surface of the second redistribution wiring layer, each bonding pad having a concavo-convex pattern on an upper surface of the bonding pad. the vertical conductive wires are bonded to the concavo-convex patterns of the bonding pads, respectively.
20240213249.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DONGHOON HWANG of Suwon-si (KR) for samsung electronics co., ltd., KYUNGHO KIM of Suwon-si (KR) for samsung electronics co., ltd., BYUNGHO MOON of Suwon-si (KR) for samsung electronics co., ltd., KYUNGHEE CHO of Suwon-si (KR) for samsung electronics co., ltd., DOYOUNG CHOI of Suwon-si (KR) for samsung electronics co., ltd., INCHAN HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L23/528, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L27/0922
Abstract: an integrated circuit device includes a lower insulating line extending in a first direction, a plurality of lower channel lines over the lower insulating line, first and second lower gate lines respectively on opposing sides of the lower insulating line and opposing sides of one of the lower channel lines, a third lower gate line extending around upper and lower surfaces of the one of the lower channel line and connecting the first and second lower gate lines to each other, an outer gate line arranged under the lower insulating line and contacting the first and second lower gate lines, an upper insulating line over an upper surface of each lower channel line, a plurality of upper channel lines over the upper insulating line, and an upper gate line extending around one of the upper channel lines.
20240213253.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ho-Jun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeoung Ma of Suwon-si (KR) for samsung electronics co., ltd., Geumjong Bae of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/118, H01L29/423
CPC Code(s): H01L27/11807
Abstract: semiconductor devices and methods of forming the same are provided. semiconductor devices may include first and second active patterns on a substrate. each of the first and second active patterns may extend in a first direction. the first and second active patterns may be aligned along the first direction and may be separated by a first trench extending in a second direction. the first trench may define a first sidewall of the first active pattern. the semiconductor devices may also include a channel pattern including first and second semiconductor patterns stacked on the first active pattern, a dummy gate electrode on the channel pattern and extending in the second direction, and a gate spacer on one side of the dummy gate electrode, the one side of the dummy gate electrode being adjacent to the first trench. the gate spacer may cover a first sidewall of the first active pattern.
Inventor(s): Na Rae SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/12, H01L25/075, H01L25/16, H01L33/48, H01L33/62
CPC Code(s): H01L27/124
Abstract: there is provided a chip on film package. the chip on film package includes a film substrate including an upper layer extending in first and second directions opposite to each other and a lower layer facing the upper layer, and having a cutting line formed thereon, first and second semiconductor chips disposed on the upper layer within an area of the cutting line, first and second connection wirings connected to the first and second semiconductor chips and extending toward the first and second directions, respectively, and a test pad connected to at least one of the first and second connection wirings and disposed on the lower layer, within the area of the cutting line.
20240213280.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jae Hong KIM of Suwon-si (KR) for samsung electronics co., ltd., Dae Hwa PAIK of Seoul (KR) for samsung electronics co., ltd., Seung Hyun LIM of Hwaseong-si (KR) for samsung electronics co., ltd., Sin Hwan LIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/75, H04N25/767, H04N25/778, H04N25/78
CPC Code(s): H01L27/14609
Abstract: an image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.
20240213283.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JUNGHYUNG PYO of Seoul (KR) for samsung electronics co., ltd., KYUNGHO LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor may include a pixel isolation structure disposed in a semiconductor substrate to define a first pixel region, first and second photoelectric conversion regions disposed in the first pixel region, and a separation structure disposed in the first pixel region, between the first and second photoelectric conversion regions. the pixel isolation structure may include first pixel isolation portions, which are spaced apart from each other in a second direction and extend lengthwise in a first direction, and second pixel isolation portions, which are spaced apart from each other in the first direction and extend lengthwise in the second direction to connect to the first pixel isolation portions. the separation structure may be spaced apart from the pixel isolation structure in the first direction and the second direction, and is at least partly at the same level as the first and second photoelectric conversion regions in a third direction perpendicular to the first direction and the second direction.
20240213302.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/08
CPC Code(s): H01L28/40
Abstract: an integrated circuit device may include a transistor on a substrate and a capacitor structure electrically connected to the transistor. the capacitor structure may include a first electrode, a dielectric layer structure on the first electrode, and a second electrode on the dielectric layer structure. the dielectric layer structure may include a plurality of first dielectric layers and a plurality of second dielectric layers that are alternately stacked. the plurality of first dielectric layers may include a ferroelectric material, and the plurality of second dielectric layers may include an anti-ferroelectric material. the distribution proportion of internal defect dipoles gradually may vary in a thickness direction of the dielectric layer structure.
Inventor(s): Boeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Haeryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Euncheol DO of Suwon-si (KR) for samsung electronics co., ltd., Cheheung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jooho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/08, H01G4/33, H01L29/51, H01L29/94, H10B12/00, H01G4/008
CPC Code(s): H01L28/56
Abstract: provided is a capacitor, a semiconductor device including the same, and an electronic apparatus including the semiconductor device, wherein the capacitor includes a first electrode including a first metal ion, a second electrode arranged spaced apart from the first electrode, a dielectric layer provided between the first electrode and the second electrode, and an interfacial layer provided between the first electrode and the dielectric layer and including a compound represented by mon, in which a diffusion energy barrier value of m is equal to or greater than a diffusion energy barrier value of the first metal ion.
Inventor(s): Sunghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungchan KANG of Suwon-si (KR) for samsung electronics co., ltd., Haeryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeonggyu SONG of Suwon-si (KR) for samsung electronics co., ltd., Cheheung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jooho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/33, H01G4/008, H01G4/12, H01L27/06
CPC Code(s): H01L28/75
Abstract: provided are a capacitor and a semiconductor device including the same. the capacitor includes a first electrode, a dielectric layer over the first electrode, a second electrode between the first electrode and the dielectric layer, and a third electrode over the dielectric layer and in contact with the dielectric layer such that the dielectric layer is between the second electrode and the third electrode. a thermal expansion coefficient of the first electrode may be greater than a thermal expansion coefficient of the dielectric layer, and a work function of the second electrode may be higher than a work function of the first electrode.
Inventor(s): Shigenobu MAEDA of Seongnam-si (KR) for samsung electronics co., ltd., Hee-Soo Kang of Seoul (KR) for samsung electronics co., ltd., Sang-Pil Sim of Seongnam-si (KR) for samsung electronics co., ltd., Soo-Hun Hong of Gunpo-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, B82Y10/00, H01L21/8234, H01L21/84, H01L27/088, H01L27/12, H01L29/08, H01L29/10, H01L29/16, H01L29/161, H01L29/165, H01L29/417, H01L29/49, H01L29/51, H01L29/66, H01L29/775, H01L29/78
CPC Code(s): H01L29/0692
Abstract: a semiconductor device can include a field insulation layer including a planar major surface extending in first and second orthogonal directions and a protruding portion that protrudes a particular distance from the major surface relative to the first and second orthogonal directions. first and second multi-channel active fins can extend on the field insulation layer, and can be separated from one another by the protruding portion. a conductive layer can extend from an uppermost surface of the protruding portion to cross over the protruding portion between the first and second multi-channel active fins.
Inventor(s): Boram KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaejoon OH of Suwon-si (KR) for samsung electronics co., ltd., Jongseob KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/15, H01L29/20, H01L29/778
CPC Code(s): H01L29/155
Abstract: provided are a superlattice buffer structure and a semiconductor device having the superlattice buffer structure. the superlattice buffer structure includes a plurality of superlattice blocks, and each of the plurality of superlattice blocks has a structure in which a first layer including al(1−x)gaxn (0≤x≤1) and a second layer including al(1−y)gayn (0≤y≤1, x>y) are alternately stacked on each other.
Inventor(s): Junghwan HUH of Suwon-si (KR) for samsung electronics co., ltd., Dongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Dae Hyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Euiju KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L21/768, H01L21/8234, H01L29/49, H01L29/51, H01L29/78
CPC Code(s): H01L29/4236
Abstract: a semiconductor device includes a substrate, a gate trench in the substrate, a gate insulating film in the gate trench, a titanium nitride (tin)-lower gate electrode film on the gate insulating film, the titanium nitride (tin)-lower gate electrode film including a top surface, a first side surface, and a second side surface opposite the first side surface, a polysilicon-upper gate electrode film on the titanium nitride (tin)-lower gate electrode film, and a gate capping film on the polysilicon-upper gate electrode film. a center portion of the top surface of the titanium nitride (tin)-lower gate electrode film overlaps a center portion of the polysilicon-upper gate electrode film in a direction that is perpendicular to a top surface of the substrate, and each of the first side surface and the second side surface of the titanium nitride (tin)-lower gate electrode film is connected to the gate insulating film.
Inventor(s): Sanghyun JO of Suwon-si (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd., Hyangsook LEE of Suwon-si (KR) for samsung electronics co., ltd., Dukhyun CHOE of Suwon-si (KR) for samsung electronics co., ltd., Jinseong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/51, H01L21/28, H01L29/423, H01L29/78, H10B51/20, H10B53/20
CPC Code(s): H01L29/516
Abstract: an electronic device and an electronic apparatus including the electronic device are provided. the electronic device includes a conductive material layer, and a ferroelectric layer covering the conductive material layer. the ferroelectric layer includes a first oxide layer including a first component, and a second oxide layer including hafnium and a second component and having a thickness that is twice or more than a thickness of the first oxide layer.
Inventor(s): Woocheol SHIN of Seoul (KR) for samsung electronics co., ltd., Sunggi HUR of Hwaseong-si (KR) for samsung electronics co., ltd., Sangwon BAEK of Hwaseong-si (KR) for samsung electronics co., ltd., Junghan LEE of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/02, H01L29/06, H01L29/423, H01L29/66
CPC Code(s): H01L29/78618
Abstract: a semiconductor device includes channels, a gate structure, and a source/drain layer. the channels are stacked in a vertical direction. each channel extends in a first direction. the gate structure extends in a second direction. the gate structure covers the channels. the source/drain layer is connected to each of opposite sidewalls in the first direction of the channels on the substrate, and includes a doped semiconductor material. the source/drain layer includes first and second epitaxial layers having first and second impurity concentrations, respectively. the first epitaxial layer covers a lower surface and opposite sidewalls in the first direction of the second epitaxial layer. a portion of each of opposite sidewalls in the first direction of the gate structure protrudes in the first direction from opposite sidewalls in the first direction of the channels to partially penetrate through the first epitaxial layer but not to contact the second epitaxial layer.
20240213415.LIGHT-EMITTING DIODE PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEUNGGYUN JUNG of Suwon-si (KR) for samsung electronics co., ltd., Heejin Kim of Suwon-si (KR) for samsung electronics co., ltd., Ilseop Won of Suwon-si (KR) for samsung electronics co., ltd., Youngkyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulsoo Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L33/60
CPC Code(s): H01L33/502
Abstract: a light-emitting diode package includes a substrate, a light-emitting diode chip mounted on the substrate, a phosphor surrounding a side surface and an upper surface of the light-emitting diode chip, a light conversion structure disposed on the phosphor, and a transparent element disposed between the phosphor and the light conversion structure.
Inventor(s): Dongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Joongil LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiheon OH of Suwon-si (KR) for samsung electronics co., ltd., Kwonjoong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L23/00, H01L25/075
CPC Code(s): H01L33/62
Abstract: a semiconductor light emitting device includes: a substrate; a light emitting device provided on an upper surface of the substrate; a first pad provided on the upper surface of the substrate; a second pad provided on the upper surface of the light emitting device; a bonding wire connecting the light emitting device to the substrate, the bonding wire including: a first portion connected to and extending in a vertical direction from the first pad; a second portion extending from the first portion and inclined at a first angle relative to the first portion; a third portion extending from the second portion and inclined at a second angle is in a range of from about 125 degrees to about 150 degrees relative to the second portion; and a fourth portion extending from the third portion, inclined at a third angle relative to the third portion, and connected to the second pad; and a seal covering at least one side surface of the light emitting device and sealing the bonding wire on the substrate.
Inventor(s): Kyounghwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonghyeok Park of Seoul (KR) for samsung electronics co., ltd., Yonggun Lee of Suwon-si (KR) for samsung electronics co., ltd., Kwanghee Kim of Seoul (KR) for samsung electronics co., ltd., Jusik Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M4/583, H01M4/04, H01M4/70, H01M10/0562
CPC Code(s): H01M4/583
Abstract: an anode-solid electrolyte sub-assembly for an all-solid secondary battery, the anode-solid electrolyte sub-assembly including: an anode current collector; a mixed ionic-electronic conductor structure disposed on a first side of the anode current collector, the mixed ionic-electronic conductor structure containing a mixed ionic-electronic conductor, and having a plurality of openings extending along a thickness direction; wherein the plurality of openings has a structure in which at least one end is open; an interlayer disposed on the mixed ionic-electronic conductor structure and opposite the anode current collector; and a solid electrolyte disposed on the interlayer and opposite the mixed ionic-electronic conductor structure, wherein the interlayer includes an interlayer material.
Inventor(s): Gisoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Jongmoon YOON of Suwon-si (KR) for samsung electronics co., ltd., Gilho KIM of Suwon-si (KR) for samsung electronics co., ltd., Juho SONG of Suwon-si (KR) for samsung electronics co., ltd., Kwanghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Changryong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M50/358, H01M50/183
CPC Code(s): H01M50/358
Abstract: according to various embodiments of the present disclosure, an electronic device may comprise: a housing and a battery disposed in the housing. the battery may comprise: a sealing member comprising a sealing material having top and bottom surfaces which are open; a first exterior member comprising a cap coupled to the sealing member and configured to cover the top surface of the sealing member; a second exterior member comprising a cap coupled to the sealing member and configured to cover the bottom surface of the sealing member; an electrode assembly including at least one electrode accommodated in the second exterior member; an electrolyte provided in the second exterior member; and a vent structure including at least one vent formed on at least one among an edge region of the sealing member, an edge region of the first exterior member, and an edge region of the second exterior member, the vent structure configured to make the inside and outside of the battery communicate with each other.
Inventor(s): Fanghai XU of Shenzhen (CN) for samsung electronics co., ltd.
IPC Code(s): H01P1/207, H01P1/202, H01P7/06
CPC Code(s): H01P1/207
Abstract: a multi-mode cavity filter includes: a metal cavity formed into a hollow shape; and a plurality of resonators supported in suspension within the metal cavity and not contacting with an inner wall of the metal cavity. the plurality of resonators includes: a first resonator configured to generate a first resonant frequency; and a second resonator electrically connected to the first resonator and configured to generate a second resonant frequency. the second resonator includes a plurality of resonance plates. a first number of the second resonant frequency is associated with a second number of the plurality of resonance plates.
Inventor(s): Daeryong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jinho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00, G01R31/367
CPC Code(s): H02J7/0047
Abstract: a method of determining an optimized value set of parameters for a target operation of a battery includes: setting a first value set of the respective parameters as a default value set; acquiring a first performance indicator by performing a simulation of the target operation according to the first value set; generating candidate second value sets having at least one value in the first value set changed; acquiring second performance indicators respectively corresponding to the candidate second value sets by performing simulations of the target operation according to the respective candidate second value sets; selecting one of the candidate second value sets as a second value set based on the second performance indicators; determining that the second performance indicator corresponding to the second value set satisfies a performance condition of the battery, and in response using the second value set as the optimized value set of the parameters.
Inventor(s): Hyunjun OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/007182
Abstract: a power control method and an electronic device for performing the method are disclosed. a power control method according to various embodiments may comprise: receiving an input for turning off the power of an electronic device; identifying the voltage of a battery based on the input being received; determining, based on a set margin voltage and the voltage of the battery based on the input being received, a reference voltage for entering a ship mode preventing and/or reducing discharge of the battery caused by leakage current; turning off the power of the electronic device; monitoring the voltage of the battery after turning off the power of the electronic device; and setting the electronic device to the ship mode based on the monitored voltage of the battery and the reference voltage.
Inventor(s): Junsuk BANG of Hwaseong-si (KR) for samsung electronics co., ltd., Dongsu KIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F3/24
CPC Code(s): H03F1/0238
Abstract: a supply modulator including a multiple output voltage regulator (movr) configured to output voltages in a discrete level-envelope tracking mode (dletm) having different levels from each other respectively corresponding to reference output voltage signals, a switching regulator configured to output a switching regulator voltage, an output voltage being based on the switching regulator voltage and a selected voltage among the voltages in the dletm and based on the switching regulator voltage in an average power tracking mode, a switching regulator controller configured to sense an output current of the movr to obtain a sensing value, and control the switching regulator based on the sensing value in the dletm, a switch array comprising switches respectively corresponding to the voltages and configured to selectively connect the selected voltage to a power amplifier by performing a switching operation, and a switch controller configured to control the switching operation.
Inventor(s): Yoondo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sigwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyelee SONG of Suwon-si (KR) for samsung electronics co., ltd., Dongryul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongmin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yoonjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Handug LEE of Suwon-si (KR) for samsung electronics co., ltd., Woosik CHO of Suwon-si (KR) for samsung electronics co., ltd., Weonjai CHOI of Suwon-si (KR) for samsung electronics co., ltd., Taewook HAM of Suwon-si (KR) for samsung electronics co., ltd., Kyunggu KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongpyo BAE of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngjun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H01Q1/24, H01Q5/50, H01Q21/08, H05K1/02, H05K7/14
CPC Code(s): H04B1/0064
Abstract: in embodiments, an electronic device may include a housing having an inner space, a printed circuit board (pcb) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the pcb, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the pcb, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the pcb and the first antenna structure. the flexible substrate may include a first connecting portion electrically connected to the pcb, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.
Inventor(s): Minki AHN of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jung Woon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/12, H04B1/00, H04B1/16
CPC Code(s): H04B1/12
Abstract: a first wireless communication apparatus includes: a transceiver configured to: receive a radio frequency (rf) signal via a channel from a second wireless communication apparatus, and downconvert the rf signal to generate a received signal that has a lower frequency than a frequency of the rf signal; and a processing circuit configured to: compare the received signal with a reference signal to generate a compensation index based on a comparison result, and compensate an initial first arrival path (fap) time index of the received signal based on the compensation index to generate a final fap time index.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B17/336, H04W72/1273, H04W72/232
CPC Code(s): H04B7/0626
Abstract: a system and a method are provided for enhanced channel state information (csi) reporting. a user equipment (ue) generates csi based on each of a plurality of power offsets. the ue transmits the csi measurements in a csi report to a base station (gnb). the ue receives, from the gnb, an indication of a channel state corresponding to a power offset of the plurality of offsets. based on the indication of the channel state, the ue uses one or more particular resources to receive a physical downlink shared channel (pdsch).
Inventor(s): Minki AHN of Suwon-si (KR) for samsung electronics co., ltd., Jinyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jung Woon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B17/336, H04B1/12
CPC Code(s): H04B17/336
Abstract: the present disclosure provides wireless communication apparatuses for data communication with other wireless communication apparatuses in a wireless communication system. in some embodiments, a first wireless communication apparatus includes a transceiver configured to receive a data signal from a second wireless communication apparatus through a channel, and a processing circuit configured to measure noise, a signal to noise ratio (snr), and error vector magnitude (evm) of the data signal, compare the snr with the evm, and selectively perform, based on a result of the comparison of the snr with the evm, a correction operation on the noise.
Inventor(s): Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd., Yoonseon HAN of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04J3/06, H04W8/24, H04W56/00
CPC Code(s): H04J3/0667
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. disclosed are an apparatus and a method for providing time synchronization between wiredly or wirelessly connected terminals by expanding a function for supporting a time sensitive network (tsn) in a 5g system (5gs) of 3generation partnership project (3gpp).
Inventor(s): Bongsung SEO of Suwon-si (KR) for samsung electronics co., ltd., Suhwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungil PARK of Suwon-si (KR) for samsung electronics co., ltd., Byeonghun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeondeok JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L25/02
CPC Code(s): H04L5/0048
Abstract: the disclosure relates to a 6g communication system for achieving high data transmission rates and ultra-low latency after 4g and 5g communication systems. a method performed by a base station in a communication system according to an embodiment of the disclosure may include identifying a first pilot for channel estimation or a second pilot for non-linearity compensation of a pa, identifying pilot information related to at least one of the first pilot and the second pilot, and transmitting, to a terminal, control information including the pilot information.
Inventor(s): Minki Ahn of Suwon-si (KR) for samsung electronics co., ltd., Jung Woon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B1/30, H04B17/336
CPC Code(s): H04L5/0098
Abstract: a first wireless communication apparatus includes a transceiver including a direct current (dc) component filter configured to remove a dc component of a first data signal received from a second wireless communication apparatus via a channel and output a corresponding second data signal, and a measurement circuit configured to determine a target subcarrier set based on a carrier frequency offset with respect to the second data signal, and measure noise and a signal-to-noise ratio (snr) of the second data signal using the target subcarrier set.
Inventor(s): Ziming HE of Cambridge (GB) for samsung electronics co., ltd., Fei TONG of Cambridge (GB) for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L27/26
CPC Code(s): H04L25/0222
Abstract: a communication device, including a receiver configured to receive a signal comprising a plurality of training symbols and a data symbol; and at least one processor configured to: select, from among the plurality of training symbols, a first training symbol and a second training symbol based on a first parameter and a second parameter; obtain a first symbol difference corresponding to the first training symbol, and a second symbol difference corresponding to the second training symbol; estimate a carrier frequency offset based on the first symbol difference and the second symbol difference; obtain a compensated data symbol corresponding to the data symbol based on the estimated carrier frequency offset; and demodulate and decode the compensated data symbol to obtain decoded data.
Inventor(s): Joon Ho CHO of Gyeongsangbuk-do (KR) for samsung electronics co., ltd., Jeong Hoon CHOI of Gyeongsangbuk-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/26
CPC Code(s): H04L27/2636
Abstract: provided is a discrete fourier transform (dft)-spread orthogonal frequency division multiplexing (ofdm) transmission method and transmitter including a phase shifter configured to generate a pi/2-binary phase shift keying (bpsk) symbol vector by phase-shifting a vector including m bpsk symbols, a dft spreader configured to generate a dft-spread pi/2-bpsk symbol vector by spreading the pi/2-bpsk symbol vector using an m-point dft matrix, a circular extender configured to generate a circularly extended pi/2-bpsk symbol vector by periodically extending the dft-spread pi/2-bpsk symbol vector, a frequency domain spectrum shaper configured to generate a frequency domain spectrum shaped pi/2-bpsk symbol vector by multiplying each element of the circularly extended pi/2-bpsk symbol vector by each element of a first shaping vector, and a subcarrier allocator configured to allocate the frequency domain spectrum shaped pi/2-bpsk symbol vector to subcarriers in an allocated frequency range.
Inventor(s): Min JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunil KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hayoung YANG of Suwon-si (KR) for samsung electronics co., ltd., Youngkwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L47/34, H04L47/36
CPC Code(s): H04L47/34
Abstract: a method performed by a reception device of a communication system is provided. the method includes obtaining, by the receiving device, a first sequence on the basis of a received signal, comparing, by the receiving device, the length of the first sequence with an operation unit, when the length of the first sequence is smaller than the operation unit, generating, by the receiving device, a second sequence on the basis of the first sequence, and performing, by the receiving device, decoding on the basis of the second sequence, wherein the length of the second sequence is greater than or equal to the operation unit.
Inventor(s): Lisi LI of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L67/145, H04W74/0833, H04W76/10
CPC Code(s): H04L67/145
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method executed by a first node in a wireless communication system is provided. the method may include: establishing a bearer for transmitting a first message; and receiving, from a second node, related information about transmission of the first message. the first message is sent by a user equipment (ue) in an idle mode or an inactive state to the second node via the bearer.
Inventor(s): Ha-Na KIM of Suwon-si (KR) for samsung electronics co., ltd., Jee-hoon PARK of Seongnam-si (KR) for samsung electronics co., ltd., Hyun-yong CHOI of Suwon-si (KR) for samsung electronics co., ltd., You-na CHOO of Seongnam-si (KR) for samsung electronics co., ltd., Soo-hyun WHANG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N5/655, H04N5/60, H04N5/64, H04N5/645, H04R1/02
CPC Code(s): H04N5/655
Abstract: an audio-visual system may include a housing comprising an open upper end and a storage space, an audio-visual device installed inside the housing and exposable through the open upper end, and a lifting device configured to expose or store the audio-visual device inside the housing through the open upper end. the audio-visual device may include a display, a speaker, and a processor configured to control the audio-visual system to operate in a first mode for outputting media art content while the display is stored in the housing according to a first event, operate in a second mode for outputting audio content through the speaker while part of the display is exposed through the open upper end according to a second event, and operate in a third mode for outputting a visual content while the entire display is exposed through the open upper end according to a third event.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Euibum HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/89, H04N5/77, H04N9/802
CPC Code(s): H04N9/89
Abstract: an electronic device obtains first video data by using a camera, obtains first reference data depending on a first schedule during a first time duration by using a microphone, receives first audio data corresponding to the first video data from an external electronic device via a wireless communication circuit, and changes the first schedule to a second schedule based on a comparison result between the first reference data and a portion of the first audio data. the electronic device further obtains second reference data depending on the second schedule during a second time duration subsequent to the first time duration by using the microphone, corrects a delay of the first audio data based on the second reference data, and creates a moving image file based on the first video data and the corrected first audio data.
20240214552.IMAGE SENSOR WITH TEST CIRCUIT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Beomsu YUN of Suwon-si (KR) for samsung electronics co., ltd., Hyuk OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N17/00, H04N25/76, H04N25/78
CPC Code(s): H04N17/002
Abstract: provided is an image sensor including a pixel array that includes a plurality of pixels, wherein each of the plurality of pixels is configured to generate an analog signal in response to incident light; an analog-to-digital converter that includes a counter, wherein the analog-to-digital converter is configured to convert the analog signal into a digital signal; and a test circuit that is configured to change a reset code according to a horizontal time period, wherein the reset code corresponds to a first counting value during a reset time period of a test mode according to a count clock signal, and wherein the test circuit is configured to test a counting operation of the counter based on the reset code that changes according to the horizontal time period.
Inventor(s): Wonseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungil KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/433, H04N19/182
CPC Code(s): H04N19/433
Abstract: an image processing device includes an encoder and a decoder. the encoder compresses image data including pixel values of a pixel group in units of pixel groups to generate a bitstream and decompresses the bitstream to generate first restored data. the decoder receives the bitstream from the encoder and decompresses the bitstream to generate second restored data. the encoder includes a first statistic circuit that generates first statistical data based on the first restored data and changes a setting value of the encoder based on the first statistical data, and the decoder includes a second statistic circuit that generates second statistical data based on the second restored data and changes a setting value of the decoder based on the second statistical data.
Inventor(s): Sungryeul RHYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Eric YIP of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/84, H04N21/845
CPC Code(s): H04N21/84
Abstract: a method, performed by a scene content transmitter, of processing scene content, according to an embodiment of the present disclosure, may include constructing at least one track data associated with a plurality of scene descriptions constituting the scene content, wherein the at least one track data includes a first sample including a scene description at a first time point and a second sample associated with a scene description at a second time point after the first time point and based on the first sample, and transmitting the at least one track data to a scene content receiver, and a header of the second sample may include information related to a target referenced by the second sample.
Inventor(s): Jaeheung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/54, H04N23/55
CPC Code(s): H04N23/54
Abstract: a camera module according to various embodiments may include a first circuit board electrically connected to an image sensor or a circuit board including the image sensor, an actuator configured to control at least one of a position or a posture of the first circuit board within the camera module, a flexible circuit board extracted and extending from at least one side surface of the first circuit board, multiple slits, the slits being disposed between adjacent ones of multiple conductive wires mounted on the flexible circuit board, and a second circuit board electrically connected to one end of the flexible circuit board. the flexible circuit board may include a first section extracted from the first circuit board or extending from the first circuit board in a first direction. the flexible circuit board may include a second section extending from one end of the first section in a second direction different from the first direction or fixed to another component of the camera module. the flexible circuit board may be deformed as the actuator is driven.
Inventor(s): Kwangyong LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungheum YI of Suwon-si (KR) for samsung electronics co., ltd., Seongsin KWAK of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Daekyu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seoyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Daiwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jihwan CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/80, H04N1/21, H04N23/60, H04N23/667, H04N101/00
CPC Code(s): H04N23/80
Abstract: an electronic device is provided. the electronic device includes a camera module, a sensor module, at least one processor configured to be operatively connected to the camera module and the sensor module, and a memory configured to be operatively connected to the at least one processor. the memory may be configured, when executed, to cause the at least one processor to acquire a plurality of first images having a first attribute and at least one second image having a second attribute for a designated time by controlling the camera module according to a photographing mode of the camera module determined based on at least one of illuminance detected through the sensor module and scene information detected through the camera module, extract information on an event section when the event is detected from the plurality of first images, and select and buffer at least one third image from the at least one second image according to the photographing mode, generate at least one piece of first content based on the information on the event section of the plurality of first images, and select at least one fourth image by evaluating at least some of the at least one third image, and generate at least one piece of second content based on the selected at least one fourth image.
Inventor(s): Jaehyoung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/11, H04N23/55, H04N23/56
CPC Code(s): H04N25/11
Abstract: an electronic device including at least one camera module and a method for controlling the same are provided. the electronic device includes a lens portion, an image sensor configured to covert light passing through the lens portion into a digital signal, and a data computation portion, wherein the image sensor includes a micro lens array portion including a plurality of micro lenses regularly-arranged and configured to focus at least a portion of the light on a specific light receiving element, color filter array portion including one or more types of multiple colors spatially separated and capable of selectively transmitting the light, and a light receiving portion including a plurality of light receiving elements converting incident light, selectively incident from the color filter array portion, into an electrical signal, wherein one micro lens corresponds to one color filter, and the one micro lens corresponds to a plurality of sub-light receiving portions including at least three light receiving elements, wherein the plurality of sub-light receiving portions include a first sub-light receiving portion receiving a first light of the incident light, a second sub-light receiving portion disposed side by side with the first sub-light receiving portion in a first direction and receiving a second light adjacent to the first light of the incident light, and a third sub-light receiving portion disposed in a direction opposite the first direction with respect to the first sub-light receiving portion and receiving a third light adjacent to the first light of the incident light.
Inventor(s): Jihye KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinpyo Gwak of Suwon-si (KR) for samsung electronics co., ltd., Dongeui Shin of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok Hong of Suwon-si (KR) for samsung electronics co., ltd., Minsu Hwangbo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/50, H04N25/706
CPC Code(s): H04N25/50
Abstract: provided is a time of flight (tof) sensor and a method for controlling the tof sensor. the tof sensor includes a first light emitter configured to output first light of a first pattern, a second light emitter configured to output second light of a second pattern, an image sensor including a plurality of pixels, and at least one processor configured to control the first light emitter and the second light emitter to sequentially output the first light and the second light, obtain, based on the output first light and second light being received through the image sensor by being reflected by a plurality of objects, a first image frame corresponding to the received first light and a second image frame corresponding to the received second light, and identify distances between the tof sensor and the plurality of objects based on the first image frame and the second image frame.
20240214703.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunji PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/709, H01L27/146, H04N25/77
CPC Code(s): H04N25/709
Abstract: an image sensor includes a plurality of pixels, each pixel of the plurality of pixels includes, a first photodiode, a second photodiode, a first transfer transistor connected to a first floating diffusion node, a second transfer transistor connected to a second floating diffusion node, a first reset transistor configured to reset the first floating diffusion node with a first reset power supply voltage, a second reset transistor configured to reset the second floating diffusion node with a second reset power supply voltage, a switch transistor connecting the second floating diffusion node to the first floating diffusion node, and a first driving transistor configured to output an output voltage according to a voltage of the first floating diffusion node.
Inventor(s): Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd., Ricky Kumar KAURA of Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04W4/14, H04W24/02
CPC Code(s): H04W4/14
Abstract: embodiments herein provide a method for managing short data service (sds) communication in a mission critical data (mcdata) communication system. the method includes determining, by a transmitting mcdata ue, whether a pre-determined criteria is met for transmitting a one-to-one standalone sds message or a group standalone sds message to receiving mcdata ue (s). further, the method includes determining data size of the one-to-one standalone sds message or group standalone sds message. furthermore, the method includes transmitting the one-to-one standalone sds message to the receiving mcdata ue for one-to-one communication or group communication using one of a signaling control plane and a media plane based the determined data size of the one-to-one standalone sds message or group standalone sds message.
Inventor(s): Yanping Gao of Suzhou Industrial Park (CN) for samsung electronics co., ltd.
IPC Code(s): H04W4/40, H04W72/543, H04W72/566
CPC Code(s): H04W4/40
Abstract: a method for cellular vehicle-to-everything and a device thereof are provided. the method includes: determining, by a processor, a service priority group corresponding to a vehicle-to-everything (v2x) service; and determining, by the processor, whether to use resources in exceptional resource pools for the v2x service based on the service priority group.
Inventor(s): Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W24/04, H04W36/30, H04W76/18, H04W76/19
CPC Code(s): H04W24/02
Abstract: the present disclosure relates to a base station that supports self-configuration and self-optimization and a method thereof. a method performed by a target base station in a mobile communication system includes: receiving a radio link failure (rlf) report of a user equipment (ue) from a source base station or a third base station; detecting a reason for an occurrence of a failure based on the rlf report of the ue; and transmitting a message to the source base station based on the detected reason for the occurrence of the failure.
Inventor(s): Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W88/04, H04W92/18
CPC Code(s): H04W24/10
Abstract: the present disclosure relates to: a communication technique merging iot technology with a 5th generation (5g) or 6th generation (6g) or pre-5g communication system for supporting a data transmission rate higher than that of a 4th generation (4g) communication system, such as long term evolution (lte); and a system therefor. the present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, and the like) on the basis of 5g communication technology and iot-related technology. according to various embodiments of the present disclosure, provided are a method and a device for processing connection mode mobility of a terminal if a terminal can access a network through a direct connection with a base station or a connection with the base station through a sidelink relay in a wireless communication system.
20240214851.TRIGGERING OF A REPORT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for triggering a report. a method for operating a user equipment (ue) includes transmitting information including at least one of (i) a trigger indicating a need for transmitting a report and (ii) content associated with the report. the trigger is related to a channel between the ue and a network entity. the need is based on at least one performance metric of a communication over the channel. the content includes at least one property associated with the channel.
Inventor(s): Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Donggun KIM of Seoul (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W68/06, H04W88/06
CPC Code(s): H04W24/10
Abstract: the present disclosure relates to a communication technique for combining, with an iot technology, a 5g communication system for supporting a data transmission rate higher than that of a 4g system, and to a system therefor. the present disclosure may be applied to intelligent services (e.g., a smart home, a smart building, a smart city, a smart car or connected car, healthcare, digital education, retail business, security and safety-related service, etc.), based on a 5g communication technology and an iot-related technology. a method for a user equipment in a first communication system according to the present invention comprises steps in which a user equipment in an inactive state: transmits a paging area update request message; checks whether or not a timer associated with a paging area update has expired; and transitions into an idle state if a response message for the paging area update request message has not been received until the timer has expired.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W52/02, H04W84/12
CPC Code(s): H04W28/0215
Abstract: an electronic device includes a temperature sensor located in the electronic device; a wireless communication module configured to transmit and receive a wireless signal; a processor operatively connected to the wireless communication module; and a memory electrically connected to the processor and storing instructions executable by the processor. the instructions, when executed by the processor, cause the electronic device to determine a target wake time (twt) parameter differently according to a heat state of the electronic device based on a temperature of the electronic device, and use the twt parameter to perform a twt negotiation with an external electronic device through the wireless communication module.
Inventor(s): Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00
CPC Code(s): H04W36/0022
Abstract: the disclosure relates to a 5g or pre-5g communication system for supporting a data transmission rate higher than a 4g communication system such as lte. a method performed by a ue in a communication system includes: receiving, from a base station associated with nr, a command message for inter-rat handover from the nr to a target rat, wherein the command message includes information on a type of the target rat; performing a procedure associated with the inter-rat handover based on the command message; in case that a failure condition for the inter-rat handover is satisfied, identifying that the inter-rat handover fails; and in case that the type of the target rat is set to eutra and the ue supports a radio link failure report for inter-rat mro eutra, storing handover failure information in a variable for the radio link failure report based on an identification that the inter-rat handover fails.
Inventor(s): Kipyo NAM of Suwon-si (KR) for samsung electronics co., ltd., Janggun BAE of Suwon-si (KR) for samsung electronics co., ltd., Kyoungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungsick KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00
CPC Code(s): H04W36/0061
Abstract: an electronic device and method of operating an electronic device are provided. the electronic device includes a memory storing a forbidden public land mobile network (fplmn) list including a node to which access of the electronic device is blocked, a communication circuit, and a communication processor configured to receive, through a first node, a handover command signal, search for a second node to which handover is to be performed, based on information included in the handover command signal, identify whether the second node is in the fplmn list, based on system information broadcast by the second node and including information of multiple public land mobile networks (plmns), in case the second node is included in the fplmn list, transmit a tracking area update (tau) request signal to the second node, and connect to the second node according to reception of an accept message corresponding to the tau request signal.
Inventor(s): Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/30, H04W48/08, H04W48/16, H04W48/18, H04W48/20
CPC Code(s): H04W36/0085
Abstract: a method and user equipment (ue) for performing a cell reselection procedure is provided. the method includes receiving priority information about frequencies, performing cell measurement, based on the priority information, and performing a cell reselection procedure, based on a result of the cell measurement.
Inventor(s): Donggun KIM of Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W12/08, H04W12/106, H04W36/00
CPC Code(s): H04W36/08
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a method performed by a user equipment (ue) in a wireless communication system includes receiving a medium access control (mac) protocol data unit (pdu) including a mac control element (ce) indicating at least one target cell configuration and performing a primary cell (pcell) change to a target cell based on the at least one target cell configuration.
Inventor(s): Taehyung LIM of Suwon-si (KR) for samsung electronics co., ltd., Jungje SON of Suwon-si (KR) for samsung electronics co., ltd., Duckey LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/38, H04W12/033, H04W36/00, H04W60/00
CPC Code(s): H04W36/385
Abstract: a method for carrying out amf reassignment in a communication system may comprise the steps of: transmitting, to an nssf, a first request message including at least one of a first parameter for requesting a public key of an amf that is to be reassigned and a second parameter for requesting a token related to the amf that is to be reassigned; receiving, from the nssf, a first response message including at least one of information indicating a target amf set, and a public key of the target amf set or the token; generating, on the basis of first security context for user equipment, an sc container including second security context for a target amf; encrypting the sc container by using the public key; and transmitting, to the target amf via a radio access network related to the user equipment, at least one of the encrypted sc container, additional information related to encryption of the sc container, and the token.
Inventor(s): Vijay Kumar MISHRA of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Govind UTTUR of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Utsav SINHA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/02, H04W60/00
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal in a wireless communication system is provided. information on a stand-alone non-public network (snpn) may be stored in at least one list of one or more forbidden snpns, while operating in an snpn access operation mode. the snpn access operation mode may be deactivated. the at least one list of one or more forbidden snpns may be maintained.
Inventor(s): Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04L69/327, H04W60/04, H04W80/10
CPC Code(s): H04W48/18
Abstract: a method performed by a network function (nf) in 5g core network (5gc) in a wireless communication system is provided. the method includes receiving, from an application function (af), an event subscription request message comprising network slice related quota information for a network slice, determining whether an event notification triggering condition for the network slice is met based on the network slice related quota information and data received from at least one nf in the 5gc, and transmitting, to the af, an event notification message for the network slice based on a result of the determining.
Inventor(s): Suha YOON of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Euichang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyunjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seho MYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/30
CPC Code(s): H04W52/0225
Abstract: the present disclosure relates to a 5g or pre-5g communication system for supporting a higher data transmission rate compared to a 4g communication system such as an lte. according to an embodiment of the present invention, a method performed by a terminal in a wireless communication system comprises the steps of: identifying, by a first processor of the terminal, a state of the terminal; transmitting the state of the terminal to a second processor of the terminal; identifying an electric power-related parameter associated with the state of the terminal; and transmitting, to a base station, a terminal message including the electric power-related parameter.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/14, H04W52/24, H04W72/1268, H04W72/232
CPC Code(s): H04W52/146
Abstract: apparatuses and methods for uplink (ul) power control in full-duplex (fd) systems. a method of operating a user equipment (ue) includes receiving first and second information for first and second sets of power control parameters for first and second ul channels or signals associated with first and second subset of slots, respectively, from a set of slots on a cell; determining, based on a slot for a transmission being from the second subset of slots, a first power control value from the second set of power control parameters for the transmission; and transmitting, based on the first power control value, the second ul channel or signal in the slot. the second subset of slots include time-domain resources indicated for simultaneous transmission and reception on the cell and the first subset does not.
Inventor(s): Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Younsun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04L5/00
CPC Code(s): H04W52/365
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. according to one embodiment of the present disclosure, a method performed by a terminal in a communication system is provided. the method comprises: receiving power headroom reporting (phr)-related configuration information; confirming at least one phr based on the phr-related configuration information; and transmitting the at least one phr, wherein the at least one phr comprises one of phr for an actual physical uplink shared channel (pusch) related to a first resource index, and phr for a reference pusch related to the first resource index, and, if a pusch related to the first resource index is transmitted in slot n, then the phr for the actual pusch related to the first resource index is for a first pusch related to the first resource index overlapping with slot n.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04L5/14, H04W72/0446, H04W72/231
CPC Code(s): H04W52/365
Abstract: power headroom reporting in full-duplex systems. a method of operating a user equipment (ue) includes receiving first and second information for first and second sets of parameters for a first and second power headroom reports (phrs) associated with first and second subsets of slots from a set of slots, respectively, and determining a power for transmission of a physical uplink shared channel (pusch) in a slot from the set of slots. the method further includes determining a phr for the power based on the first set of parameters when the slot is from the first subset of slots or the second set of parameters when the slot is from the second subset of slots and transmitting the phr based on whether a reporting condition is met. the second subset of slots includes time-domain resources indicated for simultaneous transmission and reception on the cell and the first do not.
Inventor(s): Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunseok RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/40, H04W52/36
CPC Code(s): H04W52/40
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. according to an embodiment of the present disclosure, a method for a terminal performing power headroom reporting in a wireless communication system using multiple transmission and reception points (trps) comprises the steps of: receiving configuration information for the power headroom reporting from a base station; if the power headroom reporting is triggered, generating power headroom information for the multiple trps on the basis of the configuration information; and transmitting, to the base station, the power headroom information for the multiple trps.
Inventor(s): Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunseok RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W72/25
CPC Code(s): H04W64/006
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. provided is a method of identifying a location by using a positioning reference signal (prs) by a first user equipment (ue) performing sidelink (sl) communication, including determining transmission resources of a first prs and a second prs, transmitting the first prs by using at least one of the determined transmission resources, transmitting the second prs by using at least one of the determined transmission resources, receiving, a third prs, a first response time, and a second response time, acquiring a first round trip time (rtt) and a second rtt, calculating a time of flight (tof) by using the first rtt, the second rtt, the first response time, and the second response time, and identifying the location of the first ue by using the calculated tof, wherein the second prs is transmitted after the first prs is transmitted and before the third prs is received.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Himke VAN DER VELDE of Zwolle (NL) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04L12/18, H04W76/27
CPC Code(s): H04W68/02
Abstract: embodiments herein provide method for multicast session notification signalling and procedure in wireless network () by ue (). in an embodiment, the method includes receiving a signal related with a multicast and broadcast service (mbs) session in a radio resource control (rrc) connected state; in case that the ue () transits from the rrc connected state to one of a rrc idle state or a rrc inactive state and determines to join in at least one mbs session, monitoring a message for a group notification related with the at least one mbs session on a physical downlink control channel (pdcch); based on a detection of the paging message, identifying a temporary mobile group identity (tmgi) indicating one of the at least one mbs session included in the paging message; and forwarding the identified tmgi to an upper layer.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L5/00, H04W72/044, H04W72/21, H04W88/06
CPC Code(s): H04W72/1268
Abstract: the disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as a smart home, a smart building, a smart city, a smart car, a connected car, health care, digital education, a smart retail, security and safety services. a method and an apparatus for an rrc idle mode related operations in wireless communication system are provided.
Inventor(s): Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Min JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L5/00, H04W72/23
CPC Code(s): H04W72/1268
Abstract: the disclosure relates to a communication technique for combining an iot technology with a 5g communication system for supporting a higher data transmission rate than that of a beyond-4g system, and a system therefor. the disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail businesses, security and safety related services, and the like) based on 5g communication technologies and iot-related technologies. in addition, the disclosure provides a method and apparatus for power control of an iab node in a wireless communication system.
Inventor(s): Hoda Shahmohammadian of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun Bae of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04B7/0452, H04L5/00, H04W72/04
CPC Code(s): H04W72/1273
Abstract: a system and a method are disclosed for processing a first pdsch, the method includes processing the first pdsch based on determining that one or more first restrictions apply to the first pdsch, the one or more first restrictions including restricting a first allocation of resource blocks, such that a number of consecutively scheduled physical resource blocks (prbs) in a bundle for the first pdsch is even, or a number of common resource blocks (crbs) offset from an initial crb of a crb grid for a set of consecutively scheduled prbs for the first pdsch is even.
Inventor(s): Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Yi WANG of Beijing (CN) for samsung electronics co., ltd., Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/21, H04L1/1607, H04L5/00, H04W72/044, H04W72/1273
CPC Code(s): H04W72/21
Abstract: a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot) may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method performed by a user equipment (ue)includes: receiving downlink data and/or downlink control signaling from a base station; determining uplink data and/or uplink control signaling, an uplink time unit and/or an uplink physical channel for transmitting the uplink data and/or the uplink control signaling based on the downlink data and/or the downlink control signaling; and transmitting the uplink data and/or uplink control signaling to the base station on the determined uplink time unit and/or uplink physical channel.
Inventor(s): Jinhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Taehyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoondong NOH of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04W72/0453, H04W72/1273
CPC Code(s): H04W72/23
Abstract: the disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method of a terminal in a wireless communication system is provided. the method includes receiving, from a first cell of a base station, cross carrier scheduling configuration including information indicating that a carrier indicator field (cif) is included in downlink control information (dci); receiving, from the first cell of the base station, the dci for scheduling a physical downlink shared channel (pdsch), the dci including the cif; if the cif indicates that a resource assignment of the pdsch is for the first cell, identifying whether a first offset value between a reception of the dci and the pdsch is less than a threshold; and in case that the first offset value is less than the threshold and the terminal supports default beam selection for the pdsch, receiving, from the first cell of the base station, data on the pdsch based on quasi co-located (qcl) parameters for a control resource set (coreset) associated with a search space with a lowest coreset identifier (id) within an active bandwidth part (bwp) of the first cell in a latest slot monitored by the terminal.
Inventor(s): Young Han Nam of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/00, H04B7/06, H04W74/08
CPC Code(s): H04W74/006
Abstract: methods and apparatuses for supporting multiple beam operations in wireless communication systems is provided. the method comprises: determining a configuration information (id) of a user equipment (ue) based on indication information included in a synchronization signal and physical broadcast channel (pbch) block (ssb), the configuration information corresponding to a first value or a second value; determining, based on the configuration information, an operation mode to identify a ue transmit (tx) scheme and a ue receive (rx) scheme, wherein the operation mode comprises a first operation mode corresponding to the first value or a second operation mode corresponding to the second value; and transmitting or receive signals based on the determined operation mode.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Youngbin CHANG of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W4/06, H04W48/12, H04W72/21, H04W72/23, H04W74/00
CPC Code(s): H04W74/0833
Abstract: the present disclosure relates to a communication method and system for converging a 5generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method for receiving system information (si) by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station (bs), first type si associated with si which is essential for communication with the bs, transmitting, to the bs, a physical random access channel (prach) preamble based on the first type si, receiving, from the bs, a random access response (rar) message, and receiving, from the bs, second type si associated with at least one si which the ue needs.
Inventor(s): Jinwoo OCK of Suwon-si (KR) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W76/20, H04W76/30
CPC Code(s): H04W76/19
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment of the disclosure, a method of a first base station may be provided, the method comprising the steps of: receiving a radio resource control (rrc) resume message for small data transmission (sdt) from an rrc inactive terminal; transmitting a first message for requesting of a terminal context to a second base station, wherein the first message includes an sdt indicator; in case that the terminal context is not relocated for the sdt, receiving a second message including partial information of the entire context of the terminal, which is included in the second base station; and based on the partial information of the second message, transferring uplink data of the terminal to the second base station.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04L5/00
CPC Code(s): H04W76/28
Abstract: apparatuses and methods for resource allocation of low power signals. a method of a user equipment (ue) in a wireless communication system includes receiving a first configuration for a discontinuous reception (drx) of a low power signal; determining, based on the first configuration for the drx, a duration of an on period associated with the drx, a cycle period within which the on period periodically occurs in time, and a number of monitoring occasions for the low power signal within the on period; and receiving the low power signal based on the monitoring occasions for the low power signal.
Inventor(s): Hongjoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Eundae Bae of Suwo-si (KR) for samsung electronics co., ltd., Younghoon Woo of Suwon-si (KR) for samsung electronics co., ltd., Jiwoong Choi of Suwon-si (KR) for samsung electronics co., ltd., Myoungjin Ham of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/06, H05B6/12, H05B6/44
CPC Code(s): H05B6/065
Abstract: an induction heating apparatus includes a plate including a plurality of cooking areas, a plurality of working coils arranged below the plate to correspond to the plurality of cooking areas, respectively, a plurality of coil switches connected to the plurality of working coils, respectively, a first inverter circuit connected to one end of a first coil switch and one end of a second coil switch among the plurality of coil switches, a second inverter circuit connected to one end of a third coil switch and one end of a fourth coil switch among the plurality of coil switches, and a branch switch connected to an other end of the second coil switch and to an other end of the third coil switch.
20240215140.SOURCE VESSEL FOR EUV_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daegeun Yoon of Suwon-Si (KR) for samsung electronics co., ltd., Sunghyup Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungpyo Hong of Suwon-si (KR) for samsung electronics co., ltd., Injae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05G2/00
CPC Code(s): H05G2/008
Abstract: a source vessel for extreme ultraviolet (euv) includes a body that includes an outlet for discharging tin debris disposed in a central portion and an intermediate focus (if) disposed in an upper end portion, and a reflector disposed in a lower end of the body and that includes a through-hole through which laser light passes. the body includes an if cap portion disposed on a lower portion of the intermediate focus and that includes a heater disposed on an outer surface thereof, and an if scanner portion disposed on an upper portion of the intermediate focus and that includes a cooling pipe disposed on an external surface thereof. an inner surface of the if cap portion includes a flow groove through which tin residue flows, and the source vessel further includes a collection container connected to the flow groove.
Inventor(s): Sangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwanghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeeeun YANG of Suwon-si (KR) for samsung electronics co., ltd., Moonil JUNG of Suwon-si (KR) for samsung electronics co., ltd., Euntae KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkwan CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/00
Abstract: a memory device includes a read word line on a substrate, a first channel extending along a plane perpendicular to an upper surface of the substrate, a second channel facing the first channel in parallel, a first gate insulation layer adjacent to the first channel between the first channel and the second channel, a second gate insulation layer adjacent to the second channel between the first channel and the second channel, a gate electrode adjacent to the first gate insulation layer between the first gate insulation layer and the second gate insulation layer, a write word line adjacent to the second gate insulation layer between the first gate insulation layer and the second gate insulation layer, a read bit line electrically connected to the first channel, and a write bit line electrically connected to the second channel.
Inventor(s): Teawon Kim of Suwon-si (KR) for samsung electronics co., ltd., Seohee Park of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Tak of Suwon-si (KR) for samsung electronics co., ltd., Minkyung Kang of Suwon-si (KR) for samsung electronics co., ltd., Joonnyung Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/764
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a line structure on the lower structure and including a conductive pattern and an insulating capping pattern on the conductive pattern, a contact structure including a lower portion adjacent to a side surface of the line structure and an upper portion on the lower portion, a spacer structure between a side surface of the lower portion of the contact structure and the side surface of the line structure, an insulating separation pattern on the spacer structure, and a protective layer between the upper portion of the contact structure and the insulating separation pattern. the spacer structure includes an internal spacer, an external spacer, and an air gap between the internal spacer and the external spacer. regions of the internal spacer and the external spacer exposed by the air gap include an oxide. the insulating separation pattern seals at least a portion of an upper portion of the air gap.
20240215229.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): MINSUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., WONHEE CHO of Suwon-si (KR) for samsung electronics co., ltd., HYOUNGYOL MUN of Suwon-si (KR) for samsung electronics co., ltd., SUNGDONG CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device may include a semiconductor layer on a substrate, a first insulating layer on the semiconductor layer, a first conductive structure, which is provided to penetrate the first insulating layer in a vertical direction perpendicular to a bottom surface of the substrate and is connected to the semiconductor layer, a second insulating layer covering the first insulating layer and the first conductive structure, a second conductive structure, which is provided to penetrate the second insulating layer in the vertical direction and is connected to the first conductive structure, and a diffusion barrier layer covering a top surface of the first insulating layer and extending to a side surface of the first conductive structure. the lowermost surface of the second conductive structure may be located at a height higher than the top surface of the first insulating layer.
Inventor(s): Gil Sung LEE of Suwon-si (KR) for samsung electronics co., ltd., Suk Kang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, G11C16/04, H01L25/065, H10B43/10, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device may include a cell substrate, a mold structure including gate electrodes stacked on the cell substrate, a channel structures penetrating the mold structure; and a first cutting structure cutting some of the gate electrodes. the first cutting structure may include a first portion having a line shape extending in a first direction and a second portion having a line shape extending in a second direction. the first portion and the second portion may be alternately connected to form a zigzag shape. the first cutting structure may include a first side wall and a second side wall opposing the first side wall. a first point of the first side wall connected from the second portion to the first portion and a second point of the second side wall connected from the first portion to the second portion may be in corresponding channel structures among the channel structures.
20240215245.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ji Young KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Woo Sung YANG of Gwangmyeong-si (KR) for samsung electronics co., ltd., Sung-Min HWANG of Hwaseong-si (KR) for samsung electronics co., ltd., Suk Kang SUNG of Seongnam-si (KR) for samsung electronics co., ltd., Joon-Sung LIM of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/10, H10B41/27, H10B43/10
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device includes a first stacked structure, a first supporter layer, a second stacked structure, a block cut structure, and a second supporter layer on the second stacked structure and separated by a second cut pattern. the first stacked structure includes a first and second stack, the second stacked structure includes a third stack separated by the block cut structure and a fourth stack, the first supporter layer is on the first stack and the second stack, the second supporter layer is on the third stack and the fourth stack, the first cut pattern includes a first connection on the block cut structure and connecting the first supporter layer and the second stack, and the second cut pattern of the second supporter layer includes a second connection on the block cut structure and connecting the second supporter layer placed on the third stack and the fourth stack.
Inventor(s): HYUN-MOOK CHOI of Suwon-si (KR) for samsung electronics co., ltd., CHAE LYOUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., JIHONG KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/35, H10B43/27
CPC Code(s): H10B43/35
Abstract: a semiconductor device includes gate layers and lower insulating layers that are alternately stacked on an upper surface of a substrate, a channel structure passing through the gate layers and the lower insulating layers and extending in a vertical direction, a string select gate layer disposed on the channel structure, a string select channel structure passing through the string select gate layer and extending in the vertical direction, and a contact pad disposed in a space between the channel structure and the string select channel structure and connecting the channel structure to the string select channel structure. a lower surface of the contact pad contacts the channel structure and an upper surface of the contact pad contacts the string select channel structure. a first width of the lower surface of the contact pad is greater than a second width of a central portion of the contact pad. a third width of the upper surface of the contact pad is greater than the second width of the central portion of the contact pad.
20240215249.VERTICAL NAND FLASH MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyunghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunho KIM of Suwon-si (KR) for samsung electronics co., ltd., Seyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyeul YANG of Suwon-si (KR) for samsung electronics co., ltd., Gukhyon YON of Hwaseong-si (KR) for samsung electronics co., ltd., Minhyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokhoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hoseok HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/35, H10B43/27
CPC Code(s): H10B43/35
Abstract: a vertical nand flash memory device may include a plurality of cell arrays. each of the plurality of cell arrays may include a channel layer, a charge trap layer on the channel layer, and a plurality of gate electrodes on the charge trap layer. the charge trap layer may include silicon oxynitride comprising a metal. the metal may include at least one of ga or in.
Inventor(s): Seyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jooheon Kang of Hwaseong-si (KR) for samsung electronics co., ltd., Yumin Kim of Suwon-si (KR) for samsung electronics co., ltd., Garam Park of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae Song of Suwon-si (KR) for samsung electronics co., ltd., Dongho Ahn of Hwaseong-si (KR) for samsung electronics co., ltd., Seungyeul Yang of Suwon-si (KR) for samsung electronics co., ltd., Myunghun Woo of Hwaseong-si (KR) for samsung electronics co., ltd., Jinwoo Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Seungdam Hyun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/35, G11C16/04, H10B43/10, H10B43/27
CPC Code(s): H10B43/35
Abstract: a memory device including the vertical stack structure includes a gate electrode, a resistance change layer, a channel between the gate electrode and the resistance change layer, and an island structure between the resistance change layer and the channel and in contact with the resistance change layer and the channel, and a gate insulating layer between the gate electrode and the channel.
Inventor(s): Sanghun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Sehee JANG of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C16/04, H01L23/528, H01L25/065, H10B41/27, H10B41/35, H10B41/40, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B43/40
Abstract: a nonvolatile memory device includes a peripheral circuit structure including a peripheral circuit and a first insulating structure covering the peripheral circuit and a cell array structure bonded to the peripheral circuit structure and including a cell region and a connection region, wherein the cell array structure includes a common source line layer, a buffer insulating layer on the common source line layer, a plurality of contact stop layers buried in the buffer insulating layer, a cell stack which includes a plurality of gate electrodes and a plurality of insulating layers alternately stacked on the buffer insulating layer, a plurality of cell channel structures extending to the common source line layer by passing through the cell stack, a plurality of contact structures each connected to one or more of the plurality of gate electrodes, and a second insulating structure covering the cell stack.
Inventor(s): Seonghun Jeong of Hwaseong-si (KR) for samsung electronics co., ltd., Byoungil Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Bosuk Kang of Seoul (KR) for samsung electronics co., ltd., Joonhee Lee of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/50, H01L21/768, H01L23/535, H10B41/27, H10B41/41, H10B41/50, H10B43/27, H10B43/40
CPC Code(s): H10B43/50
Abstract: a semiconductor device includes a peripheral circuit structure including a first substrate and circuit elements on the first substrate; and a memory cell structure including a second substrate on the first substrate, a first horizontal conductive layer on the second substrate, a second horizontal conductive layer on the first horizontal conductive layer, gate electrodes spaced apart from each other and stacked on the second horizontal conductive layer, channel structures penetrating through the gate electrodes, and separation regions penetrating the gate electrodes, extending, and spaced apart from each other. the semiconductor device has a through-wiring region including a through-contact plug electrically connecting the memory cell structure and the peripheral circuit structure, the separation regions include first separation regions adjacent to the through-contact plug, and the first separation regions penetrate through the second horizontal conductive layer and are spaced apart from the first horizontal conductive layer.
Inventor(s): Tae Jin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeong-Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Daiki MINAMI of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyerim HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K30/20, H10K39/00, H10K85/40, H10K85/60
CPC Code(s): H10K30/20
Abstract: provided are a photoelectric device, a light absorption sensor, a sensor-embedded display panel, and an electronic device. the photoelectric device includes a first electrode and a second electrode facing each other, and a light absorbing layer between the first electrode and the second electrode, wherein the light absorbing layer is configured to absorb light of a red wavelength spectrum, a green wavelength spectrum, a blue wavelength spectrum, an infrared wavelength spectrum, or any combination thereof, the light absorbing layer includes a p-type semiconductor and an n-type semiconductor, and the n-type semiconductor includes a compound represented by chemical formula 1. details for chemical formula 1 are as described in the detailed description.
Inventor(s): Kyuyoung Hwang of Anyang-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Seoul (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Aram Jeon of Seoul (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun Im of Seongnam-si (KR) for samsung electronics co., ltd., Byoungki Choi of Hwaseong-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/02, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K101/10
CPC Code(s): H10K85/342
Abstract: provided are an organometallic compound represented by formula 1, an organic light-emitting device including the same and an electronic apparatus including the organic light-emitting device:
Inventor(s): Kyuyoung Hwang of Anyang-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Seoul (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Aram Jeon of Seoul (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun Im of Seongnam-si (KR) for samsung electronics co., ltd., Byoungki Choi of Hwaseong-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/02, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K101/10
CPC Code(s): H10K85/342
Abstract:
m(l)(l) <formula 1>
Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd.
- A47L9/28
- A47L9/00
- CPC A47L9/2842
- Samsung electronics co., ltd.
- A61B5/00
- A61B5/145
- CPC A61B5/486
- A61B5/01
- A61B5/0531
- A61B5/318
- CPC A61B5/72
- A63B21/00
- A63B71/06
- CPC A63B21/00069
- A63F13/533
- A63F13/24
- A63F13/335
- A63F13/42
- CPC A63F13/533
- B01D46/00
- A61L9/20
- CPC B01D46/0004
- B23K3/06
- H05K3/34
- CPC B23K3/0623
- B24B53/017
- B24B37/005
- B24B37/04
- CPC B24B53/017
- C03C21/00
- H04M1/02
- CPC C03C21/002
- C07F15/00
- C09K11/06
- H10K50/11
- H10K50/15
- H10K50/16
- H10K85/30
- CPC C07F15/0033
- C23C16/02
- C23C16/44
- C23C16/448
- C23C16/52
- CPC C23C16/0245
- D06F39/02
- F16K15/06
- CPC D06F39/022
- D06F58/20
- D06F25/00
- D06F58/24
- F26B21/00
- CPC D06F58/203
- F21V5/00
- F21V19/00
- G01B11/24
- F21Y115/10
- CPC F21V5/00
- F24F1/36
- F24F1/0003
- CPC F24F1/36
- F25D17/06
- F25D11/02
- F25D23/06
- CPC F25D17/065
- F25D23/02
- CPC F25D23/028
- F25D29/00
- E05F15/73
- CPC F25D29/00
- G01B11/16
- CPC G01B11/16
- G01R31/3185
- G06F30/333
- CPC G01R31/318547
- G01R31/3187
- G01R31/317
- G06F1/10
- CPC G01R31/3187
- G02B27/00
- G02B27/01
- CPC G02B27/0093
- G03B21/20
- G03B21/14
- G03B21/56
- CPC G03B21/208
- G03F7/16
- G03F7/004
- G03F7/039
- G03F7/38
- CPC G03F7/168
- G03F7/00
- CPC G03F7/705
- G05B19/418
- CPC G05B19/41865
- G05F1/565
- G05F1/575
- CPC G05F1/565
- G06F3/0354
- H02J7/00
- H02J50/10
- H02J50/12
- H02J50/80
- H02J50/90
- CPC G06F3/03545
- G06F3/039
- G06F3/044
- G06F3/046
- G06F3/04886
- CPC G06F3/0393
- G06F3/06
- CPC G06F3/061
- CPC G06F3/0611
- G06F15/78
- G11C11/4096
- CPC G06F3/0631
- G06F11/10
- CPC G06F3/0658
- CPC G06F3/0659
- CPC G06F3/0665
- G06F3/14
- G06F3/01
- G06F21/84
- CPC G06F3/1431
- G06F7/544
- G11C11/418
- G11C11/419
- CPC G06F7/5443
- G06F9/4401
- CPC G06F9/4401
- G06F21/57
- CPC G06F9/4403
- G06F9/445
- G06F9/448
- CPC G06F9/44526
- G06F12/02
- CPC G06F12/02
- CPC G06F12/023
- G06F12/0877
- G06F12/0804
- CPC G06F12/0877
- G06F13/16
- G06F13/42
- G06F15/173
- H04L67/104
- H04L67/1097
- CPC G06F13/1673
- G06F13/40
- G06F11/07
- G11C5/14
- CPC G06F13/4022
- G06F17/16
- G06N20/00
- CPC G06F17/16
- G06F21/62
- CPC G06F21/6227
- G06F30/3308
- G06F30/31
- CPC G06F30/3308
- G06N3/04
- CPC G06N3/04
- G06N3/0464
- G06F11/00
- G06N3/08
- CPC G06N3/0464
- G06N3/048
- G06F17/17
- H04L9/00
- CPC G06N3/048
- G06N3/0495
- CPC G06N3/0495
- G06N3/065
- G06N3/049
- CPC G06N3/065
- G06F15/80
- CPC G06N3/08
- G06T3/00
- G06T3/40
- G06T5/00
- G06T15/06
- CPC G06T3/0093
- G06T5/50
- CPC G06T3/40
- G06T7/00
- G02B21/00
- G06T5/30
- G06T7/13
- CPC G06T7/0004
- G06T7/50
- G06T7/90
- G06V10/56
- CPC G06T7/50
- G06T9/00
- CPC G06T9/00
- G06T11/20
- G06T11/60
- G06V10/74
- CPC G06T11/203
- G06V10/44
- G06V40/16
- G06V40/20
- CPC G06V10/44
- G06V40/10
- G06V40/40
- CPC G06V40/107
- G08C17/02
- G06F3/041
- G06F3/0487
- CPC G08C17/02
- G09G3/00
- CPC G09G3/035
- G06F1/16
- G09G3/32
- H01L25/16
- H01L27/12
- CPC G09G3/32
- G09G3/34
- CPC G09G3/3426
- G09G5/10
- G06F3/16
- G06T7/60
- G06V20/52
- H04B17/27
- CPC G09G5/10
- G10L15/183
- G10L15/00
- CPC G10L15/183
- G10L15/22
- G10L15/19
- CPC G10L15/22
- G11B27/10
- G06F3/0482
- H04N23/63
- H04N23/661
- H04R1/10
- CPC G11B27/10
- G11C7/10
- CPC G11C7/1048
- G11C7/22
- CPC G11C7/222
- G11C11/4093
- H03K19/017
- CPC G11C11/4096
- G11C16/04
- H01L25/065
- H10B41/10
- H10B41/27
- H10B41/35
- H10B43/10
- H10B43/27
- H10B43/35
- H10B80/00
- CPC G11C16/0483
- G11C16/10
- G11C16/08
- G11C16/24
- G11C16/32
- CPC G11C16/10
- G11C29/12
- CPC G11C29/12005
- G11C29/14
- G11C29/42
- G11C29/46
- CPC G11C29/1201
- G11C29/44
- CPC G11C29/46
- H01J37/32
- H01J37/34
- CPC H01J37/3211
- H01L21/683
- CPC H01J37/32642
- H01L21/02
- C23C16/34
- C23C16/40
- C23C16/50
- C23C16/56
- H01L21/311
- CPC H01L21/02164
- H01L21/027
- H01L21/3213
- H01L21/66
- CPC H01L21/0273
- H01L21/67
- F16K3/02
- F16K3/18
- F16K3/314
- F16K51/02
- H01L21/677
- CPC H01L21/67126
- CPC H01L21/67138
- CPC H01L21/6715
- H01L33/50
- CPC H01L21/67271
- CPC H01L21/6833
- G01R31/28
- H03K3/03
- CPC H01L22/34
- H01L23/31
- H01L23/00
- H01L23/29
- CPC H01L23/3178
- H01L23/367
- H01L25/00
- H01L25/18
- CPC H01L23/3675
- H01L23/498
- H05K1/18
- CPC H01L23/49816
- H01L21/48
- H05K1/11
- H05K3/46
- CPC H01L23/49838
- H01L23/14
- CPC H01L23/49894
- H01L23/522
- CPC H01L23/5223
- H01L23/528
- CPC H01L23/5226
- H01L21/768
- CPC H01L23/5283
- H01L23/532
- CPC H01L23/5329
- H01L23/538
- CPC H01L23/5381
- H01L23/544
- H01L25/10
- CPC H01L23/544
- H01L23/552
- H01L21/56
- H01L23/053
- CPC H01L23/552
- CPC H01L23/562
- H01L23/48
- H01L27/146
- CPC H01L24/05
- CPC H01L24/13
- CPC H01L25/0657
- H01L27/092
- H01L21/822
- H01L21/8238
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- CPC H01L27/0922
- H01L27/118
- CPC H01L27/11807
- H01L25/075
- H01L33/48
- H01L33/62
- CPC H01L27/124
- H04N25/75
- H04N25/767
- H04N25/778
- H04N25/78
- CPC H01L27/14609
- CPC H01L27/1463
- H01G4/08
- CPC H01L28/40
- H01G4/33
- H01L29/51
- H01L29/94
- H10B12/00
- H01G4/008
- CPC H01L28/56
- H01G4/12
- H01L27/06
- CPC H01L28/75
- B82Y10/00
- H01L21/8234
- H01L21/84
- H01L27/088
- H01L29/08
- H01L29/10
- H01L29/16
- H01L29/161
- H01L29/165
- H01L29/49
- H01L29/78
- CPC H01L29/0692
- H01L29/15
- H01L29/20
- H01L29/778
- CPC H01L29/155
- CPC H01L29/4236
- H01L21/28
- H10B51/20
- H10B53/20
- CPC H01L29/516
- H01L29/786
- CPC H01L29/78618
- H01L33/60
- CPC H01L33/502
- CPC H01L33/62
- H01M4/583
- H01M4/04
- H01M4/70
- H01M10/0562
- CPC H01M4/583
- H01M50/358
- H01M50/183
- CPC H01M50/358
- H01P1/207
- H01P1/202
- H01P7/06
- CPC H01P1/207
- G01R31/367
- CPC H02J7/0047
- CPC H02J7/007182
- H03F1/02
- H03F3/24
- CPC H03F1/0238
- H04B1/00
- H01Q1/24
- H01Q5/50
- H01Q21/08
- H05K1/02
- H05K7/14
- CPC H04B1/0064
- H04B1/12
- H04B1/16
- CPC H04B1/12
- H04B7/06
- H04B17/336
- H04W72/1273
- H04W72/232
- CPC H04B7/0626
- CPC H04B17/336
- H04J3/06
- H04W8/24
- H04W56/00
- CPC H04J3/0667
- H04L5/00
- H04L25/02
- CPC H04L5/0048
- H04B1/30
- CPC H04L5/0098
- H04L27/26
- CPC H04L25/0222
- CPC H04L27/2636
- H04L47/34
- H04L47/36
- CPC H04L47/34
- H04L67/145
- H04W74/0833
- H04W76/10
- CPC H04L67/145
- H04N5/655
- H04N5/60
- H04N5/64
- H04N5/645
- H04R1/02
- CPC H04N5/655
- H04N9/89
- H04N5/77
- H04N9/802
- CPC H04N9/89
- H04N17/00
- H04N25/76
- CPC H04N17/002
- H04N19/433
- H04N19/182
- CPC H04N19/433
- H04N21/84
- H04N21/845
- CPC H04N21/84
- H04N23/54
- H04N23/55
- CPC H04N23/54
- H04N23/80
- H04N1/21
- H04N23/60
- H04N23/667
- H04N101/00
- CPC H04N23/80
- H04N25/11
- H04N23/56
- CPC H04N25/11
- H04N25/50
- H04N25/706
- CPC H04N25/50
- H04N25/709
- H04N25/77
- CPC H04N25/709
- H04W4/14
- H04W24/02
- CPC H04W4/14
- H04W4/40
- H04W72/543
- H04W72/566
- CPC H04W4/40
- H04W24/04
- H04W36/30
- H04W76/18
- H04W76/19
- CPC H04W24/02
- H04W24/10
- H04W88/04
- H04W92/18
- CPC H04W24/10
- H04W68/06
- H04W88/06
- H04W28/02
- H04W52/02
- H04W84/12
- CPC H04W28/0215
- H04W36/00
- CPC H04W36/0022
- CPC H04W36/0061
- H04W48/08
- H04W48/16
- H04W48/18
- H04W48/20
- CPC H04W36/0085
- H04W36/08
- H04W12/08
- H04W12/106
- CPC H04W36/08
- H04W36/38
- H04W12/033
- H04W60/00
- CPC H04W36/385
- H04W48/02
- CPC H04W48/18
- H04L69/327
- H04W60/04
- H04W80/10
- H04W76/30
- CPC H04W52/0225
- H04W52/14
- H04W52/24
- H04W72/1268
- CPC H04W52/146
- H04W52/36
- CPC H04W52/365
- H04L5/14
- H04W72/0446
- H04W72/231
- H04W52/40
- CPC H04W52/40
- H04W64/00
- H04W72/25
- CPC H04W64/006
- H04W68/02
- H04L12/18
- H04W76/27
- CPC H04W68/02
- H04W72/044
- H04W72/21
- CPC H04W72/1268
- H04W72/23
- H04B7/0452
- H04W72/04
- CPC H04W72/1273
- H04L1/1607
- CPC H04W72/21
- H04W72/0453
- CPC H04W72/23
- H04W74/00
- H04W74/08
- CPC H04W74/006
- H04W4/06
- H04W48/12
- CPC H04W74/0833
- H04W76/20
- CPC H04W76/19
- H04W76/28
- CPC H04W76/28
- H05B6/06
- H05B6/12
- H05B6/44
- CPC H05B6/065
- H05G2/00
- CPC H05G2/008
- CPC H10B12/00
- H01L21/764
- CPC H10B12/482
- CPC H10B12/50
- H10B43/40
- CPC H10B43/27
- CPC H10B43/35
- H10B41/40
- CPC H10B43/40
- H10B43/50
- H01L23/535
- H10B41/41
- H10B41/50
- CPC H10B43/50
- H10K30/20
- H10K39/00
- H10K85/40
- H10K85/60
- CPC H10K30/20
- C09K11/02
- H10K50/17
- H10K50/18
- H10K101/10
- CPC H10K85/342
