Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on February 6th, 2025
Samsung Electronics Co., Ltd.: 187 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (20), H01L25/065 (12), H01L23/498 (10), H01L23/31 (10), H10B80/00 (9) H10B43/27 (4), G06T19/006 (3), H04W48/16 (3), H04W64/00 (2), H04W60/06 (2)
With keywords such as: layer, device, semiconductor, including, based, information, substrate, surface, structure, and data in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Minwoo RYU of Suwon-si (KR) for samsung electronics co., ltd., Jinwook YOON of Suwon-si (KR) for samsung electronics co., ltd., Taegyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Euihyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jihoon HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A01D34/00, A01D101/00
CPC Code(s): A01D34/008
Abstract: a mobile robot and a method performed by the mobile robot are provided. the mobile robot includes a main body, a plurality of wheels mounted on the main body, a blade mounted on the main body to cut grass, an optical sensor configured to generate an image with a field of view facing a front of the main body, a user interface configured to obtain a user input and provide information about an operation of the mobile robot, and at least one processor. the at least one processor is configured to identify a plurality of objects from the image obtained while the main body moves, determine an object detected for a predetermined period of time among the plurality of identified objects to be a contaminant, determine a degree of contamination of the optical sensor based on a characteristic of the contaminant and a location of the contaminant in the image, provide information corresponding to the degree of contamination of the optical sensor via the user interface, and determine an operation mode of the mobile robot based on the degree of contamination of the optical sensor.
Inventor(s): Donggyu OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A44C5/14
CPC Code(s): A44C5/14
Abstract: an embodiment in the present disclosure relates to a fastening structure capable of attaching/detaching a strap for an electronic device using the strap. to this end, the electronic device can have fastening grooves formed to face each other on the inner side surfaces of the pair of lugs arranged in a housing, the fastening grooves connecting an open-ended portion and a close-ended portion so as to have at least one curve. when the strap is attached/detached to/from the pair of lugs, a fastening pin can be formed in the vicinity of one end of the strap so as to move according to the fastening grooves. one end portion of the strap having the fastening pin can correspond to an end oriented toward the housing during attachment to the housing from among two ends provided at each side of the strap. other various embodiments are possible.
20250040693. WAFER CLEANING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DONGHOON KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaemin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A46B17/06, A46B13/00, B08B1/52, B08B3/12, H01L21/67
CPC Code(s): A46B17/06
Abstract: a wafer cleaning apparatus includes a wafer roller rotating a wafer around a first direction parallel to a normal direction of a first surface of the wafer, a first brush facing the first surface of the wafer, a second brush facing a second surface of the wafer opposite to the first surface, a first cleaning tank disposed apart from the first brush and movable to accommodate at least a portion of the first brush, and a second cleaning tank disposed apart from the second brush and movable to accommodate at least a portion of the second brush. the first and second cleaning tanks include a first solution injection member connected to a first solution supply pipe and a second solution injection member connected to a second solution supply pipe, respectively. each of the first and second solution injection members includes a bubble generating filter having a plurality of through-holes.
Inventor(s): Hyunseok HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L11/40
CPC Code(s): A47L9/2826
Abstract: a robot cleaner and a control method thereof are provided. the robot cleaner includes a camera, a vacuum, a driver, and at least one processor configured to acquire at least one image through the camera while the robot cleaner is driving along a first driving route, identify an amount of dust in areas within a view angle of the camera based on the acquired image, control the suction part to perform a cleaning operation for an area to be cleaned identified based on the identified amount of dust, and acquire first map data indicating an amount of dust of an area wherein the robot cleaner drove among the areas within the view angle of the camera and second map data indicating an amount of dust of an area wherein the robot cleaner is going to drive among the areas within the view angle of the camera based on the identified amount of dust.
Inventor(s): Dongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehun HYEON of Suwon-si (KR) for samsung electronics co., ltd., Kiwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hwangjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwanghyung LEE of Seoul (KR) for samsung electronics co., ltd., Myeonghee JEON of Seoul (KR) for samsung electronics co., ltd., Yuchang JEONG of Seoul (KR) for samsung electronics co., ltd., Jiwon HA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00
CPC Code(s): A63B24/0062
Abstract: an electronic device and a wearable device for providing information on the exercise capacity of a user, and an operation method of the electronic device performing same. the electronic device may include: a communication module for receiving, from the wearable device, sensor data including movement information of a user wearing the wearable device; a processor(s) for estimating the exercise capacity of the user on the basis of the sensor data and generating exercise capacity information about the estimated exercise capacity; and a display module for outputting the exercise capacity information. the sensor data includes exercise information about movements performed by the user in accordance with one or more exercise programs presented to the user when the wearable device is in an exercise capacity evaluation mode. the processor(s) may determine the exercise capacity information on the basis of the exercise information and evaluation criteria information corresponding to the one or more exercise programs.
Inventor(s): Yu Kyung Jung of Suwon-si (KR) for samsung electronics co., ltd., Jae-Young Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinha Kim of Suwon-si (KR) for samsung electronics co., ltd., Seung Hoon Song of Suwon-si (KR) for samsung electronics co., ltd., Woo Yong Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01D53/84, B01D53/56, C12N1/20, C12N9/06, C12N9/12, C12N15/70
CPC Code(s): B01D53/84
Abstract: a recombinant microorganism having enhanced ability for reducing nitrogen oxide, a composition comprising the recombinant microorganism for use in decreasing a concentration of nitrogen oxide in a sample, and a method of decreasing a concentration of nitrogen oxide in a sample using the recombinant microorganism or the composition.
Inventor(s): Wonkeun Cho of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24D7/06, B24D18/00
CPC Code(s): B24D7/06
Abstract: disclosed are grinding wheels, back-grinding apparatuses, and abrasive article manufacturing methods. the grinding wheel comprises a wheel body having a disk shape and an abrasive article combined with one surface of the wheel body. the abrasive article includes an abrasive body and a plurality of grinding particles in the abrasive body. the abrasive body provides a groove hole that is recessed in a first direction as a horizontal direction on a lateral surface of the abrasive body. a length in the first direction of the groove hole is less than a width in the first direction of the abrasive body.
Inventor(s): Daeseon Park of Suwon-si (KR) for samsung electronics co., ltd., Seoktae Kang of Daejeon (KR) for samsung electronics co., ltd., David Kim of Suwon-si (KR) for samsung electronics co., ltd., Junho Kim of Daejeon (KR) for samsung electronics co., ltd., Inseo Yoon of Suwon-si (KR) for samsung electronics co., ltd., Hansol Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C02F9/00, C02F1/00, C02F1/02, C02F1/44, C02F1/70, C02F101/14, C02F101/16, C02F103/34
CPC Code(s): C02F9/00
Abstract: an apparatus configured to treat wastewater includes a first water tank configured to store wastewater, a second water tank configured to store absorbent liquid, and a membrane assembly including a membrane including holes, the membrane assembly configured to receive the wastewater from the first water tank and the absorbent liquid from the second water tank, where the membrane assembly is further configured to allow materials to move between the wastewater and the absorbent liquid through the holes, and where, in the membrane assembly, a temperature of the absorbent liquid is different from a temperature of the wastewater.
Inventor(s): Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jeongho MUN of Hwaseong-si (KR) for samsung electronics co., ltd., Seonghyeon AHN of Suwon-si (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Jaejun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08F120/28, G03F7/004, G03F7/20
CPC Code(s): C08F120/28
Abstract: provided are a polymer including a first repeating unit represented by formula 1 and having a glass transition temperature of 50� c. or less, a polymer-containing composition including the polymer, and a method of forming a pattern by using the polymer-containing composition:
Inventor(s): Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jeongho MUN of Hwaseong-si (KR) for samsung electronics co., ltd., Seonghyeon AHN of Suwon-si (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Jaejun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08F120/28, G03F7/004, G03F7/20
CPC Code(s): C08F120/28
Abstract:
Inventor(s): DONGHOON KWON of Suwon-si (KR) for samsung electronics co., ltd., BOUN YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09G1/02, B24B57/02, C09K3/14
CPC Code(s): C09G1/02
Abstract: provided are a slurry composition for chemical mechanical polishing including: an abrasive including a polishing particle and a coating layer surrounding the polishing particle; and a photoinitiator, wherein the polishing particle includes a metal oxide, and wherein the coating layer includes a photoreactive monomer or oligomer, and a chemical mechanical polishing apparatus.
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C09K11/06
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C09K11/06
Abstract:
formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C09K11/06
Abstract:
m(l)(l)
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C09K11/06
Abstract: wherein mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C09K11/06
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C09K11/06
Abstract: wherein yis o, s, or se; zand zare each independently —si(q)(q)(q) or —ge(q)(q)(q); a1 and a2 are each independently an integer from 0 to 10; a sum of a1 and a2 is 1 or greater; * and *′ each indicate a binding site to m; and the descriptions of the remaining substituents in formulae 1a and 1b are as provided herein.
Inventor(s): Jongsoo HONG of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Chunseong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/94, A47L9/04, A47L9/28, G01N21/55
CPC Code(s): G01N21/94
Abstract: a robotic vacuum cleaner according to an embodiment includes a main body forming an outer appearance, a rotation part rotatably disposed on a lower side of the main body, a cleaning member detachably couplable to the rotation part and having at least one reflective pattern provided on a surface thereof, and an optical sensor disposed at a position adjacent to the rotation part, emitting light toward the cleaning member, and obtaining a light reflection amount reflected by the cleaning member, and the at least one reflective pattern has a reflectance different from a remaining region of the surface not provided with reflective pattern.
Inventor(s): Heejin Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/28, G01R31/311
CPC Code(s): G01R31/2893
Abstract: provided are a semiconductor test carrier, a semiconductor test apparatuse, and a semiconductor test method. the semiconductor test carrier includes a support plate, a connection member that extends in a horizontal direction from one side of the support plate, and an upper plate on the support plate. the support plate includes a support body having a disk shape and a glass member coupled to the support body. the support body provides a placement hole that vertically penetrates the support body. at least a portion of the glass member is inserted into the placement hole.
Inventor(s): Ungjin Jang of Suwon-si (KR) for samsung electronics co., ltd., Hyucksoo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/317, G01R31/319
CPC Code(s): G01R31/31721
Abstract: provided are a semiconductor test apparatus for simultaneously testing a maximum number of semiconductor chips, and a power supply method of the semiconductor test apparatus. the semiconductor test apparatus includes a tester including a power supply configured to simultaneously supply power to a plurality of devices under test (duts) during a test, and a test board arranged between the tester and the plurality of duts and transmitting the power from the power supply to the tester, wherein the power supply includes a plurality of power channels, and each of the plurality of duts receive two or more types of power from the power channels, each type of power being power supplied at a respective supply voltage for the dut, the power supply shares current between the plurality of power channels and supplies the shared current amount to each of the plurality of duts.
20250044411. MULTI-USER HAND GESTURE RECOGNITION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Viet Nguyen of Frisco TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Qiang Xie of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/41, G01S13/10, G06F3/01
CPC Code(s): G01S7/415
Abstract: an embodiment includes a method of multi-user gesture recognition includes determining positions of a plurality of users based on a first radar information from at least one radar, determining a plurality of regions of interest for the plurality of users based on positions of the plurality of users, in a first duty cycle of a plurality of duty cycles, obtaining a second radar information using a first radar configuration that includes a first set of parameters for gesture recognition at a range of distances based on the plurality of regions of interest, in a second duty cycle, obtaining a third radar information using a second radar configuration, and detecting a first user gesture from a first user of the plurality of users and a second user gesture from a second user of the plurality of users based on the second and third radar information.
Inventor(s): Youngchul LEEM of Suwon-si (KR) for samsung electronics co., ltd., Jeongyub LEE of Yongin-si (KR) for samsung electronics co., ltd., Haesung KIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B1/00
CPC Code(s): G02B1/005
Abstract: an optical device forms a refractive index distribution for exhibiting a certain phase delay profile with respect to light in a visible light wavelength, and includes a nanopattern layer including a crystalline compound having a refractive index greater than 3 with respect to the light in the visible light wavelength band and a height equal to or less than 2 �m. the nanopattern layer may include the crystalline compound grown according to a selective epitaxial growth method, and accordingly, may have a height beneficial for a manufacturing process. thus, the efficiency of the optical device may be improved.
Inventor(s): Jungpa SEO of Suwon-si (KR) for samsung electronics co., ltd., Seungyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G02B9/60, G02B30/00
CPC Code(s): G02B13/0045
Abstract: provided is a device including: an image sensor; and a lens assembly, wherein the lens assembly includes a first lens made of a synthetic resin that is closest to the object side of the lens assembly among the lenses of the assembly, wherein at least one surface of an object side or an image side surface of the first lens is a free curved surface lens including a first radius of curvature for a first curve in a first direction, and a second radius of curvature different from the first radius of curvature for a second curve in a second direction, wherein an effective diameter of the second curve is greater than an effective diameter of the first curve, and the device satisfies the expression 0.1<dy_l1/f1<0.3, wherein dy_l1 is the effective diameter of the first curve, and f1 is a focal length of the first lens.
Inventor(s): Sungkun Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/09, G03F7/095
CPC Code(s): G03F7/094
Abstract: photoresist films are described such as those that include a first photoresist layer including a first photosensitive polymer and a second photoresist layer that includes a second photosensitive polymer, the second photoresist layer being disposed at two or more different positions in a direction perpendicular to a surface of the first photoresist layer, and wherein the second photosensitive polymer is hydrogen bonded, covalently bonded, or ionically bonded to the first photosensitive polymer. also described are methods of manufacturing an integrated circuit device using a photoresist film.
Inventor(s): Ji Young PARK of Suwon-si (KR) for samsung electronics co., ltd., Daekeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyeol BAEK of Suwon-si (KR) for samsung electronics co., ltd., Giyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Ji SONG of Suwon-si (KR) for samsung electronics co., ltd., Thanh Cuong NGUYEN of Suwon-si (KR) for samsung electronics co., ltd., Suk Koo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/705
Abstract: in a method of predicting extreme ultraviolet (euv) dose, an entire photochemical reaction mechanism until a photoacid generator (pag) molecule releases a proton from a pag-cation under euv exposure may be analyzed. a lowest unoccupied molecular orbital (lumo) energy level may be obtained by performing a simulation for structural optimization of the pag-cation. an additional parameter different from the lumo energy level may be obtained by performing a simulation for structural optimization of at least one intermediate molecular structure formed by the entire photochemical reaction mechanism. a two-parameter linear regression model for predicting the euv dose may be obtained based on the lumo energy level and the additional parameter.
Inventor(s): Suxian ZHANG of Guangzhou (CN) for samsung electronics co., ltd., Huihui YANG of Guangzhou (CN) for samsung electronics co., ltd., Zhongwei ZHANG of Guangzhou (CN) for samsung electronics co., ltd., Kechi XIE of Guangzhou (CN) for samsung electronics co., ltd.
IPC Code(s): G04G13/02, G01S5/02
CPC Code(s): G04G13/021
Abstract: provided is a method of operating an electronic apparatus, an electronic apparatus, and a storage medium. the method of operating a first electronic apparatus includes: acquiring alarm clock setting information of at least one alarm clock from at least one second electronic apparatus; determining, based on the alarm clock setting information, an alarm sound playing direction corresponding to each alarm clock of the at least one alarm clock; and for each alarm clock of the at least one alarm clock, playing an alarm sound corresponding to the alarm clock toward the alarm sound playing direction corresponding to the alarm clock.
Inventor(s): Juneyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Younghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeahyuck LEE of Suwon-si (KR) for samsung electronics co., ltd., Minho PARK of Suwon-si (KR) for samsung electronics co., ltd., Joongwoo AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G04G21/02, H01S5/50
CPC Code(s): G04G21/02
Abstract: the electronic device of the disclosure may include: a semiconductor optical amplifier configured to divide an outputtable wavelength band and output multiple laser lights having a designated wavelength band and designated power, a fixed array distributed bragg reflector (dbr) grating configured to modify a wavelength of multiple laser lights and output multiple laser lights having a modified wavelength, and an output coupler configured to allow the modulated multiple laser lights to adjust an output direction and/or angle and output the modulated multiple laser lights to an outside of the electronic device.
20250044828. CLOCK MULTIPLEXING CIRCUIT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongun Jeong of Suwon-si (KR) for samsung electronics co., ltd., Donghyeok Jeong of Suwon-si (KR) for samsung electronics co., ltd., ChangSik Yoo of Suwon-si (KR) for samsung electronics co., ltd., Kihan Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/12
CPC Code(s): G06F1/12
Abstract: disclosed is a clock multiplexing circuit which includes a first transistor that is between a first input terminal that receives a first input clock signal and an output terminal that outputs an output pulse signal and operates based on a logic level of a second input terminal receiving a second input clock signal, and a second transistor that is between the output terminal and a first voltage node and operates based on the logic level of the second input terminal. the first input clock signal and the second input clock signal have the same period and have different phases. the output pulse signal transitions to a first logic level at a first time when the first input clock signal transitions to the first logic level and transitions to a second logic level at a second time when the second input clock signal transitions to the first logic level.
Inventor(s): Munhwi KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Songmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1624
Abstract: an electronic device according to various embodiments of the present invention includes: a first housing; a second housing; at least one processor; and a flexible display, wherein a portion of the flexible display is inserted into or drawn out of the first housing according to the driving of a driving module of the electronic device, and the at least one processor may be configured to display at least one control button that can change the size of the externally exposed portion of the flexible display.
Inventor(s): Sungho AHN of Suwon-si (KR) for samsung electronics co., ltd., Jihyung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Inkuk YUN of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1624
Abstract: an example electronic device may include a plurality of housings including a first housing and a second housing, wherein the first housing movably connects to the second housing in a moving direction, a display panel in which a screen display area visually exposed to an outside changes depending on a movement of the second housing relative to the first housing, and a lattice plate disposed on a rear surface of the display panel to support the display panel. the display panel may include a flat portion forming the screen display area and comprising a surface substantially forming a flat surface, an edge portion connected to one end portion of the flat portion and comprising at least a partial region which is curved, and a bending portion connected to the other end portion of the flat portion opposite to the edge portion and comprising at least a partial region which bends according to a movement of the first housing relative to the second housing. the lattice plate may include a first lattice portion disposed on a rear surface of the edge portion and including a first lattice pattern, and a second lattice portion disposed on a rear surface of the bending portion and including a second lattice pattern that is different from the first lattice pattern so as to have a relatively higher modulus than the first lattice portion.
20250044845. PREDICTIVE POWER STEERING IN SOCS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Praveen FRANCIS of Boston MA (US) for samsung electronics co., ltd., Samantika SURY of Boston MA (US) for samsung electronics co., ltd., Alfredo METERE of San Jose CA (US) for samsung electronics co., ltd., David LOMBARD of Los Angeles CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F1/26
CPC Code(s): G06F1/26
Abstract: provided are systems, methods, and apparatuses for obtaining first data of a power domain of a system on chip and second data of the power domain, predicting an expected power for the power domain based on the first data and the second data, and applying to the power domain a power level that is selected based on the expected power. the first data is utilization data. the second data is thermal data that includes at least one of a spatial thermal limit or a positional thermal limit of the power domain. the spatial thermal limit is based on at least one of a proximity of the power domain to a component outside the power domain or a power level of the component at a time when the expected power is calculated. the positional thermal limit is based on a location of the power domain on the system on chip.
Inventor(s): Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F1/16, G06F3/041, G06F3/044
CPC Code(s): G06F3/016
Abstract: an electronic device includes: a first housing; a second housing movably coupled with respect to the first housing; a flexible display; a first vibration motor in the first housing; a second vibration motor in the second housing; and at least one processor. the at least one processor: receives a touch input through a display region of the flexible display; in response to the touch input, identifies a first distance between the position of a contact point of the touch input and the first vibration motor, and a second distance between the position and the second vibration motor; and adjusts, on the basis of the first distance and the second distance, the strength of vibration provided through the first vibration motor and the second vibration motor so as to provide a haptic notification.
Inventor(s): CHINAM KIM of Suwon-si (KR) for samsung electronics co., ltd., DO-HAN KIM of Suwon-si (KR) for samsung electronics co., ltd., CHANGMIN LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/061
Abstract: a memory device with a computation function includes a first cell array including first memory cells connected to word lines, a second cell array including second memory cells connected to the word lines, a first bit line sense amplifier that sense first voltages of first bit lines connected to the first memory cells, a second bit line sense amplifier that senses second voltages of second bit lines connected to the second memory cells, a first column selection circuit that outputs a first output signal among the first voltages based on a first column compute selection signal, a second column selection circuit that outputs a second output signal among the second voltages based on a second column compute selection signal different from the first column compute selection signal, and a column compute control circuit that generates the first column compute selection signal and the second column compute selection signal.
Inventor(s): SANG-HWA JIN of Suwon-si (KR) for samsung electronics co., ltd., MIN-HO KIM of Suwon-si (KR) for samsung electronics co., ltd., DONGOUK MOON of Suwon-si (KR) for samsung electronics co., ltd., SOO-YOUNG JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/061
Abstract: a computational storage device includes a control module, and a nonvolatile memory connected to the control module. the nonvolatile memory is configured to store a plurality of graph data elements, which comprises a plurality of nodes and a plurality of edges that connect at least a portion of the plurality of nodes to each other, in a first memory area and a second memory area each having a plurality of blocks and having different read speeds. the control module is configured to store a first graph data element of the plurality of graph data elements having a relatively high degree of association with one node of the plurality of nodes in the first memory area, and store a second graph data element of the plurality of graph data elements having a relatively low degree of association with the one node of the plurality of nodes in the second memory area.
Inventor(s): Xianghu CHEN of Nanjing (CN) for samsung electronics co., ltd., Zuolong WANG of Nanjing (CN) for samsung electronics co., ltd., Yong ZHANG of Nanjing (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/16
CPC Code(s): G06F3/165
Abstract: a method and an apparatus for audio processing in a multi-view mode are provided. triggering, when a preset audio output adjusting event occurs, corresponding views to perform audio output by using matching sound output devices based on a policy that a first application uses a real sound output device and a non-first application uses a virtual sound output device, wherein the audio output adjusting event is an event causing the sound output devices used by the views to not match the policy, when a mixing mode is off, the first application is an application currently in an audio focus, and when the mixing mode is on, the first application is an application currently participating in mixing.
Inventor(s): Jin HYUN of Pohang-si (KR) for samsung electronics co., ltd., Youngjoo LEE of Pohang-si (KR) for samsung electronics co., ltd., Seungwoo HONG of Pohang-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/30
CPC Code(s): G06F9/30149
Abstract: a processor-implemented method includes determining a first width, the first width being a minimum width of a plurality of sectors into which an input range for a non-linear function is divided, and a plurality of second widths dividing the plurality of sectors each into one or more segments, determining a final width of a target sector, the target sector being one of the plurality of sectors, for approximating the non-linear function, based on one or more among the first width and the plurality of second widths, and dividing the non-linear function into one or more segments comprised in the target sector and approximating the divided non-linear function for each of the one or more segments to a linear function.
Inventor(s): Donny YI of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F11/34
CPC Code(s): G06F9/4881
Abstract: a method may include determining a characteristic of a machine learning task, determining a characteristic of a compute system, wherein the compute system may include one or more compute devices, and assigning, based on the characteristic of the machine learning task and the characteristic of the compute system, the machine learning task to at least one of the one or more compute devices. the characteristic of the machine learning task may include at least one of a compatibility, priority, order, size, or type. the characteristic of the machine learning task may include at least one of a performance compatibility, efficiency compatibility, or a latency compatibility. the characteristic of the compute system may include at least one of a policy, topology, status, operating parameter, or scheduling algorithm. the characteristic of the compute system may include at least one of a performance policy or efficiency policy.
Inventor(s): Wenjie LIU of San Jose CA (US) for samsung electronics co., ltd., Matthew BRYSON of Los Gatos CA (US) for samsung electronics co., ltd., Rajiv SHANMUGAM MADESWARAN of San Jose CA (US) for samsung electronics co., ltd., Naga Sanjana BIKONDA of San Jose CA (US) for samsung electronics co., ltd., Vishwanath MARAM of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/48
CPC Code(s): G06F9/4881
Abstract: a method may include determining a first performance of a first compute task on one or more computational devices, wherein the first performance may be determined based on a first weight of the first compute task, determining a second performance of a second compute task on the one or more computational devices, and assigning, based on the first performance and the second performance, the first compute task to at least one of the one or more computational devices. the method may further include determining, based on a characteristic of the first compute task, the first weight. the characteristic of the first compute task may include at least one of a type of the first compute task, computational complexity of the first compute task, priority of the first compute task, latency of the first compute task, or amount of data used by the first compute task.
Inventor(s): Kibeen JUNG of Suwon-si (KR) for samsung electronics co., ltd., Minkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Hankyoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Namhoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Byeonghui KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyo OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F1/324
CPC Code(s): G06F9/5016
Abstract: a storage device includes at least one nonvolatile memory device, and a controller controlling the at least one nonvolatile memory device. the controller includes a parameter storage storing a power parameter indicating a clock value of each of internal configurations for each power state. the power parameter is a value derived by performing machine learning considering performance, peak power, and average power.
Inventor(s): Wenlong LI of Nanjing (CN) for samsung electronics co., ltd., Mengyuan WU of Nanjing (CN) for samsung electronics co., ltd.
IPC Code(s): G06F9/50
CPC Code(s): G06F9/5027
Abstract: provided are an apparatus and method for processing a task. the method includes, based on receiving target information sent by a user terminal for a plurality of candidate applications in a group chat, performing semantic analysis on the target information to generate a target task corresponding to the target information. the method includes identifying, based on the target task and the plurality of candidate applications, a target application corresponding to the target task; providing the target task to the target application to execute the target task; receiving task result information corresponding to the target task. the method includes generating, based on the task result information, target response information corresponding to the task result information; providing the target response information corresponding to the task result information on the user terminal.
Inventor(s): Jong Heon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Kangrak KWON of Suwon-si (KR) for samsung electronics co., ltd., Youngkyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok SEO of Suwon-si (KR) for samsung electronics co., ltd., Kyungmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongwook LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/07
CPC Code(s): G06F11/0793
Abstract: an apparatus includes a port that is connected to a link including plural lanes to support communication between the apparatus and another device and that transmits a flit in a flit mode, and a processor that controls the link based on a link training and status state machine (ltssm). the processor transitions from an l0 state to an l0p state, included in the ltssm, for a portion of the plural lanes based on a receiver error occurring in the portion of the plural lanes and based on the link reaching a specific data rate using equalization bypass, and the port, after transitioning to the l0p state, transmits an ordered set (os) through the portion of the plural lanes and transmits the flit through remaining lanes of the plural lanes.
Inventor(s): Bongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngsok KIM of Seoul (KR) for samsung electronics co., ltd., Sangsu LEE of Seoul (KR) for samsung electronics co., ltd., Jounghoo LEE of Seoul (KR) for samsung electronics co., ltd., Yeonan HA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0223
Abstract: an electronic device and method are provided. the method includes, in response to a result of a performed determination, between a processing-in-memory (pim) operation and a non-pim operation, being that a target operation included in an instruction set is the pim operation, loading information regarding a pim operation type of the target operation to a pim operation register of an accelerator of the electronic device based on a performed determination that input data, for use in the target operation, is arranged in a memory of the accelerator according to a characteristic of the target operation, and controlling, using a pim operation execution instruction, one or more pim processing elements (pes) of the memory to perform the target operation using the arranged input data and the information regarding the operation type loaded in the pim operation register.
20250045201. STORAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghwa JIN of Suwon-si (KR) for samsung electronics co., ltd., Dongouk MOON of Suwon-si (KR) for samsung electronics co., ltd., Minho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F13/16
CPC Code(s): G06F12/0246
Abstract: a method includes generating mapping information in which, for each frame of plural frames stored in a storage component, one or more logical addresses is assigned to the frame and providing a batch read request to the storage component, to read all of the one or more logical addresses assigned to the frame by referring the mapping information.
Inventor(s): Jongheon Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/24
CPC Code(s): G06F13/24
Abstract: a method of operating a storage device includes receiving a clock signal corresponding to a plurality of data bits and an acknowledgement (ack) signal from a host device through a clock line during a read operation, outputting a data signal including the plurality of data bits from the storage device through a data line during the read operation, generating an interrupt signal when the clock signal is at a low level before outputting the last data bit from among the plurality of data bits, transmitting the interrupt signal to the host device through the data line, and receiving a not-acknowledgment (nack) signal from the host device through the data line in response to the interrupt signal when there is clock loss of the clock signal.
Inventor(s): Jiwon BAEK of Hwaseong-si (KR) for samsung electronics co., ltd., Seungju HAN of Seoul (KR) for samsung electronics co., ltd., Kikyung KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Insoo KIM of Seongnam-si (KR) for samsung electronics co., ltd., Jaejoon HAN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/32, G06V10/74, G06V10/77, G06V10/82, G06V40/16, G06V40/40
CPC Code(s): G06F21/32
Abstract: a method with access authority management includes: receiving an input image comprising a region of at least one portion of a body of a user; determining whether the user corresponds to multiple users or a single user using the region of the at least one portion of the body; performing a verification for the user based on a face region in the input image, in response to the determination that the user is the single user; determining whether the input image is a real image or a spoofed image based on whether the verification is successful; and allowing an access authority to a system to the user, in response to the determination that the input image is the real image.
Inventor(s): Jonghoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0442, G06N3/063
CPC Code(s): G06N3/0442
Abstract: a processor-implemented method includes: determining an operation sequence of a neural network based on dependency information of a tile constituting a feature map of the neural network and layer information of the neural network; and generating a first command for controlling a feature map memory and a second command for controlling an operator based on the operation sequence, wherein the first command comprises information on a tile input to each of a plurality of memory queues constituting the feature map memory.
Inventor(s): Jungbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Euntaik LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonsu LEE of Suwon-si (KR) for samsung electronics co., ltd., Mooyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/045
CPC Code(s): G06N3/045
Abstract: a processor of an electronic device according to an embodiment may be configured to identify first graphs included in a first model on the basis of a request for driving the first model, wherein the first model is stored in non-volatile memory of the electronic device. the processor may be configured to identify at least one graph, corresponding to at least one of the first graphs, among second graphs included in one or more second models which are different from the first model and stored in volatile memory. the processor may be configured to obtain, on the basis of the at least one identified graph among the second graphs, an instance for controlling the first model. the processor may be configured to execute a function related to the first model on the basis of the instance.
Inventor(s): Whan GHANG of Suwon-si (KR) for samsung electronics co., ltd., Min Je KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N10/20, G06N10/80
CPC Code(s): G06N10/20
Abstract: an apparatus with hybrid quantum-classical neural network architecture generation includes a generating device configured to generate a hybrid quantum-classical layer based neural network architecture based on setting information for generating a neural network architecture, wherein the generating device comprises a neuron distribution module configured to determine, based on the setting information, whether to distribute neurons in each layer of the neural network into a quantum circuit or a classical circuit, a quantum circuit generation module configured to generate a quantum circuit for the each layer, based on a result of distribution into the quantum circuit, and a classical circuit generation module configured to generate a classical circuit for the each layer, based on a result of distribution into the classical circuit.
Inventor(s): Abhiram Gnanasambandam of Frisco TX (US) for samsung electronics co., ltd., John W. Glotzbach of Allen TX (US) for samsung electronics co., ltd., John Seokjun Lee of Allen TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06T5/00, H04N23/84
CPC Code(s): G06T3/4038
Abstract: a method includes obtaining a ground truth image and generating multiple image frames using the ground truth image, a modeled optical blur, and a modeled global motion. the method also includes generating multiple mosaic image frames using the image frames and a color filter array and generating multiple raw input image frames using the mosaic image frames and a noise model associated with at least one imaging sensor. the method further includes providing the raw input image frames to a multi-frame processing pipeline in order to generate synthetic training data. in addition, the method includes training a machine learning-based image processing engine using the ground truth image and the synthetic training data.
Inventor(s): Youngmo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Bonkon KOO of Suwon-si (KR) for samsung electronics co., ltd., Jongchul CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/70, H04N23/95
CPC Code(s): G06T5/60
Abstract: provided are an electronic device and method for reconstructing an image from a coded image. the electronic device may acquire a coded image, based on light in which a phase is modulated by a first phase mask including noise or a second phase mask not including the noise, and acquire a reconstructed image by inputting the coded image to an artificial intelligence model trained to reconstruct an image. the noise may be an error that occurred according to a process of a phase mask.
Inventor(s): Hyunseung LEE of Suwon-s (KR) for samsung electronics co., ltd., Seokhee LEE of Seoul (KR) for samsung electronics co., ltd., Kyuha CHOI of Suwon-si (KR) for samsung electronics co., ltd., Youngsu MOON of Suwon-si (KR) for samsung electronics co., ltd., Karam PARK of Seoul (KR) for samsung electronics co., ltd., Younghoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Namik CHO of Seoul (KR) for samsung electronics co., ltd., Sunwoo CHO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T3/4046, G06T3/4053, G06T5/20
CPC Code(s): G06T5/60
Abstract: an image processing apparatus, including: at least one processor; and a memory configured to store one or more instructions which, when executed by the at least one processor, cause the image processing apparatus to: obtain a neural network model for performing image quality processing on an input image; calculate a plurality of gradients by partially differentiating weights of the neural network model with respect to a loss of the neural network model, by applying training data corresponding to the input image to the neural network model; remove at least one gradient from among the plurality of gradients by applying a gradient mask including gradient pruning information to the plurality of gradients; train the neural network model by updating the weights of the neural network model based on one or more remaining gradients from among the plurality of gradients; and obtain a quality-processed output image based on the input image, using the trained neural network model
Inventor(s): Youngdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungjai KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongin LIM of Suwon-si (KR) for samsung electronics co., ltd., Seungju HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/70, G06T5/50, G06T7/00, G06T7/194
CPC Code(s): G06T5/70
Abstract: disclosed is a source image preprocessing method and device including: outputting a feature map by applying at least one kernel to a source image; generating a reconstructed source image by applying at least one mask to the feature map that corresponds to the source image; and updating the at least one kernel based on a value of the loss function between the reconstructed source image and a target image.
Inventor(s): Junyeob KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jisun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T7/70
CPC Code(s): G06T7/001
Abstract: an overlay measurement device includes a light source configured to direct an illumination to an overlay measurement target, a lens assembly configured to condense the illumination at a measurement position at any one point on the overlay measurement target, a detector configured to obtain a plurality of target overlay images through a beam reflected from the measurement position, a controller configured to determine at least one of a first similarity coefficient and a second similarity coefficient for each of the plurality of target overlay images and determine a defective overlay image from among the plurality of target overlay images based on at least one of the first similarity coefficient and the second similarity coefficient for each of the plurality of target overlay images, and a memory configured to store a normal overlay image and defect data corresponding to the defective overlay image.
Inventor(s): Eunbin LEE of Suwon-si (KR) for samsung electronics co., ltd., Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Eunyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Stephanie AHN of Suwon-si (KR) for samsung electronics co., ltd., Bona LEE of Suwon-si (KR) for samsung electronics co., ltd., Miyeoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/0362, G06T7/20, G06V20/20
CPC Code(s): G06T19/006
Abstract: according to an embodiment, a processor of a wearable device displays a virtual object superimposed on a virtual space by using a display. the processor receives an input for rotating a dial in a first direction while the superimposed virtual object is displayed in the virtual space. while the input is maintained, the processor reduces a first area in which the virtual space is displayed. while the input is maintained, the processor maintains a size of the virtual object that is superimposed on the virtual space and is displayed inside of the first area reduced while the input is maintained. while the input is maintained, the processor expands a second area including the image that is further displayed on the display in response to the input.
Inventor(s): Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Daiwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongil KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungjun SON of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/0487, G06T7/70, G06T13/00
CPC Code(s): G06T19/006
Abstract: an example electronic device includes a display; at least one sensor; at least one camera; and a processor operably connected to the display, the at least one sensor, and the at least one camera, wherein the processor executes an augmented reality (ar) application, obtains image data of surroundings of the electronic device by using the at least one camera, generates a 3d space coordinate system on the basis of the obtained image data, obtains a first input of selecting a 3d object, obtains a second input of selecting a first point on the display, maps the first point to a first coordinate of the 3d space coordinate system, generates a 3d path connecting the first coordinate of the 3d space coordinate system to a second coordinate of the 3d space coordinate system, on the basis of movement of the electronic device detected by the at least one sensor and movement of the second input on the display, and arranges the 3d object on a plurality of coordinates on the 3d path.
Inventor(s): Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Daiwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongil KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungjun SON of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/0487, G06T7/70, G06T13/00
CPC Code(s): G06T19/006
Abstract: an example electronic device includes a display; at least one sensor; at least one camera; and a processor operably connected to the display, the at least one sensor, and the at least one camera, wherein the processor executes an augmented reality (ar) application, obtains image data of surroundings of the electronic device by using the at least one camera, generates a 3d space coordinate system on the basis of the obtained image data, obtains a first input of selecting a 3d object, obtains a second input of selecting a first point on the display, maps the first point to a first coordinate of the 3d space coordinate system, generates a 3d path connecting the first coordinate of the 3d space coordinate system to a second coordinate of the 3d space coordinate system, on the basis of movement of the electronic device detected by the at least one sensor and movement of the second input on the display, and arranges the 3d object on a plurality of coordinates on the 3d path.
Inventor(s): Ishay Goldin of Tel-Aviv (IL) for samsung electronics co., ltd., Avraham Raviv of Tel-Aviv (IL) for samsung electronics co., ltd., Yonatan Dinai of Tel-Aviv (IL) for samsung electronics co., ltd., Nimrod Harel of Tel-Aviv (IL) for samsung electronics co., ltd., Niv Zehngut of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): G06V10/82, G06V10/77, G06V20/40
CPC Code(s): G06V10/82
Abstract: aspects of the method, apparatus, non-transitory computer readable medium, and system include obtaining a video comprising a plurality of video frames; computing, using a machine learning model, a global dependency value based on the plurality of video frames; deactivating a filter of the machine learning model based on the global dependency value; and processing, using the machine learning model, at least a portion of the video based on the deactivated filter.
Inventor(s): Vishakha S R of Bangalore (IN) for samsung electronics co., ltd., Bindigan Hariprasanna Pawan Prasad of Bangalore (IN) for samsung electronics co., ltd., Green Rosh K S of Bangalore (IN) for samsung electronics co., ltd., Akula Jayaprakash of Bangalore (IN) for samsung electronics co., ltd., Meghana Shankar of Bangalore (IN) for samsung electronics co., ltd., Prateek Kukreja of Bangalore (IN) for samsung electronics co., ltd., Shubham Mallik Thakur of Bangalore (IN) for samsung electronics co., ltd., Sagar Parmar of Bangalore (IN) for samsung electronics co., ltd., Mukesh Jha of Bangalore (IN) for samsung electronics co., ltd., Sungsoo Choi of Suwon-si (KR) for samsung electronics co., ltd., Hyuntaek Woo of Suwon-si (KR) for samsung electronics co., ltd., Chaeeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Beomsu Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/20, A63F13/213, A63F13/428, G06F3/01, G06V10/75, G06V10/77
CPC Code(s): G06V40/28
Abstract: there is provided a method and apparatus for performing gesture recognition in an electronic device, including: tracking a visible trajectory of a hand of a user from a plurality of frames captured by the electronic device, identifying, by the electronic device, a first frame where the hand of the user has gone out of a field of view (fov) of the electronic device, identifying the second frame where the hand of the user has come back into the fov, predicting, using an artificial intelligence (ai) model, a trajectory of the hand of the user using one or more frames captured before the first frame, and one or more frames captured after the second frame, and recognizing at least one hand gesture performed during the visible trajectory of the hand of the user, and the predicted trajectory of the hand of the user.
Inventor(s): Jeongryeol SEO of Suwon-si (KR) for samsung electronics co., ltd., Sangwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkook KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a display apparatus of a plurality of display apparatuses constituting a wall display includes a first board, a second board, and a plurality of display modules. the first board includes a first communication interface including a circuitry for wireless transmission, and a timing controller configured to, in response to information on an image being received, generate a plurality of driving signals for driving the plurality of display modules based on the received information and transmit the plurality of driving signals to the second board through the first communication interface. the second board includes a second communication interface including circuitry for wireless reception, a plurality of interfaces electrically connected to the plurality of display modules, and an ic chip configured to, based on the plurality of driving signals being received through the second interface, provide each of the received driving signals to each of the display modules.
Inventor(s): Jeongryeol SEO of Suwon-si (KR) for samsung electronics co., ltd., Sangwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkook KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a display apparatus of a plurality of display apparatues constituting a wall display includes a first board, a second board, and a plurality of display modules. the first board includes a first communication interface including a circuitry for wireless transmission, and a timing controller configured to, in response to information on an image being received, generate a plurality of driving signals for driving the plurality of display modules based on the received information and transmit the plurality of driving signals to the second board through the first communication interface. the second board includes a second communication interface including circuitry for wireless reception, a plurality of interfaces electrically connected to the plurality of display modules, and an ic chip configured to, based on the plurality of driving signals being received through the second interface, provide each of the received driving signals to each of the display modules.
Inventor(s): Jaesung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongkon BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/00, G09G5/22
CPC Code(s): G09G5/005
Abstract: an electronic device is provided. the electronic device includes a display, a display driver ic (ddi) configured to drive the display on the basis of a video mode, memory storing one or more computer programs, and one or more processors communicatively coupled to the display, the ddi, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to generate first image data corresponding to a first resolution, generate second image data by adding a blank section to at least some sections of the first image data, and transmit the second image data to the ddi, and wherein the ddi comprises an upscaler configured to convert the second image data input from the one or more processors into third image data corresponding to a second resolution larger than the first resolution by a designated ratio, and is configured to drive the display so that the display displays the third image data.
Inventor(s): Toni M. Hirvonen of Santa Clarita CA (US) for samsung electronics co., ltd., Carlos Tejeda Ocampo of Tuxtla Gutiérrez (MX) for samsung electronics co., ltd.
IPC Code(s): G10L19/032, G10L19/002, G10L19/008, G10L19/20, G10L19/24
CPC Code(s): G10L19/032
Abstract: one embodiment provides a computer-implemented method that includes analyzing, by a computing device, spatial object-based audio content associated with one or more objects. one or more relative perceptual importance metrics of the one or more objects are determined, by the computing device, based on modeling. based on the one or more relative perceptual importance metrics, resources are allocated, by the computing device, for improving overall audio quality relative to bitrate.
Inventor(s): LAESANG JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10
CPC Code(s): G11C7/227
Abstract: a method of operating a storage device which communicates with a host device, the method including: detecting a first power signal provided from the host device; determining whether a time interval between the detection of the first power signal and a most recent shutoff of the first power signal exceeds a reference time interval; generating a dummy delay signal in response to determining that the time interval exceeds the reference time interval; and managing a first subsequent memory operation based on the dummy delay signal.
Inventor(s): Kiryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Inhak Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaesung Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/418, G11C11/419
CPC Code(s): G11C11/418
Abstract: a memory device includes a cell array including a plurality of static random-access memory (sram) cells; a row decoder configured to drive a plurality of word lines of the plurality of sram cells based on a row address; a data input/output circuit connected to a plurality of bit lines of the cell array and connected to a sub-power line configured to supply cell voltage to the plurality of sram cells; and a word line pulse generator configured to generate a word line pulse with a first pulse width that varies based on the row address and to provide the word line pulse to the row decoder.
Inventor(s): Taehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Chansoo Kang of Suwon-si (KR) for samsung electronics co., ltd., Minju Kim of Suwon-si (KR) for samsung electronics co., ltd., Daewon Kang of Suwon-si (KR) for samsung electronics co., ltd., Dougyong Sung of Suwon-si (KR) for samsung electronics co., ltd., Jungmo Yang of Suwon-si (KR) for samsung electronics co., ltd., Sejin Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/67
CPC Code(s): H01J37/32917
Abstract: the present disclosure relates to plasma diagnostic devices. an example plasma diagnostic device includes a pinhole through which a first optical signal passes, an optical device in which the first optical signal is incident and the first optical signal is converted into a second optical signal, a filter configured to filter the second optical signal and to output a third optical signal of a specific wavelength band, and a sensor configured to monitor a distribution of the first optical signal, the second optical signal, and the third optical signal.
Inventor(s): Youn Sok Choi of Suwon-si (KR) for samsung electronics co., ltd., Ju Hyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hae Wook Park of Suwon-si (KR) for samsung electronics co., ltd., Young Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32917
Abstract: a plasma diagnosis device and a method for manufacturing the plasma diagnosis device are provided. the plasma diagnosis device includes: a process chamber in which processes using plasma are performed; a probe structure which includes a protective layer having a first face abutting the plasma, a second face opposite to the first face, and an outer wall connecting the first face and the second face inside the process chamber, and a conductive measuring unit spaced apart from the first face of the protective layer and configured to measure a status of the plasma; and a wafer on a periphery of the probe structure and in contact with the outer wall of the protective layer, in which the wafer and the protective layer include materials different from each other.
Inventor(s): Jin Wook Jung of Suwon-si (KR) for samsung electronics co., ltd., Young Duk Suh of Suwon-si (KR) for samsung electronics co., ltd., Sun Moon Kim of Suwon-si (KR) for samsung electronics co., ltd., Myung-Sik Lee of Suwon-si (KR) for samsung electronics co., ltd., Seung Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Do Hyun Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, H01L21/027
CPC Code(s): H01L21/02348
Abstract: a method for fabricating a semiconductor device is provided. the method comprises providing a mask which includes first particles, and second particles spaced apart from the first particles, on a surface of the mask, applying a first adhesive over the first particles on the mask, irradiating the first adhesive with light on a first position of the first particles to cure the first adhesive, resulting in a cured first adhesive, forming a first adhesive film from the cured first adhesive in which the first particles are stuck to the first adhesive and removing the first adhesive film on the mask, wherein the first adhesive overlaps a first region of the surface of the mask in which the first particles are disposed, and does not overlap a second region spaced laterally from the first region of the mask.
Inventor(s): Guifu Yang of Suwon-si (KR) for samsung electronics co., ltd., Sunghwan Jang of Suwon-si (KR) for samsung electronics co., ltd., Sanghyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinbum Kim of Suwon-si (KR) for samsung electronics co., ltd., Hanhum Park of Suwon-si (KR) for samsung electronics co., ltd., Sunguk Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/3115, H01L21/033, H01L21/311, H01L21/3213
CPC Code(s): H01L21/31155
Abstract: a method of manufacturing a semiconductor apparatus includes forming a target layer, a bottom mask layer including a first mask, and a photoresist pattern, on a substrate; contracting the photoresist pattern; forming a mandrill bar on the first mask layer using the photoresist pattern that had been contracted; forming a conformal spacer layer on the first mask and the mandrill bar; etching the spacer layer such that at least a portion of the first mask is free of the spacer layer; forming a sacrificial layer on the at least the portion of the first mask; forming a hard-mask bar by etching the spacer layer and the first mask; and patterning the target layer using the hard-mask bar.
Inventor(s): Geun Young YEOM of Seoul (KR) for samsung electronics co., ltd., Jin Woo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sang Wuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Yun A LEE of Suwon-si (KR) for samsung electronics co., ltd., Chan Mi LEE of Suwon-si (KR) for samsung electronics co., ltd., Sang Gyo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Yun Jong JANG of Seoul (KR) for samsung electronics co., ltd., Hae In KWON of Suwon-si (KR) for samsung electronics co., ltd., Hong Seong GIL of Suwon-si (KR) for samsung electronics co., ltd., Doo San KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01J37/32, H01L21/3065
CPC Code(s): H01L21/67069
Abstract: an ion beam etching apparatus comprising a plasma chamber, a plasma source disposed on top of the plasma chamber and configured to generate plasma, a process chamber defining a treating area where a substrate is treated, a grid structure disposed between the process chamber and the plasma chamber, wherein the grid structure receives the plasma, and supplies ions or radicals toward the substrate, a discharge line connected to the grid structure, and a first pumping system connected to the discharge line, wherein particles or polymers within the grid structure are discharged through the discharge line.
20250046635. SUBSTRATE PROCESSING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangchul Han of Suwon-si (KR) for samsung electronics co., ltd., Yihwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngbok Lee of Suwon-si (KR) for samsung electronics co., ltd., Junho Lee of Suwon-si (KR) for samsung electronics co., ltd., SeokJun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01J37/32, H01L21/687
CPC Code(s): H01L21/67259
Abstract: a method of processing a substrate includes locating a substrate in a substrate processing apparatus, fixing the substrate in the substrate processing apparatus, processing the substrate, and checking a fixed state of the substrate. the substrate processing apparatus includes a process chamber, a stage supporting the substrate, a plasma induction electrode used to generate plasma and located in the stage, a first power source configured to supply rf power to the plasma induction electrode, a heater located in the stage and used to heat the stage, a second power source configured to supply ac power to the heater, and a monitoring unit electrically connected to the plasma induction electrode. the checking of the fixed state of the substrate includes measuring ac-2 power of the ac power, which is transferred to the monitoring unit through the heater and the plasma induction electrode.
20250046659. SEMICONDUCTOR PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Se Ra Lee of Suwon-si (KR) for samsung electronics co., ltd., Jun Yeong Heo of Suwon-si (KR) for samsung electronics co., ltd., Yeong Kwon Ko of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L21/78, H01L23/00
CPC Code(s): H01L22/32
Abstract: a semiconductor package, which may include a semiconductor chip including a first surface and a second surface, which may be opposite to each other in a first direction. the semiconductor package may include a plurality of first bumps in a first area on the first surface and arranged along a second direction that intersects with the first direction, a plurality of second bumps in a second area on the first surface and arranged along the second direction and spaced apart from the plurality of first bumps in a third direction that intersects with the first direction and the second direction, a first test pad in a third area between the first area and the second area, and a third bump on the first test pad. the first test pad may be along an edge of the semiconductor chip in the third direction.
Inventor(s): Taejun JEON of Suwon-si (KR) for samsung electronics co., ltd., Yongkwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Junwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Gyuhyeong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/64
CPC Code(s): H01L23/3121
Abstract: a semiconductor package includes a package substrate having a first region, a second region and third region sequentially arranged from a first side portion to a second side portion thereof. the second region has a chip mounting region in a central region. a semiconductor chip is disposed in the chip mounting region and is mounted on a plurality of substrate pads of the package substrate. a pair of first flow control structures is disposed in the first region and is arranged symmetrically on both sides along a center line passing through a center of the chip mounting region. at least one pair of second flow control structures is disposed in the second region of the package substrate and is arranged symmetrically on both sides of the chip mounting region. a molding member is on the package substrate and fills a gap between the semiconductor chip and the package substrate.
Inventor(s): Ji Hwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyung Don MUN of Suwon-si (KR) for samsung electronics co., ltd., Sangjin BAEK of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/522, H01L25/00, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes: a first redistribution line structure; a first semiconductor chip on one surface of the first redistribution line structure; a first conductive bump between, and connecting, the first redistribution line structure and the first semiconductor chip; a first encapsulant encapsulating at least a portion of the first semiconductor chip; a second semiconductor chip on another, opposite surface of the first redistribution line and including a through via; a second conductive bump between, and connecting, the first redistribution line structure and the second semiconductor chip; a second encapsulant encapsulating at least a portion of the second semiconductor chip; and a second redistribution line structure on the second encapsulant. the second encapsulant covers at least a portion of a surface of the second semiconductor chip facing the second redistribution line structure.
Inventor(s): YOUNGBAE KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/538, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a wiring substrate includes a first re-distribution layer, a second re-distribution layer on the first re-distribution layer, and a core portion between the first re-distribution layer and the second re-distribution layer, wherein the core portion includes a bottom surface disposed on a top surface of the first re-distribution layer, and a first intermediate surface disposed on the top surface of the first re-distribution layer, wherein a distance between the top surface of the first re-distribution layer and the core portion along the first intermediate surface, which is measured in a direction perpendicular to the top surface of the first re-distribution layer, increases as a distance from the bottom surface increases.
20250046698. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sojeong HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31
CPC Code(s): H01L23/49838
Abstract: disclosed is a semiconductor package including a package substrate and a semiconductor chip on the package substrate. the package substrate includes a wiring layer, a plurality of pads arranged in rows on the wiring layer, and a solder resist pattern on the wiring layer. the solder resist pattern includes openings that expose the pads. a first opening is positioned nearest an end of a row, wherein the first opening has a cross-section including a first inner lateral surface and a second inner lateral surface that face each other. a slope of the first inner lateral surface is about 10 or more degrees less than a slope of the second inner lateral surface.
Inventor(s): Choongbin YIM of Suwon-si (KR) for samsung electronics co., ltd., Jongkook KIM of Suwon-si (KR) for samsung electronics co., ltd., Chengtar WU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L23/498, H01L25/10
CPC Code(s): H01L23/5383
Abstract: a semiconductor package includes a support substrate having a through hole and including an insulating layer, one or more wiring layers including a first wiring layer, and a first electronic device on the first wiring layer, a semiconductor chip positioned in the through hole to be at least partially surrounded by the support substrate and including a connection pad on a first surface of the semiconductor chip, an encapsulant filling at least a portion of the through hole and encapsulating at least a portion of the semiconductor chip, a first redistribution layer structure on the first surface of the semiconductor chip and including a first redistribution layer, and a second redistribution layer structure over a second surface of the semiconductor chip that is opposite to the first surface of the semiconductor chip, the second redistribution layer structure including a second redistribution layer.
20250046724. SUBSTRATE PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunsu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L23/498, H01L25/16, H10B80/00
CPC Code(s): H01L23/5386
Abstract: provided is a semiconductor package, the semiconductor package including: a package substrate including an upper surface having a first region and a second region, the second region disposed on a level lower than that of the first region, and a plurality of wiring layers; a first semiconductor chip disposed on the first region of the upper surface of the package substrate and electrically connected to the plurality of wiring layers of the package substrate; a second semiconductor chip disposed on the second region of the upper surface of the package substrate; and an interposer substrate disposed between the second region of the upper surface of the package substrate and the second semiconductor chip and electrically connecting the plurality of wiring layers of the package substrate and the second semiconductor chip.
Inventor(s): Jeongdu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghyup KIM of Suwon-si (KR) for samsung electronics co., ltd., Woongkee KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L21/02
CPC Code(s): H01L23/544
Abstract: a wafer includes: a scribe lane surrounding a semiconductor chip region on one surface of the wafer body; and a stress adjustment portion in the scribe lane and including a first film and a second film that have at least different materials from that of the wafer body. the wafer may be provided before a semiconductor process.
20250046728. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongwon KANG of Suwon-si (KR) for samsung electronics co., ltd., Hongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Changyeon SONG of Suwon-si (KR) for samsung electronics co., ltd., Sunguk LEE of Suwon-si (KR) for samsung electronics co., ltd., Jae-Ean LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L23/498
CPC Code(s): H01L23/544
Abstract: a semiconductor package may include a semiconductor chip and an upper redistribution layer including a marking structure on the semiconductor chip, an upper insulating layer surrounding the marking structure, and an outer insulating layer on the upper insulating layer, wherein the marking structure may include a lower marking pattern, a marking via on the lower marking pattern, and an upper marking pattern on the marking via, the upper marking pattern may include a first conductive pattern on the marking via and a second conductive pattern on the first conductive pattern, and the second conductive pattern may be exposed by a trench defined by the outer insulating layer.
Inventor(s): Yongkoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jingu Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Seokkyu Choi of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/66, H01L21/48, H01L21/56, H01L21/683, H01L23/00, H01L23/31, H01L23/538, H01Q9/04, H01Q19/00
CPC Code(s): H01L23/66
Abstract: a semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.
20250046740. SEMICONDUCTOR CHIP STRUCTURE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jubin SEO of Suwon-si (KR) for samsung electronics co., ltd., Dongchan LIM of Suwon-si (KR) for samsung electronics co., ltd., Sujeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Junkyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
CPC Code(s): H01L24/08
Abstract: a semiconductor chip structure includes a plurality of semiconductor chips. a bonding electrode included in each of the semiconductor chips is filled with nanotwin copper and fine grain copper is disposed in at least a portion of the bonding electrode.
Inventor(s): Young Lyong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/367, H01L23/498, H01L25/065
CPC Code(s): H01L24/29
Abstract: a semiconductor package includes first and second chips horizontally spaced apart from each other on a substrate. an under-fill layer is interposed between the substrate and the first and second chips. an upper mold layer is disposed on the substrate to cover side surfaces of the first and second chips. the second chip includes vertically-stacked sub-chips and a chip mold layer covering side surfaces of the sub-chips. the under-fill layer extends into a space between lower side surfaces of the chip mold layer and the first chip. the upper mold layer extends into a space between upper side surfaces of the chip mold layer and the first chip to cover an uppermost surface of the under-fill layer. the upper side surface of the chip mold layer is recessed inward from the lower side surface of the chip mold layer.
20250046747. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junyun KWEON of Suwon-si (KR) for samsung electronics co., ltd., Wooju KIM of Suwon-si (KR) for samsung electronics co., ltd., Kangil YUN of Suwon-si (KR) for samsung electronics co., ltd., Junho YOON of Suwon-si (KR) for samsung electronics co., ltd., Dayoung CHO of Suwon-si (KR) for samsung electronics co., ltd., Jinwook HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/304, H01L21/306, H01L23/31, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H01L24/32
Abstract: a semiconductor package includes a substrate, a first semiconductor chip on the substrate and including a first chip pad and a first upper insulating layer on sidewalls of the first chip pad, a first bonding wire on a top surface of the first chip pad and connected to the first chip pad, and a second semiconductor chip on a top surface of the first semiconductor chip and spaced apart from the first chip pad, wherein the second semiconductor chip includes a second semiconductor die and a second lower insulating layer on a bottom surface of the second semiconductor die, wherein the second lower insulating layer may be directly bonded to the first upper insulating layer by a chemical bond between the first upper insulating layer and the second lower insulating layer.
20250046749. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunsoo Chung of Suwon-si (KR) for samsung electronics co., ltd., Kwangsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Inhyo Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L25/18, H10B80/00
CPC Code(s): H01L24/32
Abstract: a semiconductor package includes an interposer; a plurality of semiconductor devices that are on the interposer and spaced apart from each other; and a package underfill layer that includes a first underfill layer in a first gap that is between the plurality of semiconductor devices and a second underfill layer in a second gap that is between the plurality of semiconductor devices and the interposer, where the second underfill layer includes a second underfill layer side surface that faces a lateral direction, where the second underfill layer side surface does not contact the plurality of semiconductor devices and a portion of the interposer that is adjacent to the second gap, where the second underfill layer side surface extends between a top surface of the interposer and bottom surfaces of the plurality of semiconductor devices and extends from a lower outer boundary.
Inventor(s): Youngja Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B23K1/00, B23K1/015, B23K3/047, B23K3/08, B23K101/40, H01L21/56
CPC Code(s): H01L24/75
Abstract: a method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.
20250046754. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyun-Mook Choi of Suwon-si (KR) for samsung electronics co., ltd., Keum Hyo Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/42, H01L23/48, H01L23/538, H10B80/00
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a package substrate including a trench; a first chip structure including a first buffer chip and a plurality of first semiconductor chips on the first buffer chip; and a second chip structure including a second buffer chip and a second semiconductor chip on the second buffer chip, wherein one of the first and second chip structures is on the trench, the other one of the first and second chip structures is on a top surface of the package substrate, a first physical layer (phy) region of the first buffer chip overlaps with a second phy region of the second buffer chip in a direction perpendicular to the top surface of the package substrate.
20250046755. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myungsam KANG of Suwon-si (KR) for samsung electronics co., ltd., Chilwoo KWON of Suwon-si (KR) for samsung electronics co., ltd., Okgyeong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/13, H01L23/31, H01L23/498, H01L23/538, H01L23/64, H10B80/00
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a ceramic substrate having a cavity, a lower redistribution structure on a lower surface of the ceramic substrate and electrically connected to the ceramic substrate, an upper redistribution structure on an upper surface of the ceramic substrate and electrically connected to the ceramic substrate, a plurality of semiconductor chips arranged in a first direction on the upper redistribution structure, and a bridge chip structure in the cavity of the ceramic substrate and including a bridge chip electrically connecting the plurality of semiconductor chips to each other.
Inventor(s): HYUNSOO CHUNG of Suwon-si (KR) for samsung electronics co., ltd., KWANG-SOO KIM of Suwon-si (KR) for samsung electronics co., ltd., JAESIC LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/373, H01L23/48, H10B80/00
CPC Code(s): H01L25/0657
Abstract: disclosed are semiconductor packages and their fabrication methods. the semiconductor package comprises a base die that includes first dummy pads on an edge at a top surface of the base die; a plurality of memory dies on the base die; a plurality of conductive posts spaced apart from the memory dies and on the edge of the base die; a mold layer that covers the base die, the memory dies, and the conductive posts; and a heat spreader that includes second dummy pads on an edge at a bottom surface of the heat spreader and third dummy pads on a central portion of the bottom surface of the heat spreader, wherein the heat spreader is disposed on the memory dies and the mold layer. the first dummy pads are correspondingly connected to the second dummy pads through the conductive posts and the second dummy pads are in contact with the conductive posts.
Inventor(s): Hansae Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H10B80/00
CPC Code(s): H01L25/105
Abstract: a semiconductor chip according to some embodiments may include a main area, and an edge area that is positioned on a side of the main area in a first direction. on the main area, main area chip pads may be provided, and on the edge area, edge area chip pads may be provided. the edge area chip pads may be arranged such that two edge area chip pads immediately adjacent to each other in the first direction may be spaced apart from each other in a direction intersecting the first direction.
20250046769. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jooyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Dahee KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyujin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/31, H01L23/498, H01L25/065, H01L25/16
CPC Code(s): H01L25/105
Abstract: a semiconductor package may include a package redistribution layer including a plurality of package redistribution patterns and a package redistribution insulating layer surrounding the plurality of package redistribution patterns, a plurality of electronic components apart from each other in a horizontal direction on the package redistribution layer and including at least one sub package, a package molding layer covering a top surface of the package redistribution layer and surrounding the plurality of electronic components, and a plurality of package connection terminals attached to a bottom surface of the package redistribution layer in a fan-out manner. the at least one sub package may include a package substrate, a semiconductor chip attached to the package substrate, and a sub molding layer on the package substrate.
Inventor(s): Junwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Kiwon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M50/574, H01M50/247, H01M50/287
CPC Code(s): H01M50/574
Abstract: an electronic device is provided which includes a printed circuit board including an opening. the electronic device may include a switch circuit unit disposed on the printed circuit board and including an input portion to which a power signal of a battery is applied, an output portion from which the switch circuit unit is configured to output the power signal, and a first ground. the electronic device may include a control circuit unit disposed on the printed circuit board. the control circuit unit is configured to control a connection between the input portion and the output portion, and includes a contact terminal. the electronic device may include a positive terminal connected to the printed circuit board to transmit the power signal of the battery. the electronic device may include a negative terminal including a body portion, a control pin formed on the body portion, and a negative electrode contact portion.
Inventor(s): Jinho Jeong of SUWON-SI (KR) for samsung electronics co., ltd., Hyungeun Kim of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H02H9/04
CPC Code(s): H02H9/046
Abstract: an electrostatic discharge (esd) protection circuit includes a first pad configured to provide a first voltage, a second pad configured to provide a second voltage, an equalizing circuit including a first inductor, a second inductor, and a third inductor, an input/output pad connected to the equalizing circuit, and a diode circuit including a first diode and a second diode. an end of the first diode is connected to the first pad and another end of the first diode is connected the equalizing circuit. an end of the second diode is connected to the equalizing circuit and the first diode and another end of the second diode is connected to the second pad.
Inventor(s): Eunji AN of Suwon-si (KR) for samsung electronics co., ltd., Kyoungtae KANG of Suwon-si (KR) for samsung electronics co., ltd., Jehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungjoo OH of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/011, H03K3/03
CPC Code(s): H03K3/011
Abstract: a drive signal supply device includes an oscillation circuit, a drive signal generation circuit, and a control circuit. the oscillation circuit includes a plurality of oscillators each including inverters and outputs a plurality of oscillation signals. a switching characteristic of each of the inverters included in one of the plurality of oscillators is different from a switching characteristic of each of the inverters included in another of the plurality of oscillators. the control circuit detects a process corner of the semiconductor device based on the plurality of oscillation signals to generate a control signal. the drive signal generation circuit generates a drive signal of a semiconductor device based on the control signal.
Inventor(s): Paboda Viduneth Ariyarathna BERUWAWELA PATHIRANAGE of San Diego CA (US) for samsung electronics co., ltd., Wan Jong KIM of Tustin CA (US) for samsung electronics co., ltd., Pranav DAYAL of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H04B17/10
CPC Code(s): H04B1/0458
Abstract: a method and an apparatus are provided in which a first signal is received at a bi-directional coupler of an antenna path. a first power, delivered to an antenna of the antenna path, is measured based on a second signal corresponding to a forward signal provided from the bi-directional coupler to the antenna and a third signal corresponding to a reverse signal reflected back to the bi-directional coupler from the antenna. a power correction value is determined based on a ratio of the second signal to the third signal and a one-to-one relationship of the ratio to a load reflection coefficient of the antenna. a second power delivered to the antenna is determined based on the first power and the power correction value.
Inventor(s): Chanho PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YOO of Suwon-si (KR) for samsung electronics co., ltd., Wanjae JU of Suwon-si (KR) for samsung electronics co., ltd., Gyucheol HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/40
CPC Code(s): H04B1/40
Abstract: according to an embodiment of the present disclosure, an electronic device comprises: a housing; a circuit board which is accommodated in the housing; a first plate which is disposed at least partially opposite to the circuit board within the housing; a transmission line which is disposed at a first surface among both surfaces of the first plate and electrically connected to the circuit board; a ground conductor which is disposed at a second surface among both surfaces of the first plate and electrically connected to the circuit board; and a radiation conductor pattern which is disposed at one of the first and second surfaces and electrically connected to one end of the transmission line. the transmission line is arranged to at least partially overlap the ground conductor as viewed from one of the first and second surfaces, and is configured to transmit a wireless signal transmitted or received through the radiation conductor pattern.
20250047329. MIMO OPERATIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Dalin Zhu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/0413, H04B7/06
CPC Code(s): H04B7/0413
Abstract: apparatuses and methods for dynamic mimo operations. a method performed by a user equipment (ue) includes receiving information about n ports and a report; based on the information, determining � port selection hypotheses, where a port selection hypothesis with index l selects a group of nports from the n ports; and transmitting the report including at least one indicator indicating the � port selection hypotheses, where �≥1, l ∈{1, . . . , �}, and 1≤n≤n.
Inventor(s): Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Taehan BAE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/0417, H04B7/06, H04W24/10
CPC Code(s): H04B7/0417
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system is provided. the method includes receiving, from a base station via higher layer signaling, one or more configurations, identifying a first csi report for prediction and a second csi report for monitoring based on the one or more configurations, and transmitting, to the base station, the first csi report for prediction and the second csi report for monitoring.
20250047341. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngsang CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H01Q21/24, H04B1/401
CPC Code(s): H04B7/061
Abstract: an electronic device is provided. the electronic device includes at least one processor, memory storing instructions, a first antenna, a second antenna, a radio frequency (rf) transceiver, a phase shifter electrically connected to the second antenna, a power branch circuit, and at least one switch circuit configured to selectively provide a first connection state or a second connection state. the instructions that, when executed by the at least one processor, cause the electronic device to control the at least one switch circuit to provide a first connection state or a second connection state.
Inventor(s): Ameha Tsegaye ABEBE of Gyeonggi-do (KR) for samsung electronics co., ltd., Sripada KADAMBAR of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar Reddy CHAVVA of Bangalore (IN) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W24/08, H04W72/1268, H04W72/51
CPC Code(s): H04B7/0626
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system is provided. the method includes receiving, from a base station via higher layer signaling, a configuration for a channel state information (csi) report, receiving, from the base station, a monitoring measurement resource, generating the csi report based on the monitoring measurement resource; and transmitting, to the base station, the csi report including a monitoring outcome report.
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/08, H04W72/23
CPC Code(s): H04B7/06966
Abstract: methods and apparatuses for indicating uplink (ul) beams and sounding reference signal (srs) resources. a method performed by a user equipment (ue) includes receiving, in a downlink control information (dci) format, (i) a srs resource indicator (sri) and (ii) a transmission configuration indication (tci) codepoint mapped to one or more first tci states and determining, based on the sri, a srs resource and a physical uplink shared channel (pusch) associated with the srs resource. the method further includes determining, based on the one or more first tci states, a spatial filter for transmitting the pusch; and transmitting the pusch using the determined spatial filter.
Inventor(s): Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Dalin Zhu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/08, H04L5/00, H04W72/23
CPC Code(s): H04B7/088
Abstract: methods and apparatuses for signaling of inter-cell beam management in a wireless communication system. a method of operating a user equipment includes receiving configuration information for a list of transmission configuration indication (tci) states; receiving an indication of activated tci state code points via a medium access control-control element (mac ce); and receiving a downlink control information (dci) indicating an activated tci state code point. the method further includes determining a tci state to apply based on the activated tci state code point; determining an entity of the tci state and a source reference signal (rs) of the tci state; updating spatial filters for downlink (dl) channels or uplink (ul) channels based on the source rs and entity; and receiving or transmitting the dl channels or the ul channels of the entity, respectively, based on the updated spatial filters.
Inventor(s): Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Mirette SADEK of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B17/336, H04L5/00, H04L5/14
CPC Code(s): H04B17/336
Abstract: a system and a method are disclosed for ue operations in an sbfd operation mode. a method includes receiving, from a base station, configuration information for ul rss to be transmitted by the ue while receiving dl interference or channel measurement signals; transmitting, to the base station, the ul rss while receiving the dl interference or channel measurement signals, based on the configuration information; estimating si based on the transmitted ul rss and the dl received interference or channel measurement signals; and transmitting, to the base station, a report corresponding to the received dl interference or channel measurement signals.
Inventor(s): Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd., Hoondong NOH of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinhyun PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Yeongeun LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L5/00, H04W72/0446, H04W72/23, H04W80/02
CPC Code(s): H04L25/0226
Abstract: a terminal and a method performed by the terminal are provided for use in a wireless communication system. the method includes receiving configuration information associated with a sounding reference signal (srs) by higher layer signaling; receiving downlink control information (dci) for triggering the srs; and transmitting, based on the configuration information and the dci, the srs in an available slot counting from a reference slot.
Inventor(s): Myeongjin Kim of Seongnam-si (KR) for samsung electronics co., ltd., Jinmin Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Eunsung Jeon of Seoul (KR) for samsung electronics co., ltd., Wookbong Lee of San Jose CA (US) for samsung electronics co., ltd., Chulho Chung of Yongin-si (KR) for samsung electronics co., ltd., Jonghun Han of Gwacheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04J11/00, H04L27/00
CPC Code(s): H04L27/2643
Abstract: a second apparatus for wireless communication includes: a transceiver; and a processing circuit configured to receive, from a first apparatus via the transceiver, a physical layer protocol data unit (ppdu) including a first signal field having a fixed length and a second signal field having a variable length. the second signal field includes an orthogonal frequency-division multiplexing (ofdm) symbol block including at least one ofdm symbol, and one or more repetitions of the ofdm symbol block.
Inventor(s): Khuong N. Nguyen of Frisco TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Hao Chen of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L47/2441, H04L47/2408, H04L47/2416, H04L47/2425
CPC Code(s): H04L47/2441
Abstract: an embodiment includes a network connected device comprising a transceiver configured to receive network traffic from the network, a memory coupled to the transceiver, a processor coupled to the memory and the transceiver, the processor configured to: decompose the network traffic into a plurality of data flows based on source information and destination information, store the plurality of data flows in a traffic map, each entry of the traffic map includes a data flow identification and traffic information of the data flow in an observation time window, determine a service type for each of the data flows using machine learning; and prioritize a first data flow over a second data flow in the plurality of data flows based on the service type.
Inventor(s): Joohyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangsun Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
CPC Code(s): H04L63/08
Abstract: an electronic device according to various embodiments disclosed in the document may include a communication circuit, a user interface module, and a processor operatively connected to the communication circuit and the user interface module, and the processor may be configured to identify at least one neighboring electronic device that is capable of performing user authentication in response to a user authentication request, to provide, via the user interface module, the list of the at least one neighboring electronic device capable of performing user authentication, and to transmit a request to an authentication server for performing user authentication using an electronic device selected from the list of the at least one neighboring electronic device capable of performing user authentication.
Inventor(s): Jaejoon YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F1/16, H05K1/14
CPC Code(s): H04M1/0277
Abstract: an electronic device is provided. the electronic device includes a bracket including one surface facing outside of the electronic device, another surface facing inside of the electronic device and opposite to the one surface, and a through hole penetrating the one surface and the other surface, a display disposed on the one surface of the bracket, a printed circuit board spaced apart from the other surface of the bracket in a direction toward which the other surface of the bracket faces, a flexible printed circuit board passing through the through hole and extending from one surface of the display facing the one surface of the bracket to the printed circuit board, and a supporting portion partially disposed on the through hole and is spaced apart from the one surface of the display, wherein the supporting portion is in contact with a part of a portion of the flexible printed circuit board, and wherein the supporting portion separates the part of the flexible printed circuit board passing through the through hole from the one surface of the display.
Inventor(s): Ohyoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyojin BAE of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun HAN of Suwon-si (KR) for samsung electronics co., ltd., Younghak OH of Suwon-si (KR) for samsung electronics co., ltd., Kyuho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sueyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72412, H04M1/02
CPC Code(s): H04M1/72412
Abstract: an electronic device is provided. the electronic device includes a display, a communication module and at least one processor, wherein the at least one processor connects with an external electronic device including a flexible display that can extend in one or more directions, displays an object corresponding to at least one application execution screen on the display, identifies a user input for displaying the object on the display of the external electronic device, displays, on the basis of the user input, on at least a part of the display, an indicator for changing the size of the flexible display, and can control, on the basis of an input for selecting the indicator, that the object is displayed on the flexible display of which the size has been changed.
Inventor(s): Kwangtaek WOO of Suwon-si (KR) for samsung electronics co., ltd., Mingyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Seonghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72454, H04W8/18
CPC Code(s): H04M1/72454
Abstract: an electronic device according to an embodiment comprises: a display module including a plurality of areas; a memory that stores computer-executable instructions; and a processor that executes the instructions by accessing the memory, wherein the instructions may be configured to: if detecting an execution input for a target application, acquire target subscriber identification module information connected to the target application, from among a plurality of pieces of subscriber identification module information read by the electronic device; and in a target area corresponding to the acquired target subscriber identification module information, from among the plurality of areas of the display module, display a screen of the target application executed by using the acquired target subscriber identification module information.
Inventor(s): Anish TAMSE of Seoul (KR) for samsung electronics co., ltd., Yin-ji PIAO of Yongin-si (KR) for samsung electronics co., ltd., Jin-Young LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/119, H04N19/129, H04N19/139, H04N19/176
CPC Code(s): H04N19/119
Abstract: provided is a video decoding method including: obtaining affine parameter group candidates of a current block based on whether adjacent blocks of the current block are decoded; determining an affine parameter group of the current block from among the affine parameter group candidates, according to affine parameter information of the current block; and reconstructing the current block, based on one or more affine parameters included in the affine parameter group.
Inventor(s): Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/137, H04N19/105, H04N19/13, H04N19/159, H04N19/176, H04N19/46
CPC Code(s): H04N19/137
Abstract: provided are a video decoding method and apparatus, in which, during video encoding and decoding processes: in which a first bin of a sub-block merge index indicating a candidate motion vector of a sub-block merge mode is obtained, the first bin being arithmetic-encoded using a context model, a second arithmetic-encoded in a bypass mode is obtained based on a first value obtained by arithmetic-decoding the first bin by using the context model, a second value is obtained by arithmetic-decoding the second bin in the bypass mode, and prediction on a current block is performed in the sub-block merge mode, based on the first value and the second value.
Inventor(s): Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/137, H04N19/105, H04N19/13, H04N19/159, H04N19/176, H04N19/46
CPC Code(s): H04N19/137
Abstract: provided are a video decoding method and apparatus, in which, during video encoding and decoding processes: in which a first bin of a sub-block merge index indicating a candidate motion vector of a sub-block merge mode is obtained, the first bin being arithmetic-encoded using a context model, a second arithmetic-encoded in a bypass mode is obtained based on a first value obtained by arithmetic-decoding the first bin by using the context model, a second value is obtained by arithmetic-decoding the second bin in the bypass mode, and prediction on a current block is performed in the sub-block merge mode, based on the first value and the second value.
Inventor(s): Geonjung KO of Seoul (KR) for samsung electronics co., ltd., Juhyung SON of Uiwang-si (KR) for samsung electronics co., ltd., Dongcheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinsam KWAK of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/139, H04N19/105, H04N19/176, H04N19/513
CPC Code(s): H04N19/139
Abstract: a video signal processing method and apparatus for encoding or decoding a video signal is disclosed. more particularly, a video signal processing method and a video signal processing apparatus using the same are disclosed, wherein a method for processing a video signal comprises the steps of: obtaining a set of control point motion vectors for prediction of a current block; obtaining the motion vector of each sub-block of the current block using control point motion vectors of the set of control point motion vectors; obtaining a predictor of the each sub-block of the current block using the motion vectors of the each sub-block; obtaining a predictor of the current block by combining predictors of the each sub-block; and restoring the current block using the predictor of the current block.
Inventor(s): Elena ALSHINA of Seoul (KR) for samsung electronics co., ltd., Alexander Alshin of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/159, H04N19/105, H04N19/176, H04N19/573
CPC Code(s): H04N19/159
Abstract: provided is a video decoding method including: obtaining a first motion vector indicating a first reference block of a current block in a first reference picture and a second motion vector indicating a second reference block of the current block in a second reference picture; obtaining a parameter related to pixel group unit motion compensation of the current block, based on at least one of information of the parameter related to the pixel group unit motion compensation and a parameter related to an image including the current picture; generating a prediction block by performing, with respect to the current block, block unit motion compensation based on the first motion vector and the second motion vector and performing the pixel group unit motion compensation based on the parameter related to the pixel group unit motion compensation; and reconstructing the current block. here, a pixel group may include at least one pixel.
Inventor(s): Seung-soo JEONG of Seoul (KR) for samsung electronics co., ltd., Min-woo PARK of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/513, H04N19/13, H04N19/139, H04N19/176, H04N19/184, H04N19/70
CPC Code(s): H04N19/513
Abstract: a method of decoding motion information according to an embodiment includes: obtaining information indicating a disparity distance for determining a prediction motion vector of a current block; scaling the disparity distance corresponding to the obtained information, based on a comparison result between a base pixel unit and a smallest pixel unit indicatable by a motion vector of the current block; determining a prediction motion vector candidate changed by the scaled disparity distance from a base motion vector of the current block from among one or more prediction motion vector candidates as the prediction motion vector of the current block; and determining the motion vector of the current block by using the prediction motion vector.
Inventor(s): Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/523, H04N19/103, H04N19/176, H04N19/513
CPC Code(s): H04N19/523
Abstract: provided is a video decoding method including: obtaining, from a sequence parameter set, sequence merge mode with motion vector difference (sequence mmvd) information indicating whether an mmvd mode is applicable in a current sequence; when the mmvd mode is applicable according to the sequence mmvd information, obtaining, from a bitstream, first mmvd information indicating whether the mmvd mode is applied in a first inter prediction mode for a current block included in the current sequence; when the mmvd mode is applicable in the first inter prediction mode according to the first mmvd information, reconstructing a motion vector of the current block which is to be used in the first inter prediction mode, by using a distance of a motion vector difference and a direction of a motion vector difference obtained from the bitstream; and reconstructing the current block by using the motion vector of the current block.
Inventor(s): Jin-yeol PARK of Seongnam-si (KR) for samsung electronics co., ltd., Young-hwa Yun of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/422, G06F3/01, G08C17/00, H04N21/431, H04N21/47
CPC Code(s): H04N21/42204
Abstract: a method for interacting with a graphical user interface (gui) of a television operating in a step mode in which movement of a cursor among menu items displayed on the gui is performed stepwise in accordance with a manipulation of a direction key of the remote controller, the method including receiving, by the television, from a remote controller a signal corresponding to spatial movement of the remote controller detected by the remote controller that instructs the television to switch from (i) the step mode to (ii) a position mode of the gui in which the movement of the cursor among the menu items is performed in accordance with the spatial movement of the remote controller and switching from the step mode of the gui to the position mode of the gui based on the signal.
Inventor(s): Miyeoung CHUNG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sanggeon KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sooryuh KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Heewoong KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongmin PARK of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/611, H04N23/63, H04N23/667
CPC Code(s): H04N23/611
Abstract: embodiments of the disclosure provide a method for supporting image capturing and an electronic device for supporting the same. the electronic device may include a first camera, a second camera disposed on an opposite surface to the first camera, a display, a memory, and at least one processor. the at least one processor may obtain a first image from at least one camera of the first camera and the second camera, based on executing an application. the at least one processor may analyze the first image. the at least one processor may determine a designated shooting mode, based on analyzing the first image. the at least one processor may display a graphic element on the display, based on determining the designated shooting mode. the at least one processor may determine a designated camera to operate in the designated shooting mode, based on a user input to capture an image. the at least one processor may capture a second image by using the designated camera.
Inventor(s): Gwangho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jongah KIM of Suwon-si (KR) for samsung electronics co., ltd., Heewoong YOON of Suwon-si (KR) for samsung electronics co., ltd., Kihyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Donghan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/67, H04N23/667
CPC Code(s): H04N23/671
Abstract: a method performed by an electronic device is provided. the method includes receiving, through a distance detection sensor, second signals in which a first signal transmitted through the distance detection sensor is reflected by an external object, identifying a distance from the external object based on at least a part of the second signals, obtaining a deviation information value for the second signals based on identifying that the distance is less than a reference distance, obtaining an image including a visual object corresponding to the external object through a first camera based on the deviation information value being greater than or equal to a reference value, and obtaining the image including the visual object corresponding to the external object through a second camera according to a camera switching, based on the deviation information value being less than the reference value.
Inventor(s): Ilho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/71, H04N5/06, H04N25/701
CPC Code(s): H04N25/745
Abstract: a method of operating a line buffer controller includes receiving pieces of line image data included in an image frame, and, when all pieces of line image data included in the image frame are received, performing a drain operation on the image frame based on a maximum standby count of the image frame.
Inventor(s): Kyungah JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/77, H03M1/12
CPC Code(s): H04N25/77
Abstract: provided is an image sensor and a method of operating same, the image sensor including: an analog signal processing circuitry configured to process analog signals and to output digital signals; a digital data processing circuitry including one or more digital circuits configured to process the digital signals; and a control circuit configured to control operations of the one or more digital circuits based on operation schedule information, wherein the operation schedule information includes one or more control time intervals associated with one or more operation sequences of the image sensor.
Inventor(s): Chang Hoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyun Yup KWAK of Suwon-si (KR) for samsung electronics co., ltd., Yong Mi LEE of Suwon-si (KR) for samsung electronics co., ltd., Seung Won CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jong Seong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sung Jin HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/771, H04N9/64, H04N25/40, H04N25/60
CPC Code(s): H04N25/771
Abstract: a system on chip and method for operating a system on chip are provided. a system on chip includes a shared memory configured to store image data and a processor configured to: generate a first correction value by performing first image processing for a first pixel value of a first pixel of the image data received from the shared memory, generate a second correction value by performing second image processing, which is different from the first image processing, for the first pixel value of the image data received from the shared memory, generate a third correction value by performing third image processing, which is different from the first image processing and the second image processing, for the first pixel value of the image data received from the shared memory, and output a first pixel correction value that is changed from the first pixel value by comparing the first to third correction values with the first pixel value and selecting one of the first to third correction values.
Inventor(s): Byeongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Juhee CHANG of Suwon-si (KR) for samsung electronics co., ltd., Kiwook HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/10, H04R1/04, H04R1/08
CPC Code(s): H04R1/1075
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing, a port coupled to the housing and including a sound passage communicating with the outside of the housing, a speaker disposed in the housing and configured to generate sound toward the sound passage, and a microphone facing at least a portion of the speaker. the speaker includes an oscillation member facing the microphone and at least a portion of the oscillation member is formed curved in a direction away from the microphone.
Inventor(s): Adrian Celestinos Arroyo of Valencia CA (US) for samsung electronics co., ltd., Zhongran Wang of Valencia CA (US) for samsung electronics co., ltd., Victor Manuel Chin Lopez of Tijuana (MX) for samsung electronics co., ltd.
IPC Code(s): H04R1/40, H04R3/14
CPC Code(s): H04R1/403
Abstract: in one embodiment, a method includes determining human directivity index (di) pattern data corresponding to a location of a listener, based on vocalization recorded by a microphone at each of a plurality of loudspeakers. the method further includes extracting a set of di features from the di pattern data; providing the set of di features to a trained machine-learning model; and determining, by the trained machine-learning model and based on the set of di features, a placement of each of the plurality of loudspeakers relative to the listener.
Inventor(s): Sunil Bharitkar of Stevenson Ranch CA (US) for samsung electronics co., ltd., Allan Devantier of Santa Paula CA (US) for samsung electronics co., ltd., Ashish Y. Rawat of Valencia CA (US) for samsung electronics co., ltd.
IPC Code(s): H04S7/00, H04R29/00
CPC Code(s): H04S7/301
Abstract: one embodiment provides a computer-implemented method that includes sending a stimulus signal to a loudspeaker. a measurement signal is received via a microphone. the stimulus signal is transformed into a stimulus time-frequency representation. the measured signal is transformed into a measured time-frequency representation. at least one frequency value is selected between the stimulus time-frequency representation and the measured time-frequency representation. correlation analysis is performed using the selected at least one frequency value. based on the correlation analysis, a statistical mode is determined to produce a start-time of the stimulus signal.
Inventor(s): Hongjin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Taehyung LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/043, H04L5/00, H04W12/106, H04W76/20
CPC Code(s): H04W12/043
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method and apparatus of a master node (mn) are provided. the method of mn comprises: transmitting, to at least one target secondary node (sn), an sn addition request message including at least one sn counter value and kkey corresponding to each target sn, wherein each target sn includes a first target sn and a second target sn; transmitting, to a user equipment (ue), a first radio resource control (rrc) reconfiguration message including the at least one sn counter value and the kkey corresponding to each target sn; and transmitting, to the first target sn, an sn reconfiguration complete message including an sn counter value received from the ue.
Inventor(s): Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/06, H04L9/40, H04W76/30
CPC Code(s): H04W12/06
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. embodiments herein disclose methods and systems for managing a user equipment () in a wireless network (). embodiments disclose initiating, by a session management function (smf) (), secondary re-authentication of the ue for existing protocol data unit (pdu) session based on at least one local policy at the smf associated with dn or based on a configuration in the subscription profile of the ue for the associated dn. embodiments disclose updating, by the smf, at least one re-authentication status parameter to a pending state, on receiving a failure message from an access and mobility management function (amf) () if the ue is unreachable. embodiments disclose triggering, by the smf, the re-authentication of the ue for the same existing pdu session, on identifying by the amf that the ue is reachable.
Inventor(s): Hyeondeok JANG of Suwon-si (KR) for samsung electronics co., ltd., Suhwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Yosub PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongsung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W72/20
CPC Code(s): H04W24/02
Abstract: the present invention relates to a 6g communication system for achieving high data transmission rates and ultra-low latency beyond 4g and 5g communication systems. according to one embodiment of the present invention, provided are a method and device wherein, in order to improve the coverage of a transmission end and the reception performance of a reception end, an ai model is trained on the pa input/output relationship at the reception end, and the trained ai model is used to compensate for pa nonlinearity in received data. in addition, according to one embodiment of the present invention, provided are a method and device wherein training of the ai model on the reception end is only instructed when training of the ai model is necessary, and a reference signal suitable for the training of the ai model is instructed. accordingly, it is possible to reduce the signaling overhead, computational overhead, or power consumption generated during the training of the ai model. in addition, the reference signal having the same or similar characteristics as the data compensating for pa nonlinearity is used in the training of the ai model, and thus overfitting of the ai model can be prevented. therefore, the ai model having optimal pa nonlinearity compensation performance can be obtained.
Inventor(s): Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L41/0803
CPC Code(s): H04W24/10
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). the present application provides a configuration method, a reporting method of a minimization of drive tests (mdt) measurement and an access network device, wherein the configuration method comprises: receiving, by a user node of an access network (cu-up), a configuration information of mdt from an operation and maintenance node; transmitting, by the cu-up, the configuration information of mdt to a control node of an access network (cu-cp); receiving, by the cu-up, the configuration information of mdt for ue from the cu-cp. the mdt under a separate architecture is achieved by the present application.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of McKinney TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W56/00
CPC Code(s): H04W36/0072
Abstract: a user equipment (ue) transmits, to a base station, a capability information indicating whether the ue supports ue-based timing advance measurement, and receives, from the base station, an indication indicating whether ue-based timing advance measurement is enabled for a candidate cell for layer 1/layer 2 triggered mobility (ltm). the ue configures ue-based timing advance measurement for the candidate cell for ltm based on the indication, and performs ue-based timing advance measurement for the candidate cell for ltm. the ue receives a cell switch command from the base station. when a valid timing advance is not included in the cell switch command, the ue switches to the candidate cell for ltm by applying a timing advance measured by the ue. when the valid timing advance is included in the cell switch command, the ue switches to the candidate cell for ltm by applying the valid timing advance.
Inventor(s): Kyoungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Kipyo NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W8/18, H04W36/00, H04W48/18
CPC Code(s): H04W36/08
Abstract: an electronic device is provided. the electronic device in an embodiment includes a subscriber identity module (sim) and at least one processor, comprising processing circuitry, electrically connected to the sim. at least one processor, individually and/or collectively, is configured to: detect a second cell based on a movement of the electronic device in a first cell of a network of a telecommunications carrier of the sim, recognize a 5g shared network based on at least a portion of system information of the second cell, determine whether the electronic device requires a 5g service in the 5g shared network, based on determining that the electronic device requires a service other than the 5g service, control the electronic device to be connected to a base station of the first cell, and based on determining that the electronic device requires the 5g service, control the electronic device to be connected to a base station of the 5g shared network.
Inventor(s): Shrinath Ramamoorthy Madhurantakam of Bengaluru (IN) for samsung electronics co., ltd., Sathia Chandrane Sundararaju of Bengaluru (IN) for samsung electronics co., ltd., Deepak Rajendran of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/36, H04W36/00, H04W36/30
CPC Code(s): H04W36/362
Abstract: a method for optimizing simultaneous conditional reconfiguration of a primary cell (pcell) and a primary secondary cell (pscell) for a user equipment (ue), includes: receiving, from a base station, a radio resource control (rrc) reconfiguration message comprising a conditional handover (cho) command and a conditional pscell addition or change (cpac) command for performing a reconfiguration of the pcell and a reconfiguration of the pscell, simultaneously, wherein the cho command comprises one or more first conditions to trigger the reconfiguration of the pcell, and wherein the cpac command comprises one or more second conditions to trigger the reconfiguration of the pscell; storing one or more reports capturing one or more metrics related to the simultaneous conditional reconfiguration of the pcell and the pscell upon receiving the rrc reconfiguration message; and transmitting, to the base station, the one or more reports for optimizing the one or more first conditions and the one or more second conditions.
Inventor(s): Deepanshu GAUTAM of Bangalore (IN) for samsung electronics co., ltd., Ashutosh KAUSHIK of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/02, H04W64/00, H04W84/04, H04W84/06
CPC Code(s): H04W48/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by an access and mobility management function (amf) entity in a wireless communication system is provided. the method comprises receiving, from a managed function entity, information on a non-terrestrial network (ntn) public land mobile network (plmn) restriction, wherein the information includes first information on an identity (id) of public land mobile network (plmn) and second information associated with a location for which an access of the plmn is restricted for an ntn access and restricting the ntn access associated with the location based on the first information and the second information.
Inventor(s): Hoyeon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongeun SUH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W48/18
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by an amf in a wireless communication system is provided. the method includes receiving, from a ue, requested nssai including a plurality of s-nssai, identifying whether each of the plurality of s-nssai is available, identifying a number of s-nssais included in an allowed nssai; in case that the number of s-nssais in the allowed nssai is less than a maximum number of s-nssais for the allowed nssai, determining to include alternative s-nssai for a first s-nssai that is not available, and in case that the number of s-nssais in the allowed nssai is at least equal to the maximum number of s-nssais for the allowed nssai, determining s-nssais for the allowed nssai based on whether the each of the plurality of s-nssai is associated with a pdu session.
Inventor(s): Donggun KIM of Chertsey (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W48/20, H04W76/19, H04W76/27
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5generation (5g) communication system or a 6generation (6g) communication system for supporting higher data rates beyond a 4generation (4g) communication system, such as long term evolution (lte). a method of managing execution failure of l1/l2 triggered mobility (ltm), in a user equipment (ue), communicatively coupled to a telecommunication network is provided. the method includes if an initial ltm execution attempt fails, performing, by the ue, cell selection, and if the selected cell is an ltm candidate cell and if the ue has been configured by the telecommunication network to attempt ltm after an ltm execution failure, the attempting, by ue, a further ltm execution.
Inventor(s): Arunprasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd., Sapan Pramodkumar SHAH of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W4/50, H04W84/18
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose methods for managing pemc switchover in pin by a first pemc entity. the method includes determining to relinquish a pemc role associated with the first pemc entity and transfer the pemc role to a second pemc entity upon detecting at least one event. further, the method includes sending a request message to the second pemc entity to transfer the pemc role to the second pemc entity based on the determination. further, the method includes receiving an accept message from the second pemc entity to transfer the pemc role associated with the first pemc entity based on the request message. the proposed method provides an efficient management of the personal iot network with better user experience.
Inventor(s): Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd., Varini GUPTA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/16
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide method for enforcing nssrg in eps by first network entity. the method includes receiving a pdn connection request with apn from ue. the method includes detecting whether any earlier pdn connection for ue is being handled by the first network entity or at least one second network entity. in an embodiment, when earlier pdn connection for the ue is handled by first network entity or the second network entity, the method includes applying nssrg information for the pdn connection, selecting a s-nssai from a plurality of s-nssais that is compatible to a s-nssai having same nssrg information from the plurality of s-nssais used to handle the earlier pdn connection by the network entity, and allocating the selected s-nssai to the ue to establish the pdn connection with the apn using allocated s-nssai.
Inventor(s): Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd., Youngkyo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W28/08, H04W28/16
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a fifth generation (5g) or a sixth generation (6g) communication system for supporting a higher data transmission rate. a method and an apparatus for supporting the use of lightweight heterogeneous networks in a wireless communication system are provided.
Inventor(s): Nishant . of Bangalore (IN) for samsung electronics co., ltd., Amit Anadrao DANGE of Bangalore (IN) for samsung electronics co., ltd., Vivek MURUGAIYAN of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Mohammad UMAIR of Bangalore (IN) for samsung electronics co., ltd., Gokul K of Bangalore (IN) for samsung electronics co., ltd., Nitesh Pushpak SHAH of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/20, H04W72/0453, H04W72/56, H04W76/27
CPC Code(s): H04W48/20
Abstract: a method, performed by a user equipment (ue) camping on a serving cell in a non-terrestrial network (ntn), for provisioning cell selection or reselection in the ntn, includes: receiving, by the ue from the serving cell, a first message comprising a first set of information; receiving, by the ue, a second message comprising a second set of information broadcasted by the serving cell, wherein the second set of information comprises information that is at least partially different from the first set of information; generating, by the ue, a cell selection or reselection list based on the first set of information and the second set of information, wherein the cell selection or reselection list comprises a plurality of candidate cells; and performing, by the ue, at least one network cell selection or reselection operation based on the cell selection or reselection list.
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W52/02
CPC Code(s): H04W52/0258
Abstract: a first station (sta) device in a wireless network, the first sta device comprising a memory and a processor coupled to the memory, the processor is configured to transmit, to a second sta, a first frame that includes a twt element comprising one or more target wake time (twt) parameters for establishing a twt agreement, wherein the first sta and the second sta are in a peer-to-peer (p2p) network, receive, from the second sta, a second frame that accepts the twt agreement, and establish the twt agreement between the first sta and the second sta.
Inventor(s): Pengru LI of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04B17/318, H04W36/06, H04W68/02
CPC Code(s): H04W56/0015
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method and an apparatus in a wireless communication system, the method including: receiving configuration information for a first signal; performing a radio resource management (rrm) measurement based on the first signal in a case that a reference signal received power and/or a reference signal received quality of the first signal is determined to satisfy a first condition based on the configuration information; and performing the rrm measurement based on a synchronization signal and physical broadcast channel block (ssb) in a case that the reference signal received power and/or the reference signal received quality of the first signal is determined not to satisfy the first condition based on the configuration information.
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Sidhant JAIN of Bangalore (IN) for samsung electronics co., ltd., Mahmoud WATFA of Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04W60/06, H04W36/08, H04W88/04
CPC Code(s): H04W60/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the embodiments herein provide a method of a network entity for handling a mobile base station relay (mbsr), the method comprising: identifying that an mbsr authorization state changes to not authorized; transmitting, to a base station, a first message including an authorization indication indicating that the mbsr authorization state is not authorized; receiving, from the base station, a second message including a first indication indicating that an operation for a non-authorized mbsr has completed; and performing a de-registration procedure with the mbsr in response to receiving the first indication.
Inventor(s): Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Amit Anandrao DANGE of Bangalore (IN) for samsung electronics co., ltd., Gokul K of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W60/06, H04W4/14, H04W48/18, H04W84/04, H04W84/06
CPC Code(s): H04W60/06
Abstract: a method performed by a user equipment (ue) for handling a non-terrestrial network (ntn) connection, includes: detecting at least one of: a presence of the ue in an ntn only coverage area, or a non-availability of a terrestrial network (tn) coverage at a location of the ue; determining an availability of an ntn; selecting the ntn for a registration of the ue; determining an absence of a voice-service support from the selected ntn, wherein the absence of the voice-service support indicates that the selected ntn does not support a voice service for the ue; performing at least one control action to avoid searching for the voice service during the registration of the ue on the ntn; and completing the registration of the ue on the ntn, based on the performed at least one control action.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W8/22
CPC Code(s): H04W64/00
Abstract: provided is a method by which a location server provides assistance information for location information measurement to a ue and the ue uses the assistance information to measure and obtain location information in a wireless communication system, the method including: transmitting an assistance data (ad) preconfiguration request message to a location server; receiving an ad provision message including validity information from the location server; receiving a location information request from the location server; and transmitting location information to the location server, based on the ad provision message including the validity information, wherein the validity information may include at least one of cell list information, beam list information, timer information or time window information.
Inventor(s): Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W8/22, H04W24/10
CPC Code(s): H04W64/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a location management function (lmf) entity, a request capabilities message, and transmitting, to the lmf entity, a provide capabilities message including capability information per band, wherein the capability information includes information on maximum aggregated downlink positioning reference signal (dl-prs) bandwidth (bw) and information on maximum number of aggregated dl-prs resources in a slot.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W72/23, H04W76/27
CPC Code(s): H04W68/02
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides a method and apparatus for paging transmission and reception, si window determination and ul carrier selection.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/04, H04W72/23, H04W76/27
CPC Code(s): H04W72/04
Abstract: the disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method and an apparatus for handling configured grant (cg) resource for small data transmission (sdt) are provided.
Inventor(s): Fang XIE of Beijing (CN) for samsung electronics co., ltd., Xinyan LI of Beijing (CN) for samsung electronics co., ltd., Jianwei XU of Beijing (CN) for samsung electronics co., ltd., Zhigang WANG of Beijing (CN) for samsung electronics co., ltd., Nan CAO of Beijing (CN) for samsung electronics co., ltd., Yunwei HUANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W52/02, H04W56/00, H04W72/0453, H04W72/566
CPC Code(s): H04W72/0446
Abstract: a method performed by a first network node in a communication system is provided. the method includes receiving, from one or more second network nodes, a first message related to each of the one or more second network nodes, the first message including information regarding an energy saving configuration of each of the one or more second network nodes, reconfiguring, based on the first message, time-frequency resources of at least one of the one or more second network nodes, and sending a second message to the at least one of the one or more second network nodes, the second message indicating the reconfigured time-frequency resources of the at least one of the one or more second network nodes.
Inventor(s): Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Mirette SADEK of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/0453, H04L5/00, H04L5/14, H04W72/0457, H04W72/51
CPC Code(s): H04W72/0453
Abstract: a system and a method are disclosed for ue operations in an sbfd operation mode. a method performed by a ue includes transmitting, to a base station, capability information for operating in an sbfd mode; receiving, from the base station, configuration information, based on the capability information, for ul signals and channels to be transmitted by the ue in a ul subband while receiving dl signals and channels within a dl subband; and based on the configuration information, performing at least one of setting a gap in a frequency domain between the dl subband and the ul subband, wherein each of the dl subband and the ul subband includes a set of rbs for reception and transmission, respectively; determining a dl signal and a ul signal that cannot be simultaneously received and transmitted, respectively; or managing a high si scenario.
Inventor(s): Ilsong SIM of Suwon-si (KR) for samsung electronics co., ltd., Gun KO of Gunpo-si (KR) for samsung electronics co., ltd., Won Woo RO of Seoul (KR) for samsung electronics co., ltd., Sangeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun MIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1263, H04W72/543
CPC Code(s): H04W72/1263
Abstract: a network scheduling device and method are disclosed. the scheduling method comprises: determining whether a set condition for a transmission time interval (tti) is satisfied, and, if the set condition is satisfied, storing in a memory, at each tti until the set tti elapses, a data array comprising the network state of the current tti, the scheduler type selected at the network state of the current tti, the network state of the next tti, and the actual compensation value for the network state of the current tti, and updating the parameters of the first neural network based on at least one of the data arrays stored in the memory, and, if the set condition is not satisfied, inputting the network state of the current tti to the first neural network and selecting a scheduler using the output of the first neural network based on the input network state of the current tti.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of McKinney TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/21, H04B17/318, H04L1/1812, H04W72/51
CPC Code(s): H04W72/21
Abstract: techniques for introducing physical uplink control channel (pucch) repetition capability for messages exchanged between a base station and ue are introduced. in an embodiment, a mechanism for introducing pucch repetition to a harq-ack feedback may be employed by sending the indication request in an uplink allocation prior to the pucch repetition being configured for the ue's harq signals. in one example, a ue allocates a request for pucch repetition with msg3 in a random access exchange, such that the base station can provide the harq feedback with its ensuing msg4 communication using pucch repetition.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04L5/00, H04W72/0446
CPC Code(s): H04W72/232
Abstract: apparatuses and methods for adaptation of monitoring for physical downlink control channels (pdcchs) in full-duplex (fd) systems. a method for a user equipment (ue) to receive pdcchs includes receiving first and second sets of parameters for reception of first and second pdcchs associated with first and second subset of slots, respectively. the method further includes receiving a first pdcch from the first pdcchs that provides a downlink control information (dci) format that includes a field indicating skipping receptions of the second pdcchs and skipping, based on the field, receptions of the second pdcchs in a slot from the second subset of slots at a first occasion that is after reception of the first pdcch and before an end of a time duration. the second subset of slots includes time-domain resources indicated for simultaneous transmission and reception and the first subset of slots does not.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/51, H04W52/02
CPC Code(s): H04W72/51
Abstract: methods and apparatuses for supporting target wake time operation for enhanced multi-link multi-radio operation. a method for wireless communication performed by a non-access point (ap) multi-link device (mld) that comprises stations (stas), the method comprising: forming a first enhanced multi-link multi-radio (emlmr) link for an emlmr mode of operation with a first ap of an ap mld; forming a second emlmr link for the emlmr mode of operation with a second ap of the ap mld; establishing a first restricted target wake time (r-twt) schedule that has an r-twt service period (sp) is established on the first emlmr link; determining that the non-ap mld is operating in the emlmr mode of operation with the ap mld; and determining, based on the r-twt sp, scheduling for traffic on the first emlmr link and the second emlmr link.
Inventor(s): Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Younsun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W64/00
CPC Code(s): H04W74/0833
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to various embodiments of the present disclosure, a method performed by a first transmission reception point (trp) in a wireless communication system comprises the steps of: transmitting, to a terminal, a first signal including information about one or more trps operating in a frequency band differing from that of the first trp; receiving, from the terminal, a random access preamble including information about at least one trp that is preferred by the terminal and determined on the basis of the first signal; transmitting a signal instructing the second trp to switch to a switch-on state if the first trp determines the second trp on the basis of the information about the at least one trp; and transmitting a signal instructing the terminal to perform a random access procedure with the second trp.
Inventor(s): Qi XIONG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Bin YU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W72/0446, H04W72/0453, H04W74/00, H04W74/08
CPC Code(s): H04W74/0841
Abstract: the disclosure provides methods and devices for confirming the resource configuration of uplink signal transmission. the method includes receiving, from a base station (bs), a synchronization signal and physical broadcasting channel (pbch) block (ssb); receiving, from the bs, information configuring a physical random access channel (prach) occasion; and transmitting, to the bs, an uplink signal on a resource set associated with the ssb.
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04W84/12, H04W88/04
CPC Code(s): H04W76/14
Abstract: a first station (sta) device in a wireless network, the first sta device comprising a memory and a processor coupled to the memory, the processor configured to transmit a first frame to a relay node that requests the relay node to perform a relay operation for a communication between the first sta and a second sta, receive a second frame from the relay node accepting the request to perform the relay operation for the communication between the first sta and the second sta, associate with the relay node based on the acceptance of the relay node to perform the relay operation, establish a relay link between the first sta and the relay node based on the association with the relay node, and communicate indirectly with the second sta via the relay link.
Inventor(s): Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04B17/318, H04W24/10, H04W76/11, H04W76/18, H04W84/04
CPC Code(s): H04W76/19
Abstract: a terminal for transmitting a signal in a wireless communication system is provided. the terminal includes a transceiver, and at least one processor configured to start a timer when a radio resource control (rrc) connection establishment procedure or an rrc connection resume procedure is initiated, identify that the timer is expired or that, while the timer is running, an integrity check failure indication is received from a lower layer, determine whether at least one of a first condition or a second condition is met, the first condition including a condition that the terminal has connection failure information available in an information container and a registered public land mobile network (plmn) does not correspond to a plmn identity included in the information container, and the second condition including a condition that a first cell identity of a current cell is not equal to a second cell identity stored in measurement result information about a cell where connection failure happened, in response to determining that at least one of the first condition or the second condition is met, set a count number about connection failure included in the information container to 0, and after determining whether at least one of the first condition or the second condition is met, clear contents included in the information container except for the count number about the connection failure.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04B17/318, H04W76/30, H04W76/40
CPC Code(s): H04W76/20
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to systems and methods for configuring and controlling state transitions of ues for nr mbs multicast service reception in an rrc inactive state. the methods include controlling state transitions based on one or more configured threshold parameters. the methods include providing an access category setting, and an access barring operation for performing an rrc resume procedure for receiving multicast in the rrc inactive state. further, the methods include performing an rrc resume procedure based on an sib1/sib24 scheduling status.
Inventor(s): Nobuharu NISHIKOORI of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): H05B6/12, H01F5/00
CPC Code(s): H05B6/1272
Abstract: an induction heating device includes an inverter circuit configured to drive heating coils. the induction heating device includes a coil board including a plurality of pattern layers on which heating coils are printed to form coil patterns. the coil patterns respectively formed on the plurality of pattern layers are electrically connected to each other, a first end of the coil patterns may be connected to an input terminal, and a second end of the coil patterns may be connected to an output terminal. at least one of the coil patterns branch in parallel at a branching point located between the input terminal and the output terminal, and join at a joining point located between the input terminal and the output terminal.
Inventor(s): Hyunwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Jae-Hyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunsik Kim of Suwon-si (KR) for samsung electronics co., ltd., Taijong Sung of Suwon-si (KR) for samsung electronics co., ltd., Young Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05H1/34
CPC Code(s): H05H1/3494
Abstract: a plasma torch includes a cathode, a pilot electrode disposed on a first outer circumference of the cathode and separated from an exterior surface of the cathode, an electrode protection member disposed below the pilot electrode and including a first insulator, an anode disposed on a second outer circumference of a process space and disposed below the pilot electrode, and a discharge gas flow path coupled to a separation gap formed between the exterior surface of the cathode and an inner surface of the pilot electrode. the discharge gas flow path is configured to supply a discharge gas.
Inventor(s): Hoyeon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Seongjun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwanghee RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungchul AN of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngjae KWON of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00, H05K5/02
CPC Code(s): H05K5/0017
Abstract: an electronic device is disclosed, including a hinge module, a first and second housing foldable about the hinge module, and a display spanning the housings. the display includes at least one polymer member, a flexible plate including a flexible portion that is bendable connecting first and second planar portions thereof. the flexible portion includes a plurality of support pieces spaced apart from each other via a plurality of slits, and a plurality of velcro patterns extending lengthwise from the plurality of support pieces. the velcro patterns of adjacent support pieces are disposed so as to be engaged with one another in a lattice form.
20250048570. DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongyeon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungmin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: a display device includes: a display panel; a rear chassis provided on a rear side of the display panel; a first frame in which the display panel is provided, and covering an upper border, a left border, and a right border of the display panel; a middle frame provided on a lower end of the display panel to be exposed to an outside, and comprising a plurality of hooks; and a second frame comprising an assembly groove assembled to the plurality of hooks, and provided in a bar shape to cover a lower border of the display panel by being assembled to the middle frame, where the plurality of hooks includes: a plurality of first hooks assembled to the assembly groove of the second frame, and a pair of second hooks provided at opposite ends of the middle frame and assembled to opposite ends of the first frame.
Inventor(s): Sooyeon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaehee KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, F16C11/04
CPC Code(s): H05K5/0226
Abstract: an electronic device includes: a first housing; a second housing; a hinge structure which pivotally connects the first housing and the second housing to each other; and a display which is disposed across the hinge structure, wherein the hinge structure includes: a hinge bracket which includes a rotary rail and a guide rail spaced apart from the rotary rail; a rotating member which includes a sliding pin and is coupled to the first housing; and a support member which includes a sliding opening and a guide groove, and supports one surface of the display.
Inventor(s): Sungjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Jungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongwoo MOON of Suwon-si (KR) for samsung electronics co., ltd., Chungwan CHU of Suwon-si (KR) for samsung electronics co., ltd., Hosoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/03, H05K5/02
CPC Code(s): H05K5/03
Abstract: an electronic device includes: a housing including a first housing, and a second housing connected to the first housing and configured to be movable with respect to the first housing; and a display assembly including a flat area connected to the housing, and a deformable area extending from the flat area and configured to be at least partially folded or rolled based on a movement relative to the housing, where the display assembly includes: a protective layer for protecting the display assembly from an external impact to the electronic device, the protective layer including a polymer film; a display panel configured to output an image; a glass disposed on the display panel; and an adhesive layer disposed between the glass and the polymer film, where a first area of the polymer film positioned in the flat area has a first thickness.
Inventor(s): Musul KIM of Suwon-si, (KR) for samsung electronics co., ltd., Sangchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungnyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20, G06F1/16, H05K5/00
CPC Code(s): H05K7/20972
Abstract: a wearable electronic device according to an embodiment may include: a housing disposed and configured to face a user's face, a first display including a display disposed inside the housing and configured to provide visual information to corresponding one of the user's eyes, a first heat dissipation fan disposed to at least partially face the first display and configured to discharge air inside the housing to an outside of the housing, a first heat conductive member comprising a thermally conductive material configured to absorb, dissipate, and/or move heat from the first display, a first heat dissipation fin provided at one end portion of the first heat conductive member and disposed on a movement path of the air discharged by the first heat dissipation fan, a second heat dissipation fan disposed to at least partially face the first display and configured to discharge the air inside the housing to the outside of the housing, a second heat conductive member comprising a thermally conductive material configured to absorb, dissipate, and/or move heat from the second display, and a second heat dissipation fin provided at one end portion of the second heat conductive member and disposed on a movement path of the air discharged by the second heat dissipation fan.
20250048617. CAPACITOR STRUCTURE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): BYEUNGMOO KANG of Suwon-si (KR) for samsung electronics co., ltd., SEOKHAN PARK of Suwon-si (KR) for samsung electronics co., ltd., KISEOK LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a capacitor structure may include a plurality of lower electrodes arranged in a first direction and a second direction perpendicular to the first direction, a supporter including a plurality of openings and adjoining the plurality of lower electrodes, a dielectric layer covering the supporter and the plurality of lower electrodes, and an upper electrode covering the dielectric layer, where each of the plurality of openings contacts four lower electrodes, and where the plurality of openings contact opposite sides of the plurality of lower electrodes along the first direction and the second direction.
Inventor(s): Yoongoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehong PARK of Suwon-si (KR) for samsung electronics co., ltd., Seokjae WON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/528
CPC Code(s): H10B12/482
Abstract: the present inventive concepts relate to semiconductor devices and methods for fabricating the same, and a semiconductor device according to some example embodiments includes: a substrate including an active region defined by a device isolation layer; a word line that crosses and overlaps the active region; a bit line crossing the active region in a direction different from the word line; a direct contact that connects the active region and the bit line and includes a metallic material; a buried contact connected to the active region; and a bit line spacer between the bit line and the buried contact, wherein a width of the direct contact is different from that of the bit line, and the bit line spacer is on an upper surface of the direct contact.
Inventor(s): Sunghwan JANG of Suwon-si (KR) for samsung electronics co., ltd., Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyojin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunguk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H10B12/488
Abstract: a semiconductor memory device includes: a plurality of word lines extending in a first direction; a plurality of channel layers alternately arranged with the word lines, wherein the channel layers extend in a second direction; and a plurality of bit lines located on the word lines and the channel layers, and extending in a third direction. the bit lines are electrically connected to the channel layers. the plurality of word lines include: a plurality of selected word lines to which a positive voltage is applied; and a plurality of non-selected word lines to which a negative voltage is applied. the plurality of channel layers include: a selected channel layer that is turned on; and a non-selected channel layer that is turned off.
20250048622. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyun Geun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kyung Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Joong Chan SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor memory device may include includes a bit line and a back gate strap line extending on a substrate, an active pattern on the bit line and the back gate strap line, a word line on a first side wall of the active pattern, a back gate electrode on a second side wall of the active pattern and connected to the back gate strap line, a data storage pattern connected to a face of the active pattern, and a word line contact plug connected to the word line. a first face of the back gate electrode and a first face of the word line may face the bit line and the back gate strap line. the first face of the back gate electrode may be connected to the back gate strap line. a second face of the word line may be connected to the word line contact plug.
Inventor(s): Jaehyeok Heo of Suwon-si (KR) for samsung electronics co., ltd., Kyoung-Ho Kim of Suwon-si (KR) for samsung electronics co., ltd., Hojun Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungsu Moon of Suwon-si (KR) for samsung electronics co., ltd., Sea Hoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk Lee of Suwon-si (KR) for samsung electronics co., ltd., Junhee Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B43/10, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: disclosed are semiconductor devices and electronic systems including the same. the semiconductor device includes a substrate that has a recess region, a gate electrode on a bottom surface of the recess region, a gate dielectric layer between the gate electrode and the bottom surface of the recess region, a plurality of shield electrodes on laterally opposite sides of the gate electrode and on inner sidewalls of the recess region, a plurality of dielectric patterns between the shield electrodes and the inner sidewalls of the recess region, a plurality of impurity regions in the substrate and on opposite sides of the shield electrodes, and a channel region in the substrate and below the bottom surface of the recess region.
Inventor(s): JOONYOUNG KWON of Suwon-si (KR) for samsung electronics co., ltd., JIYOUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., JUNHYOUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., SUKKANG SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: the present disclosure relates to three-dimensional (3d) semiconductor memory devices and electronic systems. an example 3d semiconductor memory device comprises a peripheral circuit structure on a peripheral substrate, a stack structure that includes a plurality of gate electrodes stacked on the peripheral circuit structure, an n-doped pattern on the stack structure, a vertical structure that extends through the stack structure into the n-doped pattern, a p-doped pattern on the n-doped pattern, and an undoped pattern between the n-doped pattern and then p-doped pattern. the p-doped pattern includes a p-doped horizontal pattern on the undoped pattern, and a p-doped vertical pattern that extends through the undoped pattern and the n-doped pattern and that contacts with the vertical structure.
Inventor(s): Jiyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonyoung Kwon of Suwon-si (KR) for samsung electronics co., ltd., Siwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device including a cell array structure and a peripheral circuit structure is provided. the cell array structure includes a first stack structure, a second stack structure on the first stack structure, and a third stack structure on the second stack structure, each of the first to third stack structures including a plurality of word lines, vertical channel structures extending into the first to third stack structures, and a second cell contact plug extending into the first to third stack structures and connected to a second contact plug at an end of a second word line in the second stack structure. the second cell contact plug includes a first horizontal protrusion having a horizontal width that increases discontinuously at a connection portion of the first stack structure and the second stack structure.
Inventor(s): Juhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisung KIM of Suwon-si (KR) for samsung electronics co., ltd., Chaeho KIM of Suwon-si (KR) for samsung electronics co., ltd., Youjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangmin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B43/10, H10B43/35, H10B43/40, H10B51/10, H10B51/20, H10B51/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device may include a stack structure including interlayer insulating layers and gate electrodes alternately stacked in a vertical direction; a vertical pillar in a hole penetrating through the stack structure, the vertical pillar including a channel layer; and protrusions between the vertical pillar and the gate electrodes. the protrusions may be spaced apart from each other in the vertical direction. the protrusions may include a first data storage layer, a second data storage layer between the first data storage layer and the channel layer, and a first conductive layer in contact with a first side surface of the second data storage layer. a material of the second data storage layer may be from a material of the first data storage layer.
Inventor(s): Bumkyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/35, H10B41/27, H10B41/35, H10B43/27
CPC Code(s): H10B43/35
Abstract: a semiconductor device includes a first semiconductor structure including a substrate, circuit elements, and circuit interconnection lines, and a second semiconductor structure on the first semiconductor structure. the second semiconductor structure includes a plate layer, first gate electrodes stacked on the plate layer and spaced apart from each other in a first direction, separation regions penetrating through the first gate electrodes and extending in a second direction, first channel structures spaced apart from the separation regions in a third direction, penetrating through the first gate electrodes, and extending in the first direction, and dummy structures contacting the separation regions, penetrating through the first gate electrodes, and extending in the first direction. the first channel structures and the dummy structures respectively have a circular shape in plan view, and the separation regions are in contact with at least portions of respective side surfaces of the dummy structures.
Inventor(s): HAKSEON KIM of Suwon-si (KR) for samsung electronics co., ltd., KANG-OH YUN of Suwon-si (KR) for samsung electronics co., ltd., DONGJIN LEE of Suwon-si (KR) for samsung electronics co., ltd., YOUNGROK KIM of Suwon-si (KR) for samsung electronics co., ltd., RYOONGBIN LEE of Suwon-si (KR) for samsung electronics co., ltd., JAEDUK LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C16/24, H10B43/27
CPC Code(s): H10B43/40
Abstract: disclosed are a semiconductor device and an electronic system including the semiconductor device. the semiconductor device includes a semiconductor substrate including a plurality of trenches and silicon, a gate electrode positioned on the semiconductor substrate and between the trenches, and a source region and a drain region respectively positioned within the trenches. the source region and the drain region include silicon carbide (sic) or gallium nitride (gan), the source region and the drain region each includes a first lightly doped region and a second lightly doped region, and a whole of the first lightly doped region overlaps the second lightly doped region in a direction perpendicular to an upper surface of the semiconductor substrate.
20250048639. NON-VOLATILE MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hakseon Kim of Suwon-si (KR) for samsung electronics co., ltd., Kangoh Yun of Suwon-si (KR) for samsung electronics co., ltd., Dongjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Youngrok Kim of Suwon-si (KR) for samsung electronics co., ltd., Ryoongbin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/27, H10B41/41, H10B43/27
CPC Code(s): H10B43/40
Abstract: a non-volatile memory device includes a peripheral circuit and a memory cell array that are sequentially stacked. the peripheral circuit includes, a device isolation layer defining an active region within a substrate, a first gate electrode extending in a first horizontal direction on the active region, an insulating pattern in a first recess and a second recess spaced apart in a second horizontal direction within the active region on opposing sides of the first gate electrode, a first low concentration doped region along an outer wall of the first recess, a second low concentration doped region along an outer wall of the second recess, a first source/drain region buried in the first low concentration doped region, and a second source/drain region buried in the second low concentration doped region.
Inventor(s): Il Ho MYEONG of Suwon-si (KR) for samsung electronics co., ltd., Su Seong NOH of Suwon-si (KR) for samsung electronics co., ltd., Seung Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Sang Woo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/30
CPC Code(s): H10B51/20
Abstract: a semiconductor memory device includes a substrate, a mold structure including a plurality of gate electrodes and a plurality of mold insulating films alternately stacked on the substrate, a channel structure extending in a first direction and penetrating the mold structure, the channel structure including a semiconductor pattern and a ferroelectric film between the semiconductor pattern and the plurality of gate electrodes, a channel pad on the channel structure, and a bit line contact connected to the channel pad, wherein an uppermost part of the ferroelectric film protrudes beyond an uppermost gate electrode among the plurality of gate electrodes, the channel pad includes a first portion in contact with the semiconductor pattern and a second portion in contact with the first portion and the bit line contact, the first portion has a first width, and the second portion has a second width greater than the first width.
Inventor(s): Suseong Noh of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo Han of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Ilho Myeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/30, H10B51/40
CPC Code(s): H10B51/20
Abstract: the present disclosure relates to a semiconductor device and a data storage system including the device. the semiconductor device has a substrate including a cell array region and a contact region. in the cell array region the semiconductor device has a first horizontal conductive layer, a gate stacking structure including a plurality of interlayer insulating layers and a plurality of gate electrodes alternately stacked on the substrate. a channel structure extends in a direction crossing into the substrate by penetrating the gate stacking structure in the cell array region, and includes a channel layer connected to the substrate. surrounding the channel layer is a ferroelectric layer. the first horizontal conductive layer is not in direct contact with the channel layer due to a dummy pattern positioned on the first horizontal conductive layer and disposed between the substrate and the ferroelectric layer.
20250048650. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seulji SONG of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KO of Suwon-si (KR) for samsung electronics co., ltd., Hodae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00
CPC Code(s): H10B63/24
Abstract: a semiconductor device includes first and second conductive lines respectively extending in first and second directions on a substrate. cell structures are respectively between the first and second conductive lines and include first and second electrodes and a selector layer. first capping layers cover side surfaces of the first conductive lines and first side surfaces of the cell structures in the second direction. first interlayer insulating layers fill spaces between the first conductive lines and between the cell structures in the second direction and contact the first capping layers. second capping layers cover second side surfaces of the cell structures in the first direction and side surfaces of the second conductive lines. second interlayer insulating layers fill spaces between the cell structures and between the second conductive lines in the first direction and contact the second capping layers. the first and second interlayer insulating layers have different carbon contents.
20250048655. SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bonjae KOO of Suwon-si (KR) for samsung electronics co., ltd., Seulji Song of Suwon-si (KR) for samsung electronics co., ltd., Youngsun Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B99/00
CPC Code(s): H10B99/10
Abstract: provided is a semiconductor memory device including: cell blocks, each including a folding structure in which electrode structures and insulating structures are alternately provided, wherein the electrode structures and the insulating structures extend in a vertical direction and are connected with each other so as to have at least two u-shaped structures forming villus shapes in a plan view, the electrode structures include a vertical electrode and a switching material layer, and the cell blocks are provided in a first horizontal direction and a second horizontal direction intersecting the first horizontal direction; and a gate stack structure including gate electrodes and interlayer insulating layers that are alternately stacked in the vertical direction along sidewalls of the electrode structures.
Inventor(s): KI HWAN KIM of Sueon-si (KR) for samsung electronics co., ltd., Unki Kim of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Yoo of Suwon-si (KR) for samsung electronics co., ltd., Ingyu Jang of Suwon-si (KR) for samsung electronics co., ltd., Sujin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L29/0847
Abstract: a semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a first semiconductor pattern, a second semiconductor pattern, and a third semiconductor pattern sequentially stacked and vertically spaced apart, a source/drain pattern on the active pattern, and a gate electrode on the first semiconductor pattern, the second semiconductor pattern, and the third semiconductor pattern, where the source/drain pattern includes a buffer layer and a main layer on the buffer layer, the main layer includes silicon that is doped with an impurity, an impurity concentration of the main layer is a first atomic fraction at a first level corresponding to the first semiconductor pattern, and the impurity concentration of the main layer is a second atomic fraction at a second level corresponding to the second semiconductor pattern.
Inventor(s): Junghyun OH of Suwon-si (KR) for samsung electronics co., ltd., Jungkyung KIM of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L27/092, H01L29/423, H01L29/786
CPC Code(s): H01L29/0847
Abstract: a semiconductor device includes a gate structure disposed on a substrate and extending along a first direction that is substantially parallel to an upper surface of the substrate, first and second impurity regions disposed on portions of the substrate at opposite sides of the gate structure along a second direction that is substantially parallel to the upper surface of the substrate, the first and second impurity regions being substantially perpendicular to each other, wherein the first and second impurity regions are each doped with n-type impurities, a third impurity region disposed on a portion of the substrate adjacent to the first impurity region along the second direction, wherein the third impurity region is doped with p-type impurities, a fourth impurity region disposed on a portion of the substrate adjacent to the first impurity region along the first direction, wherein the fourth impurity region is connected to the third impurity region and is doped with p-type impurities and a wiring structure disposed on the gate structure, wherein the wiring structure includes wirings that are disposed on a plurality of different levels. the fourth impurity region does not overlap a first one of the wirings along a vertical direction that is substantially perpendicular to the upper surface of the substrate. the first one of the wirings is disposed at an uppermost level among the plurality of different levels.
Inventor(s): Ki Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Unki KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongho YOO of Suwon-si (KR) for samsung electronics co., ltd., Ingyu JANG of Suwon-si (KR) for samsung electronics co., ltd., Sujin JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H01L29/08, H01L29/423
CPC Code(s): H01L29/1033
Abstract: a semiconductor device includes a substrate including an active pattern, a channel pattern and a source/drain pattern on the active pattern wherein the channel pattern includes semiconductor patterns vertically stacked and spaced apart from each other, the plurality of semiconductor patterns including a first semiconductor pattern and a neighboring second semiconductor pattern, and a gate electrode on the semiconductor patterns. the gate electrode includes an inner electrode between the first and second semiconductor patterns. the source/drain pattern includes a buffer layer and a main layer on the buffer layer. an indent region is defined in a vertical cross section of the device by the main layer, the first and second semiconductor patterns, and the inner electrode. the buffer layer is in the indent region. the buffer layer does not extend onto sidewalls of the first and second semiconductor patterns.
20250048707. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donghoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L23/528, H10B12/00
CPC Code(s): H01L29/6656
Abstract: a semiconductor device comprising: a substrate; a plurality of gate structures on the substrate, wherein the plurality of gate structures includes a first gate structure and a second gate structure that is adjacent the first gate structure; spacer structures on opposite sidewalls of the first gate structure; wherein the spacer structures comprise: insulating spacers on the opposite sidewalls of the first gate structure; an inner protective layer on the insulating spacers and an upper surface of the first gate structure; and an outer protective layer on at least a portion of the inner protective layer, an insulating filling layer on the spacer structures, wherein the insulating filling layer is between the first gate structure and the second gate structure; and an upper capping layer on an upper surface of the insulating filling layer, wherein the upper capping layer includes a same material as the insulating filling layer.
Inventor(s): Hokyun AN of Suwon-si (KR) for samsung electronics co., ltd., Kibum LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungmin CHO of Suwon-si (KR) for samsung electronics co., ltd., Sunggyu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/8238, H01L21/225, H01L21/265, H01L21/324
CPC Code(s): H01L21/823821
Abstract: a method of manufacturing a semiconductor device includes forming, on a substrate, a semiconductor material layer including germanium, forming a diffusion material layer in an upper portion of the substrate adjacent to the semiconductor material layer by performing a first heat treatment on the semiconductor material layer, removing the semiconductor material layer, recrystallizing the diffusion material layer by performing a second heat treatment on the diffusion material layer, and forming a fin-type structure by removing at least a portion of the substrate and at least a portion of the diffusion material layer. the diffusion material layer includes germanium diffused from the semiconductor material layer. a germanium concentration in the fin-type structure decreases from an upper surface of the fin-type structure toward a lower surface of the fin-type structure along a vertical direction perpendicular to a top surface of the substrate.
20250048723. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sutae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L23/48, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L27/088
Abstract: a semiconductor device includes a substrate having first and second surfaces; an active pattern extending on the first surface of the substrate, the active pattern having first and second conductivity-type impurity regions, the first and second conductivity-type impurity regions in contact with each other; semiconductor patterns stacked on a portion of the active pattern between the first and second conductivity-type impurity regions; an inactive gate structure extending across the portion of the active pattern between the first and second conductivity-type impurity regions, the inactive gate structure surrounding the semiconductor patterns; a first contact passing through the substrate from the second surface of the substrate and connected to the first conductivity-type impurity region; and a second contact passing through the substrate from the second surface of the substrate and connected to the second conductivity-type impurity region.
20250048727. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): CHANGHUN KIM of Suwon-si (KR) for samsung electronics co., ltd., JAEICK SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L29/06, H01L29/423, H01L29/66
CPC Code(s): H01L27/0921
Abstract: a semiconductor device includes a first substrate doped with an impurity of a first conductivity-type, a first well region formed in the first substrate and doped with an impurity of a second conductivity-type, different from the first conductivity-type, a first guard band that extends in a first direction, parallel to an upper surface of the substrate, is in the first well region, and doped with an impurity of the second conductivity-type, a second guard band facing the first guard band, in the substrate, and doped with an impurity of the first conductivity-type, a first electrode structure electrically connected to the first guard band, a second electrode structure electrically connected to the second guard band, and a first insulating layer on sidewalls of the first electrode structure and the second electrode structure, the first electrode structure, the insulating layer, and the second electrode structure provide a capacitor.
Inventor(s): Sangyun LEE of Yongin-si (KR) for samsung electronics co., ltd., Sookyoung ROH of Yongin-si (KR) for samsung electronics co., ltd., Seokho YUN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14645
Abstract: an image sensor includes: a sensor substrate including a first pixel and a second pixel; and a color separating lens array for condensing light of first wavelength onto the first pixel by changing a phase of light of the first wavelength included in incident light, wherein the sensor substrate further includes: an active pixel area for outputting an active pixel signal for image generation; a first dummy pixel area arranged outside the active pixel area and outputting a dummy pixel signal to correct image data generated from the active pixel signal; and a second dummy pixel area arranged outside the active pixel area and the first dummy pixel area and not outputting any pixel signal.
Inventor(s): Hyungeun Yoo of Suwon-si (KR) for samsung electronics co., ltd., Dongmin Keum of Suwon-si (KR) for samsung electronics co., ltd., Jung-Saeng Kim of Suwon-si (KR) for samsung electronics co., ltd., Bumsuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Yun Ki Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/77, H04N25/78
CPC Code(s): H01L27/14603
Abstract: an image sensor is provided. the image sensor image sensor includes: a first pixel group including a first pixel, a second pixel, a third pixel and a fourth pixel; a second pixel group including a fifth pixel, a sixth pixel, a seventh pixel and an eighth pixel, wherein the second pixel group is provided adjacent to the first pixel in a first direction; a first lens corresponding to the first pixel and the second pixel; a second lens corresponding to the third pixel and the fourth pixel; a device isolation pattern electrically isolating the first pixel group from the second pixel group; and a readout circuit configured to: output phase data based on at least a portion of phase signals received from the first pixel group; and output image data based on at least a portion of color signals received from the second pixel group.
Inventor(s): Choonlae CHO of Suwon-si (KR) for samsung electronics co., ltd., Hongkyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungho CHA of Suwon-si (KR) for samsung electronics co., ltd., Sookyoung ROH of Suwon-si (KR) for samsung electronics co., ltd., Sangeun MUN of Suwon-si (KR) for samsung electronics co., ltd., Sungmo AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14627
Abstract: provided is an image sensor including a sensor substrate including a plurality of pixels configured to sense light, and a nano-photonic lens array configured to separate incident light based on color and condense the separated incident light onto the plurality of pixels, wherein the nano-photonic lens array includes a plurality of supercells two-dimensionally disposed and including first unit patterns and second unit patterns, respectively including a plurality of pixel corresponding regions corresponding to the plurality of pixels, and wherein each of the plurality of pixel corresponding regions includes a plurality of nano-structures configured to separate the incident light based on color and condense the incident light onto the plurality of pixels, and wherein a cross-sectional size or a cross-sectional shape of a first nano-structure is different from a cross-sectional size or a cross-sectional shape of a second nano-structure.
Inventor(s): Joonyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Seogwoo Hong of Yongin-si (KR) for samsung electronics co., ltd., kyungwook Hwang of Seoul (KR) for samsung electronics co., ltd., Hyunjoon Kim of Seoul (KR) for samsung electronics co., ltd., Junsik Hwang of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/00, H01L27/15, H01L33/62
CPC Code(s): H01L33/005
Abstract: provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (leds) to a plurality of wells of an interposer through a fluidic self assembly (fsa) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro leds and the plurality of wells, and a fourth operation of transferring the plurality of micro leds to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.
Inventor(s): Sanghyun SOHN of Suwon-si (KR) for samsung electronics co., ltd., Yeseul Park of Suwon-si (KR) for samsung electronics co., ltd., Sungjun Koh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L33/52
CPC Code(s): H01L33/502
Abstract: a display device includes a lower substrate comprising at least one light-emitting diode (led) light source, an upper substrate comprising at least one quantum dot color filter, and a bonding layer configured to bond the lower substrate and the upper substrate. the upper substrate may include a partition wall structure including least one sub-rod is repeatedly provided in an edge area of a partition wall layer.
Inventor(s): Junghoon YOON of Suwon-si (KR) for samsung electronics co., ltd., Wonyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hochul LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/58, H01L23/00, H01L25/075
CPC Code(s): H01L33/58
Abstract: a display apparatus includes: a substrate; and a plurality of light emitting diode (led) elements disposed on the substrate in a matrix form, wherein the plurality of led elements includes: a first led element including a first light emitting layer, a second led element including a second light emitting layer, and a third led element including a third light emitting layer, wherein the first led element, the second led element, and the third led element are disposed in a column direction of the plurality of led elements, and constitute one pixel together, and wherein the first light emitting layer, the second light emitting layer, and the third light emitting layer respectively comprises a first weak light-emitting area, a second weak light-emitting area, and a third weak light-emitting area that are aligned in a line in the column direction.
Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd.
- A01D34/00
- A01D101/00
- CPC A01D34/008
- Samsung electronics co., ltd.
- A44C5/14
- CPC A44C5/14
- A46B17/06
- A46B13/00
- B08B1/52
- B08B3/12
- H01L21/67
- CPC A46B17/06
- A47L9/28
- A47L11/40
- CPC A47L9/2826
- A63B24/00
- CPC A63B24/0062
- B01D53/84
- B01D53/56
- C12N1/20
- C12N9/06
- C12N9/12
- C12N15/70
- CPC B01D53/84
- B24D7/06
- B24D18/00
- CPC B24D7/06
- C02F9/00
- C02F1/00
- C02F1/02
- C02F1/44
- C02F1/70
- C02F101/14
- C02F101/16
- C02F103/34
- CPC C02F9/00
- C08F120/28
- G03F7/004
- G03F7/20
- CPC C08F120/28
- C09G1/02
- B24B57/02
- C09K3/14
- CPC C09G1/02
- C09K11/06
- H10K50/11
- H10K50/15
- H10K50/16
- H10K85/30
- CPC C09K11/06
- G01N21/94
- A47L9/04
- G01N21/55
- CPC G01N21/94
- G01R31/28
- G01R31/311
- CPC G01R31/2893
- G01R31/317
- G01R31/319
- CPC G01R31/31721
- G01S7/41
- G01S13/10
- G06F3/01
- CPC G01S7/415
- G02B1/00
- CPC G02B1/005
- G02B13/00
- G02B9/60
- G02B30/00
- CPC G02B13/0045
- G03F7/09
- G03F7/095
- CPC G03F7/094
- G03F7/00
- CPC G03F7/705
- G04G13/02
- G01S5/02
- CPC G04G13/021
- G04G21/02
- H01S5/50
- CPC G04G21/02
- G06F1/12
- CPC G06F1/12
- G06F1/16
- CPC G06F1/1624
- G06F1/26
- CPC G06F1/26
- G06F3/041
- G06F3/044
- CPC G06F3/016
- G06F3/06
- CPC G06F3/061
- G06F3/16
- CPC G06F3/165
- G06F9/30
- CPC G06F9/30149
- G06F9/48
- G06F11/34
- CPC G06F9/4881
- G06F9/50
- G06F1/324
- CPC G06F9/5016
- CPC G06F9/5027
- G06F11/07
- CPC G06F11/0793
- G06F12/02
- CPC G06F12/0223
- G06F13/16
- CPC G06F12/0246
- G06F13/24
- CPC G06F13/24
- G06F21/32
- G06V10/74
- G06V10/77
- G06V10/82
- G06V40/16
- G06V40/40
- CPC G06F21/32
- G06N3/0442
- G06N3/063
- CPC G06N3/0442
- G06N3/045
- CPC G06N3/045
- G06N10/20
- G06N10/80
- CPC G06N10/20
- G06T3/40
- G06T5/00
- H04N23/84
- CPC G06T3/4038
- G06T5/60
- G06T5/70
- H04N23/95
- CPC G06T5/60
- G06T3/4046
- G06T3/4053
- G06T5/20
- G06T5/50
- G06T7/00
- G06T7/194
- CPC G06T5/70
- G06T7/70
- CPC G06T7/001
- G06T19/00
- G06F3/0362
- G06T7/20
- G06V20/20
- CPC G06T19/006
- G06F3/0487
- G06T13/00
- G06V20/40
- CPC G06V10/82
- G06V40/20
- A63F13/213
- A63F13/428
- G06V10/75
- CPC G06V40/28
- G09G3/32
- CPC G09G3/32
- G09G5/00
- G09G5/22
- CPC G09G5/005
- G10L19/032
- G10L19/002
- G10L19/008
- G10L19/20
- G10L19/24
- CPC G10L19/032
- G11C7/22
- G11C7/10
- CPC G11C7/227
- G11C11/418
- G11C11/419
- CPC G11C11/418
- H01J37/32
- CPC H01J37/32917
- H01L21/02
- H01L21/027
- CPC H01L21/02348
- H01L21/3115
- H01L21/033
- H01L21/311
- H01L21/3213
- CPC H01L21/31155
- H01L21/3065
- CPC H01L21/67069
- H01L21/687
- CPC H01L21/67259
- H01L21/66
- H01L21/78
- H01L23/00
- CPC H01L22/32
- H01L23/31
- H01L23/64
- CPC H01L23/3121
- H01L23/498
- H01L23/522
- H01L25/00
- H01L25/065
- CPC H01L23/49822
- H01L23/538
- CPC H01L23/49838
- H01L21/48
- H01L21/56
- H01L25/10
- CPC H01L23/5383
- H01L25/16
- H10B80/00
- CPC H01L23/5386
- H01L23/544
- CPC H01L23/544
- H01L23/66
- H01L21/683
- H01Q9/04
- H01Q19/00
- CPC H01L23/66
- CPC H01L24/08
- H01L23/367
- CPC H01L24/29
- H01L21/304
- H01L21/306
- H01L25/18
- CPC H01L24/32
- B23K1/00
- B23K1/015
- B23K3/047
- B23K3/08
- B23K101/40
- CPC H01L24/75
- H01L23/42
- H01L23/48
- CPC H01L25/0652
- H01L23/13
- CPC H01L25/0655
- H01L23/373
- CPC H01L25/0657
- CPC H01L25/105
- H01M50/574
- H01M50/247
- H01M50/287
- CPC H01M50/574
- H02H9/04
- CPC H02H9/046
- H03K3/011
- H03K3/03
- CPC H03K3/011
- H04B1/04
- H04B17/10
- CPC H04B1/0458
- H04B1/40
- CPC H04B1/40
- H04B7/0413
- H04B7/06
- CPC H04B7/0413
- H04B7/0417
- H04W24/10
- CPC H04B7/0417
- H01Q21/24
- H04B1/401
- CPC H04B7/061
- H04W24/08
- H04W72/1268
- H04W72/51
- CPC H04B7/0626
- H04B7/08
- H04W72/23
- CPC H04B7/06966
- H04L5/00
- CPC H04B7/088
- H04B17/336
- H04L5/14
- CPC H04B17/336
- H04L25/02
- H04W72/0446
- H04W80/02
- CPC H04L25/0226
- H04L27/26
- H04J11/00
- H04L27/00
- CPC H04L27/2643
- H04L47/2441
- H04L47/2408
- H04L47/2416
- H04L47/2425
- CPC H04L47/2441
- H04L9/40
- CPC H04L63/08
- H04M1/02
- H05K1/14
- CPC H04M1/0277
- H04M1/72412
- CPC H04M1/72412
- H04M1/72454
- H04W8/18
- CPC H04M1/72454
- H04N19/119
- H04N19/129
- H04N19/139
- H04N19/176
- CPC H04N19/119
- H04N19/137
- H04N19/105
- H04N19/13
- H04N19/159
- H04N19/46
- CPC H04N19/137
- H04N19/513
- CPC H04N19/139
- H04N19/573
- CPC H04N19/159
- H04N19/184
- H04N19/70
- CPC H04N19/513
- H04N19/523
- H04N19/103
- CPC H04N19/523
- H04N21/422
- G08C17/00
- H04N21/431
- H04N21/47
- CPC H04N21/42204
- H04N23/611
- H04N23/63
- H04N23/667
- CPC H04N23/611
- H04N23/67
- CPC H04N23/671
- H04N25/71
- H04N5/06
- H04N25/701
- CPC H04N25/745
- H04N25/77
- H03M1/12
- CPC H04N25/77
- H04N25/771
- H04N9/64
- H04N25/40
- H04N25/60
- CPC H04N25/771
- H04R1/10
- H04R1/04
- H04R1/08
- CPC H04R1/1075
- H04R1/40
- H04R3/14
- CPC H04R1/403
- H04S7/00
- H04R29/00
- CPC H04S7/301
- H04W12/043
- H04W12/106
- H04W76/20
- CPC H04W12/043
- H04W12/06
- H04W76/30
- CPC H04W12/06
- H04W24/02
- H04W72/20
- CPC H04W24/02
- H04L41/0803
- CPC H04W24/10
- H04W36/00
- H04W56/00
- CPC H04W36/0072
- H04W36/08
- H04W48/18
- CPC H04W36/08
- H04W36/36
- H04W36/30
- CPC H04W36/362
- H04W48/02
- H04W64/00
- H04W84/04
- H04W84/06
- CPC H04W48/02
- H04W48/16
- CPC H04W48/16
- H04W48/20
- H04W76/19
- H04W76/27
- H04W4/50
- H04W84/18
- CPC H04W48/18
- H04W28/08
- H04W28/16
- H04W72/0453
- H04W72/56
- CPC H04W48/20
- H04W52/02
- CPC H04W52/0258
- H04B17/318
- H04W36/06
- H04W68/02
- CPC H04W56/0015
- H04W60/06
- H04W88/04
- CPC H04W60/06
- H04W4/14
- H04W8/22
- CPC H04W64/00
- CPC H04W68/02
- H04W72/04
- CPC H04W72/04
- H04W72/566
- CPC H04W72/0446
- H04W72/0457
- CPC H04W72/0453
- H04W72/1263
- H04W72/543
- CPC H04W72/1263
- H04W72/21
- H04L1/1812
- CPC H04W72/21
- H04W72/232
- CPC H04W72/232
- CPC H04W72/51
- H04W74/0833
- CPC H04W74/0833
- H04W74/00
- H04W74/08
- CPC H04W74/0841
- H04W76/14
- H04W84/12
- CPC H04W76/14
- H04W76/11
- H04W76/18
- CPC H04W76/19
- H04W76/40
- CPC H04W76/20
- H05B6/12
- H01F5/00
- CPC H05B6/1272
- H05H1/34
- CPC H05H1/3494
- H05K5/00
- H05K5/02
- CPC H05K5/0017
- CPC H05K5/0217
- F16C11/04
- CPC H05K5/0226
- H05K5/03
- CPC H05K5/03
- H05K7/20
- CPC H05K7/20972
- H10B12/00
- CPC H10B12/315
- H01L23/528
- CPC H10B12/482
- H01L29/06
- H01L29/423
- H01L29/775
- H01L29/786
- CPC H10B12/488
- CPC H10B12/50
- H10B43/27
- H10B43/10
- H10B43/35
- H10B43/40
- CPC H10B43/27
- H10B41/10
- H10B41/27
- H10B41/35
- H10B41/40
- H10B51/10
- H10B51/20
- H10B51/40
- CPC H10B43/35
- G11C16/24
- CPC H10B43/40
- H10B41/41
- H10B51/30
- CPC H10B51/20
- H10B63/00
- CPC H10B63/24
- H10B99/00
- CPC H10B99/10
- H01L29/08
- H01L29/66
- CPC H01L29/0847
- H01L27/092
- H01L29/10
- CPC H01L29/1033
- CPC H01L29/6656
- H01L21/8238
- H01L21/225
- H01L21/265
- H01L21/324
- CPC H01L21/823821
- H01L27/088
- H01L29/417
- CPC H01L27/088
- CPC H01L27/0921
- H01L27/146
- CPC H01L27/14645
- H04N25/78
- CPC H01L27/14603
- CPC H01L27/14627
- H01L33/00
- H01L27/15
- H01L33/62
- CPC H01L33/005
- H01L33/50
- H01L33/52
- CPC H01L33/502
- H01L33/58
- H01L25/075
- CPC H01L33/58
