Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on January 30th, 2025
Samsung Electronics Co., Ltd.: 184 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (19), H01L23/498 (14), H01L25/065 (13), H01L27/146 (8), H10B80/00 (8) H04B7/0626 (3), H10B12/315 (2), H04W52/146 (2), H10B80/00 (2), H01L23/49811 (2)
With keywords such as: device, substrate, based, layer, region, configured, semiconductor, structure, electronic, and memory in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Samjong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Seho PARK of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon BAE of Suwon-si (KR) for samsung electronics co., ltd., Jiseob AN of Suwon-si (KR) for samsung electronics co., ltd., Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L5/30, A47L9/04, A47L9/24, H02J7/00
CPC Code(s): A47L9/2884
Abstract: a cordless vacuum cleaner is provided. the cordless vacuum cleaner includes a plurality of batteries and a method of controlling the same are provided. the cordless vacuum cleaner includes a main body, a suction fan, a suction motor arranged inside the main body and configured to rotate the suction fan, a charging circuit configured to charge the main body, a plurality of batteries charged and discharged through the charging circuit, memory storing one or more computer programs, and one or more processors communicatively coupled to the suction motor, the charging circuit, the plurality of batteries, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the cordless vacuum cleaner to, based on state information about each of the plurality of batteries, control discharge of each of the plurality of batteries, and the state information includes a battery discharge amount of each of the plurality of batteries.
20250031939. DISHWASHER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Johannes BÜSING of Suwon-si (KR) for samsung electronics co., ltd., Jisun YANG of Suwon-si (KR) for samsung electronics co., ltd., Seungyong YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/42
CPC Code(s): A47L15/4223
Abstract: the dishwasher may comprise: a tub forming a washing chamber; a spray unit for spraying water into the washing chamber; a sump to accommodate the water to be supplied to the spray unit; and a duct including a first body part, which extends along a first direction and is connectable to the spray unit, and a second body part, which extends from the first body part in a second direction and allows the water from the sump to be introduced. the duct can include: a first frame including a plurality of first coupling members aligned in the first direction and the second direction; a second frame including a plurality of second coupling members that can be coupled to the plurality of first coupling members; a guide path formed by the coupling of the first frame and the second frame; and a partition to partition the guide path into a plurality of sections.
Inventor(s): Rohan CHOUDHARY of Noida (IN) for samsung electronics co., ltd., Deepak SINGH of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): A61B5/024, A61B5/00, A61B5/11, G16H10/60, G16H40/67
CPC Code(s): A61B5/02433
Abstract: a method for adjusting heart rate measurement accuracy of a wearable device includes: obtaining, by a data module, a plurality of pieces of data including user activity data, user information, and environment conditions related to a user from a plurality of data sources; determining a skin attribute of the user based on the obtained plurality of pieces of data; emitting, by a transmitter module, infrared (ir) radiation and visible light at an intensity level for measuring a heart rate of the user; receiving, by a receiver module, scattered ir radiation resulting from interaction of the transmitted ir radiation and the transmitted visible light based on a skin condition of the user and the environment conditions; determining, by a correlation module, a scattered radiation vector based on the scattered ir radiation; determining, by a detection module, a wavelength of the visible light to be adjusted based on the scattered radiation vector; and adjusting, by the transmitter module, the wavelength of the visible light.
Inventor(s): Pyeonggook JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jungpil YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/11, G06F1/16
CPC Code(s): A61B5/1121
Abstract: a wearable device may measure a first joint angle of a user, measure a second joint angle of the user, generate a filter input based on a difference between first angle data obtained by measuring the first joint angle and second angle data obtained by measuring the second joint angle, perform filtering on the generated filter input through a filter so that a change timepoint of a torque rotation direction of a driving module of the wearable device corresponds to a peak timepoint of the generated filter input by delaying a phase of the generated filter input through the filter, generate a torque based on a filter output generated by the filtering, and provide the generated torque to the user.
Inventor(s): Choice CHOUDHARY of Tohana (IN) for samsung electronics co., ltd., Desh Deepak AGARWAL of Noida (IN) for samsung electronics co., ltd., Mangal SINGH of Chandigarh (IN) for samsung electronics co., ltd., Ankit AGARWAL of Ghaziabad (IN) for samsung electronics co., ltd., Sobita CHOUDHARY of Haryana (IN) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/0205, A61B5/11, A61B5/117, G16H20/00
CPC Code(s): A61B5/7282
Abstract: the disclosure relates to a system and a method for enhancing user experience of an electronic device during abnormal sensation in a user body. the method includes determining, by a detection module, a level of abnormal sensation in the user body, generating, by a prevention module, vibrations of required frequency in a wearable device and in the electronic device, and performing, by an event modulation module, one or more functions for enhancing the user experience of the electronic device.
Inventor(s): Sungcheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Keumjong BAE of Suwon-si (KR) for samsung electronics co., ltd., Jaeseung HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H3/00, A61H1/02
CPC Code(s): A61H3/00
Abstract: a wearable and reconfigurable motion assistance apparatus may include: a waist member including a support to be worn around a waist part of a user, a thigh belt to be worn around a thigh part of the user, an actuator connected to the waist belt and configured to generate power, a main frame including an upper frame connected to the actuator and a lower frame connected to the upper frame and configured to transmit the power to the thigh belt, an upper cover provided to be detachable from the upper frame, and a lower cover provided to be detachable from the lower frame.
Inventor(s): Yoonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Jeaguk SHIM of Suwon-si (KR) for samsung electronics co., ltd., Nagyeom YOO of Suwon-si (KR) for samsung electronics co., ltd., Sunghoon YIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A63B71/06
CPC Code(s): A63B24/0006
Abstract: according to an embodiment, a wearable electronic device may comprise a camera, a display, communication circuitry, and a processor. the processor may obtain a first image captured by an external electronic device from the external electronic device through the communication circuitry, the first image including an image captured for body portions of a user wearing the wearable electronic device, obtain exercise information about designated exercise postures using the body portions, obtaining a second image through the camera, based on identifying that the user's first body portion is positioned in a field of view (fov) area of the camera using the first image and the second image, display, through the display, a first virtual object indicating a first designated exercise posture related to the first body portion among the designated exercise postures on a first area of the second image corresponding to the user's first body portion, identify whether the first designated exercise posture matches a first posture of the first body portion of the user, display first feedback information to correct the first posture using the first virtual object, based on identifying that the first designated exercise posture does not match the first posture, and display second feedback information indicating that the first posture matches the first designated exercise posture using the first virtual object, based on identifying that the first designated exercise posture matches the first posture.
Inventor(s): Sanghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonyoung JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00
CPC Code(s): A63B24/0062
Abstract: a wearable device may include an actuator including a motor and/or circuitry, a sensor configured to generate motion data corresponding to a motion of a hand of a user, at least one processor configured to control the actuator, a cable connected to the actuator, and a body coupling component connected to the cable and connected or fixed to a body part of the user, wherein the processor is individually and/or collectively configured to estimate a position of the hand of the user based on the motion data corresponding to the motion of the hand of the user, determine a tension value to be applied to the cable at the position of the hand of the user based on the position of the hand of the user and a tension control model defined with respect to a surrounding space of the user, and control the actuator to generate tension at the determined tension value on the cable.
Inventor(s): Youngja KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunwon KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B23K3/08, B23K3/04, B23K101/40, H01L23/00
CPC Code(s): B23K3/085
Abstract: a solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated; a heater configured to heat the heat transfer fluid to generate saturated vapor; a substrate stage configured to be moved up and down within the vapor generating chamber and configured to support a substrate on which an electronic component is mounted via solder; a cleaning portion installed in an upper portion of the vapor generating chamber, wherein the cleaning portion is configured to spray a cleaning fluid onto the substrate on the substrate stage, wherein the cleaning fluid includes a material the same as the heat transfer fluid; and a guide structure configured to collect the cleaning fluid sprayed onto the substrate on the substrate stage and to direct the cleaning fluid to a reservoir that contains the heat transfer fluid.
20250033143. APPARATUS FOR SUBSTRATE DICING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Ju PARK of Suwon-si (KR) for samsung electronics co., ltd., Young Chul KWON of Suwon-si (KR) for samsung electronics co., ltd., Jae Heung LEE of Suwon-si (KR) for samsung electronics co., ltd., Nam-Tae HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B23K26/042, B23K26/03, B23K26/064, B23K26/53
CPC Code(s): B23K26/042
Abstract: an apparatus for substrate dicing includes: a laser beam emitter outputting a laser beam; a stage on which a test substrate is loaded, wherein the test substrate includes a sample substrate and a test film; a laser beam modulator modulating the laser beam to output a modulated beam; an optical system transferring the modulated beam into the sample substrate; a camera capturing the modulated beam that is reflected from the test film; and a controller generating a control signal based on at least one of a reaction point being formed in the test film or a shape of the reaction point of the test film being biased toward one side with respect to a central axis, wherein the laser beam modulator is configured to modulate the laser beam based on the control signal to output the modulated beam.
Inventor(s): Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Dohyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Suhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyujin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60R16/023, B60K35/22, H04L67/12, H04W4/48, H04W56/00
CPC Code(s): B60R16/023
Abstract: the present disclosure relates to a vehicle-mounted electronic device sharing content in a vehicle, a method of operating the electronic device, and a user terminal. according to an embodiment, the vehicle-mounted electronic device may include a communication module configured to communicate with two or more user terminals inside the vehicle. the vehicle-mounted electronic device may include a display module configured to display a shared user interface (ui) in response to a connection to the two or more user terminals. the vehicle-mounted electronic device may include a processor configured to receive content information to be shared from each of the two or more user terminals via the communication module. the vehicle-mounted electronic device may include the processor configured to synchronize the two or more user terminals such that they display the shared ui for displaying the content information and vehicle-related information at once.
20250033996. WATER PURIFIER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungha PARK of Suwon-si (KR) for samsung electronics co., ltd., Gimun GWAK of Suwon-si (KR) for samsung electronics co., ltd., Chulwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sujin SEONG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunjun CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C02F1/00, C02F103/00
CPC Code(s): C02F1/001
Abstract: provided is a water purifier including: a raw water flow path into which water flows from outside; a filter configured to filter the water introduced from the raw water flow path; a purified water flow path configured to discharge the water having passed through the filter; a drain flow path through the water discharged from the filter through the wastewater flow path is discharged; a resistance valve configured to reduce a flow rate of the drain flow path; a first connection flow path connecting the raw water flow path to a downstream side of the resistance valve on the drain flow path; a second connection flow path connecting the purified water flow path to an upstream side of the resistance valve on the drain flow path; and a tank arranged on the second connection flow path. during washing of the filter, the water stored in the tank flows into the filter via the upstream side of the resistance valve on the drain flow path, and the water flowing into and through the filter is discharged to the outside through the raw water flow path, the first connection flow path, and the downstream side of the resistance valve on the drain flow path.
Inventor(s): Guolian Wu of Saint Joseph MI (US) for samsung electronics co., ltd., Raveendran Vaidhyanathan of Rockaway NJ (US) for samsung electronics co., ltd., Kisup Lee of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06B1/02, D06B23/20
CPC Code(s): D06B1/02
Abstract: an apparatus includes a storage tank configured to store liquid carbon dioxide. the apparatus also includes a cabinet configured to seal an interior space. the apparatus further includes a nozzle configured to spray the liquid carbon dioxide from the storage tank into the sealed interior space of the cabinet such that the liquid carbon dioxide leaving the nozzle changes into a two-state flow. the apparatus may also include a carbon dioxide recovery system configured to draw gaseous carbon dioxide from the sealed interior space of the cabinet, convert the gaseous carbon dioxide into a liquid state, and return the carbon dioxide in the liquid state to the storage tank. the carbon dioxide recovery system may include at least one compressor configured to pressurize the gaseous carbon dioxide and at least one condenser configured to cool the pressurized carbon dioxide from the at least one compressor.
Inventor(s): Gieun LEE of Suwon-si (KR) for samsung electronics co., ltd., Mikyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/34, D06F34/32, H05K1/18
CPC Code(s): D06F34/34
Abstract: provided is a washing machine including a common mounting region allowed for a mechanical key and an electronic key to be mounted thereon includes a printed circuit board (pcb) used for a user interface panel. the pcb includes the common mounting region where the electronic key or the mechanical key is mounted, a first jumper connecting the common mounting region to ground, and a plurality of conductive planes to be coupled to terminals of the mechanical key.
Inventor(s): Minjoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Minku KOO of Suwon-si (KR) for samsung electronics co., ltd., Mira KIM of Suwon-si (KR) for samsung electronics co., ltd., Judai KIM of Suwon-si (KR) for samsung electronics co., ltd., Changwan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/22, D06F58/04, D06F105/60
CPC Code(s): D06F58/22
Abstract: a dryer includes a drum, an air blowing module configured to form an air flow to be brought into the drum, a filter configured to filter out foreign substances included in air discharged out of the drum in the air flow, an input/output interface, a memory to store at least one instruction, and at least one processor. the at least one processor is configured to execute the at least one instruction stored in the memory to determine whether the filter is separated and installed after a previous dry operation, increase a number of successive operation times based on a dry operation type of the dryer in response to the filter being not separated and installed, and control the input/output interface to provide a notification to guide separation of the filter from the dryer and cleaning of the separated filter from the dryer based on the number of successive operation times.
Inventor(s): Jihaeng HEO of Suwon-si (KR) for samsung electronics co., ltd., Seungwan YOO of Suwon-si (KR) for samsung electronics co., ltd., Minjoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Dohaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungeun CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Saebyeok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/45, D06F58/50, D06F105/24
CPC Code(s): D06F58/45
Abstract: a clothing dryer, and a method performed thereby, to identify the degree of clogging of a filter for collecting foreign substances generated according to a drying operation in a clothing dryer are provided. the clothing dryer includes a display, an expansion valve provided in a heat pump, and a controller identifying the degree of clogging of a filter.
Inventor(s): Sanggoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Bongjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggi KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunggu JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F16M11/04, F16M11/10
CPC Code(s): F16M11/041
Abstract: a connecting apparatus arrangeable to connect a display and a stand. the connecting apparatus includes a plurality of coupling protrusions arrangeable at the display, and a mounting unit connectable to the stand, the mounting unit including a plurality of hooks coupleable to the plurality of coupling protrusions, respectively, so that while the plurality of hooks of the mounting unit that is connected to the stand are coupled to the plurality of coupling protrusions which are arranged at the display, the display and the stand are connected to each other, and at least a number of hooks from among the plurality of hooks are moved along a first direction to couple to the plurality of coupling protrusions and are moved along a second direction opposite the first direction to decoupleable from the plurality of coupling protrusions.
Inventor(s): Su Myeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D21/00
CPC Code(s): F25D21/008
Abstract: a method performed by an electronic device, may include: receiving, from a refrigerator connected with the electronic device through a network, first information on the refrigerator, inputting, as input data, at least a portion of the first information to a prediction model for managing a defrosting period of the refrigerator, obtaining output data from the prediction model in response to the input data, predicting, based on the output data of the prediction model, an amount of frost in the refrigerator, and based on the predicted amount of the frost, transmitting second information for setting the defrosting period of the refrigerator to the refrigerator.
20250035370. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juno KWON of Suwon-si (KR) for samsung electronics co., ltd., Jin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Gahyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hocheol CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/12, F25D11/02, F25D23/02, F25D23/04, F25D29/00
CPC Code(s): F25D23/126
Abstract: a refrigerator including a main body having a storeroom, an inner door rotatably coupled to the main body and having a door opening, an outer door rotatably arranged in front of the inner door to open or close the door opening, a dispenser including a water-intake space and an operation lever and configured to supply water to the water-intake space by manipulation of the operation lever, and an automatic water supplier including a water container installation space formed to have a water container mounted and a water level sensor configured to detect a water level of the water container, and configured to supply water into the water container to fill the water container with a certain amount of water. the water-intake space and the water container installation space may be arranged in the door opening of the inner door to be accessed while the inner door is closed.
Inventor(s): Lahar GUPTA of New Delhi (IN) for samsung electronics co., ltd., Mangi Lal SHARMA of Tehsil Ratangarh (IN) for samsung electronics co., ltd.
IPC Code(s): G01C21/36
CPC Code(s): G01C21/3629
Abstract: a method performed by an electronic device for voice-based navigation, includes: determining a field of view (fov) of the user using one or more sensors associated with the electronic device; determining one or more points of interest (pois) with respect to the determined fov of the user, and generating a response for the voice-based navigation based on at least one of the one or more pois and the determined fov of the user.
Inventor(s): Jongwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Janghoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Heejun KWON of Suwon-si (KR) for samsung electronics co., ltd., Seohyeon PARK of Suwon-si (KR) for samsung electronics co., ltd., Daehee PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01D5/24, H04M1/72454
CPC Code(s): G01D5/24
Abstract: an electronic device is provided. the electronic device includes a grip sensor, memory storing one or more computer programs, one or more processors communicatively coupled to the grip sensor and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to adjust a capacitance of a capacitor in the grip sensor to change a voltage outputted from the grip sensor, based on a first capacitance stored in the memory, after the capacitance of the capacitor is adjusted to a second capacitance greater than the first capacitance, detect a grip on the electronic device using the voltage changed by the capacitor, based on identifying that the capacitance of the capacitor is decreased to a third capacitance smaller than the first capacitance, change the first capacitance stored in the memory to the third capacitance, and based on a number of the capacitance of the capacitor adjusted smaller than the second capacitance, change the first capacitance stored in the memory to the second capacitance.
20250035563. SEMICONDUCTOR MEASUREMENT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ryuju Sato of Yokohama (JP) for samsung electronics co., ltd., INGI KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/95, G01N21/88
CPC Code(s): G01N21/95
Abstract: a semiconductor measurement device includes a laser light source generating a fundamental wave having a first wavelength, an objective lens focusing the fundamental wave on a sample surface of a sample, a wavelength filter blocking reflected light corresponding to the fundamental wave that is reflected from the sample surface and transmitting signal light generated by irradiating the fundamental wave to the sample surface, and a first detection unit detecting the signal light passing through the wavelength filter. the first detection unit is located to detect the signal light generated from the sample surface and measures an intensity distribution of the signal light emitted in two or more different emission directions from the sample surface of the sample placed at a fixed position. the signal light includes nonlinear light generated from the sample surface irradiated by the fundamental wave and having a second wavelength which is different from the first wavelength.
20250035564. SUBSTRATE TEST METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sung-Il Choi of Suwon-si (KR) for samsung electronics co., ltd., Byeongkwan Song of Suwon-si (KR) for samsung electronics co., ltd., Chulmoo Kang of Suwon-si (KR) for samsung electronics co., ltd., Kang-Woong Ko of Suwon-si (KR) for samsung electronics co., ltd., Kyungbeom Kim of Suwon-si (KR) for samsung electronics co., ltd., Mira Park of Suwon-si (KR) for samsung electronics co., ltd., Yongseok Won of Suwon-si (KR) for samsung electronics co., ltd., Younsub Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoo Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G06T7/00, G06T7/13
CPC Code(s): G01N21/9503
Abstract: the present disclosure relates to substrate test methods. an example substrate test method comprises loading a substrate into a substrate test apparatus and testing the substrate in the substrate test apparatus. the step of testing the substrate includes testing a first region of the substrate, and testing a second region of the substrate after testing the first region. the step of testing the first region includes determining that the first region is aligned and irradiating light to the first region. the step of testing the second region includes determining that the second region is aligned and irradiating light to the second region.
Inventor(s): Jae Sung YOON of Seoul (KR) for samsung electronics co., ltd., Sug Bong CHOE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01R33/12, G01N27/04, G01N27/72, G01R27/16
CPC Code(s): G01R33/12
Abstract: a method and apparatus for measuring properties of a magnetic body are provided. the method includes applying a uniform magnetic field to generate a magnetic space; rotating a magnetic body in the magnetic space about a predetermined axis; measuring a first resistance value; measuring a second resistance value; and calculating a magnetic anisotropy constant of the magnetic body, based on the first and second resistance values, wherein the first resistance value is a measured resistance value of the magnetic body according to a magnetic field sweep in a direction of a magnetization hard axis of the magnetic body, and wherein the second resistance value is another measured resistance value of the magnetic body according to an angle of an external magnetic field, the angle of the external magnetic field being an angle formed by a magnetization easy axis of the magnetic body and a direction of the uniform magnetic field applied to the magnetic body.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G01S7/00, G01S13/42
CPC Code(s): G01S7/006
Abstract: methods and devices of a wireless system are provided. a first device of the wireless system receives a first set of sensing reference signals (rss) over beams from a second device, performs first beam measurements based on the first set of sensing rss, and transmits, to the second device, a first information report based on the beam measurements. the first information report includes a first type of sensing information. the first device also receives, from the second device, a second set of sensing rss, performs second beam measurements based on the second set of sensing rss, and transmits, to the second device, a second information report based on the second beam measurements. the second information report includes a second type of sensing information that is different from the first type of sensing information.
Inventor(s): Paboda Viduneth Ariyarathna BERUWAWELA PATHIRANAGE of San Diego CA (US) for samsung electronics co., ltd., Oren ELIEZER of San Diego CA (US) for samsung electronics co., ltd., Gennady FEYGIN of San Diego CA (US) for samsung electronics co., ltd., Wan Jong KIM of Tustin CA (US) for samsung electronics co., ltd., Pranav DAYAL of San Diego CA (US) for samsung electronics co., ltd., Bhupinder Singh Sachdev of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G01S13/04, G01S7/03
CPC Code(s): G01S13/04
Abstract: a system and a method are disclosed for proximity detection using a phased antenna array including multiple antenna elements. a method includes transmitting, via a first antenna element and a second antenna element among the multiple antenna elements, a transmission signal; determining, for the first antenna element, a first power of a first injected signal and a second power of a first reflected signal corresponding to the transmission signal; determining, for the second antenna element, a third power of a second injected signal and a fourth power of a second reflected signal corresponding to the transmission signal; calculating, for the first antenna element, a first power metric based on at least one of the first power of the first injected signal or the second power of the first reflected signal; calculating, for the second antenna element, a second power metric based on at least one of the third power of the second injected signal or the fourth power of the second reflected signal; comparing the first power metric with a first threshold value; comparing the second power metric with a second threshold value; and determining whether an object is detected within a proximity range of the phased antenna array, based on the comparison of at least one of the first power metric with the first threshold value or the second power metric with the second threshold value.
Inventor(s): Chanhyung YOO of Suwon-si (KR) for samsung electronics co., ltd., Byungkwon KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonsang PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongchoon HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B3/14, G02B27/00, G02B27/01, G02B27/09
CPC Code(s): G02B3/14
Abstract: according to an embodiment, a wearable electronic device may include a camera, a display, a lens assembly configured to focus or guide light beams representing visual information output from the display, the lens assembly including a first lens configured to adjust a refractive index by receiving an electrical signal, at least one processor and memory storing instructions. according to an embodiment, the instructions, when executed by the at least one processor, may cause the wearable electronic device to control the display to output the light beams representing the visual information through the lens assembly. according to an embodiment, the instructions, when executed by the at least one processor, may cause the wearable electronic device to adjust a refractive index of a first area of the first lens corresponding to a first distance from an edge of the first lens to reduce blur of a first object displayed based on the first light beams passing through the first area of the first lens corresponding to the first distance from the edge of the first lens. according to an embodiment, the instructions, when executed by the at least one processor, may cause the wearable electronic device to adjust the refractive index of the second area of the first lens to a second value corresponding to a second distance, which is longer than the first distance, from the edge of the first lens. various other embodiments may be possible.
Inventor(s): Chanhyung YOO of Suwon-si (KR) for samsung electronics co., ltd., Byungkwon KANG of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonsang PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongchoon HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01
CPC Code(s): G02B27/0172
Abstract: according to an embodiment of the disclosure, a wearable electronic device may be provided. the wearable electronic device may comprise a display member and a light output device including a polarizer. the display member may include a first lens, a second lens configured to transmit light of a first polarization state and refract light of a second polarization state, an optical waveguide disposed between the first lens and the second lens and configured to receive light output from the light output device and emit the light of the first polarization state toward the second lens, and a transparent display assembly including a transparent display disposed between the first lens and the optical waveguide and configured to output the light of the second polarization state toward the second lens.
Inventor(s): Sanghwa Woo of Suwon-si (KR) for samsung electronics co., ltd., Wooseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Bongkeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sanghwa Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36
CPC Code(s): G03F1/36
Abstract: provided is an optical proximity correction (opc) method including receiving a design layout for a target pattern to be formed on a substrate, obtaining a first opc pattern by performing a baseline opc on the design layout, and obtaining a second opc pattern by curving the first opc pattern.
Inventor(s): Yangsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Sukdong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1652
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing disposed to be movable with respect to the first housing, a rollable display inserted into the first housing or withdrawn from the first housing based on sliding-in or sliding-out of the second housing, a motor driving module disposed inside the first housing or the second housing and configured to move the second housing in a first direction or a second direction, communication circuitry, at least one processor, and memory storing instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to display a first screen in an exposed area of the rollable display, move the second housing in the second direction so that the exposed area of the rollable display is extended, display a shared screen shared with an external electronic device, in a first area corresponding to an exposed area before the rollable display is extended, of extended exposed area,, based on a user input received through the first screen, and transmit information, related to the shared screen, to the external electronic device through the communication module.
20250036169. FOLDABLE COMPUTING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chaoqun WEI of Suzhou (CN) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G09F9/30
CPC Code(s): G06F1/1681
Abstract: disclosed is a foldable computing device, comprising, a host case; a first enclosure pivotally coupled to the back side of the host case via a first hinge; a second enclosure pivotally coupled to the front side of the first enclosure via a second hinge; a flexible display panel attached to the first enclosure and the second enclosure; and a locking unit arranged between the first enclosure and the second enclosure, which is configured for locking the first enclosure and the second enclosure together after the second enclosure being opened from the first enclosure, or, unlocking the first enclosure and the second enclosure before the second enclosure being closed onto the first enclosure.
Inventor(s): Junhyeok SONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Backman KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangsik YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Wonku YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunghyun YOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Suhyun YOU of Gyeonggi-do (KR) for samsung electronics co., ltd., Seokho LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Hwanju JO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/169
Abstract: an electronic device according to an embodiment of the present disclosure may include: a housing including a first plate and a second plate, wherein the first plate includes an opening; a display panel at least partially exposed through the opening and including a touch sensor; a first support member coupled to the display panel and a portion of the first plate along at least part of one side of the opening; and a switch device configured to be actuated according to a depression of the display panel, the depression caused by a downward force exerted on an upper portion of the display panel. other various embodiments are also possible.
Inventor(s): Jongkil PARK of Suwon-si (KR) for samsung electronics co., ltd., Bonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Joseph AHN of Suwon-si (KR) for samsung electronics co., ltd., Hajoong YUN of Suwon-si (KR) for samsung electronics co., ltd., Hui JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/20
CPC Code(s): G06F1/203
Abstract: according to an embodiment of the disclosure, there may be provided an electronic device comprising: a housing forming an exterior of the electronic device, a printed circuit board on which at least one component is disposed, and a heat dissipation member contacting the at least one component or contacting the at least one component through a thermally conductive material, and including a first plate, a second plate and a wick. the wick may be disposed on a second plate inside the heat dissipation member and include a first portion and a second portion. the first portion may be thicker than the second portion.
Inventor(s): Kwangtaek WOO of Suwon-si (KR) for samsung electronics co., ltd., Jaeho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seonghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Changho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3212
CPC Code(s): G06F1/3212
Abstract: an electronic device including: a first housing; a second housing configured to be movable relative to the first housing; a first battery provided in the first housing; a second battery provided in the second housing; a memory; and at least one processor operatively connected to the first battery, the second battery, and the memory, wherein instructions, when executed by the at least one processor, cause the electronic device to: monitor a state of the first battery, a state of the second battery, and a state of the electronic device; determine whether or not the state of the first battery or the state of the second battery meets configured conditions; and determine a battery to be preferentially used as one of the first battery or the second battery, based on whether or not the state of the first battery or the state of the second battery meets the configured conditions.
Inventor(s): Kunhyung Kwon of Suwon-si (KR) for samsung electronics co., ltd., Kyounghwan Kwon of Suwon-si (KR) for samsung electronics co., ltd., Youngseob Choi of Suwon-si (KR) for samsung electronics co., ltd., Jonghan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/044, G06F3/14, G06F3/147
CPC Code(s): G06F3/0416
Abstract: an electronic device according to an example embodiment includes: a touch panel configured to sense a touch input; a display panel configured to output an image; a touch and display driver integration (tddi) configured to control the touch panel and the display panel; and an interface circuit for data interfacing with a host, wherein the tddi is configured to receive touch firmware data from the host via the interface circuit, and manage the touch firmware data by using at least one of a first volatile memory included in the interface circuit and the tddi.
20250036288. DETERMINING EXPOSURE TEMPERATURES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seohyun Shin of Suwon-si (KR) for samsung electronics co., ltd., Kyungduk Lee of Suwon-si (KR) for samsung electronics co., ltd., Sanghwa Jin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0616
Abstract: a method of providing an exposure temperature includes generating reference information indicating relationships between an exposure condition and a retention value, where the exposure condition include an exposure temperature and an exposure time of a nonvolatile memory device and the retention value indicates retention characteristic of the nonvolatile memory device, before a power-off time point when the nonvolatile memory device is powered-off, performing a monitoring program operation to write monitoring data in target memory cells included in the nonvolatile memory device, after a power-on time point when the nonvolatile memory device is powered on, generating a measured retention value by performing a monitoring read operation to read data from the target memory cells, and estimating, based on the reference information, a measured exposure temperature corresponding to the measured retention value and a measured exposure time between the power-off time point and the power-on time point.
Inventor(s): Kyunghan LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongsik HWANG of Suwon-si (KR) for samsung electronics co., ltd., Chon Yong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jae-Gon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/1009
CPC Code(s): G06F3/0619
Abstract: a memory device is provided. the memory device includes: a buffer memory; a nonvolatile backup memory; and a memory controller configured to: store map data corresponding to an external storage device in the buffer memory; provide, in response to a request from the external storage device, an address pair corresponding to the request, from among address pairs of the map data, to the external storage device; and back up, in response to a sudden power-off event, the map data to the nonvolatile backup memory.
Inventor(s): JAE-HOON CHOI of SUWON-SI (KR) for samsung electronics co., ltd., SANG-WAN NAM of SUWON-SI (KR) for samsung electronics co., ltd., SANGYONG YOON of SUWON-SI (KR) for samsung electronics co., ltd., KOOKHYUN CHO of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/064
Abstract: a memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. the first memory device includes a first one-time programmable (otp) block, the second memory device includes a second otp block different from the first otp block, and a horizontal distance from one side of the first memory device to the first otp block is different from a horizontal distance from one side of the second memory device to the second otp block.
Inventor(s): Cunbao CHANG of XiAn (CN) for samsung electronics co., ltd., Wenbin CAO of XiAn (CN) for samsung electronics co., ltd., Sha SHI of XiAn (CN) for samsung electronics co., ltd., Lijuan XUE of XiAn (CN) for samsung electronics co., ltd., Kunpeng SUN of XiAn (CN) for samsung electronics co., ltd., Ningning ZHU of XiAn (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: a method and device for data access, electronic apparatus and storage medium are provided. the method for data access includes: writing a key of a first key-value pair to a host memory in response to a write request to write the first key-value pair to the memory database; determining whether to write a value of the first key-value pair to the host memory or a computing express link (cxl) memory based on a length of the value of the first key-value pair; and writing the value of the first key-value pair to the host memory or the cxl memory, based on a result of the determination.
Inventor(s): Choonkyoung MOON of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Bokun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/01
CPC Code(s): G06F3/1423
Abstract: a wearable electronic device may include a camera, a display, and at least one processor operatively connected, directly or indirectly, to the camera, and the display, wherein the at least one processor may be configured to identify a displayable area corresponding to an external display included in an image of a space acquired through the camera, identify, based on at least a portion of the external display being excluded from the displayable area due to movement of the external display, a first area of the displayable area, in which a portion of the external display is disposed and a second area of the displayable area, which corresponds to a remaining area excluding the first area, and control the display to display a virtual screen on the second area.
Inventor(s): Mujun ZHANG of Guangzhou (CN) for samsung electronics co., ltd., Cao CHEN of Guangzhou (CN) for samsung electronics co., ltd., Jibin WU of Guangzhou (CN) for samsung electronics co., ltd., Zhongmin HUANG of Guangzhou (CN) for samsung electronics co., ltd., Xiaolong ZI of Guangzhou (CN) for samsung electronics co., ltd., Xihong LIU of Guangzhou (CN) for samsung electronics co., ltd., Kaiming CHEN of Guangzhou (CN) for samsung electronics co., ltd.
IPC Code(s): G06F11/07, G06F11/34
CPC Code(s): G06F11/0721
Abstract: a method of controlling an electronic apparatus for running at least one application is provided. the method includes obtaining feature data corresponding to a plurality of running applications, wherein the feature data comprises current system state data and running state data corresponding to the at least one application, identifying a target abnormal application based on the feature data corresponding to the plurality of the running applications, obtaining interactive data corresponding to a plurality of call actions of the target abnormal application within a preset duration, identifying a target abnormal call action based on the interactive data corresponding to the plurality of the call actions, and performing call restriction on the target abnormal call action based on monitoring the target abnormal call action.
Inventor(s): Jinsoo Lim of Suwon-si (KR) for samsung electronics co., ltd., Changkyu Seol of Suwon-si (KR) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Daewook Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongjin Park of Suwon-si (KR) for samsung electronics co., ltd., Hyoungbae Ahn of Suwon-si (KR) for samsung electronics co., ltd., Youngdon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/1004
Abstract: an electronic device may include a reception circuit configured to generate a plurality of reception data bits based on a voltage level of an analog signal received through a link, and to generate a plurality of bit reliability values indicating probabilities of error occurrence of the plurality of reception data bits based on the voltage level of the analog signal, an alignment circuit configured to group the plurality of reception data bits into a plurality of error correction code (ecc) symbols, and to generate a plurality of symbol reliability values indicating probabilities of error occurrence of the plurality of ecc symbols based on the plurality of bit reliability values, and a decoding circuit configured to correct errors of the plurality of ecc symbols based on the plurality of symbol reliability values.
Inventor(s): Myungkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Seongmuk Kang of Suwon-si (KR) for samsung electronics co., ltd., Jae-Gon Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyomin Sohn of Suwon-si (KR) for samsung electronics co., ltd., Yeonggeol Song of Suwon-si (KR) for samsung electronics co., ltd., Kijun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/1008
Abstract: an example cxl (compute express link)-based memory module includes a memory device and a controller. the memory device includes a plurality of volatile memory cells and stores data or reads the stored data. the controller communicates with a host device through a cxl interface and controls the memory device. the controller includes an error correction code (ecc) circuit that generates a first codeword by adding a parity vector generated based on reed-solomon encoding to data received from the host device, an error injecting circuit that generates an error symbol and generates a second codeword by injecting the error symbol into at least a portion of the first codeword, and a memory device interface that controls the memory device such that the second codeword where the error symbol is injected is stored in the memory device. the controller determines a number of error symbols to be injected into the second codeword.
Inventor(s): Dimin NIU of Sunnyvale CA (US) for samsung electronics co., ltd., Mu-Tien CHANG of Santa Clara CA (US) for samsung electronics co., ltd., Hongzhong ZHENG of Los Gatos CA (US) for samsung electronics co., ltd., Sun Young LIM of Hwasung-City (KR) for samsung electronics co., ltd., Indong KIM of Hwasung-City (KR) for samsung electronics co., ltd., Jangseok CHOI of Campbell CA (US) for samsung electronics co., ltd., Craig HANSON of Champlin MN (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F13/40, G06F13/42
CPC Code(s): G06F13/1673
Abstract: a memory module that includes a non-volatile memory and an asynchronous memory interface to interface with a memory controller is presented. the asynchronous memory interface may use repurposed pins of a double data rate (ddr) memory channel to send an asynchronous data to the memory controller. the asynchronous data may be device feedback indicating a status of the non-volatile memory.
Inventor(s): BYUNGTAK LEE of Jeju-si (KR) for samsung electronics co., ltd., HEE-SEONG LEE of Siheung-si (KR) for samsung electronics co., ltd., MYUNGKYOON YIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/362, G06F13/40
CPC Code(s): G06F13/362
Abstract: a system-on-chip including: a first slave having a first safety level; a second slave having a second safety level; a first master having a third safety level, the first master outputs a first access request for the first slave and a second access request for the second slave; a safety function protection controller that outputs first attribute information corresponding to the first safety level, second attribute information corresponding to the second safety level, and third attribute information corresponding to the third safety level; and an interconnect bus that receives the first, second and third attribute information, transfers the first access request to the first slave when it is determined that the third safety level is higher than or equal to the first safety level, and blocks the second access request when it is determined that the third safety level is lower than the second safety level.
Inventor(s): Krishna Teja MALLADI of San Jose CA (US) for samsung electronics co., ltd., Andrew CHANG of Los Altos CA (US) for samsung electronics co., ltd., Byung Hee CHOI of Fremont CA (US) for samsung electronics co., ltd., Ehsan M. NAJAFABADI of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/40, G06F3/06, G06F9/4401, G06F12/0802, G06F12/0808, G06F12/1045, G06F13/16, G06F13/28, G06F13/42, G06F15/173, H04L49/351, H04L49/45
CPC Code(s): G06F13/4027
Abstract: a system and method for managing memory resources. in some embodiments, the system includes a stored-program processing circuit, a network interface circuit, a cache-coherent switch, and a first memory module. in some embodiments, the first memory module is connected to the cache-coherent switch, the cache-coherent switch is connected to the network interface circuit, and the stored-program processing circuit is connected to the cache-coherent switch.
Inventor(s): Dmytro PROGONOV of Kyiv (UA) for samsung electronics co., ltd., Andrii ASTRAKHANTSEV of Kyiv (UA) for samsung electronics co., ltd., Oleksandra SOKOL of Kyiv (UA) for samsung electronics co., ltd., Dmytro DEGTIAROV of Kyiv (UA) for samsung electronics co., ltd., Heorhii NAUMENKO of Kyiv (UA) for samsung electronics co., ltd., Ivan SHAPOVAL of Kyiv (UA) for samsung electronics co., ltd., Kyrylo ROMANII of Kyiv (UA) for samsung electronics co., ltd., Maksym ZEMLIANOI of Kyiv (UA) for samsung electronics co., ltd., Viacheslav DERKACH of Kyiv (UA) for samsung electronics co., ltd., Yevgen ROMANKO of Kyiv (UA) for samsung electronics co., ltd.
IPC Code(s): G06F21/32
CPC Code(s): G06F21/32
Abstract: an electronic device and a method of controlling the electronic device are provided. the electronic device includes at least one motion sensor, at least one biometric sensor, memory storing one or more computer programs, and one or more processors communicatively coupled to the at least one motion sensor, the at least one biometric sensor, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors cause the electronic device to, based on receiving a request for user authentication, acquire a first signal through the at least one motion sensor, and acquire a second signal through the at least one biometric sensor, acquire motion information indicating a type of a user's motion based on the first signal, acquire biometric information indicating a biometric feature of a user according to the motion of the user based on the second signal, and input the motion information and the biometric information into a user authentication model, and perform the user authentication according to whether the type of the motion and the biometric feature match authentication information.
Inventor(s): Maksim Alekseevich VILENSKII of Moscow (RU) for samsung electronics co., ltd., Oleg Vladimirovich OGURTSOV of Moscow district (RU) for samsung electronics co., ltd., Artem Aleksandrovich LUKANIN of Moscow district (RU) for samsung electronics co., ltd., Vitaly Andreevich CHEREPANOV of Perm district (RU) for samsung electronics co., ltd., Aleksander Vladimirovich BORZILOV of Moscow (RU) for samsung electronics co., ltd., Vladimir Alekseevich EREMEEV of Moscow (RU) for samsung electronics co., ltd., Jonghyun HO of Suwon-si (KR) for samsung electronics co., ltd., Unkyu PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/13, G06F30/27
CPC Code(s): G06F30/13
Abstract: the disclosure relates to robotics, computer vision, scanning of three-dimensional (3d) objects, navigation, and, in particular, to a method and device for generating output data of a virtual sensor. a technical result is to increase the accuracy of matching the generated output data of the virtual sensor with the output data of the particular real sensor. a method for generating output data of the virtual sensor is provided. the method includes simulating a three-dimensional (3d) virtual space corresponding to a real space, objects having object parameters and the virtual sensor in the simulated 3d virtual space, defining environment conditions of the simulated objects and relative position of the simulated objects in the simulated 3d virtual space and generating the output data of the virtual sensor based on the simulated virtual sensor.
Inventor(s): Joon-Woo LEE of Seoul (KR) for samsung electronics co., ltd., Junghyun LEE of Seoul (KR) for samsung electronics co., ltd., Yongjune KIM of Pohang-si (KR) for samsung electronics co., ltd., Young-Sik KIM of Gwangju (KR) for samsung electronics co., ltd., Jong-Seon NO of Seoul (KR) for samsung electronics co., ltd., Eunsang LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/048, G06F11/07, G06F17/17
CPC Code(s): G06N3/048
Abstract: an operation method of performing a neural network operation of fully homomorphic encrypted data is provided. the operation method includes: receiving data for performing the neural network operation and receiving a parameter for generating an approximation polynomial corresponding to the neural network operation; obtaining layer information corresponding to layers of a neural network model, the layer information based on the data; determining importances of the layers, respectively, wherein the determining of the importances is based on the parameter and the layer information; generating an approximation polynomial approximating the neural network operation for each of the layers, wherein the generating is based on the layer importance; and generating an operation result by performing the neural network operation based on the approximation polynomial, wherein the parameter includes a computation time condition that the neural network operation must satisfy.
Inventor(s): Yongjune KIM of Pohang-si (KR) for samsung electronics co., ltd., Junghyun LEE of Seoul (KR) for samsung electronics co., ltd., Young-Sik KIM of Gwangju (KR) for samsung electronics co., ltd., Jong-Seon NO of Seoul (KR) for samsung electronics co., ltd., Jiheon WOO of Pohang-si (KR) for samsung electronics co., ltd., Eunsang LEE of Seoul (KR) for samsung electronics co., ltd., Joon-Woo LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08, G06N3/04, H04L9/00
CPC Code(s): G06N3/08
Abstract: a processor-implemented method includes receiving data for performing a neural network operation of homomorphic encrypted data and a parameter for generating an approximate polynomial corresponding to the neural network operation, obtaining layer information corresponding to each of a plurality of layers configuring a neural network based on the data, determining layer importance corresponding to each of the plurality of layers, based on the parameter and the layer information, generating an approximate polynomial approximating the neural network operation for each of the plurality of layers, based on the layer importance, and generating an operation result by performing the neural network operation based on the approximate polynomial.
Inventor(s): Devendra Kumar Jangid of Goleta CA (US) for samsung electronics co., ltd., Abhiram Gnanasambandam of Frisco TX (US) for samsung electronics co., ltd., John W. Glotzbach of Allen TX (US) for samsung electronics co., ltd., John Seokjun Lee of Allen TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, H04N23/80, H04N23/84
CPC Code(s): G06T3/4053
Abstract: a method includes extracting multiple shallow features from a low-resolution image using a shallow feature extractor that includes a quaternion convolutional network. the method also includes extracting multiple deep features from the multiple shallow features using a deep feature extractor that includes multiple quaternion residual distillation blocks (qrdbs), where each qrdb includes a quaternion self-attention module. the method further includes reconstructing the multiple deep features into a high-resolution image. each qrdb may further include a quaternion gated deconvolutional feed forward network (qgdfn) configured to suppress one or more of the multiple deep features.
Inventor(s): Siddharth Deepak ROHEDA of Bangalore (IN) for samsung electronics co., ltd., Amit Satish UNDE of Bangalore (IN) for samsung electronics co., ltd., Alok Shankarlal SHUKLA of Bangalore (IN) for samsung electronics co., ltd., Rishikesh JHA of Bangalore (IN) for samsung electronics co., ltd., Soohyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Shashavali DOODEKULA of Bangalore (IN) for samsung electronics co., ltd., Sai Kumar Reddy MANNE of Bangalore (IN) for samsung electronics co., ltd., Saikat Kumar DAS of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06T5/73
CPC Code(s): G06T5/73
Abstract: a method of detecting blur in an input image, the method including: detecting one or more candidate blur regions of a plurality of regions in the input image; determining, a first confidence score of the one or more candidate blur regions in the input image; determining a second confidence score of a global blur in the input image; determining a third confidence score of an intentional blur in the input image; and detecting a type of blur and a strength of the type of blur in the input image based on the first confidence score of the one or more candidate blur regions, the second confidence score of the global blur, and the third confidence score of the intentional blur.
Inventor(s): Gunawath Dilshan Godaliyadda of Allen TX (US) for samsung electronics co., ltd., Tyler Luu of Richardson TX (US) for samsung electronics co., ltd., John W. Glotzbach of Allen TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/00
CPC Code(s): G06T5/75
Abstract: a method includes obtaining, using at least one processing device of an electronic device, an input image containing blur. the method also includes generating, using the at least one processing device, an edge enhancement mask and a gain mask based on the input image. the method further includes generating, using the at least one processing device, a halo-suppressed edge mask based on the edge enhancement mask and the gain mask. in addition, the method includes generating, using the at least one processing device, a sharpened image based on the input image and the halo-suppressed edge mask.
Inventor(s): Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeaguk SHIM of Suwon-si (KR) for samsung electronics co., ltd., Nagyeom YOO of Suwon-si (KR) for samsung electronics co., ltd., Yonggu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunghoon YIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06V10/25
CPC Code(s): G06T17/00
Abstract: a wearable electronic device is provided. the wearable electronic device includes at least one sensor, a display, and at least one processor including processing circuitry, and memory storing instructions that, when executed by the at least one processor, cause the wearable electronic device to detect a plurality of objects included in a first field of view (fov), capable of detecting through the at least one sensor, of the wearable electronic device, recognize a type of a first object among the plurality of objects, identify whether the first object is a real object or a virtual object, determine a first risk level of the first object, based on the recognized type of the first object and whether the first object is the real object or the virtual object, determine a first distance related to the first object, based on the first risk level of the first object, and provide feedback based on the first risk level of the first object, based on the distance between the first object and a user's body being less than or equal to the first distance.
Inventor(s): Hungi PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Miji PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd., Sangyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/01, G06F3/14
CPC Code(s): G06T19/006
Abstract: a head-mounted device may comprise: a display; memory comprising storage media storing instructions; and at least one processor comprising processing circuitry, wherein the instructions, when executed by the at least one processor individually or collectively, cause the head-mounted device to: provide content corresponding to a first space through the display based on a first safety zone corresponding to the first space; based on obtaining a request related to content corresponding to a second space, identify whether an execution condition of the second space is satisfied based on the first safety zone; display at least one affordance, related to a second safety zone corresponding to the second space, through the display based on the execution condition of the second space being not satisfied; and based on an input corresponding to the at least one affordance, provide the content corresponding to the second space, through the display, based on the second safety zone.
Inventor(s): Miji PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hungi PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd., Sangyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiwoo LEE of Suwon-si (JP) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06T19/20
CPC Code(s): G06T19/006
Abstract: an electronic device may be configured to obtain a real space image using a camera, identify an external object from the obtained real space image, determine an object of interest among the identified external object based on a focus mode of the electronic device, and arrange a virtual object corresponding to the determined object of interest in a virtual space.
Inventor(s): Eunbin LEE of Suwon-si (KR) for samsung electronics co., ltd., Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Eunyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Stephanie AHN of Suwon-si (KR) for samsung electronics co., ltd., Bona LEE of Suwon-si (KR) for samsung electronics co., ltd., Miyeoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/20, G06F3/01, G06F3/02
CPC Code(s): G06T19/20
Abstract: according to an embodiment, a processor of a wearable device displays a virtual object superimposed on a virtual space by using a display. the processor receives an input for rotating a dial in a first direction while the superimposed virtual object is displayed in the virtual space. while the input is maintained, the processor reduces a first area in which the virtual space is displayed. while the input is maintained, the processor maintains a size of the virtual object that is superimposed on the virtual space and is displayed inside of the first area reduced while the input is maintained. while the input is maintained, the processor expands a second area including the image that is further displayed on the display in response to the input.
Inventor(s): Hyunsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sungjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Inhak NA of Suwon-si (KR) for samsung electronics co., ltd., Myungjin EOM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/50, G06F18/20, G06F18/2431, G06V10/70, G06V10/764, G06V10/94, G06V20/64
CPC Code(s): G06V20/50
Abstract: a method of performing object recognition is performed by an electronic device and includes obtaining a spatial map of a space, using a first recognition model, recognizing one or more objects in the space, to obtain first object information of the objects, and dividing the space into a plurality of subset spaces, based on the obtained spatial map and the obtained first object information. the method further includes determining at least one second recognition model to be allocated to each of the plurality of subset spaces into which the space is divided, based on characteristic information of each of the plurality of subset spaces, and using the determined at least one second recognition model allocated to each of the plurality of subset spaces, performing object recognition on each of the plurality of subset spaces, to obtain second object information.
Inventor(s): Do Hyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/58, G06V10/22, G06V10/26, G06V10/776, G06V10/82, G06V10/98
CPC Code(s): G06V20/58
Abstract: a vehicle control system comprises an image signal processor (isp), a first neural processing unit (npu), a second npu, a data processing circuit, and sensors mounted on a vehicle. the isp receives a first image and processes it to generate a second image. the first npu and the second npu both independently segment the second image to identify a type of the object and produce data related to the object. the data processing circuit receives data from both npus and sensor data from the sensors and determines whether either of the first npu or the second npu is abnormal by comparing correlations between the npu data and the sensor data during a first frame interval.
Inventor(s): Choonkyoung MOON of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Bokun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/59, G06F1/16, G06F3/01, G06V40/20
CPC Code(s): G06V20/597
Abstract: according to an embodiment, a wearable electronic device may include a camera, a display, communication circuitry, and a processor, wherein the processor may establish a communication connection with a control device included in a vehicle through the communication circuitry, identify the state of a user in the vehicle through the camera, identify a driving state of the vehicle, determine at least one area for identifying a gesture of the user, based on at least one of the state of the user or the driving state, and execute a first function corresponding to a first gesture among at least one function, based on identifying the first gesture of the user in the at least one area.
Inventor(s): Jinwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Bumjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongcheon SUN of Suwon-si (KR) for samsung electronics co., ltd., Suyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeongcheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/69, G06T7/00, G06V10/764
CPC Code(s): G06V20/698
Abstract: a method of generating a defect classification model includes preparing a sample wafer that has undergone at least one unit of a manufacturing process, capturing, using an electronic device, a plurality of primary images of different locations of the sample wafer, obtaining a plurality of secondary images based on the capturing of the plurality of primary images, detecting a plurality of defect images including a defect from among the plurality of primary images and the plurality of secondary images, classifying and labeling at least one of the plurality of defect images as defect data, and generating an automatic defect classification model based on the defect data.
Inventor(s): Chirag GARG of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): G08B3/10, H04S7/00
CPC Code(s): G08B3/1008
Abstract: the disclosure relates to a method for providing an environmental audio alert on a personal audio device. the method includes: determining head direction of a user in an environment in a time frame. the method includes detecting an audio event occurring in the environment in the time frame. the method includes determining direction of a source of the detected audio event. the method includes localizing a sound source with respect to the determined head direction of the user for generating a spatial binaural audio alert and providing the generated spatial binaural audio alert on the personal audio device.
Inventor(s): Young KIM of Yongin-si (KR) for samsung electronics co., ltd., Geunwoo KO of Yongin-si (KR) for samsung electronics co., ltd., Minsu KIM of Ansan-si (KR) for samsung electronics co., ltd., Geeyoung SUNG of Daegu (KR) for samsung electronics co., ltd., Dongyeoul LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangbum LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Jonghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongseok LEE of Seoul (KR) for samsung electronics co., ltd., Punjae CHOI of Yongin-si (KR) for samsung electronics co., ltd., Jong-Young HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G02B30/34, G03H1/22, G09G3/32
CPC Code(s): G09G3/001
Abstract: a three-dimensional holographic display device includes a light emitting diode (led) array including a plurality of light sources controlled to sequentially output light according to a preset pattern, a lens configured to refract light incident from the led array, a spatial light modulator (slm) configured to modulate light incident from the lens, and a processor configured to generate a plurality of holographic signals each comprising depth information adjusted according to an arrangement location of each of the plurality of light sources, and for each of the plurality of light sources, control the slm to modulate the light based on a holographic signal corresponding to the light source.
Inventor(s): Jinkyo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Joonhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangeun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06F3/0482, G06F3/0485, G06F3/0488, G06F9/451
CPC Code(s): G09G3/035
Abstract: an electronic apparatus is provided. the electronic apparatus includes at least one housing which may have a plurality of states, at least one display, and at least one processor. the at least one processor is set to display a first execution screen of at least one application on a first display area of the at least one display when the at least one housing is in a first state, wherein the first display area corresponds to the first state, identify the transition of the at least one housing from the first state to a second state, display a first screen, which includes at least one graphic object, on the second display area when a first condition is satisfied, wherein the first screen is displayed on the basis of the transition of the at least one housing from the first state to the second state, and display a second execution screen of a first application on at least a portion of the second display region in response to a first input to a first graphic object, corresponding to the first application, among the one or more graphic objects.
Inventor(s): Minsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung-Hoon BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20
CPC Code(s): G09G3/2007
Abstract: a driving device of a display panel includes a reference voltage generator, a capacitor circuit, and a gamma voltage generator. the reference voltage generator is configured to generate a maximum gamma voltage and a minimum gamma voltage. the capacitor circuit is configured to, response to receiving the first driving voltage, charge a first charge based on a voltage difference between a first driving voltage and the maximum gamma voltage and charge a second charge based on a voltage difference between the first driving voltage and the minimum gamma voltage. the capacitor circuit is configured to, in response to receiving a second driving voltage, output a first gamma reference voltage and a second gamma reference voltage. the gamma voltage generator is configured to generate a plurality of gamma voltages based on the first gamma reference voltage and the second gamma reference voltage.
Inventor(s): Hyunjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghwy KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongkon BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3258, G09G3/20
CPC Code(s): G09G3/3258
Abstract: the disclosure relates to an electronic device and a method for swapping a gamma voltage for discharging of pixels during a repair operation of a display panel. the method includes determining whether a display is in at least one prespecified abnormal state, and performing a display recovery operation, based on determining that the display is in the abnormal state, the display recovery operation including an operation of transitioning the display from an on state to an off state, and an operation of transitioning the display from the off state to the on state, wherein a device driver integrated circuit (ic) (ddi) is controlled to supply a discharge voltage for discharging the voltage of designated nodes included in a plurality of pixels, to a data line of the display before the display transitions from the off state to the on state.
Inventor(s): Kwanghyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/14, G06F3/0362, G09G3/00
CPC Code(s): G09G5/14
Abstract: a processor of an electronic device may be configured to display a first window having a first size via a display area of a flexible display of the electronic device. the processor may be configured to, while the first window having the first size is being displayed, identify a change in an angle between a first housing of the electronic device and a second housing of the electronic device via at least one sensor of the electronic device, wherein the change in the angle is greater than a threshold angle. the processor may be configured to maintain the display of the first window having the first size on the basis of the change in the angle performed for a first time period which is equal to a reference time or longer than the reference time. the processor may be configured to display, via the display area, the first window having a second size smaller than the first size and a second window related to the first window, on the basis of the change in the angle performed for a second time period which is shorter than the reference time.
Inventor(s): Vikas YADAV of San Jose CA (US) for samsung electronics co., ltd., Zheng TANG of Mountain View CA (US) for samsung electronics co., ltd., Vijay SRINIVASAN of San Jose CA (US) for samsung electronics co., ltd., Hongxia JIN of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): G10L15/18
CPC Code(s): G10L15/1815
Abstract: a method of interpreting a verbal input, may include: assigning a meaning classification to the verbal input, and a confidence score to the meaning classification; and based on the confidence score corresponding to the meaning classification of the verbal input being less than or equal to a threshold, generating at least one paraphrase of the verbal input using at least one large language model (llm); assigning the meaning classification to the at least one paraphrase, and the confidence score to the meaning classification; and concatenating the verbal input, the at least one paraphrase, the meaning classification, and the confidence score to generate a concatenated input; inputting the concatenated input into the at least one llm.
Inventor(s): TAEYOUNG OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4093, G11C7/10, G11C11/4076, H01L23/48, H03K19/0175, H10B80/00
CPC Code(s): G11C11/4093
Abstract: a semiconductor die includes a first pin configured to output a first on-die termination (odt) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second odt circuits each having an odt that is responsive to the first odt control signal; and a second pin configured to receive a second odt control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first odt circuits each having an odt that is responsive to the second odt control signal.
Inventor(s): Hyojin Ahn of Suwon-si (KR) for samsung electronics co., ltd., Seoyeong Lee of Suwon-si (KR) for samsung electronics co., ltd., Jungho Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungjun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C16/26
CPC Code(s): G11C16/3459
Abstract: according to the inventive concept, a memory device may receive a pass voltage signal set in advance from a host and perform a verification operation with respect to a memory cell array based on the received pass voltage signal. the memory device includes an aggressor word line on which a read operation is performed, and a memory block including a victim word line adjacent to the aggressor word line, and a change in a read voltage with respect to the memory block is recorded and the recorded change in the read voltage is sent to the host.
Inventor(s): Sangsoo Cha of Suwon-si (KR) for samsung electronics co., ltd., Minjeong Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12
CPC Code(s): G11C29/1201
Abstract: a memory controller includes a health grade determining circuit to determine a health grade of a memory block based on a combination of an error detecting result of data read from at least one page of the block and block information related to a degree of degradation of the block, and an io ratio setting circuit. the io ratio setting circuit sets, according to the determined health grade, an io ratio between a host io operation and an internal io operation. the host io operation exchanges data with the memory device in response to a request from a host and the internal io operation exchanges data with the memory device in relation to a background operation. the memory controller performs the host io operation and the internal io operation with the memory device according to the set io ratio during a period in which the background operation is performed.
20250038018. TAPE TRANSFER DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jwa Hyeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67
CPC Code(s): H01L21/67132
Abstract: a tape transfer device includes a moving part configured to move in a first direction, a screw passing through the moving part and extends in the first direction, a push plate spaced apart from the moving part in a second direction that intersects the first direction, a connecting part connecting the push plate and the moving part, and extending in the second direction, a columnar shaft passing through the push plate, and extending in the first direction, and a clamp on at least a part of a surface of the shaft and configured to protrude from and/or retreat from at least a part of the surface of the shaft.
20250038064. CHIP-ON-FILM PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minwoo Cho of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/373, H01L23/00, H01L23/498
CPC Code(s): H01L23/3735
Abstract: the present disclosure relates to chip-on-film packages. an example chip-on-film package comprises a base film including a first surface and a second surface opposite to the first surface. the base film includes a protection layer adjacent to the first surface, a film substrate adjacent to the second surface, a plurality of lead lines between the film substrate and the protection layer, and a bonding layer between the plurality of lead lines and the protection layer. the chip-on-film package includes a semiconductor chip adjacent to the first surface, and a mold layer that covers a top surface and a lateral surface of the semiconductor chip. the first surface includes a circuit surface on which the semiconductor chip is disposed and a thermal conductive surface that faces the circuit surface when the base film is bent. the thermal conductive surface is in direct contact with a top surface of the mold layer.
20250038080. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunsu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/18, H10B80/00
CPC Code(s): H01L23/49811
Abstract: provided is a semiconductor package including a first substrate, a first semiconductor package on the first substrate and including a first semiconductor chip, and a second semiconductor package on the first substrate spaced apart from the first semiconductor package in a horizontal direction, and including one or more semiconductor chips and a molding layer on the one or more semiconductor chips, wherein the molding layer includes a molding member and one or more dummy posts extending into the molding member in a vertical direction and configured to be electrically insulated.
Inventor(s): Jongho PARK of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Seonghoon BAE of Suwon-si (KR) for samsung electronics co., ltd., Jaemok JUNG of Suwon-si (KR) for samsung electronics co., ltd., Juil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Taeoh HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/36
CPC Code(s): H01L23/49811
Abstract: a semiconductor package includes a lower redistribution wiring layer having a first region and a second region and including first redistribution wirings, a semiconductor chip disposed on the first region of the lower redistribution wiring layer, a molding member covering the semiconductor chip on the lower redistribution wiring layer, a plurality of vertical conductive structures penetrating the molding member on the second region of the lower redistribution wiring layer, electrically connected to the first redistribution wirings, and including first conductive pillars and second conductive pillars stacked on the first conductive pillars respectively, and an upper redistribution wiring layer disposed on the molding member and having second redistribution wirings electrically connected to the plurality of vertical conductive structures. each of the first conductive pillars has a first length and each of the second conductive pillars has a second length greater than the first length.
20250038083. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Insik HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498
CPC Code(s): H01L23/49816
Abstract: a semiconductor device according to embodiments includes a semiconductor package, a package pad positioned on a surface of the semiconductor package, and a solder ball positioned on the package pad. the package pad includes a package center pad positioned at the center of the semiconductor package, and a package edge pad positioned on an edge portion of the semiconductor package, the package edge pad covers a side surface extending from a surface of the semiconductor package.
20250038090. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Seongho Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065, H01L25/18
CPC Code(s): H01L23/49827
Abstract: the present disclosure relates to semiconductor packages. an example semiconductor package comprises a package substrate that includes a signal pad and a ground pad, an interposer substrate on the package substrate, a semiconductor chip on the interposer substrate, a plurality of signal lines on a top surface of the package substrate, and a first connection terminal between the package substrate and the interposer substrate. each signal line of the plurality of signal lines extends in a first direction. the plurality of signal lines and the signal pad are spaced apart in a second direction that intersects the first direction. the plurality of signal lines, the signal pad, and the ground pad are in contact with the top surface of the package substrate. the first connection terminal overlaps at least a portion of the plurality of signal lines in a plan view.
20250038094. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joongsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Minkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongrim SEO of Suwon-si (KR) for samsung electronics co., ltd., Wonjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuil HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/367, H01L23/49, H01L25/16
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a first redistribution structure comprising a plurality of first redistribution layers. a second redistribution structure is above the first redistribution structure. the second redistribution structure comprises a plurality of second redistribution layers. a first semiconductor chip is on the first redistribution structure and is arranged between the first redistribution structure and the second redistribution structure. a conductive block directly contacts the first redistribution structure and the second redistribution structure and extends in a horizontal direction between the first redistribution structure and the second redistribution structure. a plurality of conductive posts is around the first semiconductor chip and the conductive block. the plurality of conductive posts extends in a vertical direction and directly contacts the first redistribution structure and the second redistribution structure.
Inventor(s): Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Insik HAN of Suwon-si (KR) for samsung electronics co., ltd., Shlege LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/768, H01L23/00, H01L25/065
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes: a package substrate having a first surface and a second surface, wherein the package substrate includes a plurality of first substrate pads and a plurality of second substrate pads that are electrically connected to each other; a semiconductor device mounted on the package substrate and electrically connected to the plurality of first substrate pads; conductive bumps disposed on the plurality of second substrate pads, wherein each of the conductive bumps includes a bump body and a conductive member, wherein the bump body has a first melting point, and the conductive member at least partially surrounds the bump body and has a second melting point that is lower than the first melting point; and a semiconductor element mounted on the package substrate, wherein the semiconductor element has metal oxide barriers that are provided on the conductive members and a side surface of the semiconductor element.
Inventor(s): Daehun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/28, H01L25/10
CPC Code(s): H01L23/49894
Abstract: a semiconductor package includes a package substrate including a first region and a second region surrounding the first region, the package substrate including a first insulation layer on an upper surface, an outermost insulation layer on the first insulation layer of the package substrate, the outermost insulation layer defining a window that exposes the first region of the package substrate, a first electronic device on the first region of the package substrate, an underfill member in the window of the outermost insulation layer on the first region of the package substrate, the underfill member at least partially filling a gap between the first electronic device and the package substrate, and a second electronic device on the outermost insulation layer.
Inventor(s): Eunsuk HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a substrate having a pair of second conductive lines thereon, and a first conductive line extending between the pair of second conductive lines and the substrate. a contact plug extends between the pair of second conductive lines and is electrically connected to the first conductive line. a gate electrode extends on the contact plug. first and second semiconductor patterns extend on first and second ones of the pair of second conductive lines, respectively. a gate insulating pattern extends between each of the first and second semiconductive patterns and the gate electrode. the first conductive line may be configured as a word line, and the pair of second conductive lines may be configured as a pair of bit lines. the gate electrode may be configured as a gate electrode of a first access transistor within a first dram cell and as a gate electrode of a second access transistor within a second dram cell.
20250038110. INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangjine Park of Suwon-si (KR) for samsung electronics co., ltd., Youngtae Kim of Suwon-si (KR) for samsung electronics co., ltd., Ilyoung Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/06, H01L29/40, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L23/5286
Abstract: an integrated circuit device includes a substrate having a front side and a back side opposite to the front side and including a fin-type active region in the front side and a substrate recess in the back side, an isolation film in the substrate defining the fin-type active region, a source/drain region on the fin-type active region, a contact plug above the substrate, a backside power rail at least partially filling the substrate recess, and a via power rail electrically connected to the contact plug, the via power rail extending into the isolation film and connected to the backside power rail. a side surface of the backside power rail and a side surface of the via power rail form an obtuse angle at a portion where the backside power rail is connected to the via power rail.
Inventor(s): Taejoo HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L23/48, H01L23/498, H01L25/065
CPC Code(s): H01L23/5381
Abstract: a semiconductor package includes a first substrate. a first lower semiconductor chip is disposed on the first substrate. a bridge structure is laterally spaced apart from the first lower semiconductor chip, on the first substrate. a second substrate is disposed on the first lower semiconductor chip and the bridge structure. a first upper semiconductor chip is disposed on the second substrate. the first upper semiconductor chip is spaced apart from the first lower semiconductor chip in a plan view. the bridge structure includes a base structure. conductive vias are disposed in the base structure and are in contact with the first substrate. the first upper semiconductor chip is electrically connected to the first lower semiconductor chip through the conductive vias.
20250038115. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JUNGHOON KANG of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L25/065
CPC Code(s): H01L23/5385
Abstract: a semiconductor package includes a lower redistribution substrate, a module structure on the lower redistribution substrate, a connection substrate on the lower redistribution substrate and at sides of the module structure, a dielectric member on the lower redistribution substrate between the connection substrate and the module structure, and an upper redistribution substrate on the dielectric member. the module structure includes an interposer substrate, a first semiconductor chip, and a molding layer. the molding layer and the dielectric member include different materials. a first via in a first vertical hole vertically penetrates the dielectric member and the molding layer. the first via connects a wiring pattern of the upper redistribution substrate to a top surface of the first semiconductor chip.
Inventor(s): YOUNG-DEUK KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/48, H01L25/065, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a semiconductor package according to an embodiment includes a connection substrate, a first semiconductor chip, and a second semiconductor chip. the first semiconductor chip is disposed on the connection substrate and includes a first interconnection area facing the connection substrate. the second semiconductor chip is disposed on the connection substrate and includes a second interconnection area facing the connection substrate. the second semiconductor chip includes a first edge adjacent to the first semiconductor chip and a second edge opposite to the first edge in a first direction. a first distance between the second interconnection area and the first edge in the first direction is different from a second distance between the second interconnection area and the second edge in the first direction.
20250038122. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Seungwan Shin of Suwon-si (KR) for samsung electronics co., ltd., Jung Hyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L23/498, H01L25/065
CPC Code(s): H01L23/544
Abstract: provided is a semiconductor package including a first redistribution substrate including a first redistribution insulating layer and a first redistribution via, a first insulating layer on the first redistribution substrate, a solder pad on the first insulating layer, a first alignment key penetrating the first insulating layer and extending to an inside of the first redistribution insulating layer, and a solder via spaced apart from the first alignment key and electrically connected to the solder pad, wherein the first alignment key includes a first key body extending from a first surface of the first insulating layer to the inside of the first redistribution substrate, and a first key protrusion protruding from a side surface of the first key body toward the first insulating layer, and wherein the first insulating layer includes a non-photosensitive material.
Inventor(s): Sanghyeon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Youngmin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/552, H01L21/56
CPC Code(s): H01L23/552
Abstract: an apparatus for forming an electromagnetic interference (emi) shielding film, includes an adhesive member having a pocket region, a support member disposed on or below the adhesive member, the support member having an opening at a position aligned with the pocket region, a coating member configured to form a shielding material layer on the adhesive member and the chip structure disposed on the adhesive member, and a pickup member configured to detach, from the adhesive member, the chip structure covered by the shielding material layer. the support member has a first side surface defining a lower region of the opening, and a second side surface spaced apart from the first side surface in a first direction, the second surface defining an upper region of the opening. a width of the lower region in the first direction is less than a width of the upper region in the first direction.
20250038134. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Byounggug MIN of Suwon-si (KR) for samsung electronics co., ltd., Yoochang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/58, H01L23/00, H01L23/31, H01L23/498, H01L23/552, H01L25/065, H10B80/00
CPC Code(s): H01L23/585
Abstract: a semiconductor package includes: a package substrate including upper pads, lower pads, and a first wiring layer electrically connecting first upper pads of the upper pads to first lower pads of the lower pads, respectively; a semiconductor chip disposed on the package substrate and electrically connected to the first upper pads; an encapsulant covering the semiconductor chip and at least a portion of the package substrate; a first conductive layer covering at least a portion of each of the encapsulant and the package substrate, wherein the first conductive layer is configured to apply a first voltage; a dielectric layer stacked on the first conductive layer; and a second conductive layer stacked on the dielectric layer, wherein the second conductive layer is configured to apply a second voltage.
Inventor(s): Joohee JANG of Hwaseong-si (KR) for samsung electronics co., ltd., Seokho KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hoonjoo NA of Seoul (KR) for samsung electronics co., ltd., Jaehyung PARK of Anyang-si (KR) for samsung electronics co., ltd., Kyuha LEE of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L27/146
CPC Code(s): H01L24/08
Abstract: a method includes forming a first substrate including a first dielectric layer and a first metal pad, forming a second substrate including a second dielectric layer and a second metal pad, and bonding the first dielectric layer to the second dielectric layer, and the first metal pad to the second metal pad. one or both of the first and second substrates is formed by forming a first insulating layer, forming an opening in the layer, forming a barrier on an inner surface of the opening, forming a metal pad material on the barrier, polishing the metal pad material to expose a portion of the barrier and to form a gap, expanding the gap, forming a second insulating layer to fill the opening and the gap, and polishing the insulating layers such that a top surface of the metal pad is substantially planar with an upper surface of the polished layer.
20250038149. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): HYUNGJUN JEON of SUWON-SI (KR) for samsung electronics co., ltd., HO-JIN LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/48, H01L23/498, H01L25/18
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a first chip and a second chip disposed thereon. the first chip includes a first semiconductor substrate including first and second surfaces, a first circuit layer disposed on the first surface, a first interconnection layer disposed on the first circuit layer, the first interconnection layer including a landing pad, a second interconnection layer disposed on the second surface, and a first penetration via protruding from the second interconnection layer and penetrating the first semiconductor substrate. the second chip includes a second semiconductor substrate including third and fourth surfaces, the fourth surface being closer to the first chip than the third surface, a third interconnection layer disposed on the fourth surface, a second circuit layer disposed between the third interconnection layer and the fourth surface, and a second penetration via penetrating the second semiconductor substrate and connected to the landing pad.
Inventor(s): Kyuha Shim of Suwon-si (KR) for samsung electronics co., ltd., Chisung Oh of Suwon-si (KR) for samsung electronics co., ltd., Useung Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065
CPC Code(s): H01L25/0657
Abstract: according to some implementations, provided is a semiconductor device including: a first semiconductor chip including first through-vias, and first front pads electrically connected to the first through-vias; and a second semiconductor chip disposed below the first semiconductor chip, and including a substrate, a circuit layer disposed below the substrate, second front pads below the circuit layer, rear pads disposed on the substrate and electrically connected to the corresponding first front pads, second through-vias penetrating through the substrate and electrically connected to the second front pads, and a rear redistribution layer electrically connecting the second through-vias and the rear pads, wherein at least one of the rear pads is spaced apart from a corresponding one of the second through-vias in a horizontal direction, and overlaps a corresponding one of the first through-vias in a vertical direction.
20250038156. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): YOUNG-JA KIM of Suwon-si (KR) for samsung electronics co., ltd., SUNWON KANG of Suwon-si (KR) for samsung electronics co., ltd., MI-NA CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/31, H01L23/367, H01L23/373, H01L23/498
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a first substrate. a second substrate is spaced apart from the first substrate. a semiconductor chip is between the first substrate and the second substrate. the semiconductor chip is electrically connected to the second substrate. a molding layer surrounds the semiconductor chip. a plate directly contacts a bottom surface of the semiconductor chip. a heat transfer structure connects the plate and the first substrate to each other.
20250038158. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): INGYU BAEK of Suwon-si (KR) for samsung electronics co., ltd., SOONHYUNG HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L27/146
CPC Code(s): H01L25/167
Abstract: the present application is directed to a semiconductor package including a package substrate, a connection substrate disposed on the package substrate, a first semiconductor chip disposed on the connection substrate, a second semiconductor chip disposed on the connection substrate and spaced apart from the first semiconductor chip, a molding layer disposed on the package substrate and at least partially covering the connection substrate, the first semiconductor chip, and the second semiconductor chip, and an optical guide member that extends into the molding layer and is disposed on the second semiconductor chip.
Inventor(s): Seokmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoongeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seungtae KO of Suwon-si (KR) for samsung electronics co., ltd., Jungyub LEE of Suwon-si (KR) for samsung electronics co., ltd., Jun HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/24, H01Q21/00, H04B1/04
CPC Code(s): H01Q21/24
Abstract: an electronic device is provided. the electronic device includes an antenna substrate and an antenna array comprising a sub array, the sub array includes a plurality of antenna elements, feeding network circuitry including a first power divider for first polarization and a second power divider for second polarization, which differs from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the sub array is disposed on a first surface of the antenna substrate, and wherein the feeding network circuitry disposed on the first side or a second side opposite to the first side of the antenna substrate, and wherein the network circuitry for decoupling is disposed in a region between the first power divider and the second power divider in the first side or the second side of the antenna substrate.
Inventor(s): Sungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaekyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungwoo MOON of Suwon-si (KR) for samsung electronics co., ltd., Daewoong CHO of Suwon-si (KR) for samsung electronics co., ltd., Jungwook HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00, H02J50/10, H02M3/158, H04R1/10
CPC Code(s): H02J7/00712
Abstract: a charging circuit may include a buck-boost circuit and a voltage regulator circuit, wherein the buck-boost circuit converts a first input voltage received at a first node into a first output voltage and charges a battery based on the first output voltage, and time-divisionally converts a second input voltage provided from the battery into a second output voltage provided to a first external device and a third output voltage provided to a second external device, and the voltage regulator circuit adjusts the first input voltage to generate the second output voltage and the third output voltage.
20250038574. WIRELESS CHARGING CIRCUIT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youso Cheon of Suwon-Si (KR) for samsung electronics co., ltd., Seokhyeong Ham of Suwon-si (KR) for samsung electronics co., ltd., Arom Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/12, H02J7/00
CPC Code(s): H02J50/12
Abstract: a wireless charging circuit wirelessly receives power and includes a power receiving circuit that includes an inductor and a capacitor, a rectifier circuit that rectifies an alternating current voltage received from the power receiving circuit and outputs a rectified voltage, a regulating circuit that outputs a charging voltage that charges a battery using the rectified voltage, an overvoltage protection circuit connected in parallel between the rectifier circuit and the regulating circuit, and a controller that detects the rectified voltage and controls the overvoltage protection circuit. the overvoltage protection circuit includes first and second overvoltage protection circuits. by separating turn-on holding times of the first and second overvoltage protection circuits, the wireless charging circuit is effectively protected from overvoltage and damage to the circuit due to heat generation is prevented.
Inventor(s): Byungwook JUNG of Suwon-si (KR) for samsung electronics co., ltd., Dohyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaesup LEE of Suwon-si (KR) for samsung electronics co., ltd., Solhee IN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/80, H02J50/20, H02J50/40
CPC Code(s): H02J50/80
Abstract: a wireless power transmission system including: a first wireless power transmitter to receive a beacon signal through a first array antenna unit, estimate a characteristic of a first wireless channel based on the beacon signal, and generate and output first power signals, wherein phases and amplitudes of the first power signals are adjusted based on a characteristic of the first wireless channel and a time reversal algorithm; and a first wireless power receiver to output the beacon signal through a first antenna unit, receive the first power signals through the first antenna unit, and generate an operating voltage based on the first power signals, wherein the first power signals are adjusted differently based on a quantity of wireless power transmitters, a quantity of wireless power receivers, a movement of the first wireless power transmitter, or a movement of the first wireless power receiver.
Inventor(s): Byoungyoun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonyeong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jongchul HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/80, H02J7/00, H02J50/12, H02J50/40
CPC Code(s): H02J50/80
Abstract: an electronic device is provided. the electronic device includes a housing, an interface configured to receive power by wire, a coil disposed on a side of the housing configured to transmit wirelessly the power to an external electronic device different from the electronic device, communication circuitry configured to communicate with the external electronic device, a battery, memory storing one or more computer programs, and one or more processors communicatively coupled to the coil, the communication circuitry, the battery, the interface and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to identify an external electronic device that is in contact with one surface of a housing on which a coil is disposed, request a display of a screen for selective transmission of the power, and transmit power to the battery among the battery and the external electronic device.
20250038586. STATOR CORE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinwoo CHO of Suwon-si (KR) for samsung electronics co., ltd., Ukho SEO of Suwon-si (KR) for samsung electronics co., ltd., Jaewoong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02K1/14
CPC Code(s): H02K1/146
Abstract: a stator core formed by stacking and then bending a plurality of straight core pieces having a plurality of bending portions is provided, wherein the core pieces each include a plurality of first core pieces and a plurality of second core pieces stacked between the plurality of first core pieces, and the bending portions each include a connecting portion formed at the same position of the plurality of first core pieces and the plurality of second core pieces when the plurality of first core pieces and the plurality of second core pieces are stacked, a first bending portion formed by cutting the plurality of first core pieces and formed on one side of the connecting portion with respect to the center of the connecting portion, and a second bending portion formed by cutting the plurality of second core pieces and formed on the other side of the connecting portion with respect to the center of the connecting portion, and wherein based on the plurality of first core pieces and the plurality of second core pieces being stacked, the first bending portion is entirely covered by the second core pieces, and the second bending portion is entirely covered by the first core pieces.
20250038711. MULTI-STAGE AMPLIFIER CIRCUITS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yong LIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F3/45
CPC Code(s): H03F1/0244
Abstract: an amplifier includes a first stage amplifier circuit configured to receive an input voltage and a first multi-stage amplifier circuit and a second multi-stage amplifier circuit branching off from an output terminal of the first stage amplifier circuit and each including a second stage and a third stage. each of the first multi-stage amplifier circuit and the second multi-stage amplifier circuit may be configured to sample a voltage corresponding to a first bias current corresponding to the second stage and a voltage corresponding to a second bias current corresponding to the third stage in a first phase, and bias the second stage with the voltage corresponding to the first bias current and bias the third stage with the voltage corresponding to the second bias current in a second phase.
20250038715. MULTI-STACK POWER AMPLIFIER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongwon YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangmin YOO of Suwon-si (KR) for samsung electronics co., ltd., Joonhoi HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/213, H03F1/56, H03F3/24
CPC Code(s): H03F3/213
Abstract: a multi-stack power amplifier having a differential structure includes a first stack including a first amplifier element, configured to amplify a first signal having a first phase, and a second amplifier element configured to amplify a second signal having a second phase opposite to the first phase; and a second stack including a third amplifier element, connected to an output terminal of the first amplifier element through a first interconnection, and a fourth amplifier element connected to an output terminal of the second amplifier element through a second interconnection intersecting the first interconnection.
Inventor(s): Ankur Harkawat of Bangalore (IN) for samsung electronics co., ltd., Aakash Arora of Bangalore (IN) for samsung electronics co., ltd., Vivek Sridhar of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H03K7/08, G06T19/00
CPC Code(s): H03K7/08
Abstract: a method for handling a display device in an extended reality (xr) environment, includes: obtaining at least one media of a scene comprising a plurality of display devices; determining at least one pixel group comprising locations of the plurality of display devices in the at least one media; determining at least one parameter based on the at least one determined pixel group, wherein the at least one parameter comprises at least one of a frequency and a duty cycle; extracting a pulse width modulation (pwm) signal corresponding to the display device from the plurality of display devices based on the at least one parameter; and recognizing the display device from the plurality of display devices by correlating the extracted pwm signal with an identifier (id) of the display device stored in at least one memory of the xr device.
20250038754. ANALOG-TO-DIGITAL CONVERSION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeha Kim of Seoul (KR) for samsung electronics co., ltd., Young Choi of Suwon-si (KR) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Youngdon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/06
CPC Code(s): H03M1/0604
Abstract: the present disclosure relates to successive approximation register analog-to-digital converters. an example successive approximation register analog-to-digital converter includes a first sampling and holding circuit that samples an analog signal at a first point in time and generates a first input voltage, a second sampling and holding circuit that samples the analog signal at a second point in time and generates a second input voltage, and a first analog-to-digital converter. the first analog-to-digital converter performs a feed forward equalization function by receiving the first input voltage and the second input voltage, sampling the first input voltage and the second input voltage, and outputting a multi-bit digital signal based on a sampling result of the first input voltage and a sampling result of the second input voltage.
Inventor(s): Hyungdong ROH of Suwon-si (KR) for samsung electronics co., ltd., Dasom Park of Suwon-si (KR) for samsung electronics co., ltd., Michael Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/12, H03M1/40
CPC Code(s): H03M1/1255
Abstract: a sampling circuit includes a linearization circuit connected to a first input terminal for receiving a first input signal and a second input terminal for receiving a second input signal, a first switch connected between the first input terminal and the linearization circuit, a second switch connected between the first input terminal and the linearization circuit, a third switch connected between the second input terminal and the linearization circuit, a fourth switch connected between the second input terminal and the linearization circuit, a first capacitor connected between the linearization circuit and a first output terminal for outputting a first sampled signal, and a second capacitor connected between the linearization circuit and a second output terminal for outputting a second sampled signal.
Inventor(s): Yunhong Kim of Suwon-si (KR) for samsung electronics co., ltd., Heesung Chae of Suwon-si (KR) for samsung electronics co., ltd., Keunyeol Park of Suwon-si (KR) for samsung electronics co., ltd., Ingyeong Shin of Suwon-si (KR) for samsung electronics co., ltd., Moo Young Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/34, H04N25/77
CPC Code(s): H03M1/34
Abstract: disclosed is an analog-to-digital converter (adc) circuit for digitizing a pixel signal into a digital signal of positive integer (n) bits. the adc includes a ramp generator, a clock, a comparator, and a counter. a system clock signal allows the ramp generator to generate a ramp signal and the clock generator to generate first to n-th clock signals. the comparator generates a comparison signal based on a comparison of the pixel signal, received from a pixel array, and the ramp signal. the counter includes an additional latch circuit and first to n-th latch circuits. the additional latch circuit generates an additional binary signal based on the system clock signal and the comparison signal, and the first to n-th latch circuits generate first to n-th latch signals based on the comparison signal and corresponding clock signal.
Inventor(s): Karthik MURALIDHAR of Bangalore (IN) for samsung electronics co., ltd., Md. Saifur RAHMAN of Mountain View CA (US) for samsung electronics co., ltd., Dattaraj Dileep Raut MULGAONKAR of Bangalore (IN) for samsung electronics co., ltd., Diwakar SHARMA of Bangalore (IN) for samsung electronics co., ltd., Eko ONGGOSANUSI of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W24/10, H04W72/23
CPC Code(s): H04B7/0626
Abstract: according to various embodiments, a method performed by a user equipment (ue) in a wireless communication system, comprising: receiving, from a base station, a channel state information (csi)-reference signal (rs) during an observation window (ow); predicting at least one first type csi report during the ow; transmitting, to the base station, the at least one predicted first type csi report during the ow and a second type csi report at an end of the ow based on the received csi-rs. the linear prediction based method is used for csi-feedback in the wireless communication network, in situations where high/medium velocity feedback (i.e., doppler) is present. the method can be used to enable a csi-type codebook feedback feature during a mobility scenario.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W72/1273
CPC Code(s): H04B7/0626
Abstract: apparatuses and methods for channel state information (csi) for joint transmission with adaptation hypotheses. a method for a user equipment (ue) to report channel state information (csi) includes receiving: information related to a csi reference signal (csi-rs) resource set including one or more non-zero power csi-rss (nzp csi-rss) on a cell, information related to a csi report including a first number of csi report sub-configurations, information related to an uplink (ul) channel for transmitting the csi report, and the one or more nzp csi-rss. the method further includes determining a second number of csi sub-reports based on the reception of the one or more nzp csi-rss and transmitting the ul channel with the csi report including the second number of csi sub-reports based on the fourth information.
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0626
Abstract: a method for operating a user equipment (ue) comprises receiving information about a channel state information (csi) report, the information including information about two parameters for basis vectors, n and m; determining n. . . n, wherein n. . . nare indices of m basis vectors selected from n basis vectors; determining nonzero offsets between the index nand indices n. . . n; and transmitting the csi report including an indicator iindicating the nonzero offsets between nand the indices n. . . n.
Inventor(s): Doyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Dahae CHONG of Suwon-si (KR) for samsung electronics co., ltd., Yoojin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0408
CPC Code(s): H04B7/06952
Abstract: an electronic device includes memory; a communication module comprising an antenna array configured to form a plurality of candidate beams; and a processor connected to the communication module and the memory, the processor comprising a channel state classifier based on a neural network, wherein the processor is configured to: generate channel characteristic data based on information measured from the plurality of candidate beams for a signal received from a base station, input the channel characteristic data to the channel state classifier to infer a channel state between the electronic device and the base station, and reform the plurality of candidate beams based on the inferred channel state.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L5/14
CPC Code(s): H04L5/0048
Abstract: a method of operating a user equipment includes receiving first information for a first candidate subband full-duplex (sbfd) configuration associated with a first l1/l2-triggered mobility (ltm) candidate cell or reference configuration, receiving second information for a second candidate sbfd configuration associated with a second ltm candidate cell or reference configuration, and determining a value of an sbfd indicator. the method further includes selecting an sbfd configuration of an ltm candidate cell based on the first information when the value is associated with the first ltm candidate cell or reference configuration or the second information when the value is associated with the second ltm candidate cell or reference configuration; and receiving a downlink signal based on the sbfd configuration of the ltm candidate cell. the value of the sbfd indicator is from a set of identifier values associated with a set of transmit-receive points.
Inventor(s): Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L5/00
CPC Code(s): H04L5/0053
Abstract: the disclosure provides a method performed by a ue in a wireless communication system, including receiving a channel state information (csi) reporting configuration comprising a plurality of first sub-configurations, and determining and reporting csi based on a second sub-configuration comprising n out of the plurality of the first sub-configurations, where n is greater than or equal to 1, wherein the csi comprises one or two csi parts, wherein a number of the csi parts included in the csi is determined based on n, and wherein at least one of the one or two csi parts included in the csi is determined based on a first order including at least one of an order of the n first sub-configurations in the second sub-configuration, an order of csi parameters in the csi, and an order between zero-padding bits and the csi parameters in the csi.
Inventor(s): Myunghyun CHO of Suwon-si (KR) for samsung electronics co., ltd., Yunheung PAEK of Seoul (KR) for samsung electronics co., ltd., Jimyung NA of Suwon-si (KR) for samsung electronics co., ltd., Hyunyoung OH of Seoul (KR) for samsung electronics co., ltd., Yongseok LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/32
CPC Code(s): H04L9/32
Abstract: a cryptography processor includes at least one interface circuit configured to communication with at least one of a host device and a semiconductor memory device, at least one register configured to store at least one of intermediate data of a common operation and control data received from the host device, a plurality of common operation circuits, respectively configured to perform different operations, and a plurality of function circuits configured to control at least one of the plurality of common operation circuits to perform a workload allocated from the host device. at least one of the plurality of common operation circuits may be configured to be controlled by different function circuits, among the plurality of function circuits, to execute different functions of a cryptographic operation, and the workload may be configured to execute a function of the cryptographic operation.
Inventor(s): Sangwook HAN of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoojin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L5/00
CPC Code(s): H04L25/0254
Abstract: a method of operating a base station, includes: transmitting a reference signal to an electronic device comprising a first model and a third model; receiving a first intermediate output from the electronic device; obtaining a second intermediate output by inputting the first intermediate output to a partial model excluding an output layer from a second model comprising a second neural network for data decompression; transmitting the second intermediate output to the electronic device; receiving a first gradient value from the electronic device and updating weight parameters of the partial model; and generating a second gradient value different from the first gradient value and transmitting the second gradient value to the electronic device.
Inventor(s): Jun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0268
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing, a third housing, and a hinge assembly. the hinge assembly includes a first hinge structure rotatably connecting the second housing to the first housing, a second hinge structure rotatably connecting the third housing to the first housing, and a rotation link structure. the rotation link structure may include a first link having one end connected to the first hinge structure, a second link having one end connected to the second hinge structure, and an intermediate link configured to be rotate about a rotation axis. the other end of the first link and the other end of the second link are connected to the intermediate link. in response to the first housing being rotated, the third housing is configured to be rotated according to a movement of the first link and the second link.
20250039293. CLOUD-BASED SMART ACCESSORY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngho RHEE of Suwon-si (KR) for samsung electronics co., ltd., Junghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72469, H04M1/72412
CPC Code(s): H04M1/72469
Abstract: various embodiments of the present disclosure relate to a cloud-based smart accessory system, and comprise: an accessory that includes at least one button, a first communication interface comprising communication circuitry, and at least one first processor comprising processing circuitry, configured to communicate with an electronic device via the first communication interface; and the electronic device that includes: a second communication interface comprising communication circuitry, a third communication interface comprising communication circuitry, and at least one second processor comprising processing circuitry, individually and/or collectively, configured to: communicate with the accessory via the second communication interface, and communicate with a server via the third communication interface, wherein at least one second processor, individually and/or collectively, may be configured to control the electronic device to: receive accessory information from the accessory; transmit the accessory information (or some information) to the server; and receive, from the server, at least one of an associated application, an associated gui resource, and associated content that have been determined by the server based on the accessory information (or the some information), or a service address of at least one external apparatus that may acquire at least one of the associated application, the associated gui resource, and the associated content.
Inventor(s): Junkwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Dongjin Jung of Suwon-si (KR) for samsung electronics co., ltd., Kyuchun Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N5/77, G06V10/44, G06V10/74, G06V10/75, G06V20/40, G06V40/16, G06V40/20, H04N23/60, H04N23/80
CPC Code(s): H04N5/77
Abstract: an electronic apparatus is provided. the electronic apparatus includes: a camera; a processor configured to control the camera; and a memory configured to be electrically connected to the processor and to store a network model trained to determine a degree of matching between an input image frame and predetermined feature information, wherein the processor is configured to: identify a representative image frame based on a degree of matching obtained by applying image frames, selected from among a plurality of image frames, to the trained network model, while the plurality of image frames are captured through the camera, identify a best image frame based on a degree of matching obtained by applying image frames within a specific section including the identified representative image frame, to the trained network model, and provide the identified best image frame.
Inventor(s): Min-woo PARK of Yongin-si (KR) for samsung electronics co., ltd., Bo-ra Jin of Yongin-si (KR) for samsung electronics co., ltd., Chan-yul Kim of Seongnam-si (KR) for samsung electronics co., ltd., Jung-hye Min of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/119, H04N19/176
CPC Code(s): H04N19/119
Abstract: provided is an image decoding method of decoding an image, the image decoding method including: obtaining at least one of block shape information and split shape information about a first coding unit included in the image, from a bitstream; determining at least one second coding unit included in the first coding unit based on at least one of the block shape information and the split shape information; and decoding the image based on the at least one second coding unit, wherein the block shape information indicates a shape of the first coding unit and the split shape information indicates whether the first coding unit is split into the at least one second coding unit. also, provided is an image encoding method corresponding to the image decoding method. also, provided is an image encoding apparatus and image decoding apparatus for respectively performing the image encoding method and image decoding method.
Inventor(s): Youxin CHEN of Nanjing (CN) for samsung electronics co., ltd., Longhai WU of Nanjing (CN) for samsung electronics co., ltd., Jie CHEN of Nanjing (CN) for samsung electronics co., ltd.
IPC Code(s): H04N21/234, G06T7/00, G06V10/42, H04N21/845
CPC Code(s): H04N21/23424
Abstract: the present disclosure discloses a video enhancement method and apparatus. the method includes: segmenting a target video into a plurality of groups of images, the images in the same group belonging to the same scene; determining, for each group of images, a matched video enhancement algorithm using a pre-trained quality assessment model, and performing video enhancement processing on the each group of images using the video enhancement algorithm; and sequentially splicing video enhancement processing results of all groups of images to obtain video enhancement data of the target video. with the present disclosure, the video enhancement processing effect can be improved and the video viewing experience can be improved.
Inventor(s): Jibum MOON of Suwon-si (KR) for samsung electronics co., ltd., Gyungchan SEOL of Suwon-si (KR) for samsung electronics co., ltd., Kyerim LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/472, G06F3/16, G10L15/08, G10L15/22, G10L15/30
CPC Code(s): H04N21/47202
Abstract: an example display device may include a voice signal receiver, a display, at least one memory storing an application supporting a contents providing service and storing instructions, a communication circuit communicating with at least one external server supporting the contents providing service, and at least one processor. the contents providing service may provide contents files of a first type and contents files of a second type.
Inventor(s): Hochang RHEE of Seoul (KR) for samsung electronics co., ltd., Nam Ik CHO of Seoul (KR) for samsung electronics co., ltd., Young Hun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Dokwan OH of Suwon-si (KR) for samsung electronics co., ltd., Hyo A KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/845, H04N21/234
CPC Code(s): H04N21/8456
Abstract: a video processing method is provided. the video processing method obtaining a clip representation based on a frame index and a global representation of an input video, obtaining a residual frame representation based on the frame index and a residual representation of the input video using a residual neural network and outputting a final frame representation generated based on the clip representation and the residual frame representation.
Inventor(s): Yongjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/55, G02B5/04, G02B5/20, H04N23/61, H04N23/68
CPC Code(s): H04N23/55
Abstract: provided is a lens assembly comprising at least two lenses aligned along a first optical axis; an image sensor configured to receive light guided or condensed through the at least two lenses; and at least one optical member disposed between the at least two lenses and the image sensor to receive light incident through the at least two lenses, and refract or reflect the light at least twice, to guide or emit the light to the image sensor, where a ratio of a longer side of an imaging surface of the image sensor to a longer side of an emission surface of a first optical member closest to the image sensor is within a specified range.
Inventor(s): Wonseok SONG of Suwon-si (KR) for samsung electronics co., ltd., Bohee LEE of Suwon-si (KR) for samsung electronics co., ltd., Sehyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Junghwan JO of Suwon-si (KR) for samsung electronics co., ltd., Yonghyun HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/68
CPC Code(s): H04N23/683
Abstract: an electronic device includes a processor causing the electronic device to enter a video capturing mode in which a camera is activated, display a live-preview corresponding to the video capturing mode using images obtained via the camera, while in the video capturing mode, display a user interface including a first graphical object indicative of a first degree of motion stabilization and a second graphical object indicative of a second degree of motion stabilization greater than the first degree, receive an input via the user interface to select one of the first graphical object or the second graphical object, based on the first graphical object being selected, display a live-preview by performing, based on motion information and a first marginal area having a first size, a first stabilization with respect to the obtained images, and based on the second graphical object being selected, display the live-preview by performing, based on the motion information and a second marginal area having a second size larger than the first size, a second stabilization with respect to the obtained images.
Inventor(s): Soongeun JANG of Suwon-si (KR) for samsung electronics co., ltd., Woo-Shik KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/84, H04N23/88, H04N23/951, H04N25/11
CPC Code(s): H04N23/843
Abstract: an image acquisition apparatus includes an image sensor including a microlens and a plurality of pixels arranged adjacent to each other and sharing the microlens; and a processor configured to process an input image acquired by the image sensor, wherein the processor may be further configured to: generate a plurality of parallax images by extracting and combining sub-images having a same parallax from the input image; generate rgb demosaic images by interpolating a color value of an empty pixel for each of the plurality of parallax images by using color values of surrounding pixels; generate a plurality of upsampled images by upsampling each of the rgb demosaic images to an input image size; and generate an output image by weighted-summing one upsampled image selected from the upsampled images and the other upsampled images based on a similarity therebetween.
Inventor(s): Soongeun JANG of Suwon-si (KR) for samsung electronics co., ltd., Woo-Shik KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/88, H04N5/265, H04N25/11, H04N25/60
CPC Code(s): H04N23/88
Abstract: an image obtaining apparatus includes an image sensor including a micro lens and a plurality of neighboring pixels sharing the micro lens and a processor configured to generate, based on an input image received from the image sensor, a plurality of parallax images having a same parallax, group, from among the plurality of parallax images, first parallax images having similar image characteristics, perform at least one image processing operation on the first parallax images, and generate an output image by combining the first parallax images on which the at least one image processing operation is performed.
Inventor(s): Hosuk Han of Suwon-si (KR) for samsung electronics co., ltd., Ilho Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/40, H04N23/80, H04N25/42
CPC Code(s): H04N25/41
Abstract: an image processing circuit is provided. the image processing circuit includes a scan conversion controller configured to receive images from a plurality of channels connected to a plurality of imaging devices and to generate output data and an image signal processor configured to receive and process the output data from the scan conversion controller. the scan conversion controller is configured to determine a scan method for generating the output data according to a first operation mode or a second operation mode.
20250039571. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyung-Min Kim of Suwon-si (KR) for samsung electronics co., ltd., Haneol Seo of Suwon-si (KR) for samsung electronics co., ltd., Min-Sun Keel of Suwon-si (KR) for samsung electronics co., ltd., Youngtae Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/633, H04N25/709
CPC Code(s): H04N25/633
Abstract: an image sensor may include: a pixel array including a plurality of first pixels configured to receive light and output a plurality of first pixel signals; a row driver coupled to the plurality of first pixels and configured to apply a preset voltage to the plurality of first pixels; and an image signal processor configured to: obtain first state codes, each related to one of the plurality of first pixels, based on a plurality of second pixel signals received from the plurality of first pixels based on the preset voltage being applied to the plurality of first pixels; and process the plurality of first pixel signals based on the first state codes.
Inventor(s): Yoonseok KANG of Suwon-si (KR) for samsung electronics co., ltd., Yongbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hwangyun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/10
CPC Code(s): H04R1/1025
Abstract: an electronic device includes a first body comprising a first anti-rotation surface; an opening/closing structure; a second body connected to the first body via the opening/closing structure; and an accommodation space formed by the first body and the second body. the opening/closing structure may comprise a hinge member, at least one contact area, a guide member, and an elastic member, and may switch from a first state, in which the accommodation space is closed, to a second state, in which the accommodation space is opened, depending on a position in which the guide member and the at least one contact area are in contact. at least a portion of the first anti-rotation surface may be in contact with a second anti-rotation surface while the accommodation space is maximally opened.
Inventor(s): Yajun ZHI of Xi'An (CN) for samsung electronics co., ltd., Dong XU of Xi'An (CN) for samsung electronics co., ltd., Shaoying ZHAO of Xi'An (CN) for samsung electronics co., ltd., Fei WANG of Xi'An (CN) for samsung electronics co., ltd., Kun WANG of Xi'An (CN) for samsung electronics co., ltd.
IPC Code(s): H04R3/12, H04R1/10
CPC Code(s): H04R3/12
Abstract: a method for controlling a set of wireless earphones, including: establishing a first bluetooth (bt) connection between a first earphone of the set of wireless earphones and a source apparatus; based on the source apparatus supporting ultra wide band (uwb) connections: establishing a first uwb connection between the first earphone and the source apparatus, and a second uwb connection between a second earphone of the set of wireless earphones and the source apparatus; and receiving, by the first earphone, audio data from the source apparatus using the first uwb connection, wherein the audio data is received from the source apparatus by the second earphone using the second uwb connection
Inventor(s): Dongeun SUH of Gyeonggi-do (KR) for samsung electronics co., ltd., Hoyeon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W16/10, H04W28/20
CPC Code(s): H04W16/10
Abstract: a method and a device are provided for replacing/changing a network slice in a communication system. a method performed by a network entity in a wireless communication system supporting network slices includes receiving, from an af, a first message including first information associated with a network slice replacement, and transmitting, based on the first information, to one or more pcfs, a second message including second information associated with the network slice replacement.
Inventor(s): Prakash Reddy Kolan of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04L41/0816, H04L41/0893, H04W28/24
CPC Code(s): H04W24/02
Abstract: a method includes configuring a first network slice with a first configuration and configuring first actions to avoid network slice replacement. the method also includes receiving an indication for the network slice replacement of the first network slice with a second network slice. the method further includes instructing to perform the first actions to avoid the network slice replacement. in addition, the method includes when the first actions performed to avoid the network slice replacement are unsuccessful, moving application flows from the first network slice to the second network slice with a second configuration, the first configuration is different from the second configuration. the method also includes monitoring a service with the second network slice.
Inventor(s): Kyungjoo SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W8/22, H04W12/06, H04W12/106, H04W60/04
CPC Code(s): H04W24/02
Abstract: the present disclosure relates to a method and an apparatus for managing a configuration of a ue in a wireless communication system, and the method, performed by the ue, in a wireless communication system including a first non-public network and a second non-public network according to an embodiment of the present disclosure comprises the steps of: receiving, by the ue accessed to the first non-public network, a nas message including configuration information for use of a service provided in the second non-public network from a first amf of the first non-public network; and on the basis of the configuration information received by the ue from the first non-public network, performing a procedure of registration to a second amf of the second non-public network.
20250039719. ANTENNA CALIBRATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00
CPC Code(s): H04W24/10
Abstract: apparatuses and methods for antenna calibration. a method performed by a user equipment (ue) includes receiving a configuration about a calibration report, the configuration including information about (i) k groups of channel state information reference signal (csi-rs) ports, where k>1, and (ii) a type of the calibration report; based on the configuration, determining a calibration offset for each of the k groups of csi-rs ports; and transmitting the calibration report including at least one indicator indicating the calibration offset for each of the k groups of csi-rs ports. the type of the calibration report (i) is based on the calibration offset and (ii) corresponds to at least one of a delay offset (do), a frequency offset (fo), and a phase offset (po). the calibration report relates to a coherent joint transmission (cjt) across the k groups of csi-rs ports.
20250039735. BANDWIDTH THROTTLING DETECTION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Priyabrata Parida of Dallas TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Anum Ali of Frisco TX (US) for samsung electronics co., ltd., Yuqiang Heng of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W28/086
CPC Code(s): H04W28/0284
Abstract: a ue includes a transceiver. the transceiver is configured to perform network activity for the ue. the ue further includes a processor operably coupled to the transceiver. the processor is configured to determine whether a change in network activity for the ue exceeds a metric, and upon determination that the metric is exceed, initiate an anomalous event detection process, and determine whether an anomalous event is detected. the processor is further configured to, upon detection of an anomalous event, determine a network load level, and modify, based on the determined network load level, a connection configuration of the ue.
20250039743. WLAN ARCHITECTURE FOR UHR NETWORKS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W28/18, H04L5/00, H04W72/0446
CPC Code(s): H04W28/18
Abstract: methods and apparatuses that facilitate relaying information between source and destination devices in a wireless local area network (wlan). a wireless communication relay device comprises a transceiver and a processor operably connected to the transceiver. the transceiver is configured to receive, from a first wireless communication device, a first frame. the processor is configured to determine that the first frame is destined for a second wireless communication device. the transceiver is further configured to transmit, to the second wireless communication device, a second frame based on the first frame. the relay device, the first wireless communication device, and the second wireless communication device are institute of electrical and electronics engineers (ieee) 802.11 devices.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/36
CPC Code(s): H04W36/0069
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate.
Inventor(s): June HWANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/26, H04W28/086, H04W48/18
CPC Code(s): H04W36/26
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal in a wireless communication system includes obtaining a first type of conditional reconfiguration and a second type of conditional reconfiguration, identifying whether at least one condition associated with the first type of conditional reconfiguration and the second type of conditional reconfiguration is fulfilled, wherein in case that a condition for a primary cell (pcell) associated with the first type of conditional reconfiguration is fulfilled, the pcell associated with the first type of conditional reconfiguration is identified as a triggered cell, and in case that conditions for a pcell and a primary secondary cell group cell (pscell) associated with the second type of conditional reconfiguration are fulfilled, the pcell and the pscell associated with the second type of conditional reconfiguration are identified as a pair of triggered cells, identifying whether one or more pairs of triggered cells exist, in case that the one or more pairs of triggered cells do not exist, identifying whether one or more triggered cells exist, and in case that the one or more triggered cells exist, applying the first type of conditional reconfiguration.
Inventor(s): Sangwook HAN of Suwon-si (KR) for samsung electronics co., ltd., Yoojin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W36/00
CPC Code(s): H04W36/30
Abstract: a terminal receives a measurement configuration from a serving cell, measures at least one received signal based on the measurement configuration, and confirms whether an event corresponding to the measurement configuration has occurred. based on the confirming that the event has occurred, the terminal generates a latent vector by encoding a measurement result set including a plurality of measurement results, and in response to the occurrence of the event, transmits, to the serving cell, a measurement report generated based on the latent vector.
Inventor(s): Himanshu SHARMA of Noida (U.P.) (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W36/00, H04W36/14, H04W76/15, H04W84/12
CPC Code(s): H04W36/304
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed herein is a method and apparatus for enhancing a quality of a voice over wi-fi (vowi-fi) call in an electronic device (). the method includes detecting, using an evolved packet data gateway (epdg) interface, a voice communication over a first wireless local area network (wlan) among a plurality of wlans associated with a node of a network. the method further includes determining one or more epdg interface tunnel parameters associated with a plurality of epdg interface tunnels. the method further includes establishing, upon detecting a change in the one or more determined epdg interface tunnel parameters, the voice communication using a second wlan among the plurality of wlans to enhance the quality of the vowi-fi call.
Inventor(s): Namkyeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/20, H04W8/18, H04W48/16, H04W88/06
CPC Code(s): H04W48/20
Abstract: one or more non-transitory computer-readable storage media storing one or more computer programs including computer-executable instructions that, when executed one or more processors of an electronic device individually or collectively, cause the electronic device to perform at least one operation are provided. the at least one operation include performing, by the electronic device, a first scan for a first part of a plurality of frequencies for non-terrestrial networks (ntn) communication by using a first radio frequency (rf) path of the electronic device corresponding to a first subscriber identity module (sim) capable of being used by the one or more processors, while the first scan is being performed, performing, by the electronic device, a second scan for a second part of the plurality of frequencies for the ntn communication by using a second rf path of the electronic device corresponding to a second sim capable of being used by the one or more processors, the second part at least including frequencies different from the first part, and performing, by the electronic device using the first sim, at least one operation for accessing a cell identified by the second scan.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bengaluru (IN) for samsung electronics co., ltd., Diwakar SHARMA of Bengaluru (IN) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/28
CPC Code(s): H04W52/0206
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method for handling network energy saving (nes) in a wireless network is provided. the method includes receiving, by a user equipment (ue) a radio resource control (rrc) reconfiguration message from a network entity, wherein the rrc reconfiguration message includes at least one of a cell discontinuous reception (cell-drx) configuration and a cell discontinuous transmission (cell-dtx) configuration for at least one serving cell, performing at least one of an activation and deactivation for at least one of the cell-drx configuration and the cell-dtx configuration by at least one of the rrc reconfiguration message and a downlink control information (dci) termed as dci x, and handling the nes in the wireless network upon performing at least one of the activation and deactivation for at least one of the cell-drx configuration and the cell-dtx configuration.
Inventor(s): Hyewon YANG of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaewon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02
CPC Code(s): H04W52/0219
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, configuration information associated with a wake-up signal (wus) for a discontinuous reception (drx) and monitoring the wus within an occasion for the wus based on the configuration information, while a group including the ue is in a drx mode, wherein the wus includes information on at least one sub-group associated with the wus among the group.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W52/02
CPC Code(s): H04W52/0225
Abstract: methods and apparatuses for facilitating establishment of a common power saving schedule for multiple peer-to-peer (p2p) devices in a wireless local area network (wlan). a first peer station device (sta) comprises a transceiver and a processor operably connected to the transceiver. the transceiver is configured to communicate over p2p links with one or more other peer stas. the processor is configured to determine parameters of a p2p power saving schedule. the transceiver is further configured to transmit, to the one or more other peer stas, a message including information on the parameters of the p2p power saving schedule.
Inventor(s): Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Younsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeon SHIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Hyemin CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/14, H04W52/28, H04W52/36
CPC Code(s): H04W52/146
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data rate. further, the disclosure relates to an operation of a terminal and a base station in a wireless communication system. more specifically, the disclosure relates to a method in which a terminal transmits an uplink channel and a device capable of performing the same.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W52/14
CPC Code(s): H04W52/146
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system is provided. the method includes determining a power control parameter, based on information on uplink and downlink frequency resource configuration for a physical uplink shared channel (pusch), determining a transmission power of the pusch, based on the determined power control parameter, and transmitting the pusch based on the determined transmission power.
Inventor(s): Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyojin LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L5/00, H04W28/02
CPC Code(s): H04W56/001
Abstract: disclosed is a method performed by a terminal in a wireless communication system, including performing rate matching for a code block based on a circular buffer, and transmitting, to a base station, uplink data based on the rate matching, wherein, in case that the rate matching is limited buffer rate matching (lbrm), a length of the circular buffer is determined based on a value obtained by dividing a transport block size (tbs) associated with the lbrm by a product of a number of code blocks of a transport block and a code rate associated with the lbrm.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04W36/36, H04W74/0833
CPC Code(s): H04W56/0045
Abstract: methods and apparatuses for user equipment (ue) initiated early timing advance acquisition a ue includes a transceiver configured to receive an early timing advance (ta) configuration including an early ta random access (ra) resource for a candidate cell for conditional layer 1/layer 2 triggered mobility (cltm), transmit, on the early ta ra resource, a physical random access channel (prach) preamble to the candidate cell, and receive a message including a current ta for the candidate cell. the ue further includes a processor operatively coupled to the transceiver. the processor is configured to apply the current ta to the candidate cell, and start a time alignment timer (tat) for the candidate cell.
Inventor(s): Vinay Kumar SHRIVASTAVA of Suwon-si (KR) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Suwon-si (KR) for samsung electronics co., ltd., Varini GUPTA of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W4/08, H04W76/27, H04W76/28
CPC Code(s): H04W68/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose methods for managing a paging operation in a wireless network () by a ue (). the method includes receiving a paging message from a network device (), where the ue () is in a radio resource control (rrc) inactive state. further, the method includes determining whether the ue () has received at least one of a core network (cn) paging and a group paging in the paging message. further, the method includes sending at least one of a ue identity, an access type and a temporary mobile group identity (tmgi) to an upper layer upon determining that the ue () simultaneously receives the cn paging and the group paging in the paging message. further, the method includes transiting the ue () into a radio resource control (rrc) idle state from the rrc inactive state.
Inventor(s): Hyungtae KWON of Suwon-si (KR) for samsung electronics co., ltd., Inkyu LEE of Seoul (KR) for samsung electronics co., ltd., Hongju LEE of Seoul (KR) for samsung electronics co., ltd., Sangeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun MIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/121, H04W72/542
CPC Code(s): H04W72/121
Abstract: a resource block scheduling method and an electronic device performing the method are disclosed. an electronic device according to various embodiments may comprise: at least one processor, comprising processing circuitry, and a memory electrically connected to at least one processor and storing instructions executable by the processor, wherein at least one processor, individually and/or collectively, is configured to execute the instructions and to:
Inventor(s): Hyungtae KWON of Suwon-si (KR) for samsung electronics co., ltd., Inkyu LEE of Seoul (KR) for samsung electronics co., ltd., Hongju LEE of Seoul (KR) for samsung electronics co., ltd., Sangeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun MIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/121, H04W72/542
CPC Code(s): H04W72/121
Abstract: based on channel quality information indexes (cqis) relating to a plurality of terminals, acquire achievable rates based on resource blocks being allocated to the plurality of terminals; and input the achievable rates to a trained neural network model to output a schedule for allocation of the resource blocks to the plurality of terminals, and the neural network model is configured to be trained to collect the training cqis relating to the plurality of terminals, acquire, based on the training cqis, training achievable rates based on the resource blocks being allocated to the plurality of terminals, and output the schedule, in which the sum of the rates for the plurality of terminals is maximized and fairness indexes for the plurality of terminals satisfy a configured fairness condition, using the input training achievable rates.
Inventor(s): Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L1/1829, H04L1/1867, H04W72/044
CPC Code(s): H04W72/23
Abstract: methods and apparatuses for beam indication with a downlink (dl)-related downlink control information (dci) format in a wireless communication system. a method of operating a user equipment (ue) includes receiving configuration information for a list of transmission configuration indication (tci) states; receiving tci state code points activated via a medium access control-control element (mac ce); and receiving a downlink control information (dci) format indicating at least one of the activated tci state code points. the dci format does not include a downlink (dl) assignment and includes fields set to a bit pattern. the method further includes determining a tci state to apply based on the at least one indicated tci state code point; updating, based on the determined tci state, quasi-co-location (qcl) assumption or spatial filters; and at least one of receiving based on the updated qcl assumption and transmitting based on the updated spatial filters.
Inventor(s): Zehong LIN of Guangzhou (CN) for samsung electronics co., ltd., Yongli Li of Guangzhou (CN) for samsung electronics co., ltd., Qin Zhou of Guangzhou (CN) for samsung electronics co., ltd., Tianwei Hong of Guangzhou (CN) for samsung electronics co., ltd., Fangran Ruan of Guangzhou (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/25, H04W84/12
CPC Code(s): H04W76/25
Abstract: a connection establishment method, applied to a first electronic device, includes: establishing a first wireless communication connection with at least one other electronic device identified based on a first search; determining at least one candidate electronic device from the at least one other electronic device based on the first wireless communication connection; displaying first identification information of the at least one candidate electronic device on an interface of the first electronic device; and establishing a second wireless communication connection with at least one target electronic device based on detecting a preset operation of a user and second identification information of the at least one target electronic device, wherein the at least one target electronic device includes one or more of the at least one candidate electronic device.
Inventor(s): Chao He of Allen TX (US) for samsung electronics co., ltd., Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04L5/00, H04L41/0896, H04W52/02
CPC Code(s): H04W76/28
Abstract: a method for a user equipment (ue) apparatus to reduce power consumption in response to an outcome of a signal reception. the outcome can indicate whether or not the ue needs to be active at a next discontinuous reception (drx) cycle. the signal can also provide configurations of parameters for transmissions or receptions during the next drx cycle and be used by the ue for measurements and to obtain channel state information.
Inventor(s): Hai DUONG VAN of Honoi (VN) for samsung electronics co., ltd., Minh Hieu Nguyen of Hanoi (VN) for samsung electronics co., ltd., Dien Dang Thi of Hanoi (VN) for samsung electronics co., ltd., Anh Dung Phan of Hanoi (VN) for samsung electronics co., ltd., Ngoc Son Vo of Hanoi (VN) for samsung electronics co., ltd.
IPC Code(s): H04W76/50, H04W76/10
CPC Code(s): H04W76/50
Abstract: an electronic apparatus includes: a memory for storing an instruction; and a processor operatively connected to the communication interface and the memory, and configured to execute the instruction to: identify a wireless connection state of a user terminal based on information on the wireless connection state of the user terminal in a case that an urgent call event to the user terminal occurs, transmit a wireless connection enable request to a server by using a predetermined existing connection, based on identifying that the wireless connection state of the user terminal is a disable state, and transmit an urgent call to the user terminal in a case that: the processor receives a response signal from the user terminal enabling its wireless connection after receiving the wireless connection enable request from the server, or a predetermined time elapses.
Inventor(s): Minseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Sujung KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungkyoon CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K1/11, H05K1/18
CPC Code(s): H05K1/0271
Abstract: an electronic device may include: a printed circuit board; and a capacitor disposed on the printed circuit board. the printed circuit board may include: a conductive layer including at least one slit in an area adjacent to the capacitor, and an insulation layer directly on the conductive layer and including a portion in the at least one slit. the at least one slit may be parallel to at least one side surface of the capacitor, and spaced apart from the at least one side surface of the capacitor by a first distance or less. the at least one slit may not overlap the capacitor when viewed from above.
20250040122. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyoo Ho JUNG of Suwon-si (KR) for samsung electronics co., ltd., Ye Seul LEE of Suwon-si (KR) for samsung electronics co., ltd., Jong Yeong MIN of Suwon-si (KR) for samsung electronics co., ltd., Joon Suk PARK of Suwon-si (KR) for samsung electronics co., ltd., Ji Ye BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jin Wook LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device includes a landing pad on a substrate; a lower electrode extending in a vertical direction on the landing pad, the lower electrode connected to the landing pad; a capacitor dielectric layer on the lower electrode; a doping layer between the lower electrode and the capacitor dielectric layer, the doping layer being in contact with each of the lower electrode and the capacitor dielectric layer, the doping layer is doped with first to third materials, the first material having a trivalent atom valence electron, the second material having a tetravalent atom valence electron, and the third material having a pentavalent atom valence electron; and an upper electrode on the capacitor dielectric layer.
Inventor(s): Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungbo KO of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device includes a substrate having an active region, a gate structure on the substrate, the gate structure extending across the active region in a first horizontal direction, bit line structures on bit line trenches extending in a second horizontal direction, intersecting the first horizontal direction, the bit line trenches on an upper surface of the substrate across the gate structure, contact plugs between the bit line structures, landing pad structures on the contact plugs, and an insulating pattern between the landing pad structures, the insulating pattern in contact with the bit line structures. portions of the bit line structures extend in the second horizontal direction in the bit line trenches. each of the landing pad structures includes a lower landing pad, arranged on a level lower than that of each of upper surfaces of the bit line structures, and an upper landing pad on the lower landing pad.
Inventor(s): Dongsik Kong of Suwon-si (KR) for samsung electronics co., ltd., Sungho Jang of Suwon-si (KR) for samsung electronics co., ltd., Junsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Junbum Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Choi of Suwon-si (KR) for samsung electronics co., ltd., Ilgweon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a gate structure includes a gate electrode on a substrate, the gate electrode including a lower portion and an upper portion sequentially stacked in a first direction substantially perpendicular to an upper surface of the substrate; a spacer structure including a second spacer and a first spacer sequentially stacked in a second direction substantially parallel to the upper surface of the substrate on a sidewall of the upper portion of the gate electrode; and a gate insulation pattern on a lower surface and a sidewall of the lower portion of the gate electrode and an outer sidewall of the spacer structure; wherein a cross-section of the first spacer has a shape of an “l”, and wherein the second spacer includes a material that is configured to induce a dipole at an interface of the first spacer and the gate insulation pattern.
20250040126. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taejin Kim of Suwon-si (KR) for samsung electronics co., ltd., Taejin Park of Suwon-si (KR) for samsung electronics co., ltd., Kyuchang Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyeonkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo Yim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a lower circuit pattern, a bit line shield structure, a first insulating interlayer, a bit line structure, a first contact plug, a channel and a capacitor. the lower circuit pattern is on a substrate. the bit line shield structure is on the lower circuit pattern. the first insulating interlayer is in an opening extending through the bit line shield structure. the bit line structure is on the bit line shield structure, and at least partially overlaps the bit line shield structure in a vertical direction substantially perpendicular to an upper surface of the substrate. the first contact plug extends through the first insulating interlayer to contact the bit line structure, and is electrically connected to the lower circuit pattern. the channel is on the bit line structure. the capacitor is on the channel and is electrically connected to the channel.
Inventor(s): JIN A KIM of HWASEONG-SI (KR) for samsung electronics co., ltd., SUN YOUNG LEE of SUWON-SI (KR) for samsung electronics co., ltd., YONG KWAN KIM of YONGIN-SI (KR) for samsung electronics co., ltd., JI YOUNG KIM of YONGIN-SI (KR) for samsung electronics co., ltd., CHANG HYUN CHO of YONGIN-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/66
CPC Code(s): H10B12/482
Abstract: a method of fabricating a semiconductor device. a cell area and a core area are defined in a substrate. a bit line structure disposed in the cell area is provided. a gate structure disposed in the core area is provided, and a core capping film disposed on the gate structure is provided. a height of the core capping film is greater than a height of the bit line structure. a first contact film is formed on the bit line structure. a second contact film is formed on the core capping film. a mask is formed on the first contact film. an upper surface of the core capping film is exposed using the mask. the first contact film is etched until a height of the first contact film becomes less than a height of the bit line structure using an etching process. in the etching process, an etching rate for the first contact film is greater than etching rates for the bit line structure and the core capping film.
Inventor(s): Seungbo KO of Suwon-si (KR) for samsung electronics co., ltd., Inwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Minyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Inho CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor device may include a device isolation layer on a side of the active region, a gate trench intersecting the active region, a gate structure in the gate trench, a bit line electrically connected to a first region of the active region, and a pad pattern electrically connected to a second region of the active region. an upper surface of the second region may be higher than an upper surface of the first region and lower than an upper surface of the bit line. a width of the bit line may be greater in an upper region than a lower region thereof. the pad pattern may contact upper and side surfaces of the second region. an upper surface of the pad pattern may be higher than an upper surface of the bit line. the gate trench may be between the first and second regions of the active region.
Inventor(s): Taeseop Choi of Suwon-si (KR) for samsung electronics co., ltd., Byunghoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Junho Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngwook Park of Suwon-si (KR) for samsung electronics co., ltd., Jiho Park of Suwon-si (KR) for samsung electronics co., ltd., Jungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihyun Hwang of Suwon-si (KR) for samsung electronics co., ltd., Minho Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes a substrate including a cell region, a core region, and a boundary region between the cell region and the core region, where the substrate includes at least one first active pattern in the cell region and a second active pattern in the core region; a first trench defined by the at least one first active pattern; and a second trench defined by the second active pattern, where an inner sidewall of the first trench defines first recesses that extend into the at least one first active pattern, an inner sidewall of the second trench defines second recesses that extend into the second active pattern, a distance between two adjacent first recesses from among the first recesses in the vertical direction corresponds to a first height, a distance between two adjacent second recesses from among the second recesses in the vertical direction corresponds to a second height.
Inventor(s): Hoonsung CHOI of Seoul (KR) for samsung electronics co., ltd., Jiyoung YUN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B20/25
CPC Code(s): H10B20/25
Abstract: a semiconductor integrated circuit device includes a standard cell on a substrate, an one time programmable (otp) memory structure at an edge portion of the standard cell, and a program transistor outside of the standard cell at a position adjacent to the edge portion of the standard cell at which the otp memory structure is provided, the program transistor being electrically connected to the otp memory structure. the otp memory structure includes a first anti-fuse and a second anti-fuse. when a program voltage is applied to the program transistor and a bias power voltage is applied to the otp memory structure, each of the first anti-fuse and the second anti-fuse becomes shorted and the bias power voltage is provided to the standard cell.
20250040140. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ju Seong MIN of Suwon-si (KR) for samsung electronics co., ltd., Jun Gyeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Min KIM of Suwon-si (KR) for samsung electronics co., ltd., Kang-Oh YUN of Suwon-si (KR) for samsung electronics co., ltd., Taek Kyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Dong Jin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jae Duk LEE of Suwon-si (KR) for samsung electronics co., ltd., Jee Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C5/06, G11C16/04, H01L25/065, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B43/40
Abstract: a semiconductor memory device comprises a cell structure and a peripheral circuit structure electrically connected to the cell structure. the peripheral circuit structure comprises an active region, a first gate structure comprising a first gate insulating layer intersecting the active region and in contact with the active region, a second gate structure comprising a second gate insulating layer spaced apart from the first gate structure, and in contact with the active region, and a source/drain region between the first gate structure and the second gate structure. a thickness of the first gate insulating layer is less than a thickness of the second gate insulating layer. the source/drain region comprises a first region adjacent to the first gate structure and a second region adjacent to the second gate structure. a depth of the first region is equal to a depth of the second region.
20250040145. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bonjae KOO of Suwon-si (KR) for samsung electronics co., ltd., Seulji Song of Suwon-si (KR) for samsung electronics co., ltd., Youngsun Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H01L29/78, H10B51/10, H10B51/40
CPC Code(s): H10B51/20
Abstract: a semiconductor memory device is provided. the semiconductor device includes: a stacked structure with word line plates and mold insulating layers which extend in first and second horizontal directions, and are alternately stacked in a vertical direction in a cell array region and an extension region, the plurality of word line plates forming a staircase structure in the extension region; a vertical bit line extending into the stacked structure in the cell array region; a plurality of selection layers between the plurality of word line plates and the vertical bit line; and a vertical channel transistor connected to one end of the vertical bit line. a first thickness of each of the plurality of mold insulating layers is about 1.5 times to about 3 times a second thickness of each of the plurality of word line plates.
Inventor(s): HYUN-MOOK CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a semiconductor memory device includes a peripheral circuit structure including peripheral circuits; a stacked structure on the peripheral circuit structure and including first electrode layers and first inter-electrode insulating layers that are alternately stacked; a first vertical pattern that extends into the stacked structure; a first insulating layer on the stacked structure, a second electrode layer on the first insulating layer, and a second insulating layer on the second electrode layer; a line separation pattern that extends into the second insulating layer, the second electrode layer, and the first insulating layer; and a second vertical pattern that extends into the second insulating layer, the second electrode layer, and the first insulating layer, where the second vertical pattern is electrically connected to the first vertical pattern.
20250040154. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hakseon KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk LEE of Suwon-si (KR) for samsung electronics co., ltd., Kangoh YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/065, H01L25/18, H10B41/27, H10B41/41, H10B43/27, H10B43/40
CPC Code(s): H10B80/00
Abstract: a semiconductor device includes a peripheral circuit structure; and a cell structure on the peripheral circuit structure, wherein the peripheral circuit structure comprises: a substrate comprising a cell region, a connection region adjacent to the cell region, and a pad region extending around the cell region and the connection region; a first connection structure between the substrate and the cell structure; a first peripheral circuit transistor in the cell region and/or the connection region; and a second peripheral circuit transistor in the pad region, wherein the first connection structure includes a first wiring structure and a dummy structure, the first wiring structure is electrically connected to the first peripheral circuit transistor and/or the second peripheral circuit transistor, and the dummy structure is not directly connected to the first peripheral circuit transistor.
20250040156. MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taehong MIN of Suwon-si (KR) for samsung electronics co., ltd., Minchul HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B99/00
CPC Code(s): H10B99/10
Abstract: a memory device includes: first conductive lines extending in a first horizontal direction on a substrate; second conductive lines extending on the first conductive lines in a second horizontal direction; third conductive lines extending on the second conductive lines in the first horizontal direction; first memory cells provided at portions where the first conductive lines cross the second conductive lines; second memory cells provided at portions where the second conductive lines cross the third conductive lines; first dummy patterns horizontally spaced apart from the first memory cells and the second memory cells; and second dummy patterns horizontally spaced apart from the first memory cells and the second memory cells, the second dummy patterns facing the first dummy patterns, respectively, in the second horizontal direction. the plurality of first dummy patterns and the plurality of second dummy patterns are on different vertical levels from each other.
20250040176. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngtaek Oh of Suwon-si (KR) for samsung electronics co., ltd., Jiwoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Taehun Kim of Suwon-si (KR) for samsung electronics co., ltd., Minkyung Bae of Suwon-si (KR) for samsung electronics co., ltd., Seungjae Baik of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk Lee of Suwon-si (KR) for samsung electronics co., ltd., Doohee Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L23/00, H01L25/065, H01L29/08, H01L29/10, H10B80/00
CPC Code(s): H01L29/7827
Abstract: a semiconductor device includes a peripheral circuit structure and a cell structure stacked on the peripheral circuit structure. the cell structure includes a plurality of gate electrodes spaced apart from each other in a vertical direction, a channel structure passing through the plurality of gate electrodes and extending in the vertical direction, the channel structure having a first end close to the peripheral circuit structure and a second end opposite to the first end, and a common source layer covering the second end of the channel structure. the channel structure includes a channel layer extending in the vertical direction, the common source layer includes a first region and a second region that contain impurities of different conductivity types, and the first region of the common source layer is connected to at least a portion of the channel layer.
20250040185. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngdae CHO of Suwon-si (KR) for samsung electronics co., ltd., Sungkeun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/528, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device may include a substrate layer; a source/drain epitaxial layer between first channel layers and second channel layers; a backside contact structure electrically connected to the source/drain epitaxial layer, wherein the backside contact structure is between the source/drain epitaxial layer and a lower surface of the substrate layer, first width of the source/drain epitaxial layer at an upper surface of the substrate layer is greater than a second width at an interface between the source/drain epitaxial layer and the backside contact structure, a first portion of the backside contact structure is closer than a closest end of the source/drain epitaxial layer to the lower surface of the substrate layer, the first portion of the backside contact structure has a third width, and the third width is greater than the second width.
20250040188. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yang Xu of Suwon-si (KR) for samsung electronics co., ltd., Gyeom Kim of Suwon-si (KR) for samsung electronics co., ltd., Pankwi Park of Suwon-si (KR) for samsung electronics co., ltd., Ryong Ha of Suwon-si (KR) for samsung electronics co., ltd., Yoon Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/06, H01L29/08, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/42392
Abstract: a semiconductor device includes a substrate; an active region extending in a first, horizontal, direction on the substrate, and including a first active pattern at a first height above a bottom surface of the substrate in a vertical direction and having a first width in a second, horizontal, direction, a second active pattern having a second width in the second direction different from the first width, and a transition active pattern connecting the first active pattern to the second active pattern; gate structures intersecting the active region each gate structure extending in the second direction across the substrate; source/drain regions disposed on sides of the gate structures, and including a first source/drain region disposed on the first active pattern, a second source/drain region disposed on the second active pattern, and a transition source/drain region disposed on the transition active pattern. each of the source/drain regions is disposed on the active region and includes a first epitaxial layer having a recessed upper surface and a second epitaxial layer disposed on the first epitaxial layer, at a second height above a bottom surface of the substrate in a vertical direction, a first sidewall thickness of the first epitaxial layer of the first source/drain region in the first direction is different from a second sidewall thickness of the first epitaxial layer of the second source/drain region in the first direction, at the second height, thicknesses of opposing sidewalls of the first epitaxial layer of the transition source/drain region in the first direction are different, and a vertical level of a lowermost end of the second epitaxial layer of the first source/drain region, a vertical level of a lowermost end of the second epitaxial layer of the second source/drain region, and a vertical level of a lowermost end of the second epitaxial layer of the transition source/drain region are different from each other.
20250040206. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dahye Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinchan Yun of Suwon-si (KR) for samsung electronics co., ltd., Daihong Huh of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/78
CPC Code(s): H01L29/0847
Abstract: a semiconductor device is described. the device includes lower and upper channel layers over an active region on a substrate. the device further includes a middle insulating structure disposed between the lower and the upper channels. the device includes gate structures surrounding the channel layers, lower and upper source/drain regions disposed on the active region on at least one side of the gate structures. between the lower and upper source/drain regions is a barrier structure. the lower and upper source/drain regions may each fill a lower recess region or an upper recess region, respectively. these recess regions are defined by the respective channel layers, the gate structures, and by the barrier structure. the side surface slopes within the upper and the lower recess regions may vary and the side surface slopes of each of the recess regions may be different from each other.
20250040216. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungil Park of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/06, H01L29/08, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/66545
Abstract: a semiconductor device includes a semiconductor stack body having a first surface and a second surface, and including semiconductor layers having different compositions stacked therein, wherein the semiconductor stack body has a recess in the second surface and a through-hole penetrating through the semiconductor stack body; a plurality of inactive gate structures disposed on a second surface of the semiconductor stack body; a first conductivity-type epitaxial pattern disposed in the through-hole and connected to a first impurity region in the semiconductor stack body; a second conductivity-type epitaxial pattern disposed in the recess and connected to a second impurity region in the semiconductor stack body; a first contact connected to the first conductivity-type epitaxial pattern; and a second contact connected to the second conductivity-type epitaxial pattern.
Inventor(s): Sung Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Jae Hyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin Wook YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L27/0922
Abstract: a semiconductor device includes a first active pattern extending in a first direction, a second active pattern on the first active pattern and extending in the first direction, a gate structure on the first active pattern and the second active pattern and extending in a second direction intersecting the first direction, a first source/drain region on side faces of the gate structure and connected to the first active pattern, a second source/drain region on the side faces of the gate structure and connected to the second active pattern, and an intermediate connecting layer which includes a first intermediate conductive pattern between the first active pattern and the second active pattern, and a second intermediate conductive pattern connected to the first intermediate conductive pattern between the first source/drain region and the second source/drain region.
Inventor(s): Keumseok Park of Slingerlands NY (US) for samsung electronics co., ltd., Seungchan Yun of Waterford NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L23/528, H01L29/06, H01L29/08, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L27/0922
Abstract: provided is a semiconductor device which includes: a 1source/drain region connected to a 1channel structure which is controlled by a 1gate structure; a 2source/drain region, above the 1source/drain region, connected to a 2channel structure which is controlled by a 2gate structure; and a middle isolation structure between the 1gate structure and the 2gate structure, wherein the middle isolation structure comprises two or more vertically-stacked semiconductor layers.
Inventor(s): Suk YANG of Suwon-si (KR) for samsung electronics co., ltd., Sung-Hwan JANG of Suwon-si (KR) for samsung electronics co., ltd., Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunguk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/118
CPC Code(s): H01L27/11807
Abstract: a semiconductor device includes a substrate, a first device region on the substrate, a second device region on the substrate and spaced apart from the first device region in a first direction, a first dummy region between the first device region and the second device region, and an insulating pattern in the first device region, the second device region and the first dummy region, where the first dummy region includes a seed pattern on the insulating pattern, and a seed mask pattern at least partially covering a top surface of the seed pattern and extending from the top surface of the seed pattern along a first sidewall of the seed pattern, where the insulating pattern in the first dummy region is on the substrate, and where the seed pattern includes a transition metal dichalcogenide.
20250040266. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon Park of Hwaseong-si (KR) for samsung electronics co., ltd., Hyungjin Bae of Suwon-si (KR) for samsung electronics co., ltd., Seungho Shin of Asan-si (KR) for samsung electronics co., ltd., Youngsun Oh of Hwaseong-si (KR) for samsung electronics co., ltd., Moosup Lim of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14654
Abstract: an image sensor includes a substrate including a first surface and a second surface facing the first surface, a first photodiode located in a first region of the substrate and generating photocharges from light incident on the first region, a second photodiode located in a second region of the substrate and generating photocharges from light incident on the second region, and an isolation structure defining the first region in which the first photodiode is located and the second region in which the second photodiode is located, and extending between the first photodiode and the second photodiode. an area of the second region is smaller than an area of the first region, a first end of the isolation structure is coplanar with the second surface, and the isolation structure extends in a vertical direction from the second surface of the substrate toward the first surface of the substrate.
Inventor(s): Daeuk JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngrae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Sachoun PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghyung PYO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14605
Abstract: an image sensor includes a substrate, a plurality of photodiodes in the substrate, a pixel separating pattern in the substrate separating the plurality of photodiodes, a first active pattern in the substrate at least partially overlapping a first photodiode and a second photodiode from among the plurality of photodiodes, a selection gate on the first active pattern at least partially overlapping the first photodiode, and a source follower gate on the first active pattern at least partially overlapping the second photodiode. the first photodiode is adjacent to the second photodiode. the pixel separating pattern includes a first pixel separating pattern and a second pixel separating pattern disposed between the first photodiode and the second photodiode. the first pixel separating pattern is spaced from the second pixel separating pattern. the first active pattern includes a first extrinsic region disposed between the first pixel separating pattern and the second pixel separating pattern.
20250040272. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Munhwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jieun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14607
Abstract: there is provided an image sensor including a substrate, a plurality of pixel groups respectively including a plurality of photodiodes provided in the substrate, a pixel isolation pattern provided between the plurality of photodiodes in the substrate, an auxiliary isolation pattern provided to extend inside from a surface of the substrate, and a micro lens provided on the surface of the substrate. the pixel isolation pattern includes an outer isolation pattern provided between the plurality of pixel groups and an inner isolation pattern provided between the plurality of photodiodes within the plurality of pixel group, and the auxiliary isolation pattern is provided between the outer isolation pattern and the inner isolation pattern that are spaced apart from each other or between a plurality of inner isolation patterns that are spaced apart from each other.
20250040277. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juntaek LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14621
Abstract: an image sensor includes a plurality of pixels arranged in a matrix form, photodiodes for the respective pixels, the photodiodes within a semiconductor substrate having a first surface to which light is incident and a second surface that faces away from the first surface, micro lenses over the first surface of the semiconductor substrate and configured to concentrate the light, color filters between the semiconductor substrate and the micro lenses, and an optical path changing member configured to change a path of at least a portion of the light when the light travels toward the photodiodes through the micro lenses. the optical path changing member having a curved surface being concave or convex on the first surface of the semiconductor substrate.
20250040279. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minkwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwoo HONG of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun GO of Suwon-si (KR) for samsung electronics co., ltd., Haneul KIM of Suwon-si (KR) for samsung electronics co., ltd., Chang Kyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Keun Yeong CHO of Suwon-si (KR) for samsung electronics co., ltd., Joonhyuk HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14627
Abstract: an image sensor includes a pixel array in which pixels having photoelectric conversion elements are arranged in a matrix, color filters corresponding to the pixels and configured to selectively transmit light of at least two different wavelength bands, and microlenses on the color filters. at least some of the microlenses may have different shapes depending on respective wavelength bands that respective corresponding color filters at least partially overlapping with the at least some microlenses are configured to selectively transmit, such that the at least some microlenses are configured to compensate for chromatic aberration between the lights passing through the respective corresponding color filters.
Inventor(s): Jihun LIM of Suwon-si (KR) for samsung electronics co., ltd., Sungki MIN of Suwon-si (KR) for samsung electronics co., ltd., Chang Kyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongkun JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14636
Abstract: an image sensor includes a substrate region having a photoelectric conversion region and a floating diffusion region therein. the floating diffusion region is configured to receive charges generated in the photoelectric conversion region in response to light incident the photoelectric conversion region. first and second horizontal conductive lines are provided that extend on the substrate region, but at different heights relative to a surface of the substrate region. the first horizontal conductive line is electrically connected to the floating diffusion region and has a thickness smaller than a thickness of the second horizontal conductive line. in addition, the first horizontal conductive line extends closer to the substrate region than the second horizontal conductive line.
Inventor(s): Ji Hyun MIN of Suwon-si (KR) for samsung electronics co., ltd., DAEUN YOON of Suwon-si (KR) for samsung electronics co., ltd., Won Sik YOON of Suwon-si (KR) for samsung electronics co., ltd., Jae Yong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hogeun CHANG of Suwon-si (KR) for samsung electronics co., ltd., Hyundong HA of Suwon-si (KR) for samsung electronics co., ltd., Yong Seok HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/06, H01L25/075, H01L33/00, H01L33/28, H01L33/30
CPC Code(s): H01L33/06
Abstract: a semiconductor nanoparticle, a method of preparing the semiconductor nanoparticle, and an electroluminescent device including the semiconductor nanoparticle. the method of preparing the semiconductor nanoparticle includes contacting a zinc precursor and a sulfur precursor in the presence of a first particle at a predetermined temperature to form a semiconductor nanocrystal layer containing zinc sulfide on the first particle, wherein the first particle includes a group ii-vi compound including zinc, selenium, and, optionally, tellurium, or the first particle includes a group iii-v compound including indium and phosphorus. the predetermined temperature includes (e.g., is) a temperature (e.g., a reaction temperature) of greater than 300� c. and less than or equal to about 380� c., and the sulfur precursor includes a thiol compound of c3 (e.g. c9) to c50 or a combination thereof.
Inventor(s): Jonghak KIM of Suwon-si (KR) for samsung electronics co., ltd., Punjae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Shigeru INOUE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/32, H01L25/075, H01L33/02, H01L33/04, H01L33/14
CPC Code(s): H01L33/32
Abstract: a light emitting element is provided. the light emitting element includes: a light emitting stack including an active layer between an n-type nitride semiconductor layer and a p-type nitride semiconductor layer, the light emitting stack having a width of 5 nm or more and 200 �m or less; a first electrode connected to the n-type nitride semiconductor layer; and a second electrode connected to the p-type nitride semiconductor layer. the p-type nitride semiconductor layer has a first surface, adjacent to the active layer, and a second surface, opposite to the first surface, and includes alingan (0≤x<1, 0≤y<1, 0<z≤1), and a bandgap of the p-type nitride semiconductor layer does not increase in a stacking direction from the second surface to the first surface. the n-type nitride semiconductor layer includes a superlattice layer and an electron retardation layer.
Inventor(s): Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sooghang IHN of Suwon-si (KR) for samsung electronics co., ltd., Daun JEONG of Hwaseong-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jun CHWAE of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07F5/02, C09K11/02, C09K11/06, H10K50/12
CPC Code(s): H10K85/658
Abstract: a heterocyclic compound represented by formula 1 and an organic light-emitting device including the same:
Inventor(s): Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sooghang IHN of Suwon-si (KR) for samsung electronics co., ltd., Daun JEONG of Hwaseong-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jun CHWAE of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07F5/02, C09K11/02, C09K11/06, H10K50/12
CPC Code(s): H10K85/658
Abstract:
Inventor(s): Unghwan Pi of Suwon-si (KR) for samsung electronics co., ltd., Stuart Papworth Parkin of Munchen (DE) for samsung electronics co., ltd., Jaechun Jeon of Munchen (DE) for samsung electronics co., ltd., Jaekeun Kim of Munchen (DE) for samsung electronics co., ltd., Andrea Migliorini of Munchen (DE) for samsung electronics co., ltd.
IPC Code(s): H10N50/01, H10B61/00, H10N50/10
CPC Code(s): H10N50/01
Abstract: according to a method of manufacturing a magnetic memory device, various types of magnetic memory devices can be manufactured at low cost by manufacturing a plurality of magnetic modules by using a delamination phenomenon of pattern segments and stacking the plurality of magnetic modules to complete a stacked memory device.
Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd.
- A47L9/28
- A47L5/30
- A47L9/04
- A47L9/24
- H02J7/00
- CPC A47L9/2884
- Samsung electronics co., ltd.
- A47L15/42
- CPC A47L15/4223
- A61B5/024
- A61B5/00
- A61B5/11
- G16H10/60
- G16H40/67
- CPC A61B5/02433
- G06F1/16
- CPC A61B5/1121
- A61B5/0205
- A61B5/117
- G16H20/00
- CPC A61B5/7282
- A61H3/00
- A61H1/02
- CPC A61H3/00
- A63B24/00
- A63B71/06
- CPC A63B24/0006
- CPC A63B24/0062
- B23K3/08
- B23K3/04
- B23K101/40
- H01L23/00
- CPC B23K3/085
- B23K26/042
- B23K26/03
- B23K26/064
- B23K26/53
- CPC B23K26/042
- B60R16/023
- B60K35/22
- H04L67/12
- H04W4/48
- H04W56/00
- CPC B60R16/023
- C02F1/00
- C02F103/00
- CPC C02F1/001
- D06B1/02
- D06B23/20
- CPC D06B1/02
- D06F34/34
- D06F34/32
- H05K1/18
- CPC D06F34/34
- D06F58/22
- D06F58/04
- D06F105/60
- CPC D06F58/22
- D06F58/45
- D06F58/50
- D06F105/24
- CPC D06F58/45
- F16M11/04
- F16M11/10
- CPC F16M11/041
- F25D21/00
- CPC F25D21/008
- F25D23/12
- F25D11/02
- F25D23/02
- F25D23/04
- F25D29/00
- CPC F25D23/126
- G01C21/36
- CPC G01C21/3629
- G01D5/24
- H04M1/72454
- CPC G01D5/24
- G01N21/95
- G01N21/88
- CPC G01N21/95
- H01L21/66
- G06T7/00
- G06T7/13
- CPC G01N21/9503
- G01R33/12
- G01N27/04
- G01N27/72
- G01R27/16
- CPC G01R33/12
- G01S7/00
- G01S13/42
- CPC G01S7/006
- G01S13/04
- G01S7/03
- CPC G01S13/04
- G02B3/14
- G02B27/00
- G02B27/01
- G02B27/09
- CPC G02B3/14
- CPC G02B27/0172
- G03F1/36
- CPC G03F1/36
- CPC G06F1/1652
- G09F9/30
- CPC G06F1/1681
- CPC G06F1/169
- G06F1/20
- CPC G06F1/203
- G06F1/3212
- CPC G06F1/3212
- G06F3/041
- G06F3/044
- G06F3/14
- G06F3/147
- CPC G06F3/0416
- G06F3/06
- CPC G06F3/0616
- G06F12/1009
- CPC G06F3/0619
- CPC G06F3/064
- CPC G06F3/0655
- G06F3/01
- CPC G06F3/1423
- G06F11/07
- G06F11/34
- CPC G06F11/0721
- G06F11/10
- CPC G06F11/1004
- CPC G06F11/1008
- G06F13/16
- G06F13/40
- G06F13/42
- CPC G06F13/1673
- G06F13/362
- CPC G06F13/362
- G06F9/4401
- G06F12/0802
- G06F12/0808
- G06F12/1045
- G06F13/28
- G06F15/173
- H04L49/351
- H04L49/45
- CPC G06F13/4027
- G06F21/32
- CPC G06F21/32
- G06F30/13
- G06F30/27
- CPC G06F30/13
- G06N3/048
- G06F17/17
- CPC G06N3/048
- G06N3/08
- G06N3/04
- H04L9/00
- CPC G06N3/08
- G06T3/40
- H04N23/80
- H04N23/84
- CPC G06T3/4053
- G06T5/73
- CPC G06T5/73
- G06T5/00
- CPC G06T5/75
- G06T17/00
- G06V10/25
- CPC G06T17/00
- G06T19/00
- CPC G06T19/006
- G06T19/20
- G06F3/02
- CPC G06T19/20
- G06V20/50
- G06F18/20
- G06F18/2431
- G06V10/70
- G06V10/764
- G06V10/94
- G06V20/64
- CPC G06V20/50
- G06V20/58
- G06V10/22
- G06V10/26
- G06V10/776
- G06V10/82
- G06V10/98
- CPC G06V20/58
- G06V20/59
- G06V40/20
- CPC G06V20/597
- G06V20/69
- CPC G06V20/698
- G08B3/10
- H04S7/00
- CPC G08B3/1008
- G09G3/00
- G02B30/34
- G03H1/22
- G09G3/32
- CPC G09G3/001
- G06F3/0482
- G06F3/0485
- G06F3/0488
- G06F9/451
- CPC G09G3/035
- G09G3/20
- CPC G09G3/2007
- G09G3/3258
- CPC G09G3/3258
- G09G5/14
- G06F3/0362
- CPC G09G5/14
- G10L15/18
- CPC G10L15/1815
- G11C11/4093
- G11C7/10
- G11C11/4076
- H01L23/48
- H03K19/0175
- H10B80/00
- CPC G11C11/4093
- G11C16/34
- G11C16/26
- CPC G11C16/3459
- G11C29/12
- CPC G11C29/1201
- H01L21/67
- CPC H01L21/67132
- H01L23/373
- H01L23/498
- CPC H01L23/3735
- H01L23/31
- H01L25/18
- CPC H01L23/49811
- H01L23/36
- CPC H01L23/49816
- H01L25/065
- CPC H01L23/49827
- H01L23/367
- H01L23/49
- H01L25/16
- CPC H01L23/49838
- H01L21/768
- H01L23/28
- H01L25/10
- CPC H01L23/49894
- H01L23/528
- H10B12/00
- CPC H01L23/5283
- H01L29/06
- H01L29/40
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- CPC H01L23/5286
- H01L23/538
- CPC H01L23/5381
- CPC H01L23/5385
- CPC H01L23/5386
- H01L23/544
- CPC H01L23/544
- H01L23/552
- H01L21/56
- CPC H01L23/552
- H01L23/58
- CPC H01L23/585
- H01L27/146
- CPC H01L24/08
- CPC H01L25/0652
- CPC H01L25/0657
- CPC H01L25/105
- CPC H01L25/167
- H01Q21/24
- H01Q21/00
- H04B1/04
- CPC H01Q21/24
- H02J50/10
- H02M3/158
- H04R1/10
- CPC H02J7/00712
- H02J50/12
- CPC H02J50/12
- H02J50/80
- H02J50/20
- H02J50/40
- CPC H02J50/80
- H02K1/14
- CPC H02K1/146
- H03F1/02
- H03F3/45
- CPC H03F1/0244
- H03F3/213
- H03F1/56
- H03F3/24
- CPC H03F3/213
- H03K7/08
- CPC H03K7/08
- H03M1/06
- CPC H03M1/0604
- H03M1/12
- H03M1/40
- CPC H03M1/1255
- H03M1/34
- H04N25/77
- CPC H03M1/34
- H04B7/06
- H04W24/10
- H04W72/23
- CPC H04B7/0626
- H04W72/1273
- H04B7/0408
- CPC H04B7/06952
- H04L5/00
- H04L5/14
- CPC H04L5/0048
- CPC H04L5/0053
- H04L9/32
- CPC H04L9/32
- H04L25/02
- CPC H04L25/0254
- H04M1/02
- CPC H04M1/0268
- H04M1/72469
- H04M1/72412
- CPC H04M1/72469
- H04N5/77
- G06V10/44
- G06V10/74
- G06V10/75
- G06V20/40
- G06V40/16
- H04N23/60
- CPC H04N5/77
- H04N19/119
- H04N19/176
- CPC H04N19/119
- H04N21/234
- G06V10/42
- H04N21/845
- CPC H04N21/23424
- H04N21/472
- G06F3/16
- G10L15/08
- G10L15/22
- G10L15/30
- CPC H04N21/47202
- CPC H04N21/8456
- H04N23/55
- G02B5/04
- G02B5/20
- H04N23/61
- H04N23/68
- CPC H04N23/55
- CPC H04N23/683
- H04N23/88
- H04N23/951
- H04N25/11
- CPC H04N23/843
- H04N5/265
- H04N25/60
- CPC H04N23/88
- H04N25/40
- H04N25/42
- CPC H04N25/41
- H04N25/633
- H04N25/709
- CPC H04N25/633
- CPC H04R1/1025
- H04R3/12
- CPC H04R3/12
- H04W16/10
- H04W28/20
- CPC H04W16/10
- H04W24/02
- H04L41/0816
- H04L41/0893
- H04W28/24
- CPC H04W24/02
- H04W8/22
- H04W12/06
- H04W12/106
- H04W60/04
- CPC H04W24/10
- H04W28/02
- H04W28/086
- CPC H04W28/0284
- H04W28/18
- H04W72/0446
- CPC H04W28/18
- H04W36/00
- H04W36/08
- H04W36/36
- CPC H04W36/0069
- H04W36/26
- H04W48/18
- CPC H04W36/26
- H04W36/30
- CPC H04W36/30
- H04W36/14
- H04W76/15
- H04W84/12
- CPC H04W36/304
- H04W48/20
- H04W8/18
- H04W48/16
- H04W88/06
- CPC H04W48/20
- H04W52/02
- H04W76/28
- CPC H04W52/0206
- CPC H04W52/0219
- CPC H04W52/0225
- H04W52/14
- H04W52/28
- H04W52/36
- CPC H04W52/146
- CPC H04W56/001
- H04W74/0833
- CPC H04W56/0045
- H04W68/02
- H04W4/08
- H04W76/27
- CPC H04W68/02
- H04W72/121
- H04W72/542
- CPC H04W72/121
- H04L1/1829
- H04L1/1867
- H04W72/044
- CPC H04W72/23
- H04W76/25
- CPC H04W76/25
- H04L41/0896
- CPC H04W76/28
- H04W76/50
- H04W76/10
- CPC H04W76/50
- H05K1/02
- H05K1/11
- CPC H05K1/0271
- CPC H10B12/315
- CPC H10B12/34
- CPC H10B12/482
- CPC H10B12/485
- CPC H10B12/50
- H10B20/25
- CPC H10B20/25
- H10B43/40
- G11C5/06
- G11C16/04
- H10B43/27
- H10B43/35
- CPC H10B43/40
- H10B51/20
- H01L29/78
- H10B51/10
- H10B51/40
- CPC H10B51/20
- H01L25/00
- CPC H10B80/00
- H10B41/27
- H10B41/41
- H10B99/00
- CPC H10B99/10
- H01L29/08
- H01L29/10
- CPC H01L29/7827
- H01L29/786
- CPC H01L29/41733
- CPC H01L29/42392
- CPC H01L29/0847
- CPC H01L29/66545
- H01L27/092
- H01L21/822
- H01L21/8238
- CPC H01L27/0922
- H01L27/118
- CPC H01L27/11807
- CPC H01L27/14654
- CPC H01L27/14605
- CPC H01L27/14607
- CPC H01L27/14621
- CPC H01L27/14627
- CPC H01L27/14636
- H01L33/06
- H01L25/075
- H01L33/00
- H01L33/28
- H01L33/30
- CPC H01L33/06
- H01L33/32
- H01L33/02
- H01L33/04
- H01L33/14
- CPC H01L33/32
- H10K85/60
- C07F5/02
- C09K11/02
- C09K11/06
- H10K50/12
- CPC H10K85/658
- H10N50/01
- H10B61/00
- H10N50/10
- CPC H10N50/01
