Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
Patent Applications by Samsung Electronics Co., Ltd. on January 23rd, 2025
Samsung Electronics Co., Ltd.: 155 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (18), H01L29/423 (8), H01L25/065 (7), H01L29/06 (7), H01L23/498 (7) H01L24/05 (2), H01L33/62 (2), H01L23/49838 (2), G06N3/08 (2), H10B10/125 (2)
With keywords such as: device, surface, layer, including, substrate, semiconductor, direction, based, portion, and configured in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Soohoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Juhan SEON of Suwon-si (KR) for samsung electronics co., ltd., Ahyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd., Yoonkyung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L9/00, A47L9/14, H03K5/1536
CPC Code(s): A47L9/2889
Abstract: provided is a station device configured to detect a first zero crossing point (zcp) and a second zcp with respect to an alternating current (ac) input voltage, by using a zcp circuit configured to detect a zcp of the ac input voltage applied to the station device, obtain information about a pulse width from the first zcp to the second zcp, identify whether the ac input voltage is in an overvoltage state, based on the information about the pulse width from the first zcp to the second zcp, and deactivate an operation of the suction motor, when the ac input voltage is in the overvoltage state. where detecting the first zcp and the second zcp includes detecting voltage points which are offset from 0 v by a preset value in the ac input voltage.
Inventor(s): Kunsun Eom of Seoul (KR) for samsung electronics co., ltd., Yeolho Lee of Anyang-si (KR) for samsung electronics co., ltd., Kak Namkoong of Seoul (KR) for samsung electronics co., ltd., Myounghoon Jung of Bucheon-si (KR) for samsung electronics co., ltd., Seongho Cho of Gwacheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/0537, A61B5/00, A61B5/0205, A61B5/024, A61B5/0533, A61B5/06
CPC Code(s): A61B5/0537
Abstract: the wrist-type body component measuring apparatus includes: a band configured to be worn on a wrist of a user; a first input electrode and a first output electrode disposed on an inside surface of the band and configured to be in contact with the wrist of the user; a second input electrode and a second output electrode disposed on an outside surface of the band; a measuring unit configured to apply a current to the first and second input electrodes and detect a voltage from the first and second output electrodes to measure a body impedance of the user; and an electrode converter configured to convert a disposition of the first and second input electrodes and the first and second output electrodes based on a determination of whether the band is worn on a left wrist or a right wrist of the user.
Inventor(s): Seonggyu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/117, A61B5/0205, G16H20/30
CPC Code(s): A61B5/117
Abstract: a method of providing a health care service, including: collecting, by a health care device, biometric information associated with a user corresponding to the health care device, through at least one sensor; identifying the user based on the biometric information and a user database stored in a server; and performing, by the health care device, a personalized care operation corresponding to the identified user.
Inventor(s): Vladislav Valerievich LYCHAGOV of Moscow (RU) for samsung electronics co., ltd., Anton Sergeevich MEDVEDEV of Moscow (RU) for samsung electronics co., ltd., Elena Konstantinovna VOLKOVA of Moscow (RU) for samsung electronics co., ltd., Gennady Dmitrievich MAMYKIN of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): A61B5/1455, A61B5/00, G16H10/40, G16H50/70
CPC Code(s): A61B5/1455
Abstract: a method for measuring blood constituents is provided. the method includes radiating an area of a subject's body, containing blood constituents and dynamic and static tissue components, with at least two light beams, detecting at least one backscattered light feedback from blood constituents and dynamic and static tissue components, the feedback representing at least one interferometric signal from each of the at least two light sources, filtering the at least one interferometric signals in accordance with a frequency band which contains frequencies of interferometric oscillations, defining dynamics of blood constituents, performing analog-to-digital (ad) conversion of the filtered signals at a frequency corresponding to the frequency band, to form discrete filtered signals, obtaining from the discrete filtered signals, a set of spectral-time features of signals, and obtaining concentration of the blood constituents based on functional relationships of the obtained set of spectral-time features of signals and concentrations of the blood constituents.
Inventor(s): Vidushi CHAUDHARY of Noida (IN) for samsung electronics co., ltd., Vijayanand KUMAR of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/11, A61B5/16
CPC Code(s): A61B5/486
Abstract: the disclosure relates to a method for mitigating cycle related injury by a device. the method includes: measuring data including at least one of gait pattern, cognitive pattern, and one or more physiological parameters of user from one or more sensors; determining one or more cycling phase and data related to the one or more cycling phase based on the measured data; measuring expected measure and general impact measure for an injury of the user during cycling session to determine injury probability of the user based on the expected measure and the general impact measure; and recommending at least one of a phase change and at least one associated activity to the user based on the determined injury probability.
Inventor(s): Changhyun ROH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B21/005, A63B21/00
CPC Code(s): A63B21/0058
Abstract: a wearable device may include a motor, a motor driver circuit, a frame connected to the motor, the frame to be worn on the body of the user to support the body, a processor configured to generate a control signal to control an electrical connection in the motor driver circuit, and a sensor configured to sense a body motion of the user. the processor is further configured to provide an exercise load through the frame according to a speed of the sensed body motion by controlling, based on the speed of the body motion, a changing ratio per time between a first control state in which the electrical connection in the motor driver circuit is a closed loop and a second control state in which the electrical connection in the motor driver circuit is an open loop.
Inventor(s): Beomjoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan KIM of Suwon-si (JP) for samsung electronics co., ltd., Guiwon SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63F13/52, A63F13/5378, G06T3/40, G06V10/25, G06V10/44
CPC Code(s): A63F13/52
Abstract: an electronic apparatus includes: a display; at least one memory storing at least one instruction; and at least one processor configured to execute the at least one instruction to: identify at least one region corresponding to at least one type of figure in a game image output through the display, identify at least one candidate region having at least a predetermined size among the at least one region corresponding to the at least one type of figure, identify feature information corresponding to the at least one candidate region based on pixel information corresponding to the at least one candidate region, and identify one of the at least one candidate region as a mini-map region based on the feature information.
Inventor(s): Hojoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinuk Byun of Suwon-si (KR) for samsung electronics co., ltd., Joongsuk Oh of Suwon-si (KR) for samsung electronics co., ltd., Seongryeol Kim of Suwon-si (KR) for samsung electronics co., ltd., Younggu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jaemyung Choe of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/005
CPC Code(s): B24B37/005
Abstract: the present disclosure relates to devices, methods, and systems for transforming measurement data. an example device for transforming measurement data includes a communicator configured to receive first measurement data, the first measurement data including step height values on a semiconductor chip with a chemical mechanical polishing (cmp) process performed thereon, and to receive layout data comprising a layout included in the semiconductor chip, and a processor configured to, based on the layout data, transform the first measurement data to second measurement data, the second measurement data including step height values of the semiconductor chip with a metal deposited thereon.
Inventor(s): DONGHOON KWON of Suwon-si (KR) for samsung electronics co., ltd., BOUN YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/04, B24B37/27, B24B53/017, B24B57/02
CPC Code(s): B24B37/04
Abstract: a chemical mechanical polishing apparatus including a substrate support plate configured to support a substrate, a rotation member positioned on the substrate support plate and configured to include a polishing pad for polishing the substrate, and a jig member positioned on the substrate support plate and movably connected to the rotation member.
Inventor(s): Sin Ae KIM of Suwon-si (KR) for samsung electronics co., ltd., Byoung In LEE of Suwon-si (KR) for samsung electronics co., ltd., Dong Woo HA of Suwon-si (KR) for samsung electronics co., ltd., Seok Man HONG of Suwon-si (KR) for samsung electronics co., ltd., Dong Jun KIM of Suwon-si (KR) for samsung electronics co., ltd., Ji Won CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J15/04, A47L11/10, A47L11/40, A47L13/16, B25J9/00, B25J11/00, B25J15/00
CPC Code(s): B25J15/0441
Abstract: a cleaning system is provided. the cleaning system includes a robot cleaner and a station. the robot cleaner includes a pad fixing part on which a cleaning pad is detachably mounted, a lifter to lift a part of the robot cleaner at which the pad fixing part is positioned, and a pad detacher to detach the cleaning pad mounted on the pad fixing part. the station includes a pad storage box in which a cleaning pad that is to be provided to the robot cleaner is stored, a pad coupling part on which a cleaning pad that is to be coupled to the robot cleaner is rested, and a pad supplier to supply the cleaning pad stored in the pad storage box to the pad coupling part.
Inventor(s): Joonhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Munseong KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F04C18/344, F25B31/02
CPC Code(s): F04C18/3448
Abstract: a rotary compressor includes: a case; a cylinder inside the case and has an internal space, and which includes a rolling piston configured to eccentrically rotate in the internal space, a vane in contact with the rolling piston such that while the vane is in contact with the rolling piston, the internal space of the cylinder is divided into a suction chamber and a compression chamber, a suction port to allow refrigerant to flow to the suction chamber, and a discharge port to allow the refrigerant to be discharged the compression chamber; a drive device that includes a rotation shaft connected to the rolling piston and a motor configured to rotate the rotation shaft; and a valve member that is fixed to a side surface of the vane and selectively opens and closes the discharge port as the vane reciprocates back and forth.
Inventor(s): Youngin SON of Suwon-si (KR) for samsung electronics co., ltd., Gwangchel JEONG of Suwon-si (KR) for samsung electronics co., ltd., Junkyu JUNG of Suwon-si (KR) for samsung electronics co., ltd., Yonghwa CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/16
CPC Code(s): F24F1/16
Abstract: the present disclosure relates to an outdoor unit of an air conditioner. the outdoor unit includes: a plurality of first refrigerant tubes arranged along a first column extending in a first direction, a plurality of second refrigerant tubes arranged along a second column parallel to the first column, a first holder including a first support plate supporting the plurality of first refrigerant tubes, a first extension extending from one side of the first support plate, and a second extension extending from another side of the first support plate, and a second holder including a second support plate supporting the plurality of second refrigerant tubes, a third extension extending from one side of the second support plate, and a fourth extension extending from another side of the second support plate. the second extension is disposed between the first extension and the second holder, and the third extension is disposed between the fourth extension and the first holder. the second extension and the third extension are in contact with and coupled to each other.
Inventor(s): Geuna LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok CHANG of Suwon-si (KR) for samsung electronics co., ltd., Bongsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jungsu PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghun SONG of Suwon-si (KR) for samsung electronics co., ltd., Minwoo YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01L19/14
CPC Code(s): G01L19/14
Abstract: according to an embodiment of the disclosure, an electronic device may include: a housing including a first surface and a second surface facing opposite to the first surface, a printed circuit board disposed in a space between the first surface and the second surface, a sensor assembly comprising at least one sensor disposed between the first surface and the printed circuit board and including first contact members comprising a conductive material disposed on a surface facing the printed circuit board, an elastic member comprising an elastic material disposed between the printed circuit board and the sensor assembly, and an electrically conductive plate disposed between the printed circuit board and the elastic member. in an embodiment, at least one of the first contact members may be electrically connected to the printed circuit board.
20250027875. OPTICAL IMAGING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungryeol Oh of Suwon-si (KR) for samsung electronics co., ltd., Hidong Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Ahn of Suwon-si (KR) for samsung electronics co., ltd., Seongsil Lee of Suwon-si (KR) for samsung electronics co., ltd., Suyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyeongcheol Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/31
CPC Code(s): G01N21/31
Abstract: an optical imaging device includes a pulse generator including a pulse generating device configured to generate pulse lasers and a pulse expander configured to receive a pulse laser from the pulse generating device, and generate a broadened pulse laser by expanding a spectrum and width of the received pulse laser, an optical assembly including an objective lens configured to receive the broadened pulse laser and pass the received broadened pulse laser to a target object, and a light receiver including a light receiving device configured to receive a reflected pulse laser corresponding to the broadened pulse laser reflected from the target object and convert the reflected pulse laser into an electrical signal, and at least one processor configured to generate a spectral image set based on the electrical signal generated by the light receiving device.
Inventor(s): Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Yeonggyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/88, G08B21/18, H04M1/02, H04M1/24
CPC Code(s): G01N21/8806
Abstract: an electronic device according to an embodiment an electronic device includes a first housing, a second housing, a flexible display, a drive device, a light-emitting circuit, a light-receiving circuit, and at least one processor operably coupled with the flexible display, the drive device, the light-emitting circuit, and the light-receiving circuit. the at least one processor is configured to emit light by using the light-emitting circuit on the basis of extraction or insertion of the flexible display, identify an abnormal state in a display area of the flexible display by using the light-receiving circuit, and in response to the identification, provide a visual notification of the abnormal state in the display area of the flexible display.
Inventor(s): Seaeun Park of Suwon-si (KR) for samsung electronics co., ltd., Saeeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Thai Hoang Nguyen of Seoul-si (VN) for samsung electronics co., ltd., Joon-sung Yang of Seoul-si (VN) for samsung electronics co., ltd.
IPC Code(s): G01R31/3185
CPC Code(s): G01R31/318541
Abstract: an integrated circuit may include a plurality of combinational logic circuits including a first combinational logic circuit, a plurality of flip-flops including a first flip-flop configured to receive a first scan input signal and a first data signal, and a first core block including a multiplexer. the multiplexer may be configured to select, based on a test control signal, one of a primary input signal received through a primary input terminal and an output signal of the first flip-flop and provide the selected signal to the first combinational logic circuit. the first flip-flop may be further configured to selectively receive, based on a scan control signal, one of the first scan input signal and the first data signal.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Wei Sun of Allen TX (US) for samsung electronics co., ltd., Bilal Sadiq of Plano TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Kyeong Jin Kim of Plano TX (US) for samsung electronics co., ltd., Shunyao Wu of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S5/02, G01S5/04, G01S5/14
CPC Code(s): G01S5/0268
Abstract: a method includes obtaining range estimates and carrier phase estimates from each of multiple anchors. the method also includes, in response to determining that a trilateration technique is to be performed, (i) obtaining improved range estimates using the carrier phase estimates and (ii) determining a first location estimate of a target device using the trilateration technique and the improved range estimates. the method also includes, in response to determining that a triangulation technique is to be performed, (i) obtaining differential range estimates using the carrier phase estimates and (ii) determining a second location estimate of the target device using the triangulation technique and the differential range estimates. the method also includes combining the first location estimate and the second location estimate to determine an overall location estimate of the target device.
Inventor(s): Chul Joon HEO of Suwon-si (KR) for samsung electronics co., ltd., Hyunchae CHUN of Incheon (KR) for samsung electronics co., ltd., Minseok YOO of Incheon (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S5/16
CPC Code(s): G01S5/16
Abstract: a method and a device for estimating a position of a device by using an optical signal through converting a linearly polarized optical signal to a plurality of electric signals using a plurality of photoelectric devices, estimating a moving distance of the device from a reference position by using the plurality of electric signals, and estimating an orientation angle of the device with respect to a reference direction by using the plurality of electric signals are provided.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Bilal Sadiq of Plano TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S13/76
CPC Code(s): G01S13/765
Abstract: methods and apparatuses for carrier-phase reporting in wifi ranging. a method of wireless communication performed by an initiating station (ista) comprises: providing one or more mechanisms to report carrier-phase information during a fine timing measurement (ftm) protocol between the ista and a responding station (rsta); enabling, via the carrier-phase information, carrier-phase-based relative ranging; and utilizing the carrier-phase information to modify an accuracy for ftm ranging.
Inventor(s): Sangyoup SEOK of Suwon-si (KR) for samsung electronics co., ltd., Gyeongtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Heebo SHIM of Suwon-si (KR) for samsung electronics co., ltd., Dongoh LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Changmin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01, G02B7/02
CPC Code(s): G02B27/0176
Abstract: an electronic device is provided. the electronic device includes a first lens support, a second lens support movable with respect to the first lens support, a first moving member coupled to the first lens support to move together with the first lens support, a second moving member coupled to the second lens support to move together with the second lens support, a plurality of friction members penetrating the first moving member and the second moving member and movable with respect to each other, and at least one deforming member disposed between the plurality of friction members and configured to press each of the plurality of friction members in a direction away from each other friction member.
Inventor(s): Heungsuk OH of Suwon-si (KR) for samsung electronics co., ltd., Hun KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sujin OH of Suwon-si (KR) for samsung electronics co., ltd., Jinseok OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36, G03F1/70, G06F30/392, G06F119/18
CPC Code(s): G03F1/36
Abstract: provided are an optical proximity correction (opc) method capable of maintaining full-chip bias consistency and a mask manufacturing method including the opc method. the opc method includes obtaining a first optical proximity corrected (opced) design layout by implementing a first opc on an opc target design layout; performing a reverse dissection on the opc target design layout based on the first opced design layout to generate first segments; performing a reverse correction to allocate first biases of the first opced design layout to the first segments of the opc target design layout; determining a full-chip representative bias based on a segment grouping of the first segments; applying the full-chip representative bias to an entire chip area; preparing mask data based on the full-chip representative bias that has been applied to the entire chip area; and exposing a mask substrate based on the mask data.
20250028257. SEMICONDUCTOR PROCESS APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyoungwhan Oh of Suwon-si (KR) for samsung electronics co., ltd., Dahae Lee of Suwon-si (KR) for samsung electronics co., ltd., Eunhee Jeang of Suwon-si (KR) for samsung electronics co., ltd., Chulmin Cho of Suwon-si (KR) for samsung electronics co., ltd., Kyungwon Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G03F7/20
CPC Code(s): G03F7/70991
Abstract: a semiconductor process apparatus includes a light generator configured to output extreme ultraviolet (euv) light having an euv wavelength band, a mask stage configured to seat a mask reflecting the euv light output from the light generator, a light-receiving optical unit including a plurality of mirrors generating output light by reflecting the euv light reflected from the mask, at least one of the plurality of mirrors including a mirror body and a reflective layer attached to a surface of the mirror body, a power supply configured to apply a bias voltage to the reflective layer, and a substrate stage configured to seat a substrate to be irradiated with the output light.
20250028285. WEARABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngtae JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jaejong RYU of Suwon-si (KR) for samsung electronics co., ltd., Hyohoon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jaeyong SIM of Suwon-si (KR) for samsung electronics co., ltd., Dongheon JANG of Suwon-si (KR) for samsung electronics co., ltd., Chulwoo JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G04G17/04, G04G9/08
CPC Code(s): G04G17/045
Abstract: a wearable electronic device includes an outer circumferential wall, a supporting member inside the outer circumferential wall, a window spaced apart from an upper side of the supporting member, a display spaced apart from the outer circumferential wall and between the supporting member and the window, and a support including a first portion between the display and the outer circumferential wall and a second portion between the display and the supporting member, the second portion extending from the first portion.
Inventor(s): Jinah KONG of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Yeeun Choi of Suwon-si (KR) for samsung electronics co., ltd., Hoon Han of Suwon-si (KR) for samsung electronics co., ltd., Jiwoong Hwang of Suwon-si (KR) for samsung electronics co., ltd., Hyoin Ahn of Suwon-si (KR) for samsung electronics co., ltd., Yeojun Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/246, G05D107/40, G05D111/10, H04N23/695
CPC Code(s): G05D1/246
Abstract: a robot device includes: a sensor; a memory storing map information corresponding to a predetermined space and including a plurality of zones; and a processor that identifies a position of user, identifies whether the user is positioned in a first zone among the plurality of zones, based on the identified position of the user and the map information, and based on identifying that the user is positioned in the first zone, identifies a movement path of the robot device based on remaining zones except for the first zone among the plurality of zones.
Inventor(s): Garam LEE of Suwon-si (KR) for samsung electronics co., ltd., Taejeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Byounggyu Park of Suwon-si (KR) for samsung electronics co., ltd., Moonsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1624
Abstract: an electronic device includes: a flexible display, a multi-bar structure including a plurality of bars spaced apart from each other on a rear surface of the flexible display, and a first rail frame and a second rail frame coupled to two opposite sides of the multi-bar structure, each including a guide rail guiding movement of the multi-bar structure. at least one bar of the plurality of bars includes a supporting member including a stop portion engaged with the guide rail of the first rail frame or the guide rail of the second rail frame. at least one of the guide rail of the first guide frame and the guide rail of the second guide frame includes a stop jaw configured to engage the stop portion.
Inventor(s): Jungchul AN of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Bowon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/046
CPC Code(s): G06F1/1641
Abstract: a foldable electronic device includes: a housing including a first housing and a second housing part, a flexible display including a first display region, a second display region, and a third display region, a first layer including an electromagnetic induction panel disposed below the first display region, a second layer contacting the second display region, a first magnet, and a second magnet. the second layer includes a shielding member comprising a shielding sheet disposed between the second magnet and a portion of the electromagnetic induction panel, and a waterproof member comprising a waterproof material at least partially surrounding the shielding member.
Inventor(s): Daehyeong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, E05D3/12
CPC Code(s): G06F1/1681
Abstract: disclosed are an hinge structure including: a first housing, a second housing, a hinge, and a flexible display, the hinge structure includes: a first rotation part, a second rotation part, a fixing bracket, and a structure, the structure includes a first rotary shaft, a second rotary shaft, a first main gear formed in the first rotary shaft, a second main gear formed in the second rotary shaft, and at least one idle gear disposed between the first main gear and the second main gear, and the first gear may be geared with the first main gear, and the second gar may be geared with the second main gear, and a foldable electronic device including the same.
Inventor(s): Jinik KIM of Suwon-si (KR) for samsung electronics co., ltd., Namjoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0346, G04G21/02, G06F3/01, G06F3/02, G06F3/0362, G06F3/038, G06F3/041
CPC Code(s): G06F3/0346
Abstract: a wearable device, a sensing information-based input control method of a wearable device, and a recording medium are provided. a wearable device includes an input interface, a first sensor, a second sensor, a display, and at least one processor configured to identify a direction and an angle in which the display faces, determine that the direction in which the display faces corresponds to an outside of a field-of-view range of a user when the identified direction and angle is outside a pre-configured range, configure an input determination threshold value of the input interface to be changed from a configured first threshold value to a second threshold value when determining that the direction in which the display faces corresponds to an outside of the field-of-view range of the user, and perform an operation corresponding to an input when a value greater than the input determination threshold value is input through the input interface.
Inventor(s): Kyungho Lee of Suwon-si (KR) for samsung electronics co., ltd., Kiheung Kim of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Oh of Suwon-si (KR) for samsung electronics co., ltd., Jongcheol Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyongryol Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0623
Abstract: a semiconductor memory device includes a memory cell array including a plurality of memory cell rows and a row hammer management circuit. the row hammer management circuit stores counted values in count cells of each of the plurality of memory cell rows as count data, and performs an internal read-update-write operation to read the count data from the count cells of a target memory cell row from among the plurality of memory cell rows, to update the count data that was read to obtain updated count data, and to write the updated count data in the count cells of the target memory cell row. the row hammer management circuit includes a hammer address queue. the row hammer management circuit changes the updated count data randomly, based on an event signal indicating a state change of the hammer address queue.
Inventor(s): Jongsun PARK of Seoul (KR) for samsung electronics co., ltd., Dongsu KIM of Seoul (KR) for samsung electronics co., ltd., Seonggeon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G11C11/16, H03K19/17728
CPC Code(s): G06F3/0625
Abstract: disclosed is a field programmable gate array device including a plurality of lookup tables each storing data. each lookup table includes a cell array including cells connected to a plurality of word lines, a drive circuit connected to the cell array through the plurality of word lines, and a peripheral circuit connected to the cell array through a plurality of bit lines and source lines, and configured to control the drive circuit. the drive circuit drives a first word line among the word lines based on first input signals. the peripheral circuit performs a data write operation on a first cell connected to the first word line, based on a first command and a second input signal, and performs a data read operation on the first cell connected to the first word line, based on a second command and the second input signal.
Inventor(s): Hari Krishnan Thiruvalli VENUGOPALAN of Bengaluru (IN) for samsung electronics co., ltd., Karthik SRINIVASAN of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: a system and method for implementing asynchronous read/write operations in a double data rate (ddr) controller to reduce dynamic random access memory (dram) access latency. the system provides a program configurable interface to the ddr controller for pre-fetching data from a memory address of interest into cache, for serving an asynchronous read operation. the asynchronous read operation minimizes or reduces pre-charge latency, row address select (ras) latency, and column address select (cas) latency. the system provides a program configurable interface to the ddr controller the read operation or the write operation being for providing buffer data directly to the ddr controller to handle an asynchronous write operation.
Inventor(s): Soo-Young Ji of Suwon-si (KR) for samsung electronics co., ltd., Seo-Hyun Shin of Suwon-si (KR) for samsung electronics co., ltd., Hyun Joon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Seung Han Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F13/42
CPC Code(s): G06F3/0659
Abstract: a storage system includes: a first device connected to a host through an interface including a first and second switches; and a second device connected to the host through the interface. the first device includes: a first controller; a first memory; and a first shared memory including information about a first degradation of the first memory. the second device includes: a second controller; a second memory; and a second shared memory including information about a second degradation of the second memory, the second shared memory being accessible by the first controller through the first switch, and wherein the first controller is configured to: receive a command related to an operation of the first memory from the host, and control the second controller to perform the command, instead of the first controller, based on identifying that the first degradation is higher than the second degradation.
Inventor(s): Ali Shafiee Ardestani of San Jose CA (US) for samsung electronics co., ltd., Joseph Hassoun of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F7/544, G06F9/30, G06N3/063
CPC Code(s): G06F7/5443
Abstract: a method for performing a convolution operation includes storing, a convolution kernel in a first storage device, the convolution kernel having dimensions x by y; storing, in a second storage device, a first subset of element values of an input feature map having dimensions n by m; performing a first simultaneous multiplication, of each value of the first subset of element values of the input feature map with a first element value from among the x*y elements of the convolution kernel; for each remaining value of the x*y elements of the convolution kernel, performing, a simultaneous multiplication of the remaining value with a corresponding subset of element values of the input feature map; for each simultaneous multiplication, storing, result of the simultaneous multiplication in an accumulator; and outputting, the values of the accumulator as a first row of an output feature map.
20250028642. COHERENT MEMORY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Krishna T. MALLADI of San Jose CA (US) for samsung electronics co., ltd., Andrew Z. CHANG of Los Altos CA (US) for samsung electronics co., ltd., Ehsan NAJAFABADI of Duluth GA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0817
CPC Code(s): G06F12/0828
Abstract: a coherent memory system. in some embodiments, the coherent memory system includes a first memory device. the first memory device may include a cache coherent controller; a volatile memory controller; a volatile memory; a nonvolatile memory controller; and a nonvolatile memory. the first memory device may be configured to receive a quality of service requirement and to selectively enable a first feature in response to the quality of service requirement.
Inventor(s): Qirui Yang of San Diego CA (US) for samsung electronics co., ltd., Bridget Davis of San Diego CA (US) for samsung electronics co., ltd., Devasena Inupakutika of Rockville MD (US) for samsung electronics co., ltd., Peter Chen of San Diego CA (US) for samsung electronics co., ltd., Bradley Carpenter of Sammamish WA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0895, G06F12/123
CPC Code(s): G06F12/0895
Abstract: a method for data storage includes receiving, by a storage device, a read request for data, the read request being associated with a request size, determining that a first cache area associated with a first portion of the data is in a first portion of a cache, the first cache area having a first size that is smaller than the request size, determining that a second cache area associated with a second portion of the data is in a second portion of the cache, the second cache area having a second size that is smaller than the request size and differently sized than the first size, and based on the read request, reading the first portion of the data from the first cache area and reading the second portion of the data from the second cache area.
Inventor(s): Patrick Anthony LA FRATTA of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/1009, G06F12/0831
CPC Code(s): G06F12/1009
Abstract: a method may include allocating a first memory page from a first portion of an address space based on a first access pattern for the first memory page, and allocating a second memory page from a second portion of the address space based on a second access pattern for the second memory page. the first portion of the address space may be configured for an interleaving operation. the second portion of the address space may be configured for a partitioned operation. the first memory page may be allocated based on an access pattern indication. the first memory page may be allocated based on a request received from a user, and the access pattern indication may be received from the user. the first portion of the address space may be mapped to a first pseudo-channel, and the second portion of the address space may be mapped to a second pseudo-channel.
Inventor(s): Seunghan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung Ji of Suwon-si (KR) for samsung electronics co., ltd., Seohyun Shin of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoon Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/28, G06F13/42
CPC Code(s): G06F13/28
Abstract: a computational storage device includes an interface exchanging a signal with a first external source, a non-volatile memory device, a storage controller, a device memory, and a computation engine. the interface receives an indirect usage request instructing the computation engine to perform a second computation for second input data from a second external source while performing a first computation for first input data acquired from the first external source. the computation engine provides the first input data and first intermediate data generated when performing the first computation to an external computational storage device in response to the indirect usage request, requests the first computation from the external computational storage device, performs the second computation for the second input data loaded from the non-volatile memory device to the device memory, and outputs second result data generated by completing the second computation to the second external source through the interface.
Inventor(s): Yongjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungwoo NOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/57, H04L9/08, H04L9/30, H04L9/32
CPC Code(s): G06F21/572
Abstract: a storage device includes: a non-volatile memory for storing a firmware set including a firmware image encrypted using a symmetric key and an encrypted symmetric key generated by encrypting the symmetric key using a public key; and a storage controller for controlling the non-volatile memory, wherein the storage controller includes: a physically unclonable function (puf) chip having a unique security key; and a one-time programmable (otp) memory for storing an encrypted secret key generated by encrypting a secret key paired with the public key using the puf chip, wherein a firmware image is obtained by loading the firmware set, providing the encrypted secret key to the puf chip, receiving the secret key from the puf chip, generating the symmetric key by decrypting the encrypted symmetric key using the secret key, and decrypting the encrypted firmware image using the symmetric key.
Inventor(s): Hyungsik PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyoungchurl LYOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/57, G06F21/60, G06F21/78
CPC Code(s): G06F21/575
Abstract: at least one processor of an electronic device according to an embodiment may turn off the electronic device, on the basis of an input identified while directory names are associated with storage areas of the memory on the basis of a first mount operation within a first mode of the electronic device, such that the directory names are dissociated from the storage areas, and may turn on the electronic device in order to boot same in a second mode. the processor may identify a part of the storage areas in which log information is stored while the electronic device is booted in a second mode. the processor may perform a second mount operation in order to associate a part of the directory names with the part of the storage areas while the remaining part of the storage areas is disassociated from the remaining part of the directory names in order to deactivate access to information stored in the remaining part of the storage areas.
Inventor(s): Dohyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Myeongjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngmoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsup KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongchan JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/64, G06F3/06, G06F21/78
CPC Code(s): G06F21/64
Abstract: provided is a storage system including a host configured to generate a hash value for a first command, merge the hash value with a random value, and provide a signature for merged data and the first command, and a storage device configured to store the random value corresponding to the first command in a first buffer, provide the random value to the host, receive the first command and the signature from the host, store the signature in a second buffer, verify the signature, and in response to verification being completed, delete the random value from the first buffer and execute the first command.
Inventor(s): Jongwook LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyung Han LEE of Seoul (KR) for samsung electronics co., ltd., Sang Hyun HAN of Seoul (KR) for samsung electronics co., ltd., Tae Kyoung HAN of Seoul (KR) for samsung electronics co., ltd., Young Jun HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
CPC Code(s): G06N3/08
Abstract: a processor-implemented method includes, while training a neural network (nn) using a current training mode selected from a plurality of training modes for training of the nn, measuring time data of a plurality of sub-operations for the training of the nn; based on the time data, determining a computation time to perform computation operations among the plurality of sub-operations and a communication time to perform communication operations among the plurality of sub-operations; based on a comparison result of the computation time and the communication time, selecting a next training mode from the plurality of training modes; and training the nn based on the next training mode.
Inventor(s): Sanghoon Myung of Suwon-si (KR) for samsung electronics co., ltd., Kyeyeop Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon Jeong of Suwon-si (KR) for samsung electronics co., ltd., Yunji Choi of Suwon-si (KR) for samsung electronics co., ltd., Songyi Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
CPC Code(s): G06N3/08
Abstract: a method of generating a neural network model and performing a circuit simulation by using the neural network model is presented. the method includes generating sample data by performing a process simulation based on a temperature and a process parameter, training the neural network model based on the sample data, performing a lightweight operation on the neural network model to generate a lightweight neural network model, re-training the lightweight neural network model, and performing the circuit simulation with the process parameter as an input by using the re-trained lightweight neural network model.
Inventor(s): Ting Hua of Cupertino CA (US) for samsung electronics co., ltd., Xiao Li of Ann Arbor MI (US) for samsung electronics co., ltd., Shangqian Gao of Mountain View CA (US) for samsung electronics co., ltd., Yen-Chang Hsu of Fremont CA (US) for samsung electronics co., ltd., Yilin Shen of Mountain View CA (US) for samsung electronics co., ltd., Hongxia Jin of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N20/00, G10L15/18, G10L15/26
CPC Code(s): G06N20/00
Abstract: a method includes accessing a plurality of weight matrices of a machine learning model. the method also includes, for each weight matrix, decomposing the weight matrix into a u matrix, an s matrix, and a v matrix using singular value decomposition. the s matrix is a diagonal matrix, and a singular group corresponds to each element in the s matrix. the method further includes, for each weight matrix, determining an importance score of each singular group. the importance score of the singular group represents a change in loss if the singular group is removed from the machine learning model. the method also includes, for each weight matrix, ranking the singular groups across the plurality of weight matrices based on the importance scores. in addition, the method includes, for each weight matrix, identifying one or more of the singular groups to prune based on the ranking of the singular groups.
Inventor(s): Joonsoo Kim of Irvine CA (US) for samsung electronics co., ltd., Tien C. Bau of Irvine CA (US) for samsung electronics co., ltd., Kamal Jnawali of Chantilly VA (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T3/4053, G06T5/40
CPC Code(s): G06T5/50
Abstract: a method includes obtaining a first image and a second image, where the second image represents a super-resolution version of the first image. the method also includes generating a third image representing a higher-resolution version of the first image. the method further includes performing flicker detection based on the third image and the second image in order to identify one or more flicker regions. the method also includes performing frequency decomposition of the third image to generate first decomposed images and of the second image to generate second decomposed images. in addition, the method includes blending portions of at least some of the first and second decomposed images based on the one or more identified flicker regions to generate a flicker-suppressed image.
Inventor(s): Mengmeng BAI of Beijing (CN) for samsung electronics co., ltd., Jiahui Yuan of Beijing (CN) for samsung electronics co., ltd., Xiansong Song of Beijing (CN) for samsung electronics co., ltd., Jaekeun Na of Beijing (KR) for samsung electronics co., ltd., Changwei Wang of Beijing (CN) for samsung electronics co., ltd., Li Zuo of Beijing (CN) for samsung electronics co., ltd., Wei Wen of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T3/4046, G06T5/10, G06T5/50, G06T5/70, G06T5/77
CPC Code(s): G06T5/60
Abstract: a method may include acquiring a first image that is obtained by adding noise to a second image, the second image comprising a target restoration region. the method may include performing at least one first denoising process on the first image using a first artificial intelligence (ai) network to obtain a first denoising result. the method may include restoring the target restoration region based on the first denoising result using a second ai network to obtain a restored image.
Inventor(s): Joonsoo Kim of Irvine CA (US) for samsung electronics co., ltd., Tien C. Bau of Irvine CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/00
CPC Code(s): G06T5/73
Abstract: a method includes receiving a degraded image including aliasing artifacts and inputting the degraded image to an image enhancement network. this method also includes processing, using the image enhancement network, the degraded image to remove one or more of the aliasing artifacts and outputting, by the image enhancement network, a restored high-quality image. another method includes obtaining a high-quality image of an environment and generating at least one degraded image of the environment by performing an aliasing artifact simulation on the obtained high-quality image. performing the aliasing artifact simulation includes (i) performing a broken line artifact simulation to introduce one or more broken line artifacts on one or more objects in the environment of the high-quality image and/or (ii) performing a jaggy artifact simulation to introduce jaggy edges to one or more other objects in the environment of the high-quality image.
Inventor(s): Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Taegu KIM of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyung YEO of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeoncheon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06T7/20, G06V10/25
CPC Code(s): G06T17/00
Abstract: an example electronic device may include a memory configured to store computer-executable instructions, and a processor configured to execute the instructions by accessing the memory. the instructions are configured to, when executed, cause the processor to generate, based on obtaining an input of a user, first feedback on the input, generate, based on an object detected in at least one of a display region, a surrounding physical space, or a virtual space, second feedback following the first feedback, and output the first feedback and the second feedback.
Inventor(s): Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Seungnyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongil Son of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/01
CPC Code(s): G06T19/00
Abstract: a wearable device comprises a display, a communication circuit, at least one processor, and memory storing instructions. the instructions, when executed by the at least one processor, cause the wearable device to: establish a first connection with a first external electronic device of the plurality of external electronic devices by using the communication circuit; identify a second external electronic device of the plurality of external electronic devices within a field of view of the wearable device; display, through the display, a first visual object representing the first connection, based on identifying an event associated with the first connection; and based on an input obtained for the first visual object for establishing a second connection between the first external electronic device and a second external electronic device, cease displaying of the first visual object and display, through the display, a second visual object representing the second connection.
Inventor(s): Feiyu HUANG of Beijing (CN) for samsung electronics co., ltd., Shizhuo Liu of Beijing (CN) for samsung electronics co., ltd., Zhezhu Jin of Beijing (CN) for samsung electronics co., ltd., Mengfei Yin of Beijing (CN) for samsung electronics co., ltd., Dafeng Zhang of Beijing (CN) for samsung electronics co., ltd., Xiaobing Wang of Beijing (CN) for samsung electronics co., ltd., Woojhon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jiangbo Guo of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, G06T5/20, G06T7/194, G06V10/25, G06V10/44, G06V10/80
CPC Code(s): G06V20/44
Abstract: according to an embodiment of the disclosure, a method may include acquiring behavior objects and relevant events associated with the behavior objects in a video to be processed by using an artificial intelligence (ai) network. according to an embodiment of the disclosure, the method may include providing a behavior object selection interface based on the acquired behavior objects. according to an embodiment of the disclosure, the method may include receiving a behavior object selected through the selection interface by a user. according to an embodiment of the disclosure, the method may include providing an event related to the behavior object selected by the user.
Inventor(s): Xiansong SONG of Beijing (CN) for samsung electronics co., ltd., Lei CAO of Beijing (CN) for samsung electronics co., ltd., Donghan YANG of Beijing (CN) for samsung electronics co., ltd., Mengmeng BAI of Beijing (CN) for samsung electronics co., ltd., Jaekeun NA of Suwon-si (KR) for samsung electronics co., ltd., Li ZUO of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, G06T5/77
CPC Code(s): G06V20/46
Abstract: according to an embodiment of the disclosure, a method performed by an electronic apparatus may include extracting at least one key frame and at least one non-key frame from a video. according to an embodiment of the disclosure, a method performed by an electronic apparatus may include inpainting the at least one key frame based on at least one mask corresponding to the at least one key frame. according to an embodiment of the disclosure, a method performed by an electronic apparatus may include inpainting the at least one non-key frame based on the at least one inpainted key frame.
20250029494. STORAGE MANAGEMENT SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JINWOOK LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G08G1/14
CPC Code(s): G08G1/148
Abstract: the present disclosure relates to storage management systems. an example storage management system includes a storage manager and a storage. the storage manager generates a storage management command based on location data of a car including information about a real-time location of the car and parking data including information about a parking place. the storage is inside the car and includes a nonvolatile memory device. the storage performs a memory management operation for preventing data loss of the nonvolatile memory device based on the storage management command.
Inventor(s): Chuleun YUN of Suwon-si (KR) for samsung electronics co., ltd., Hangseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3208
CPC Code(s): G09G3/3208
Abstract: an electronic device () according to one embodiment may comprise: a display (); a first converter circuit () which includes a non-inverting buckbooster () and a charge pump () and is configured to supply a negative first bias voltage to the display (); and a control circuit (). the control circuit (), according to one embodiment, can be configured to check a target first bias voltage to be supplied to the display (). the control circuit (), according to one embodiment, can be configured to output a first voltage corresponding to half the absolute value of the target first bias voltage to the charge pump () by using the non-inverting buckbooster (). the control circuit (), according to one embodiment, can be configured to generate a second voltage by inverting the sign of the first voltage and converting the magnitude of the first voltage by a factor of two through the charge pump (). the control circuit (), according to one embodiment, can be configured to supply the second voltage to the display () as the first bias voltage.
Inventor(s): Hongsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungkwon KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonsang PARK of Suwon-si (KR) for samsung electronics co., ltd., Chanhyung YOO of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongchoon HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3225, G02B27/01
CPC Code(s): G09G3/3225
Abstract: an electronic device may include: a display panel in which a plurality of pixels arranged in a matrix; a first main gate line extending in a first direction and configured to be electrically connectible to a first pixel among the plurality of pixels; a second main gate line extending in the first direction and configured to be electrically connectible to a second pixel among the plurality of pixels, the second pixel being adjacent to the first pixel along a second direction intersecting the first direction; a first main source line extending in the second direction and configured to be electrically connectible to the first pixel; and a second main source line extending in the second direction and configured to be electrically connectible to a third pixel among the plurality of pixels, the third pixel being adjacent to the first pixel along the first direction.
Inventor(s): Yongkoo HER of Suwon-si (KR) for samsung electronics co., ltd., Youngdo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungbae Bae of Suwon-si (KR) for samsung electronics co., ltd., Hyunchang Shin of Suwon-si (KR) for samsung electronics co., ltd., Joongyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Songhee Jung of Suwon-si (KR) for samsung electronics co., ltd., Jaeseung Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/10, G09G3/3233
CPC Code(s): G09G5/10
Abstract: various embodiments disclose a method and an apparatus including a display, a memory including information on a number of duty cycles per one refresh period for emitting light by pixels of the display corresponding to each of a plurality of refresh rates of the display, and a processor, wherein the processor is configured to control the electronic device to perform an operation according to a first number of duty cycles based on the display operating at a first refresh rate, and perform an operation according to a second number of duty cycles based on the display operating at a second refresh rate, wherein the first number is less than the second number based on the first refresh rate being higher than the second refresh rate.
Inventor(s): Taegu KIM of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jaeyung YEO of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeoncheon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/16, G10L15/22
CPC Code(s): G10L15/16
Abstract: a device and method for operating an artificial intelligence (ai) agent in a communal space are provided. when a communal space event occurs, an ai agent that operates in common in a communal space may be generated, a domain may be determined in the ai agent, the determined domain may be loaded, user information about a user participating in the communal space event may be collected, and an utterance of the user may be processed based on the determined domain and the user information.
Inventor(s): Jaeyung YEO of Suwon-si (KR) for samsung electronics co., ltd., Taegu KIM of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeoncheon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G06F3/01
CPC Code(s): G10L15/22
Abstract: the present disclosure relates to a method of operating an artificial intelligence (ai) agent considering a gaze and the method includes: setting a position of a virtual object, outputting the virtual object, obtaining gaze information of a user, determining whether an activation condition of the virtual object is satisfied by considering the gaze information of the user, and based on the activation condition of the virtual object being satisfied as a result of determination, processing an utterance of the user without a wake word.
Inventor(s): Ruijie MENG of Beijing (CN) for samsung electronics co., ltd., Lei YANG of Beijing (CN) for samsung electronics co., ltd., Wei LIU of Beijing (CN) for samsung electronics co., ltd., Xiaoyan LOU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G10L17/06, G10L17/02, G10L17/04, G10L21/034, G10L25/18, G10L25/60
CPC Code(s): G10L17/06
Abstract: according to an embodiment of the disclosure, a method may include determining registered audio information associated with a user based on a bone conduction (bc) signal. according to the embodiment of the disclosure, the method may include extracting a second audio signal corresponding to the user from a first audio signal based on the registered audio information associated with the user. according to the embodiment of the disclosure, the method may include processing the at least one from among the extracted second audio signal and a portion of the first audio signal which does not contain the second audio signal.
Inventor(s): Tomasz KRUKOWICZ of Warszawa (PL) for samsung electronics co., ltd., Marcin GOZDZIEWSKI of Warszawa (PL) for samsung electronics co., ltd., Krzysztof ARENDT of Warszawa (PL) for samsung electronics co., ltd., Jakub TKACZUK of Warszawa (PL) for samsung electronics co., ltd.
IPC Code(s): G10L21/0208
CPC Code(s): G10L21/0208
Abstract: an example electronic apparatus includes a memory configured to store at least one instruction and at least one processor connected to the memory to control the electronic apparatus. the at least one processor is configured to, by executing the at least one instruction, obtain a first audio signal including a voice signal and a noise signal, convert the first audio signal in a time domain to a second audio signal in a frequency domain, obtain a first gain value representing a signal-to-noise ratio (snr) from the second audio signal, obtain a second gain value with a first dynamic range by filtering the first gain value, obtain a third gain value by inputting the second gain value to a neural network model trained to output a signal from which noise is removed, and convert the second audio signal to a third audio signal from which at least a portion of the noise signal is removed, using the third gain value.
Inventor(s): Sanggeun YOO of Suwon-si (KR) for samsung electronics co., ltd., Kwangkyu BANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11B33/12, H01R13/58
CPC Code(s): G11B33/126
Abstract: a multi connector grip includes a first surface including a first cable connector groove configured to accommodate a first cable connector, the first cable connector groove having a first cable connector groove depth and the first cable connector having a first depth; and a second surface opposite to the first surface and including a second cable connector groove configured to accommodate a second cable connector, the second cable connector groove having a second cable connector groove depth and the second cable connector having a second depth, wherein a difference between the first cable connector groove depth and the second cable connector groove depth is equal to a difference between the first depth and the second depth.
20250029644. MAGNETIC MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Unghwan Pi of Suwon-si (KR) for samsung electronics co., ltd., Stuart Papworth Parkin of Munchen (DE) for samsung electronics co., ltd., Jaechun Jeon of Munchen (DE) for samsung electronics co., ltd., Jaekeun Kim of Munchen (DE) for samsung electronics co., ltd., Andrea Migliorini of Munchen (DE) for samsung electronics co., ltd.
IPC Code(s): G11C11/16, G11C11/18, G11C19/08, H01F10/32, H10B61/00, H10N50/10, H10N50/80
CPC Code(s): G11C11/161
Abstract: a magnetic memory device includes a lower magnetic track layer extending in a first direction and including a plurality of first magnetic domains, a spacer layer on the lower magnetic track layer and extending in the first direction, an upper magnetic track layer on the spacer layer and extending in the first direction, the upper magnetic track layer including a plurality of second magnetic domains, and a plurality of read units on the upper magnetic track layer and arranged apart from one another in the first direction, wherein the plurality of first magnetic domains and the plurality of second magnetic domains have magnetization directions parallel to each other at positions overlapping each other in a second direction perpendicular to the first direction.
Inventor(s): Siyeon Cho of Suwon-si (KR) for samsung electronics co., ltd., Daewon Ha of Suwon-si (KR) for samsung electronics co., ltd., Myunghun Woo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/22
CPC Code(s): G11C11/2275
Abstract: a method of operating a nonvolatile memory device includes applying a ground voltage to a selected wordline among the wordlines, applying an erase pass voltage to at least one unselected wordline among the wordlines, applying an erase voltage to a selected bitline among the bitlines, applying an erase prohibition voltage to an unselected bitline among the bitlines, and applying a gate induced drain leakage (gidl) voltage to at least one string selection line corresponding to a string selected from among the plurality of strings.
Inventor(s): Yumin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Garam PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae SONG of Suwon-si (KR) for samsung electronics co., ltd., Seungyeul YANG of Suwon-si (KR) for samsung electronics co., ltd., Seungdam HYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C13/00
CPC Code(s): G11C13/0069
Abstract: a memory device including a variable serial resistive element having a voltage dividing effect and an operating method thereof are disclosed. the memory device includes a memory unit, a variable serial resistive element connected to the memory unit, a controller connected to the variable serial resistive element and configured to control a resistance of the variable serial resistive element, and a power source connected to the variable serial resistive element. the operating method of the memory device includes maintaining a resistance of a serial resistive element connected to a memory element as a first resistance during a first operation of the memory element and maintaining the resistance of the serial resistive element as a second resistance during a second operation of the memory element, wherein the serial resistive element includes a variable resistive element.
Inventor(s): Unghwan Pi of Suwon-si (KR) for samsung electronics co., ltd., Stuart Papworth Parkin of Munchen (DE) for samsung electronics co., ltd., Andrea Migliorini of Munchen (DE) for samsung electronics co., ltd., Jaechun Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C19/08, G11C11/16, H10B61/00, H10N50/10, H10N50/80
CPC Code(s): G11C19/0841
Abstract: a method of operating a magnetic memory device includes: (i) applying a first current to a free layer of a magnetic tunnel junction structure, which includes a magnetic translation unit (mtu) extending between a first magnetic pad and a second magnetic pad, and a tunnel barrier layer and a pinned layer stacked on the mtu, so that a multi-domain is established within the mtu, (ii) applying a magnetic field to the free layer so that the magnetization direction of the mtu switches to become anti-parallel to the magnetization directions of the first magnetic pad and the second magnetic pad, (iii) applying a second current to the free layer so that a portion of the multi-domain penetrates into the first magnetic pad, and (iv) applying another magnetic field to the free layer so that the magnetization direction of the first magnetic pad switches.
Inventor(s): Kiheung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanguhn CHA of Suwon-si (KR) for samsung electronics co., ltd., Junhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungchul PARK of Seoul (KR) for samsung electronics co., ltd., Hyojin JUNG of Hwaseong-si (KR) for samsung electronics co., ltd., Kyungsoo HA of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/42, G11C29/12, G11C29/20, G11C29/44
CPC Code(s): G11C29/42
Abstract: a semiconductor memory device includes a memory cell array, an error correction code (ecc) circuit, a fault address register and a control logic circuit. the memory cell array includes a plurality of memory cell rows. the scrubbing control circuit generates scrubbing addresses for performing a scrubbing operation on a first memory cell row based on refresh row addresses for refreshing the memory cell rows. the control logic circuit controls the ecc circuit such that the ecc circuit performs an error detection and correction operation on a plurality of sub-pages in the first memory cell row to count a number of error occurrences during a first interval and determines a sub operation in a second interval in the scrubbing operation based on the number of error occurrences in the first memory cell row.
Inventor(s): Hunjae JANG of Suwon-si (KR) for samsung electronics co., ltd., SANGJINE PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, B08B3/04, B08B3/08, B08B3/10, H01L21/02
CPC Code(s): H01L21/67051
Abstract: provided is a substrate processing apparatus including a process chamber including a process space, a stage configured to support a substrate, a rotator configured to rotate the stage, a pressurizing pump configured to increase a pressure in the process space, and a cleaning agent discharger configured to spray a cleaning agent into the process space. the cleaning agent discharger includes a discharge ring including a discharge path through which the cleaning agent flows and a plurality of discharge nozzles connected to the discharge ring and spaced apart in a circumferential direction about a central axis of the stage.
20250029863. ELECTROSTATIC CHUCK MODULE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Naoyuki TAKADA of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H05B3/28
CPC Code(s): H01L21/6833
Abstract: an electrostatic chuck module operates at temperatures above the heat resistance temperature of a resin. the electrostatic chuck module includes: a base that includes a flow path for a coolant disposed below the base, a concave part disposed on the base, and a convex part disposed along an outer circumference of the base; an insulator disposed in the concave part of the base; a resistance heating element disposed on or within the insulator; a crack plate disposed on the insulator and the resistance heating element; and a ceramics plate disposed on the crack plate and that includes an electrode that adsorbs a target object with static electricity. the convex part of the base is bonded to the crack plate.
Inventor(s): KANG GYUNE LEE of Suwon-si (KR) for samsung electronics co., ltd., SANG-WON LEE of Suwon-si (KR) for samsung electronics co., ltd., HYEON HWANG of Suwon-si (KR) for samsung electronics co., ltd., Younhwan SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H01L21/67, H01L21/687
CPC Code(s): H01L21/6838
Abstract: a chuck table includes a support part receiving a package substrate. the package substrate includes a package area having semiconductor packages arranged thereon and a scrap area surrounding the package area. a package pad part is between the support part and the package substrate and directly contacts the package area. a scrap pad part is disposed between the support part and the package substrate and directly contacts the scrap area. a vacuum pipe extends through the package pad part and extends into the support part. the vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom. a fixing device is connected to the vacuum pipe. the fixing device moves closer to an upper surface of the scrap area as the vacuum pressure is applied to the vacuum pipe, and moves away from the upper surface of the scrap area as the vacuum pressure is released.
20250029879. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongkuk Lee of Suwon-si (KR) for samsung electronics co., ltd., Yeongseon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00, H01L23/48, H01L25/065
CPC Code(s): H01L22/32
Abstract: disclosed is a semiconductor package comprising a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. the first semiconductor chip may include an upper bonding pad, an upper test pad, and an upper dielectric layer that surrounds the upper bonding pad and the upper test pad. the second semiconductor chip includes a lower bonding pad in contact with the upper bonding pad, a lower test pad in contact with the upper test pad, and a lower dielectric layer that surrounds the lower bonding pad and the lower test pad.
Inventor(s): Weizhong ZHOU of Suzhou (CN) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L21/56, H01L21/768, H01L23/00, H01L23/13
CPC Code(s): H01L23/3128
Abstract: a semiconductor package and a method of manufacturing the same are provided. the semiconductor package includes a substrate including first and second surfaces opposite to each other and a groove recessed from the first surface, a chip within the groove and including an active surface facing a bottom surface of the groove, an inactive surface opposite to the active surface, and a side surface connecting the active surface with the inactive surface, chip pads on the active surface of the chip, a shielding layer including a first sub-shielding layer between the bottom surface of the groove and the active surface of the chip and including openings corresponding to the chip pads, respectively, a third sub-shielding layer on the inactive surface of the chip, and a second sub-shielding layer between the side surface of the chip and a side surface of the groove and connecting the first and third sub-shielding layers.
Inventor(s): Donggyu Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/36, H01L23/00, H01L23/38, H01L23/498, H01L23/538, H01L23/64
CPC Code(s): H01L23/36
Abstract: a semiconductor package may include a package substrate, a semiconductor chip on the package substrate, and one or more outer terminals below the package substrate. the one or more outer terminals may include at least one signal terminal delivering an operation signal to the semiconductor chip and at least one power terminal supplying an electric power to the semiconductor chip. the package substrate may include an insulating portion, one or more interconnection patterns provided in the insulating portion to electrically connect the semiconductor chip to the at least one signal terminal, and a heat-dissipation pattern provided in the insulating portion to electrically connect the semiconductor chip to the at least one power terminal. the heat-dissipation pattern may include at least one conductive pattern and at least one thermoelectric pattern, which are connected in series in a direction from the one or more outer terminals toward the semiconductor chip.
Inventor(s): Myungsam KANG of Suwon-si (KR) for samsung electronics co., ltd., Chilwoo KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Okgyeong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/00, H01L23/373, H01L25/18
CPC Code(s): H01L23/367
Abstract: a semiconductor package includes: a first semiconductor chip disposed on a package substrate; a second semiconductor chip adjacent to the first semiconductor chip in a horizontal direction and disposed on the package substrate; a plurality of first thermal interfacial material patterns overlapping the first semiconductor chip in a vertical direction; a plurality of second thermal interfacial material patterns overlapping the second semiconductor chip in the vertical direction; and a first non-metal thermal conductive layer disposed between the plurality of first thermal interfacial material patterns, wherein the plurality of first thermal interfacial materials are spaced apart from the plurality of second thermal interfacial materials in the horizontal direction, and a thermal conductivity of the first non-metal thermal conductive layer in the horizontal direction is lower than a thermal conductivity of the first non-metal thermal conductive layer in the vertical direction.
Inventor(s): Seungduk BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/31, H01L23/538, H01L25/065, H10B80/00
CPC Code(s): H01L23/481
Abstract: a semiconductor stacked structure includes a first semiconductor chip including, a central region, an outer region at least partially surrounding the central region, the outer region including a corner region, and a first through-electrode in the central region, a plurality of second semiconductor chips sequentially stacked in the central region and connected to the first semiconductor chip, each of the plurality of second semiconductor chips including a second through-electrode, and at least one passive device in the corner region of the outer region.
20250029896. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younghun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/528, H01L27/088, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction parallel to an upper surface of the substrate; a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction; channels spaced apart from each other in a vertical direction, each of the channels extending through the gate structure; a through contact extending through the substrate and the active pattern in the vertical direction, an upper portion and a lower portion of the through contact connected to each other and formed of the same material; a lower wiring on a back side of the substrate, the lower wiring electrically connected to the through contact; and an upper wiring disposed on a front side of the substrate, the upper wiring electrically connected to the upper wiring.
20250029897. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jun Ki PARK of Suwon-si (KR) for samsung electronics co., ltd., Sung Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Wan Don KIM of Suwon-si (KR) for samsung electronics co., ltd., Won Keun CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/485, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L23/485
Abstract: a semiconductor device includes a back interlayer insulating film, a back wiring line in the back interlayer insulating film, the back wiring line including a first surface and a second surface opposite the first surface in a first direction, a fin-type pattern on the first surface of the back wiring line and extending in a second direction, a gate electrode on the fin-type pattern and extending in a third direction, a first source/drain pattern on a first side of the gate electrode, the first source/drain pattern including a bottom surface contacting the fin-type pattern, a back source/drain contact in the fin-type pattern and connected to the first surface of the back wiring line, and a contact insulating liner between the fin-type pattern and the back source/drain contact, the contact insulating liner extending along at least a portion of side walls of the back source/drain contact.
Inventor(s): Kyounglim Suk of Suwon-si (KR) for samsung electronics co., ltd., Kimin Cheong of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/522, H01L25/00, H01L25/18
CPC Code(s): H01L23/49822
Abstract: provided are a semiconductor package including a pad with high reliability and a method of manufacturing the semiconductor package. the semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a through post extending around the semiconductor chip and on the first redistribution substrate, and a second redistribution substrate on the semiconductor chip and the through post. a first pad region and a second pad region are defined on an upper surface of the second redistribution substrate, the first pad region positioned at a central portion of the second redistribution substrate, and the second pad region extending around the first pad region, a first-type pad in a planar shape is in a first opening, a second-type pad having an outer protruding portion is in a second opening.
Inventor(s): Jaesic LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngbae Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/027, H01L23/00
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes: a first semiconductor chip including a first semiconductor layer, and a first connection pad and a first insulation layer that are provided on a surface of the first semiconductor layer extending in a first direction; and a second semiconductor chip including a second semiconductor layer, and a second connection pad and a second insulation layer that are provided on a surface of the second semiconductor layer. the first connection pad directly contacts the second connection pad and is provided on the second connection pad in a second direction that is perpendicular to the first direction. the first insulation layer directly contacts the second insulation layer, the first insulation layer is provided on the second insulation layer in the second direction. a width of the second connection pad in the first direction is smaller than a width of the first connection pad in the first direction.
Inventor(s): Hyunsoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinchan AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065, H10B80/00
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a logic die that includes a backside power delivery network layer, an interposer die disposed on the logic die, a plurality of memory dies stacked on the interposer die, and a mold layer that covers the interposer die and the memory dies. each of the logic die and the interposer die has a first width.
20250029927. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): YOUNGBAE KIM of Suwon-si (CN) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/498, H01L25/065
CPC Code(s): H01L23/5381
Abstract: a semiconductor package includes a package substrate, a first device on the package substrate and a second device on the package substrate and horizontally spaced apart from the first device, where the package substrate includes a first redistribution layer, a second redistribution layer on the first redistribution layer, a core section between the first redistribution layer and the second redistribution layer, a dummy structure in the first redistribution layer and on a bottom surface of the core section and a bridge chip in the second redistribution layer and on a top surface of the core section, and where a thermal conductance of the dummy structure is greater than a thermal conductance of the first redistribution layer.
20250029935. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyuil Hwang of Suwon-si (KR) for samsung electronics co., ltd., Minkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Joongsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Pyunghwa Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/552, H01L21/48, H01L23/00, H01L23/498, H01L25/10, H01L25/18
CPC Code(s): H01L23/552
Abstract: disclosed are semiconductor packages and their fabrication methods. the semiconductor package comprises a lower redistribution substrate, an upper redistribution substrate, and a semiconductor chip between the lower redistribution substrate and the upper redistribution substrate. the lower redistribution substrate includes a lower dielectric structure, a lower redistribution pattern surrounded by the lower dielectric structure, and a lower shield structure surrounded by the lower dielectric structure and surrounding the lower redistribution pattern. the upper redistribution substrate includes an upper dielectric structure, an upper redistribution pattern surrounded by the upper dielectric structure, and an upper shield structure surrounded by the upper dielectric structure and surrounding the upper redistribution pattern.
20250029936. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongwon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L25/065, H10B80/00
CPC Code(s): H01L23/562
Abstract: a semiconductor package includes a substrate that includes a first surface and a second surface that is opposite to the first surface, where the first surface includes a first region and a second region, where the substrate includes a wiring circuit layer; first connection pads in the first region of the substrate and second connection pads in the second region of the substrate, a semiconductor chip structure that is on the first region of the substrate and is connected to the first connection pads by conductive bumps, a stiffener that extends along the first side and is in the first region of the substrate, an underfill on the first region of the substrate, where the underfill is spaced apart from the stiffener, and external connection conductors that are on the second surface of the substrate and electrically connected to the wiring circuit layer.
Inventor(s): HYUNSU HWANG of Suwon-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., KUYOUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., JUMYONG PARK of Suwon-si (KR) for samsung electronics co., ltd., DONGJOON OH of Suwon-si (KR) for samsung electronics co., ltd., SANGHOO CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/05
Abstract: disclosed are semiconductor packages and their fabrication methods. the semiconductor package comprises a substrate, a seed layer on the substrate, and a wiring pad on the seed layer. the wiring pad includes a pad portion, and a capping layer on the seed layer and covering a top surface and a lateral surface of the pad portion. a bottom surface of the pad portion is in contact with a top surface of the seed layer. a width of the top surface of the pad portion is greater than a width of the bottom surface of the pad portion.
20250029942. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Raeyoung KANG of SUWON-SI (KR) for samsung electronics co., ltd., MINKI KIM of SUWON-SI (KR) for samsung electronics co., ltd., JIHOON KIM of SUWON-SI (KR) for samsung electronics co., ltd., JINKYEONG SEOL of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48
CPC Code(s): H01L24/05
Abstract: a semiconductor package includes a lower structure and an upper structure on the lower structure. the lower structure includes a first substrate, a first through-electrode penetrating the first substrate in a first direction, a first pad connected to the first through-electrode, and a first protective layer surrounding the first pad. the upper structure includes a second substrate, a second through-electrode penetrating the second substrate in the first direction, a second pad connected to the second through-electrode, and a second protective layer surrounding the second pad. the second pad is offset from the first pad in a second direction crossing the first direction. the first pad has a first portion not overlapping the second pad. a first barrier pattern is disposed between the first portion and the second protective layer. a portion of the first barrier pattern is disposed between the first pad and the second pad.
Inventor(s): Jihoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., YEONGKWON KO of Suwon-si (KR) for samsung electronics co., ltd., KUYOUNG KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/29, H01L23/31, H01L23/48, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes: a buffer die; a plurality of memory dies stacked on the buffer die; a mold layer covering a portion of a top surface of the buffer die and lateral surfaces of the plurality of memory dies; and an inorganic layer disposed on the mold layer, wherein the inorganic layer covers at least a portion of the lateral surface of an uppermost memory die of the plurality of memory dies, wherein a top surface of the inorganic layer is substantially coplanar with a top surface of the uppermost memory die of the plurality of memory dies, and wherein the inorganic layer includes oxide or nitride.
Inventor(s): Sunghyun YOO of Suwon-si (KR) for samsung electronics co., ltd., Jinwoong Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyehoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Yong Namkung of Suwon-si (KR) for samsung electronics co., ltd., Jaehee Lim of Suwon-si (KR) for samsung electronics co., ltd., Hyoungjin Lim of Suwon-si (KR) for samsung electronics co., ltd., Jongpil Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/075, H01L27/15, H01L33/38, H01L33/50
CPC Code(s): H01L25/0753
Abstract: a display panel includes: a substrate; a plurality of substrate electrodes on the substrate; a plurality of first light emitting diodes electrically connected to the plurality of substrate electrodes, and configured to emit light of a first color; and a plurality of second light emitting diodes electrically connected to the plurality of substrate electrodes, each of the plurality of second light emitting diodes being configured to emit light of a second color and emit light of a third color, wherein the second color and the third color are different from the first color.
20250029966. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): TagGun LEE of Suwon-si (KR) for samsung electronics co., ltd., Donguk PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngseob SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/538, H10B80/00
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes first and second dies that transmit and/or receive signals with each other. the semiconductor package includes a package substrate, at least one first die on the package substrate and connected to the package substrate with an interposer therebetween, and at least one second die on the package substrate and connected to the package substrate. each of the first and second dies includes a transmitter and a receiver, each including data lanes, and the number of the data lanes of the transmitter and/or the receiver of the first die is different from the number of the data lanes of the transmitter and/or the receiver of the second die.
Inventor(s): Youngki Jung of Suwon-si (KR) for samsung electronics co., ltd., Sangmin Shin of Suwon-si (KR) for samsung electronics co., ltd., Jinho Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulgyu Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/00
CPC Code(s): H01L25/167
Abstract: provided are a light emitting diode (led) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. the led module having a multi-layer structure includes substrate; a led located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the led and connected to the led; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (fog) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the fog electrode through the upper insulating layer.
Inventor(s): Sinhyung JEON of Suwon-si (KR) for samsung electronics co., ltd., Sanggi OH of Suwon-si (KR) for samsung electronics co., ltd., Jeongnam CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/22, H01Q1/38, H01Q1/48, H01Q1/52, H05K1/02
CPC Code(s): H01Q1/2283
Abstract: an electronic device according to an embodiment includes: a printed circuit board; a first antenna module including at least one antenna; a second antenna module including at least one antenna; a bluetooth module comprising circuitry; and at least one processor, comprising processing circuitry, wherein the first antenna module includes: a chip antenna; a feeding line; at least one first ground area; a set of first conductive patterns; and a first lumped element comprising a conductive material, set including a first lumped element, a second lumped element, a third lumped element, and a fourth lumped element. a third conductive pattern, fourth conductive pattern, and the at least one first ground area form a closed loop by the second lumped element, the third lumped element, and the fourth lumped element.
20250030151. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/38, H01Q9/04, H04M1/02
CPC Code(s): H01Q1/243
Abstract: an electronic device is provided. the electronic device includes a housing, an antenna structure disposed in the housing, wherein the antenna structure includes a substrate including a first substrate surface, a second substrate surface facing away from the first substrate surface, and a ground layer disposed between the first substrate surface and the second substrate surface, a first conductive patch including a plurality of sub-patches arranged to correspond to the ground layer, and a second conductive patch disposed between a first sub-patch and a second sub-patch among the plurality of sub-patches of the first conductive patch when viewed from above the first substrate surface, and a wireless communication circuit configured to transmit or receive a first wireless signal in a first frequency band through the plurality of sub-patches of the first conductive patch and to transmit or receive a second wireless signal in a second frequency band through the second conductive patch. the electronic device further includes a first non-conductive area disposed in a position overlapping at least a portion of the second conductive patch when viewed from above the first substrate surface.
Inventor(s): Jiho KIM of Suwon-si (KR) for samsung electronics co., ltd., Junwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungmin CHO of Suwon-si (KR) for samsung electronics co., ltd., Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q5/378, H01Q1/24, H01Q5/50, H04M1/02
CPC Code(s): H01Q5/378
Abstract: an electronic device includes: a first housing; a second housing; a hinge structure coupled with the first and second housings so that the first and second housings are foldable relative to each other; and a wireless communication circuit on the second housing, wherein the second housing includes: a sixth side portion; a fifth side portion facing the sixth side portion; a fourth side portion facing the hinge structure; a third corner portion between the sixth side portion and the fourth side portion; a fourth corner portion between the fifth side portion and the fourth side portion; and a first matching circuit coupled with the sixth side portion and configured to induce a second surface current having a second phase opposite to a first phase of a first surface current induced on the first and second housings and the hinge structure based on the electronic device being in a folded state.
Inventor(s): Jiantong Li of McKinney TX (US) for samsung electronics co., ltd., Aditya Dave of Plano TX (US) for samsung electronics co., ltd., Yong Su of Allen TX (US) for samsung electronics co., ltd., Xinguang Xu of Allen TX (US) for samsung electronics co., ltd., Won Suk Choi of McKinney TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H01Q21/24, H01Q1/24, H01Q21/06
CPC Code(s): H01Q21/24
Abstract: an apparatus includes a via-fed dual-polarized patch, a first capacitive-fed dual-polarized patch, and a second capacitive-fed dual-polarized patch. the first capacitive-fed dual-polarized patch is capacitively coupled to the via-fed dual-polarized patch through an air gap. the second capacitive-fed dual-polarized patch is capacitively coupled to the first capacitive-fed dual-polarized patch through a dielectric layer.
Inventor(s): Jeongwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Min SAGONG of Suwon-si (KR) for samsung electronics co., ltd., Moonsoo SON of Suwon-si (KR) for samsung electronics co., ltd., Dongryul SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03H7/38, H04B1/00
CPC Code(s): H03H7/38
Abstract: according to various embodiments disclosed herein, an electronic device comprises: a wireless communication circuit; an antenna; a matching circuit; and a processor. the matching circuit includes: a first switching circuit; a second switching circuit; a first inductor; a second inductor; a third inductor; a plurality of capacitors. the processor may be configured so as to be able to: apply the wireless signal to at least one of the plurality of capacitors; control to turn on or off the plurality of switching elements of the first switching circuit and the plurality of switching elements of the second switching circuit; and operate the matching circuit as a serial variable capacitor and a parallel variable capacitor.
Inventor(s): Yongwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyeongjoon Ko of Suwon-si (KR) for samsung electronics co., ltd., Hurham Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K19/0948, H03K19/0185
CPC Code(s): H03K19/0948
Abstract: a complementary metal oxide semiconductor (cmos)-to-current mode logic (cml) converter for converting a cmos input signal into a cml output signal, including: a low-pass filter comprising a fixed resistor and a first fixed capacitor, and a swing width control circuit configured to adjust a swing width of a voltage swing of the cml output signal based on a common mode level, wherein the swing width control circuit includes: a second fixed capacitor; and a variable capacitor comprising a capacitor array.
Inventor(s): Heewook Shin of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk Lee of Seoul-si (KR) for samsung electronics co., ltd., Junho Boo of Seoul-si (KR) for samsung electronics co., ltd., Seunghoon Lee of Seoul-si (KR) for samsung electronics co., ltd., Youngjae Cho of Suwon-si (KR) for samsung electronics co., ltd., Michael Choi of Suwon-si (KR) for samsung electronics co., ltd., Jinwook Burm of Seoul-si (KR) for samsung electronics co., ltd., Gilcho Ahn of Seoul-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/06
CPC Code(s): H03M1/0607
Abstract: provided is an analog-to-digital converter and a voltage offset correction method thereof. the analog-to-digital converter may include a digital-to-analog converter (dac) configured to generate a first comparison voltage, a comparison circuit configured to output a first comparison result signal based on a result of comparing the first comparison voltage with a second comparison voltage, and a control circuit configured to control the dac and output an output signal, wherein the dac may include a correction circuit configured to generate a correction voltage by selectively switching switches connected to terminals to which a plurality of reference voltages are applied, and correct a voltage offset of the comparison circuit based on the correction voltage.
Inventor(s): Hyeonu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/026, H04B7/06, H04L5/00
CPC Code(s): H04B7/026
Abstract: an electronic device may include a processor, a wireless communication module operatively connected to the processor configured to transmit and receive a wireless signal, and a memory configured to store instructions. the instructions may be executed by the processor to cause the device to receive a null data packet announcement (ndpa) frame or a null data packet (ndp) frame. the instructions may be executed by the processor to cause the electronic device to receive a beamforming report poll (bfrp) frame. the instructions may be executed by the processor to cause the electronic device to transmit a feedback frame containing the channel state information based on the bfrp frame. the instructions may be executed by the processor to cause the electronic device to perform communication through a combination of one or more access points (aps) determined based on the feedback frame in a network environment for multi-ap coordination.
Inventor(s): Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W72/231
CPC Code(s): H04B7/0626
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure provides a method performed by a user equipment (ue) in a wireless communication system. the method includes: receiving, from a base station, channel state information (csi) report configuration information including a list of sub-configurations; and transmitting, to the base station, a first csi report for at least one sub-configuration associated with the list of sub-configurations.
Inventor(s): Deepanshu GAUTAM of Bangalore (IN) for samsung electronics co., ltd., Nishant GUPTA of Bangalore (IN) for samsung electronics co., ltd., Walter FEATHERSTONE of Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04L41/0806, H04L41/0895, H04W24/02
CPC Code(s): H04L41/0806
Abstract: in embodiments of the present disclosure, a method by a first network node includes transmitting, to a second network node, a request for creating a managed object instance (moi), the request including one or more requirements related to an edge enabler server (ees), and receiving, from the second network node, a response including information associated with the moi for an eesfunction information object class (ioc) created based on the one or more requirements included in the request, wherein the created moi includes one or more attributes indicated in the eesfunction ioc, and wherein the one or more attributes include an identifier of the ees, serving location information for the ees, and information indicating whether the ees supports service continuity.
Inventor(s): Bumhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo SEO of Suwon-si (KR) for samsung electronics co., ltd., Jungil CHO of Suwon-si (KR) for samsung electronics co., ltd., Joonghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Choonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyewon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jihyoun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hansang SONG of Suwon-si (KR) for samsung electronics co., ltd., Seungwon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yujung HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
CPC Code(s): H04L63/0442
Abstract: a method of a first electronic device which is connected to a fabric network supporting end-to-end encryption (e2ee) in a wireless communication system is provided. the method includes generating a fabric key based on a pre-stored first device key and a second member key received from a second electronic device, transmitting the fabric key to the second electronic device through a fabric server, which manages the fabric network, and a service server, which manages service data, encrypting service data based on the fabric key, and transmitting the encrypted data to the second electronic device through the service server, wherein the fabric key is shared with the fabric server, which is a member entity of the fabric network, and the second electronic device, wherein the encrypted data is decryptable at a member entity of the fabric network that shares the fabric key.
Inventor(s): Bohyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Baekeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H02J50/10, H05K7/20
CPC Code(s): H04M1/0235
Abstract: an electronic device includes: a first housing; a second housing movable with respect to the first housing; a rollable display partially fixed to the second housing and can be inserted into the first housing in a slide-in state or drawn out from the first housing in a slide-out state; a wireless charging ic inside the first housing or the second housing and can receive power from an outside; a battery inside the first housing or the second housing and can be charged with the power received from the outside via the wireless charging ic; and at least one processor configured to: based on the state of the second housing, determine a current to be received from the outside through the wireless charging ic or a current for charging the battery; and transmit a signal related to the current to the wireless charging ic.
Inventor(s): Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0268
Abstract: according to various embodiments of the present disclosure, an electronic device may comprise: a first housing; a second housing configured to slide with respect to the first housing; a rollable display including a first display area and a second display area extending from the first display area, wherein at least a part of the second display area is configured to be moved based on a sliding movement of the second housing; and a driving structure configured to provide driving power for the sliding of the second housing with respect to the first housing, wherein the driving structure comprises: a motor disposed in the first housing; a pinion gear connected to the motor and configured to be rotated in one direction or in the other direction opposite to the one direction based on the driving power of the motor; a rack disposed in the second housing, configured to be meshed with the pinion gear, and including a guide groove; and a gear bracket coupled to one side of the motor and including a guide groove support configured to support the guide groove of the rack.
Inventor(s): Taeeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hunki LEE of Suwon-si (KR) for samsung electronics co., ltd., Kiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Choonghyo PARK of Suwon-si (KR) for samsung electronics co., ltd., Seongkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Byounghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Woojin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/03, H04R1/28, H04R1/32
CPC Code(s): H04M1/035
Abstract: an electronic device is provided. the electronic device includes a housing including a first speaker hole and a speaker assembly disposed in the housing and configured to radiate a sound to an outside of the electronic device through the first speaker hole, wherein the speaker assembly includes a speaker including a diaphragm, a first speaker cover facing the diaphragm and spaced apart from the diaphragm, a sound space formed between the diaphragm and the first speaker cover, a first supporting structure including a first portion formed to surround a portion of the sound space, and a step structure disposed adjacent to an area where a portion of the first portion of the first supporting structure contacts the first speaker cover and disposed to be spaced apart from the speaker.
Inventor(s): Hyungjong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yejin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungkeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Pius Lee of Suwon-si (KR) for samsung electronics co., ltd., Chaebin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31, G06V20/50
CPC Code(s): H04N9/3179
Abstract: a projection device includes: a projector; at least one memory storing one or more instructions; and at least one processor, wherein the one or more instructions, when executed by the at least one processor, cause the projection device to: obtain a first image; generate a blur image, based on the first image; obtain a background image by performing image processing on an edge region of the blur image to exhibit a vignetting effect on the edge region; and control the projector to project a second image in which the background image and the first image are combined.
Inventor(s): Narae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Chanyul KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Woongil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/159, H04N19/105, H04N19/119, H04N19/132, H04N19/176, H04N19/593
CPC Code(s): H04N19/159
Abstract: provided are a video encoding or decoding method and apparatus, which, during video encoding and decoding processes, determine whether an intra prediction mode of the current block is a dc mode, when the intra prediction mode of the current block is the dc mode, in a case where lengths of a height and a width of the current block are the same, determine an average of upper reference samples of the current block and left reference samples of the current block, as a dc value, and in a case where the lengths of the height and the width of the current block are different from each other, determine a weighted average value, which is determined by determining an average of the upper reference samples of the current block as an upper dc value, determine an average of the left reference samples of the current block as a left dc value, and combining the upper value and the left dc value with a predetermined weight, as a dc value, and perform intra prediction on the current block, based on the dc value.
Inventor(s): Hyunseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Gukhyun RYU of Suwon-si (KR) for samsung electronics co., ltd., Kideok SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/4363, H04N21/422, H04N21/431, H04N21/462
CPC Code(s): H04N21/4363
Abstract: an electronic device is provided. the electronic device includes a display, a communication interface configured to perform communication with a plurality of source devices, and one or more processors configured to control the display to display an image signal received from each of the plurality of source devices, according to a predetermined signal received from an input device, control the communication interface so that the communication interface that transmits a control signal received from the input device to a first source device from among the plurality of source devices transmits the control signal to a second source device, based on the control signal being received from the input device according to a user input regarding the input device, transmit the control signal to the second source device, and based on an image signal reflecting the user input being received, control the display to display the received image signal.
Inventor(s): Bongjoe KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/472, H04N21/422, H04N21/466
CPC Code(s): H04N21/47205
Abstract: a display device includes a display, an image receiver configured to receive video content having a first style, a memory storing one or more instructions and including one or more neural networks, and at least one processor configured to execute the one or more instructions stored in the memory to execute the one or more instructions to obtain a feature corresponding to a second style, transfer, by the one or more neural networks, a style of frame images of the video content from the first style to the second style based on the feature, and control the display to display frame images having the second style.
Inventor(s): Taeyoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N23/61, H04N23/667, H04N23/695
CPC Code(s): H04N23/64
Abstract: an electronic apparatus includes: a camera; a driver; at least one memory storing one or more instructions; and one or more processors operably connected to the camera, the driver, and the at least one memory, wherein the one or more instructions, when executed by the one or more processors, cause the electronic apparatus to: obtain an image captured through the camera; and based on an object included in the image, control the driver to change a photographic method of the camera and a placement state of the electronic apparatus.
Inventor(s): Akshaya A MUKUNDAN of Bengaluru (IN) for samsung electronics co., ltd., Vishwanath Vijaykumar HIREMATH of Bengaluru (IN) for samsung electronics co., ltd., Prashant Govindlal RUPAPARA of Bengaluru (IN) for samsung electronics co., ltd., Takahiko INADA of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/78, H04N25/46
CPC Code(s): H04N25/78
Abstract: there is provided a method for reading out a pixel array in an image sensor. the method includes determining a readout sequence based on a row offset, the row offset indicating a first set of rows and a second set of rows sharing a first output line and a second output line, reading, in a first row from the first set of rows of the pixel array, pixels corresponding to a first floating diffusion (fd) node from the first output line, and reading, in a second row from the first set of rows of the pixel array, pixels corresponding to a second floating diffusion (fd) node from the second output line at the plurality of time intervals, the first row and the second row from the first set of rows are incremented through the first set of rows based on the determined readout sequence.
Inventor(s): Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Sanghyeok KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungseoung YOO of Suwon-si (KR) for samsung electronics co., ltd., Juyeon JIN of Suwon-sI (KR) for samsung electronics co., ltd.
IPC Code(s): H04R3/12
CPC Code(s): H04R3/12
Abstract: a first electronic device is provided. the first electronic device includes: a microphone; a communication circuit; at least one processor, comprising processing circuitry, individually and/or collectively configured to: identify a request of a broadcast service to provide, based on synchronizing a second audio signal obtained via a microphone of a second electronic device with a first audio signal obtained via the microphone of the first electronic device, the first audio signal and the second audio signal to at least one external electronic device around the first electronic device and the second electronic device; and according to the request, transmit, using the communication circuit, to the second electronic device, information for a broadcast isochronous group (big) event including a first broadcast isochronous stream (bis) event for the first electronic device and a second bis event for the second electronic device.
Inventor(s): Jaehong KIM of Suwon-si (KR) for samsung electronics co., ltd., Subin Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngseon Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/18, H04W4/80, H04W88/06
CPC Code(s): H04W8/183
Abstract: an electronic device includes: a near field communication (nfc) circuit; at least one processor operatively connected to the nfc circuit; and memory storing instructions that, when executed by the at least one processor, cause the electronic device to: receive, via the nfc circuit from an external electronic device, an nfc application identifier (id), identify a subscriber identity module (sim) profile, from among a plurality of sim profiles, that corresponds to the nfc application id, and perform, via the nfc circuit, an nfc communication with the external electronic device based on the identified sim profile.
Inventor(s): Karthik Srinivasa GOPALAN of Bangalore (IN) for samsung electronics co., ltd., Ankur BANSAL of Bangalore (IN) for samsung electronics co., ltd., Aniruddh Rao KABBINALE of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/033, H04W12/02
CPC Code(s): H04W12/033
Abstract: embodiments herein disclose a method and an uwb device for linked secure advertisement. the method includes receiving uwb data to be broadcasted as advertisement, and classifying the uwb data to be broadcasted into sensitive uwb information and non-sensitive uwb information. the method also includes protecting the sensitive uwb information. further, the method includes generating the secure advertisement comprising at least one of the non-sensitive uwb information and the protected-sensitive uwb information, and broadcasting the secure advertisement. further, the proposed method provides a method for linking the fragments of the uwb advertisement data and fragmenting each field of the uwb data.
20250031085. CHANNEL STATE INFORMATION REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00
CPC Code(s): H04W24/10
Abstract: apparatuses and methods for csi reporting. a method performed by a user equipment (ue) includes receiving a configuration about a channel state information (csi) report. the configuration includes information about (i) k>1 non-zero power (nzp) csi-reference signal (rs) resources and (ii) a codebooktype. the codebooktype indicates a codebook associated with pcsi-rs ports aggregated across the k nzp csi-rs resources. the method further includes, based on the configuration, determining, a number of layers (v) and when v>1, determining a vector bfor each pair of consecutive layers (2−1,2) and determining one of: (a) a coefficient cfor each pair of consecutive layers (2−1,2) and (b) a coefficient c for each layer l=1, . . . , v. the method further includes transmitting the csi report including at least one vector indicator indicating vectors {b} and at least one coefficient indicator indicating coefficients. p>32, r=1, . . . , ┌v/2┐, and each vector has a length dependent on p.
Inventor(s): Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/36
CPC Code(s): H04W36/0033
Abstract: the disclosure relates to a 5generation (5g) or pre-5g communication system for supporting a higher data transfer rate after a 4generation (4g) communication system such as long term evolution (lte). according to various embodiments of the disclosure, an operation method performed by a center unit (cu)-control plane (cp) of a candidate base station (bs) may include transmitting a first message for a bearer context setup request to a cu-user plane (up) of the candidate bs, wherein the first message includes information for indicating a conditional handover which is a handover performed by a user equipment (ue) when at least one execution condition is satisfied, and receiving a second message for a bearer context setup response from the cu-up.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04B7/06, H04W56/00, H04W76/20
CPC Code(s): H04W36/0058
Abstract: techniques for performing a conditional low-layer triggered mobility (cltm) are disclosed. a ue may receive, from a current serving cell, for each of a respective one or more candidate target cells, (i) a cell configuration, (ii) at least one corresponding physical layer (l1) measurement configuration, and (iii) at least one execution condition. the ue performs, using the l1 measurement configurations, l1 measurements for the candidate target cells. the ue evaluates, based on one or more l1 measurement results, the execution condition corresponding to one or more candidate target cells. based upon evaluating that the execution condition corresponding to a candidate target cells is met, the ue determines the target cell as a new serving cell and selects a beam for the new serving cell based on one or more of the l1 measurements. the ue detaches from the current serving cell to apply the configuration of the new serving cell.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/32, H04W88/08
CPC Code(s): H04W36/00725
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to one embodiment, a method for operating a user equipment (ue) in a wireless communication system may comprise receiving an l1/l2 triggered mobility (ltm) medium access control control element (mac ce) from a base station, determining whether the ltm mac ce includes a timing advance (ta) value or a random access channel (rach)-less handover indicator, and when the ltm mac ce includes the ta value or the rach-less handover indicator, performing a handover procedure to a target cell based on the ta value or the rach-less handover indicator.
Inventor(s): Jajohn Mathew MATTAM of Bangalore (IN) for samsung electronics co., ltd., Sanjukta BISWAS of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/04
CPC Code(s): H04W36/0085
Abstract: handling layer 3 handover and layer 1/layer 2 triggered mobility (ltm) measurement in a wireless network is provided. the method performed by a user equipment (ue) includes receiving layer 3 measurement reporting configuration and ltm measurement reporting configuration from a centralized unit (cu) in the wireless network; determining layer 3 measurement for cell at the layer 1 of the ue based on the layer 3 measurement reporting configuration, and ltm measurement for cell at the layer 1 of the ue based on the ltm measurement reporting configuration; determining whether the layer 3 measurement meets layer 3 measurement reporting criteria, and whether the ltm measurement meets ltm measurement reporting criteria; and transmitting one of the layer 3 measurement to the cu, or the ltm measurement to a distributed unit (du).
Inventor(s): Donggun KIM of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00
CPC Code(s): H04W36/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of performing l1/l2 triggered mobility (ltm) in a user equipment (ue), communicatively coupled to a telecommunication network, wherein if the ue receives rrcreconfiguration containing ltm target cell information, rrcreconfigurationcomplete is sent to a source cell, and upon receipt of a mac control element (ce) from the source cell, the target cell information is applied, a handover is performed, and a further rrcreconfigurationcomplete is generated and sent to the target cell upon completion of the handover.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/36, H04W36/00, H04W76/20
CPC Code(s): H04W36/362
Abstract: a method performed by a master node (mn) in a wireless communication system is provided. the method includes receiving, from a source secondary node (s-sn), a secondary node (sn) change required message for initiating a subsequent conditional primary secondary cell group cell (pscell) addition and change (cpac), transmitting, to a plurality of candidate sns, an sn addition request message, receiving, from the plurality of candidate sns, an sn addition request acknowledge message, transmitting, to the s-sn and the plurality of candidate sns, the information on the at least one pscell, and receiving, from the plurality of candidate sns, first information on an updated configuration for the at least one pscell.
20250031134. ACQUISITION OF SYSTEM INFORMATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W48/14, H04W48/12
CPC Code(s): H04W48/14
Abstract: a ue includes a processor, and a transceiver operatively coupled to the processor. the transceiver is configured to receive information indicating that a system information block 1 (sib1) for a cell is not periodically broadcast within the cell, transmit, based on the information, a request for the sib1 of the cell, and receive the sib1 of the cell.
Inventor(s): Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W68/00, H04W76/10
CPC Code(s): H04W48/18
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). according to an embodiment, a method performed by a ue is provided. the method comprises transmitting, to an access and mobility management function (amf), information indicating that the ue supports network slice replacement feature, and in case that there is a protocol data unit (pdu) session associated with a single network slice selection assistance information (s-nssai) that needs to be replaced, receiving, from the amf, a mapping of the s-nssai to an alternative s-nssai.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Yuchih Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W88/02, H04W88/08
CPC Code(s): H04W52/0229
Abstract: the following methods and apparatuses are provided which enable an ap mld to indicate to one or more non-ap mlds a recommended wake-up time for them on one or more links. the recommended wake time, in some embodiments, may continue for at least one sta over a prescribed number of intervals. features are also provided for a sta to request a wake-up time recommendation to an ap, along with rules for the sta to obey. in one aspect of the disclosure, an ap sends a wake time recommendation element (wtre) in a beacon interval. rather than an immediate wake time, the wtre includes a prescription recommending that one, more or all stations defer their wakeup times to a recommended wake time.
Inventor(s): Kyujae JANG of Suwon-si (KR) for samsung electronics co., ltd., Jaemoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Dohun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaegon GHIM of Suwon-si (KR) for samsung electronics co., ltd., Jimin KOO of Suwon-si (KR) for samsung electronics co., ltd., Sungyoul CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04W4/38, H04W24/08, H04W52/22, H04W76/20
CPC Code(s): H04W52/367
Abstract: the present disclosure relates to an apparatus and a method for controlling power consumption for monitoring a sensor state in an electronic device. the electronic device can stop checking the state of at least one sensor until a radio resource control (rrc) connection is maintained, and a cumulative electromagnetic wave specific absorption rate (sar) reaches a preset threshold value (sar_threshold). the cumulative electromagnetic wave specific absorption rate may be an electromagnetic wave specific absorption rate accumulated by transmission power transmitted within a time period corresponding to a time slot using a specific frequency band.
Inventor(s): Eunhye Park of Suwon-si (KR) for samsung electronics co., ltd., Jinmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jung Woon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L25/02
CPC Code(s): H04W56/0035
Abstract: an operation method of a wireless communication device includes receiving a first signal including a first reference signal group, calculating a first residual frequency offset based on the first signal, receiving a second signal that is subsequent to the first signal and includes a second reference signal group, compensating a phase of the second signal based on the first residual frequency offset, estimating a first channel based on first channel characteristics, the first reference signal group, and the first signal, estimating a second channel based on second channel characteristics, the second reference signal group, and the second signal of which the phase is compensated, and calculating a second residual frequency offset based on the first channel estimation and the second channel estimation.
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Koustav ROY of Bangalore (IN) for samsung electronics co., ltd., Jagadeesh GANDIKOTA of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Krishnamurthy D R of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W60/00, H04W24/02
CPC Code(s): H04W60/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments disclosed herein relate to methods and systems for updating a partially allowed network slice selection assistance information (nssai) list, and managing a congestion timer/back-off timer for an alternative single-nssai (s-nssai) in wireless communication networks. the methods include removing network slice support information stored in a user equipment (ue), if a non-access stratum (nas) message from a network indicates to delete the network slice support information. the methods include applying a back-off timer to the s-nssai to be replaced (s-nssai-1)/alternative s-nssai (s-nssai-a)/combination of s-nssai-a+s-nssai-1, on receiving a packet data unit (pdu) session establishment request, when the network is congested. the methods include applying a back-off timer to the s-nssai-a/s-nssai-1/combination of s-nssai-a+s-nssai-1, on receiving a congestion timer from the network function while requesting an alternative s-nssai
20250031184. BUNDLING PAGING OCCASIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W68/02
CPC Code(s): H04W68/02
Abstract: a ue includes a transceiver. the transceiver is configured to receive a first paging configuration, and receive a second paging configuration. the ue further includes a processor operably coupled to the transceiver. the processor is configured to determine whether to apply the first or the second paging configuration, and according to the applied paging configuration, determine a paging frame (pf) and determine a paging occasion (po) index.
Inventor(s): Weiping SUN of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Allen TX (US) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/231, H04W28/02, H04W72/12
CPC Code(s): H04W72/231
Abstract: provided is a fifth generation (5g) or sixth generation (6g) communication system for supporting higher data rates. a method includes receiving, from a base station, a radio resource control (rrc) message including a first parameter indicating whether to delay a scheduling request (sr) transmission; in case that a regular buffer status report (bsr) is triggered, identifying whether the first parameter indicates to delay the sr transmission; in case that the first parameter indicates to delay the sr transmission, identifying whether a timer used to determine whether to delay the sr transmission is running; and based on identifying whether the timer used to determine whether to delay the sr transmission is running, delaying the sr transmission or triggering the sr transmission.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/00, H04L5/00, H04W16/14, H04W72/23, H04W74/0808, H04W74/0833
CPC Code(s): H04W74/006
Abstract: methods and apparatuses for control signaling for an unlicensed spectrum band. a method of a user equipment (ue) in a wireless communication system includes receiving, from a base station (bs), a downlink control information (dci) format and determining a type of channel access procedure based on a field in the dci format. the type of channel access procedure is one of: a first type of channel access procedure that includes a random time duration for sensing; a second type of channel access procedure that includes a positive and deterministic time duration for sensing; or a third type of channel access procedure that does not include a time duration for sensing. the method further includes performing a channel access procedure based on the determined type of channel access procedure and transmitting an uplink transmission on a channel with shared spectrum channel access after performing the channel access procedure.
Inventor(s): Fasil Abdul LATHEEF of Bangalore (IN) for samsung electronics co., ltd., Mangesh Abhimanyu INGALE of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04B7/06, H04L5/00, H04W36/36, H04W74/00, H04W76/18
CPC Code(s): H04W74/0833
Abstract: the present disclosure relates to a pre-5th-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th-generation (4g) communication system such as long term evolution (lte). embodiments herein disclose a method for reporting an accessibility measurement by a ue based on a rrc connection establishment failure in a wireless communication system. the method includes detecting a rrc connection establishment failure and logging parameters selected while attempting the failed rrc connection establishment, wherein the logged parameters are referred as accessibility measurements. further, the method includes indicating a presence of a connection establishment failure report to a base station and reporting a connection establishment failure report to the base station, in response to receiving request from the base station, wherein the failure report comprises accessibility measurements that comprise at least one of a ssb information selected during cell access and subsequently on which the ue encountered the rrc connection establishment failure and a uplink carrier information selected during cell access and subsequently on which the ue encountered the establishment failure.
Inventor(s): Madhusudan Gorur MANJUNATH of Bangalore (IN) for samsung electronics co., ltd., Sunil Kumar Nagaraju of Bangalore (IN) for samsung electronics co., ltd., Kaja Mohaideen Mohamed Ali of Bangalore (IN) for samsung electronics co., ltd., Sreenivasa Dhamarangunta Reddy of Bangalore (IN) for samsung electronics co., ltd., Anupam Majumder of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04W8/20, H04W12/043, H04W52/02
CPC Code(s): H04W76/10
Abstract: a method for optimizing cross subscriber identity module (sim) calling by a user equipment (ue), comprising: detecting, by the ue, an event associated at the ue, and cross sim calling is established at the ue; initiating, by the epdg of the ap, an evolved packet data gateway (epdg) at a communication processor (cp) of the ue based on the call being established; and processing, by the cp of the ue, the cross sim data packets using an ip security tunnel.
Inventor(s): Sanghyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngho HWANG of Suwon-si (KR) for samsung electronics co., ltd., Juno PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwhan OH of Suwon-si (KR) for samsung electronics co., ltd., Youngkyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jaehong LIM of Suwon-si (KR) for samsung electronics co., ltd., Chulmin CHO of Suwon-si (KR) for samsung electronics co., ltd., Seok HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B3/26, G03F7/00
CPC Code(s): H05B3/26
Abstract: a substrate supporting member and a substrate processing apparatus including the same are provided. the substrate supporting member includes a plate having at least one heating zone. a heating member is on a first surface of the plate and located in the at least one heating zone. the heating member extends along a circumferential direction of the plate and is configured to heat a substrate supported by the plate. a first electrode is on the first surface of the plate and is connected to an inner side surface of the heating member. a second electrode is on the first surface of the plate and is connected to an outer side surface of the heating member. the heating member has a stair-step configuration such that a thickness of the heating member increases from the second electrode toward the first electrode.
20250031285. COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jiyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Jooyong YOON of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoon CHOO of Suwon-si (KR) for samsung electronics co., ltd., Jonghun HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/12, F24C7/08
CPC Code(s): H05B6/1209
Abstract: a cooking apparatus includes: a cooking plate; at least one induction heater below the cooking plate and configured to generate a magnetic field; and a light source configured to emit light, wherein the cooking plate may include: a glass body; a printing layer on a lower surface of the glass body, the printing layer including a hole configured to allow the light emitted from the light source to be transmitted through the hole, and a color filter layer on a lower surface of the printing layer and corresponding to the hole in a vertical direction, wherein the cooking plate is divided into a first region that corresponds to the at least one induction heater and a second region that does not correspond to the at least one induction heater, and wherein the color filter layer is located in the first region.
20250031286. COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongjoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Eundae BAE of Suwon-si (KR) for samsung electronics co., ltd., YoungHoon WOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/12
CPC Code(s): H05B6/1254
Abstract: a cooking apparatus comprising a cooking plate; at least one coil assembly to generate a magnetic field; and a driving circuit to drive the at least one coil assembly. the at least one coil assembly includes a base; and a working coil supportable by the base. the working coil is formed of a wire. the wire is withdrawable toward the base.
Inventor(s): Youngjin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kihwan KWON of Suwon-si (KR) for samsung electronics co., ltd., Hongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Honjeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Sujin CHO of Suwon-si (KR) for samsung electronics co., ltd., Woosung CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/14, G06F1/16, H05K5/02
CPC Code(s): H05K1/148
Abstract: according to an embodiment, an electronic device includes: a first printed circuit board (pcb), a second pcb spaced apart from the first pcb, and a flexible printed circuit board (fpcb) connecting the first printed circuit board and the second printed circuit board. the electronic device includes a support plate including a hole through which a portion of the fpcb passes, and a waterproof member comprising a waterproof material disposed in the hole. the flexible printed circuit board includes a first connector connected the first pcb, a second connector, and a slit separating the first connector and the second connector. a portion of the slit may be disposed in the waterproof member.
Inventor(s): Changik JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunyoung ROH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H04R1/04, H04R1/08, H05K7/14
CPC Code(s): H05K5/0217
Abstract: an electronic device may include a housing forming a side surface surrounding an internal space, and including a front frame which is disposed in the internal space and forms at least a portion of the side surface, and on which a sound hole for transferring a sound from an outside of the electronic device to the internal space, and an acoustic duct communicating with the sound hole are formed, a printed circuit board (pcb) which is supported by the front frame and includes a first board surface, a second board surface, and an opening, a sound module disposed on, directly or indirectly, the first board surface to overlap the opening, and a sealing member that seals a portion between the front frame and the pcb. the front frame includes a support area supporting the sealing member along a circumferential direction of the sealing member.
20250031329. ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeong WOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K5/00
CPC Code(s): H05K5/0226
Abstract: the disclosure relates to an electronic device. an electronic device according to an embodiment of the disclosure may comprise: a first housing, a second housing rotatably disposed with respect to the first housing, a hinge including a first hinge arm connected to the first housing and a second hinge arm connected to the second housing, a flexible display disposed on the first housing and the second housing and spaced apart from each of the first hinge arm and the second hinge arm, a first plate disposed between the first hinge arm and the flexible display, and a second plate disposed between the second hinge arm and the flexible display and spaced apart from the first plate. the first plate may comprise a first edge portion including a first inclined surface inclined with respect to a direction in which the first hinge arm and the flexible display are spaced apart from each other.
Inventor(s): Jaehyun BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/03, H05K5/02
CPC Code(s): H05K5/03
Abstract: a flexible glass including: a flexible area configured to move between a planar shape and a curved shape with respect to at least one folding axis extending along a first direction; a planar area provided on at least one side of the flexible area; and a plurality of first holes provided in at least a portion of the flexible area, where the plurality of first holes extend along the first direction and are provided along a second direction intersecting the first direction in an arrangement area of the flexible area, and a first width of the arrangement area along the second direction of at least one edge of the flexible area intersecting the at least one folding axis is greater than a second width of the arrangement area at a center between edges of the flexible area.
20250031359. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jee Woong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jin Kyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Yun Suk Nam of Suwon-si (KR) for samsung electronics co., ltd., Kyo-Wook Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B10/00
CPC Code(s): H10B10/125
Abstract: the present disclosure relates to semiconductor devices, including a semiconductor device including a backside power delivery network (bspdn). an example semiconductor device includes a substrate comprising a first surface and a second surface opposite to each other, a first active pattern on the first surface, a first gate structure intersecting the first active pattern, and first and second back wiring patterns disposed on the second surface at a same height from the substrate. the first back wiring pattern comprises a first extension portion and a second extension portion each extending in a first direction, and a connection portion extending in a second direction intersecting the first direction to connect the first extension portion to the second extension portion. the second back wiring pattern is spaced apart from the first extension portion in the second direction, and spaced apart from the connection portion in the first direction.
Inventor(s): Byounghak HONG of Albany NY (US) for samsung electronics co., ltd., Seunghyun SONG of Albany NY (US) for samsung electronics co., ltd., Saehan PARK of Clifton Park NY (US) for samsung electronics co., ltd., Seungyoung LEE of Clifton Park NY (US) for samsung electronics co., ltd., Inchan HWANG of Schenectady NY (US) for samsung electronics co., ltd.
IPC Code(s): H10B10/00, H01L21/762, H01L27/092, H01L29/06, H01L29/423, H01L29/66, H01L29/786
CPC Code(s): H10B10/125
Abstract: a multi-stack semiconductor device includes: a plurality of lower transistor structures arranged on a lower stack and including a plurality of lower fin structures surrounded by a plurality of lower gate structures, respectively; a plurality of upper transistor structures arranged on an upper stack and including a plurality of upper fin structures surrounded by a plurality of upper gate structures, respectively; and at least one of a lower diffusion break structure on the lower stack and a upper diffusion break structure on the upper stack, wherein the lower diffusion break structure is formed between two adjacent lower gate structures, and isolates two lower transistor structures respectively including the two adjacent lower gate structures from each other, and the upper diffusion break structure is formed between two adjacent upper gate structures, and isolates two upper transistor structures respectively including the two adjacent upper gate structures from each other.
Inventor(s): Minju KANG of Suwon-si (KR) for samsung electronics co., ltd., Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangjae PARK of Suwon-si (KR) for samsung electronics co., ltd., Sohyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H10N50/80, H10N70/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a first active pattern including a first edge portion and a second edge portion spaced apart from the first edge portion in a first direction, a first word line between the first edge portion and the second edge portion and extending in a second direction intersecting the first direction, a bit line on the first edge portion and extending in a third direction intersecting the first direction and the second direction, and a storage node contact on the second edge portion, where the first edge portion includes a first top surface and a second top surface, and the second top surface of the first edge portion is closer to the second edge portion than the first top surface of the first edge portion.
Inventor(s): Junil Lee of Suwon-si (KR) for samsung electronics co., ltd., Yongjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Chanho Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangwan Nam of Suwon-si (KR) for samsung electronics co., ltd., Ryoongbin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C16/30, H10B41/27, H10B41/41, H10B43/27
CPC Code(s): H10B43/40
Abstract: a semiconductor device may include a first semiconductor structure including a substrate, an active region in the substrate, a device isolation region defining the active region, and a capacitor structure on the device isolation region and vertically overlapping the device isolation region. the capacitor structure may include a first electrode structure extending in a first direction and including first capacitor electrodes stacked in the first direction, a second electrode structure including second capacitor electrodes stacked in the first direction, and a first insulating structure between the first electrode structure and the second electrode structure. each of the first capacitor electrodes and the second capacitor electrodes are alternately arranged and spaced apart from each other in a second direction parallel to an upper surface of the substrate, extend in a third direction perpendicular to the first direction and the second direction, and has a plate shape.
20250031377. 3D SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Chang-Bum Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyuckjoon Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L23/00, H01L25/065, H01L25/18, H10B41/27, H10B41/41, H10B43/27, H10B80/00
CPC Code(s): H10B43/40
Abstract: a three-dimensional (3d) semiconductor memory device is provided. the device includes: a memory cell region; and a peripheral circuit configured to control the memory cell region. the memory cell region includes: a cell array region including memory cells arranged vertically along a vertical direction; and a connection region including ends of word lines that are connected to the memory cells, wherein the ends form a stair-step configuration. the peripheral circuit includes a peripheral circuit region overlapping the connection region along the vertical direction. the peripheral circuit region includes a first main pass transistor electrically connected to a first word line of the word lines, and a first dummy pass transistor electrically separated from the word lines. the first main pass transistor and the first dummy pass transistor are arranged along a first direction perpendicular to the vertical direction.
Inventor(s): Hojun CHOI of Anyang-si (KR) for samsung electronics co., ltd., Ji Seong KIM of Eumseong-gun (KR) for samsung electronics co., ltd., Min Cheol OH of Seoul (KR) for samsung electronics co., ltd., Ki-Il KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L21/8238, H01L27/092, H01L29/08, H01L29/423, H01L29/66
CPC Code(s): H01L29/7827
Abstract: there is provided a semiconductor device capable of improving electrical characteristics and integration density. the semiconductor device includes an active pattern protruding from a substrate, the active pattern including long sidewalls extending in a first direction and opposite to each other in a second direction, a lower epitaxial pattern on the substrate and covering a part of the active pattern, a gate electrode on the lower epitaxial pattern and extending along the long sidewalls of the active pattern, and an upper epitaxial pattern on the active pattern and connected to an upper surface of the active pattern. the active pattern includes short sidewalls connecting with the long sidewalls of the active pattern, and at least one of the short sidewalls of the active pattern has a curved surface.
20250031412. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Myungil KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/528, H01L29/06, H01L29/40, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device includes gate structures on an insulation structure, the gate structures disposed in a second direction substantially parallel to an upper surface of the insulation structure, source/drain layers at opposite sides, respectively, of each gate structure in a first direction intersecting the second direction, semiconductor patterns disposed in a third direction substantially perpendicular to the upper surface of the insulation structure, the semiconductor patterns extending through each of the gate structures and contacting the source/drain layers, a first division pattern between the gate structures, and a connection pattern extending into and contacting an upper portion of the first division pattern and upper portions of the gate structures adjacent to the first division pattern, a lower surface of the connection pattern being lower than upper surfaces of the gate structures and an upper surface of the connection pattern being higher than the upper surfaces of the gate structures.
Inventor(s): Rock-Hyun BAEK of Pohang-si (KR) for samsung electronics co., ltd., Jin-Su JEONG of Daegu-si (KR) for samsung electronics co., ltd., Jun-Sik YOON of Pohang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/10, H01L29/16, H01L29/423, H01L29/49, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/0653
Abstract: the present disclosure discloses a gate-all-around field effect transistor which not only can suppress the occurrence of punch through in the lower end of the substrate and direct leakage of current from the source region/drain region into the lower ends of the channels, but also can facilitate heat release of the substrate by forming trench inner spacers (tis) and thus preventing source region/drain region impurities from diffusing into the substrate, and a method for manufacturing the same.
20250031442. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ji Won Park of Suwon-si (KR) for samsung electronics co., ltd., Min Seok Jo of Suwon-si (KR) for samsung electronics co., ltd., Woo Sung Park of Suwon-si (KR) for samsung electronics co., ltd., Jun-Youp Lee of Suwon-si (KR) for samsung electronics co., ltd., Jin Young Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L23/528, H01L29/06, H01L29/417, H01L29/423, H01L29/775
CPC Code(s): H01L27/092
Abstract: a semiconductor device includes a first substrate having a first surface and a second opposite surface, a first lower interlayer insulating layer on the second surface, a first active pattern including a first lower pattern contacting the first surface, a plurality of first sheet patterns spaced apart from the first lower pattern in a second direction, a first gate structure on the first lower pattern, a first source/drain pattern on a side of the first gate structure, a second lower interlayer insulating layer including a third surface and a fourth opposite surface, a second active pattern including a second lower pattern contacting the third surface, a plurality of second sheet patterns spaced apart from the second lower pattern in the second direction, a second gate structure on the second lower pattern, wherein the first lower pattern has a first height, and the second lower pattern has a second different height.
Inventor(s): Seungchan YUN of Waterford NY (US) for samsung electronics co., ltd., Jaejik Baek of Watervliet NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L27/0922
Abstract: provided is a three-dimension (3d) stacked semiconductor device which includes: a 1source/drain region connected to a 1channel structure; and a 2source/drain region, above the 1source/drain region, connected to a 2channel structure above the 1channel structure, wherein the 2channel structure has a smaller length than the 1channel structure in a channel-length direction, in which the 2source/drain region is connected to a 3source/drain region through the 2channel structure.
Inventor(s): Jintae KIM of Clifton Park NY (US) for samsung electronics co., ltd., Panjae PARK of Halfmoon NY (US) for samsung electronics co., ltd., Kang-ill SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L23/528, H01L27/092
CPC Code(s): H01L27/0207
Abstract: provided is a semiconductor device based on a cell architecture which includes: a 1semiconductor cell; and a 2semiconductor cell which is connected to the 1semiconductor cell in a 1direction such that an output pin of the 1semiconductor cell is connected to an input pin of the 2semiconductor cell, wherein the 2semiconductor cell is in a form in which the 1semiconductor cell is turned upside down.
20250031464. IMAGE SENSORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungwook LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14603
Abstract: image sensors may include a base substrate including a substrate layer, a buried insulation layer on the substrate layer, and a semiconductor layer on the buried insulation layer, a photo sensing device in the substrate layer, a buried impurity region spaced apart from the photo sensing device in an upper portion of the substrate layer, a transfer gate including a vertical gate extending through the semiconductor layer and the buried insulation layer and extending into an inner portion of the substrate layer, which is between the photo sensing device and the buried impurity region, a planar gate on the semiconductor layer, and a gate insulation layer between the substrate layer and the planar gate.
20250031467. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sooyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Doowon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yongjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sol Yoon of Suwon-si (KR) for samsung electronics co., ltd., Keunhyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Dongjun Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/79
CPC Code(s): H01L27/14614
Abstract: an image sensor is described comprising a first, a second, and a third stack mounted together. the first stack includes a first semiconductor substrate with a photoelectric conversion region, a floating diffusion region, and a transmission gate. the photoelectric conversion region absorbs light, and the charges freed by the light absorption are stored in the floating diffusion region prior to being transferred to other circuitry by the transmission gate. the transmission gate comprises an etch stop film on an upper surface and on a sidewall. the second stack, attached to the first stack, includes a second semiconductor substrate in which is located a pixel gate. the pixel gate is electrically connected with the floating diffusion region and further comprises a gate spacer on a sidewall of the pixel gate. the third stack, attached to the second stack, includes a logic transistor.
Inventor(s): Ha Young KO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/69
CPC Code(s): H01L27/14627
Abstract: an assembly method of an image sensor module assembly device is provided. the assembly method includes: setting an image sensor and a module lens of an image sensor module at a first position; inputting image data to the image sensor module set at the first position; pre-processing data that are output from the image sensor module based on sensing the input image data; obtaining, based on the pre-processed data, a module optical system reference value of the module lens and a sensor optical system reference value of the image sensor; and determining whether to maintain the first position based on the module optical system reference value and the sensor optical system reference value.
Inventor(s): Hyungchae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhwa HAN of Suwon-si (KR) for samsung electronics co., ltd., Jinsuk HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor includes: a substrate having a first surface and a second surface opposite to the first surface in a first direction, the substrate including pixel areas arranged along a second direction parallel to the first surface; photodiodes in the substrate in each of the pixel areas and separated from each other in the second direction; a first device isolation layer between the pixel areas; and a pair of second device isolation layers extending between the photodiodes from the first device isolation layer along a third direction and being spaced apart from each other in the third direction, wherein the third direction is parallel to the first surface and different from the second direction, the substrate further includes a potential barrier region between the photodiodes and between the pair of second device isolation layers, and the potential barrier region includes p-type impurities and carbon.
20250031476. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minho JANG of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun GO of Suwon-si (KR) for samsung electronics co., ltd., Doowon KWON of Suwon-si (KR) for samsung electronics co., ltd., Changkyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongkun JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L23/00, H01L23/522, H04N25/79
CPC Code(s): H01L27/14636
Abstract: an image sensor includes a first semiconductor chip including a first semiconductor substrate including a plurality of pixels and a first wiring structure having a first bonding pad; a second semiconductor chip including a second semiconductor substrate having pixel signal generator circuits, a second wiring structure on the second semiconductor substrate and having an upper bonding pad bonded to the first bonding pad, a back side insulating layer on a lower surface of the second semiconductor substrate and including a shielding metal pattern buried therein, and a conductive through-via penetrating the back side insulating layer and the first semiconductor substrate, and a third semiconductor chip including a bonding layer having a lower bonding pad connected to the conductive through via, a third semiconductor substrate including logic devices, and a third wiring structure having a third bonding pad bonded to the lower bonding pad.
Inventor(s): Dongchul Shin of Suwon-si (KR) for samsung electronics co., ltd., Joosung Kim of Suwon-si (KR) for samsung electronics co., ltd., Junghun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/32, H01L25/075, H01L33/00, H01L33/04
CPC Code(s): H01L33/32
Abstract: a light-emitting device includes a base semiconductor layer, at least one core provided on the base semiconductor layer, the at least one core including a body portion extending in a first direction and a shielding portion provided at an upper end of the body portion, where a width of a lower surface of the shielding portion in a second direction orthogonal to the first direction is greater than a width of the body portion in the second direction, a first insulating layer provided on an upper surface of the base semiconductor layer and an upper surface of the shielding portion, and at least one light-emitting portion provided on a side surface of the body portion.
Inventor(s): Seonghwan SHIN of Suwon-si (KR) for samsung electronics co., ltd., Gunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Tackmo LEE of Suwon-si (KR) for samsung electronics co., ltd., Soonmin HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/56, H01L25/075, H01L25/16, H01L27/15
CPC Code(s): H01L33/56
Abstract: a display module includes: a substrate including a mounting surface having a thin-film transistor (tft) layer is formed thereon, a side surface, and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface; an anisotropic conductive layer on the tft layer and configured to electrically connect the tft layer with the plurality of inorganic light-emitting elements; a front cover for covering the mounting surface; a side cover for surrounding the side surface; and a metal plate adhered to the rear surface. a side end of the front cover extends to a region outside the mounting surface. the side cover is made of a moisture-proof material for preventing moisture from permeating, and extends to at least a part of a side surface of the metal plate from a lower portion of the front cover corresponding to the region outside the mounting surface.
Inventor(s): Jongho LIM of Suwon-si (KR) for samsung electronics co., ltd., Myoungsu CHAE of Suwon-si (KR) for samsung electronics co., ltd., Yeonjun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyongsik WON of Suwon-si (KR) for samsung electronics co., ltd., Joonwoo JEON of Suwon-si (KR) for samsung electronics co., ltd., Soonwon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H05K1/11
CPC Code(s): H01L33/62
Abstract: a light-emitting diode (led) package includes a package substrate, an led chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. the first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. the first side is spaced farther from a center of the package substrate than the second side. a length of the first side is shorter than a length of the second side.
Inventor(s): Junsik HWANG of Hwaseong-si (KR) for samsung electronics co., ltd., Seogwoo HONG of Yongin-si (KR) for samsung electronics co., ltd., Kyungwook HWANG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L25/075, H01L27/12
CPC Code(s): H01L33/62
Abstract: a micro light emitting device, a display apparatus including the same, and a method of manufacturing the micro light emitting device are disclosed. the micro light emitting device includes a first type semiconductor layer; a light emitting layer provided on the first type semiconductor layer; a second type semiconductor layer provided on the light emitting layer; one or more first type electrodes provided on the second type semiconductor layer; one or more second type electrodes provided on the second type semiconductor layer and spaced apart from the one or more first type electrodes; and a bonding spread prevention portion provided between the one or more first type electrodes and the one or more second type electrodes.
Inventor(s): Donghyeon YEO of Suwon-si (KR) for samsung electronics co., ltd., Yongwoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Heekon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/64, H01L25/16, H01L33/60
CPC Code(s): H01L33/642
Abstract: an electronic device is provided. the electronic device includes a cover including a first surface which is a portion of an outer surface of the electronic device and a second surface facing in a direction opposite to the first surface, and including a light transmission portion, a substrate disposed in an inner space of the electronic device, a light source disposed on the substrate to emit light through the light transmission portion, and a heat dissipation sheet disposed on the second surface of the cover to surround at least a portion of the light transmission portion, and a heat dissipation sheet attached on the second surface of the cover to surround at least a portion of the light transmission portion, wherein the heat dissipation sheet includes a heat diffusion member, and a light reflection member.
Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd.
- A47L9/28
- A47L9/00
- A47L9/14
- H03K5/1536
- CPC A47L9/2889
- Samsung electronics co., ltd.
- A61B5/0537
- A61B5/00
- A61B5/0205
- A61B5/024
- A61B5/0533
- A61B5/06
- CPC A61B5/0537
- A61B5/117
- G16H20/30
- CPC A61B5/117
- A61B5/1455
- G16H10/40
- G16H50/70
- CPC A61B5/1455
- A61B5/11
- A61B5/16
- CPC A61B5/486
- A63B21/005
- A63B21/00
- CPC A63B21/0058
- A63F13/52
- A63F13/5378
- G06T3/40
- G06V10/25
- G06V10/44
- CPC A63F13/52
- B24B37/005
- CPC B24B37/005
- B24B37/04
- B24B37/27
- B24B53/017
- B24B57/02
- CPC B24B37/04
- B25J15/04
- A47L11/10
- A47L11/40
- A47L13/16
- B25J9/00
- B25J11/00
- B25J15/00
- CPC B25J15/0441
- F04C18/344
- F25B31/02
- CPC F04C18/3448
- F24F1/16
- CPC F24F1/16
- G01L19/14
- CPC G01L19/14
- G01N21/31
- CPC G01N21/31
- G01N21/88
- G08B21/18
- H04M1/02
- H04M1/24
- CPC G01N21/8806
- G01R31/3185
- CPC G01R31/318541
- G01S5/02
- G01S5/04
- G01S5/14
- CPC G01S5/0268
- G01S5/16
- CPC G01S5/16
- G01S13/76
- CPC G01S13/765
- G02B27/01
- G02B7/02
- CPC G02B27/0176
- G03F1/36
- G03F1/70
- G06F30/392
- G06F119/18
- CPC G03F1/36
- G03F7/00
- G03F7/20
- CPC G03F7/70991
- G04G17/04
- G04G9/08
- CPC G04G17/045
- G05D1/246
- G05D107/40
- G05D111/10
- H04N23/695
- CPC G05D1/246
- G06F1/16
- CPC G06F1/1624
- G06F3/046
- CPC G06F1/1641
- E05D3/12
- CPC G06F1/1681
- G06F3/0346
- G04G21/02
- G06F3/01
- G06F3/02
- G06F3/0362
- G06F3/038
- G06F3/041
- CPC G06F3/0346
- G06F3/06
- CPC G06F3/0623
- G11C11/16
- H03K19/17728
- CPC G06F3/0625
- CPC G06F3/0655
- G06F13/42
- CPC G06F3/0659
- G06F7/544
- G06F9/30
- G06N3/063
- CPC G06F7/5443
- G06F12/0817
- CPC G06F12/0828
- G06F12/0895
- G06F12/123
- CPC G06F12/0895
- G06F12/1009
- G06F12/0831
- CPC G06F12/1009
- G06F13/28
- CPC G06F13/28
- G06F21/57
- H04L9/08
- H04L9/30
- H04L9/32
- CPC G06F21/572
- G06F21/60
- G06F21/78
- CPC G06F21/575
- G06F21/64
- CPC G06F21/64
- G06N3/08
- CPC G06N3/08
- G06N20/00
- G10L15/18
- G10L15/26
- CPC G06N20/00
- G06T5/50
- G06T3/4053
- G06T5/40
- CPC G06T5/50
- G06T5/60
- G06T3/4046
- G06T5/10
- G06T5/70
- G06T5/77
- CPC G06T5/60
- G06T5/00
- CPC G06T5/73
- G06T17/00
- G06T7/20
- CPC G06T17/00
- G06T19/00
- CPC G06T19/00
- G06V20/40
- G06T5/20
- G06T7/194
- G06V10/80
- CPC G06V20/44
- CPC G06V20/46
- G08G1/14
- CPC G08G1/148
- G09G3/3208
- CPC G09G3/3208
- G09G3/3225
- CPC G09G3/3225
- G09G5/10
- G09G3/3233
- CPC G09G5/10
- G10L15/16
- G10L15/22
- CPC G10L15/16
- CPC G10L15/22
- G10L17/06
- G10L17/02
- G10L17/04
- G10L21/034
- G10L25/18
- G10L25/60
- CPC G10L17/06
- G10L21/0208
- CPC G10L21/0208
- G11B33/12
- H01R13/58
- CPC G11B33/126
- G11C11/18
- G11C19/08
- H01F10/32
- H10B61/00
- H10N50/10
- H10N50/80
- CPC G11C11/161
- G11C11/22
- CPC G11C11/2275
- G11C13/00
- CPC G11C13/0069
- CPC G11C19/0841
- G11C29/42
- G11C29/12
- G11C29/20
- G11C29/44
- CPC G11C29/42
- H01L21/67
- B08B3/04
- B08B3/08
- B08B3/10
- H01L21/02
- CPC H01L21/67051
- H01L21/683
- H05B3/28
- CPC H01L21/6833
- H01L21/687
- CPC H01L21/6838
- H01L21/66
- H01L23/00
- H01L23/48
- H01L25/065
- CPC H01L22/32
- H01L23/31
- H01L21/56
- H01L21/768
- H01L23/13
- CPC H01L23/3128
- H01L23/36
- H01L23/38
- H01L23/498
- H01L23/538
- H01L23/64
- CPC H01L23/36
- H01L23/367
- H01L23/373
- H01L25/18
- CPC H01L23/367
- H10B80/00
- CPC H01L23/481
- H01L23/528
- H01L27/088
- H01L29/06
- H01L29/423
- H01L29/775
- H01L29/786
- H01L23/485
- H01L29/08
- H01L29/66
- CPC H01L23/485
- H01L23/522
- H01L25/00
- CPC H01L23/49822
- H01L21/027
- CPC H01L23/49838
- CPC H01L23/5381
- H01L23/552
- H01L21/48
- H01L25/10
- CPC H01L23/552
- CPC H01L23/562
- CPC H01L24/05
- H01L23/29
- CPC H01L25/0657
- H01L25/075
- H01L27/15
- H01L33/38
- H01L33/50
- CPC H01L25/0753
- CPC H01L25/105
- H01L25/16
- CPC H01L25/167
- H01Q1/22
- H01Q1/38
- H01Q1/48
- H01Q1/52
- H05K1/02
- CPC H01Q1/2283
- H01Q1/24
- H01Q9/04
- CPC H01Q1/243
- H01Q5/378
- H01Q5/50
- CPC H01Q5/378
- H01Q21/24
- H01Q21/06
- CPC H01Q21/24
- H03H7/38
- H04B1/00
- CPC H03H7/38
- H03K19/0948
- H03K19/0185
- CPC H03K19/0948
- H03M1/06
- CPC H03M1/0607
- H04B7/026
- H04B7/06
- H04L5/00
- CPC H04B7/026
- H04W72/231
- CPC H04B7/0626
- H04L41/0806
- H04L41/0895
- H04W24/02
- CPC H04L41/0806
- H04L9/40
- CPC H04L63/0442
- H02J50/10
- H05K7/20
- CPC H04M1/0235
- CPC H04M1/0268
- H04M1/03
- H04R1/28
- H04R1/32
- CPC H04M1/035
- H04N9/31
- G06V20/50
- CPC H04N9/3179
- H04N19/159
- H04N19/105
- H04N19/119
- H04N19/132
- H04N19/176
- H04N19/593
- CPC H04N19/159
- H04N21/4363
- H04N21/422
- H04N21/431
- H04N21/462
- CPC H04N21/4363
- H04N21/472
- H04N21/466
- CPC H04N21/47205
- H04N23/60
- H04N23/61
- H04N23/667
- CPC H04N23/64
- H04N25/78
- H04N25/46
- CPC H04N25/78
- H04R3/12
- CPC H04R3/12
- H04W8/18
- H04W4/80
- H04W88/06
- CPC H04W8/183
- H04W12/033
- H04W12/02
- CPC H04W12/033
- H04W24/10
- CPC H04W24/10
- H04W36/00
- H04W36/08
- H04W36/36
- CPC H04W36/0033
- H04W56/00
- H04W76/20
- CPC H04W36/0058
- H04W36/32
- H04W88/08
- CPC H04W36/00725
- H04W36/04
- CPC H04W36/0085
- CPC H04W36/08
- CPC H04W36/362
- H04W48/14
- H04W48/12
- CPC H04W48/14
- H04W48/18
- H04W68/00
- H04W76/10
- CPC H04W48/18
- H04W52/02
- H04W88/02
- CPC H04W52/0229
- H04W52/36
- H04W4/38
- H04W24/08
- H04W52/22
- CPC H04W52/367
- H04L25/02
- CPC H04W56/0035
- H04W60/00
- CPC H04W60/00
- H04W68/02
- CPC H04W68/02
- H04W28/02
- H04W72/12
- CPC H04W72/231
- H04W74/00
- H04W16/14
- H04W72/23
- H04W74/0808
- H04W74/0833
- CPC H04W74/006
- H04W76/18
- CPC H04W74/0833
- H04W8/20
- H04W12/043
- CPC H04W76/10
- H05B3/26
- CPC H05B3/26
- H05B6/12
- F24C7/08
- CPC H05B6/1209
- CPC H05B6/1254
- H05K1/14
- H05K5/02
- CPC H05K1/148
- H04R1/04
- H04R1/08
- H05K7/14
- CPC H05K5/0217
- H05K5/00
- CPC H05K5/0226
- H05K5/03
- CPC H05K5/03
- H10B10/00
- CPC H10B10/125
- H01L21/762
- H01L27/092
- H10B12/00
- H10N70/00
- CPC H10B12/482
- H10B43/40
- G11C16/30
- H10B41/27
- H10B41/41
- H10B43/27
- CPC H10B43/40
- H01L29/78
- H01L21/8238
- CPC H01L29/7827
- H01L29/417
- H01L29/40
- CPC H01L29/41733
- H01L29/10
- H01L29/16
- H01L29/49
- CPC H01L29/0653
- CPC H01L27/092
- H01L21/822
- CPC H01L27/0922
- H01L27/02
- CPC H01L27/0207
- H01L27/146
- CPC H01L27/14603
- H04N25/79
- CPC H01L27/14614
- H04N25/69
- CPC H01L27/14627
- CPC H01L27/1463
- CPC H01L27/14636
- H01L33/32
- H01L33/00
- H01L33/04
- CPC H01L33/32
- H01L33/56
- CPC H01L33/56
- H01L33/62
- H05K1/11
- CPC H01L33/62
- H01L27/12
- H01L33/64
- H01L33/60
- CPC H01L33/642
