Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on February 29th, 2024
Samsung Electronics Co., Ltd.: 249 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (23), H10B80/00 (19), H01L24/16 (17), H01L23/498 (17), H10B43/27 (15)
With keywords such as: device, layer, based, configured, including, memory, substrate, semiconductor, electronic, and data in patent application abstracts.
See the following report for Samsung Electronics Co., Ltd. patent applications published on February 29th, 2024:
Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Ngoc Duc NGUYEN of Hanoi City (VN) for samsung electronics co., ltd., The Nghia NGUYEN of Hanoi City (VN) for samsung electronics co., ltd., Van Khanh NGUYEN of Hanoi City (VN) for samsung electronics co., ltd., Thi Tam TRUONG of Hanoi City (VN) for samsung electronics co., ltd.
IPC Code(s): H04M1/2757, H04L65/1104, H04W12/06
Abstract: the disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). in a wireless communication system, a method performed by a first user equipment (ue) may include: obtaining at least one phone number from a plurality of usable sources, classifying, based on a usage state, the at least one phone number into one of a permanent state, a temporary state, or an invalid state, and transmitting a session initiation protocol (sip) message including information associated with the at least one classified phone number to a second ue.
Inventor(s): Sunghan PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A45C11/00, A45C13/00
Abstract: a case coupled to an electronic device incudes a base including a supporting surface, a moving plate including a first supporting member and a second supporting member thicker than the first supporting member and movable on the second surface of the base with respect to the base, wherein a state of the moving plate includes a first state and a second state, wherein a side surface of the second supporting member and the supporting surface inclined with respect to the rotational axis faces each other within the first state, and faces the inner surface of the first supporting member or a side surface of the first supporting member perpendicular to the inner surface of the first supporting member, by a movement of the second supporting member with respect to the first supporting member within the second state.
20240065471.APPARATUS FOR EXTRACTING BEVERAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Geunyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Myoungkeun KWON of Suwon-si (KR) for samsung electronics co., ltd., Sojeong YU of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoon CHOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47J31/44, A47J31/057, A47J31/46
Abstract: provided is a beverage extraction apparatus including a water tank for storing water, a heater configured to heat the water supplied from the water tank, and a water distribution module configured to discharge the heated water toward the dripper from a plurality of locations. the water distribution module includes a water outlet member including a water outlet plate and a plurality of water outlets provided to pass through the water outlet plate, and the water distribution module is configured such that discharge times at which water begins to be discharged from the plurality of water outlets are different.
Inventor(s): Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Haeri Park HANANIA of San Gabriel CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/024, G02B27/28
Abstract: an electronic device including a light source and a detector are provided. the light source includes an electromagnetic spectral emission source configured to output an electromagnetic spectral emission, a polarization optical element configured to polarize the electromagnetic spectral emission, a collimation optical element configured to focus or collimate the electromagnetic spectral emission into narrow or tight beam to reduce diffusion, and a diffractive optical element configured to separate the electromagnetic spectral emission into a predetermined arrangement.
Inventor(s): Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Shailabh KUMAR of Pasadena CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/024
Abstract: the disclosure is directed to a system and a method for biosignal detection, the method including emitting an electromagnetic spectral emission, including polarized light, that is reflected on a surface, collecting attributes from the reflected electromagnetic spectral emission, calculating stokes parameters based on the collected attributes, determining at least one signal based on the stokes parameters, and analyzing the at least one signal to estimate health-related information, wherein the collected attributes comprise at least one of a light intensity of a predetermined polarization state, a light intensity for a wavelength range, and a light intensity for multiple pixels
Inventor(s): Vutha Va of Plano TX (US) for samsung electronics co., ltd., Anum Ali of Plano TX (US) for samsung electronics co., ltd., Priyabrata Parida of Garland TX (US) for samsung electronics co., ltd., Saifeng Ni of Santa Clara CA (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, G01S13/88
Abstract: a method for warning a wearer of a pacemaker against potential electromagnetic interference by a radar-aided mobile device is provided. the method includes obtaining sensor data from a sensor of an electronic device. the method includes detecting electromagnetic interference (emi) risk based on the sensor data obtained. the method includes determining whether a condition for executing an emi risk mitigation function is satisfied, based on the detected emi risk. the method includes, in response to determining that the condition for executing the emi risk mitigation function is satisfied, performing the emi risk mitigation function. in some embodiments, performing the emi risk mitigation function includes at least one of: adjusting a radio frequency (rf) transmit power; and outputting an alert that warns a user of the electronic device about a pacemaker in relation to the detected emi risk.
Inventor(s): Sukeun Kuk of Suwon-si (KR) for samsung electronics co., ltd., Taehun Yeon of Ansan-si (KR) for samsung electronics co., ltd., Hyun Chul Lee of Suwon-si (KR) for samsung electronics co., ltd., Minseok Koo of Suwon-si (KR) for samsung electronics co., ltd., Hyukjae Kwon of Suwon-si (KR) for samsung electronics co., ltd., Dongsik Yang of Suwon-si (KR) for samsung electronics co., ltd., Sehyeong Oh of Suwon-si (KR) for samsung electronics co., ltd., Sangmin Ji of Suwon-si (KR) for samsung electronics co., ltd., Hyeonsu Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01J38/02, B01J21/18, B01J23/34, B01J31/02
Abstract: an organic-inorganic composite catalyst wherein the organic-inorganic composite catalyst includes a porous carbonaceous particle, a first compound; and a metal oxide particle, wherein the first compound and the metal oxide particle are supported on the porous carbonaceous particle, the first compound contains a polar functional group, an anion, or a combination thereof, the metal oxide is represented by the formula mo, wherein 0<a≤4, 0<b≤5, and m is a metal of groups 2 to 16 of the periodic table of elements, or a combination thereof, and the organic-inorganic composite catalyst is configured to remove a second compound from an unpurified air flow including the second compound.
Inventor(s): Shibaek PARK of Suwon-si (KR) for samsung electronics co., ltd., Han Sung KIM of Changwon-si (KR) for samsung electronics co., ltd., Jooha MAENG of Suwon-si (KR) for samsung electronics co., ltd., Youngsuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Gi Seong KIM of Changwon-si (KR) for samsung electronics co., ltd., Sung Hun JEONG of Changwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J9/00, B25J9/06, B25J13/08, B25J15/00, B25J19/02
Abstract: an apparatus for automatically fastening a chemical coupler to a connector of an automatic clean quick coupler (acqc) system, includes a main body, a multi-degree of freedom (dof) robot arm on the main body, a gripper on the multi-dof robot arm that is configured to grip the chemical coupler, a vision sensor on the multi-dof robot arm, and a controller connected to the gripper, the multi-dof robot arm, and the vision sensor. the controller uses information about an environment surrounding the multi-dof robot arm acquired by the vision sensor, to control an operation of the multi-dof robot arm and an operation of the gripper.
20240066717.ROBOT AND CONTROLLING METHOD THEREOF_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yeeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Jinah KONG of Suwon-si (KR) for samsung electronics co., ltd., Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwoong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J13/06
Abstract: a robot is provided. the robot includes a display, a memory storing identification information of the robot, a communication interface communicating with a server providing a virtual environment service, and at least one processor configured to, based on receiving a user input for interlocking the robot with the virtual environment service, transmit the identification information of the robot stored in the memory to the server through the communication interface, and based on receiving interaction information related to an avatar corresponding to the identification information of the robot from the server through the communication interface, control an operation of the robot based on the interaction information.
Inventor(s): David Kim of Suwon-si (KR) for samsung electronics co., ltd., Seoktae Kang of Daejeon (KR) for samsung electronics co., ltd., Seunghyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junho Kim of Daejeon (KR) for samsung electronics co., ltd., Daeseon Park of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): C02F9/00, B01D47/06
Abstract: embodiments of the present inventive concept provides a water treating device for treating a circulating water including a storage tank configured to store the circulating water, a first filter configured to filter the circulating water discharged by the storage tank, a phosphorus removing device configured to remove phosphorus contained in the circulating water, and an ultraviolet ray irradiation device configured to irradiate an ultraviolet ray to the circulating water.
Inventor(s): Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kazuki HARANO of Tokyo (JP) for samsung electronics co., ltd., Kiyoshi MURATA of Tokyo (JP) for samsung electronics co., ltd., Haruyoshi SATO of Tokyo (JP) for samsung electronics co., ltd., Seungmin RYU of Suwon-si (KR) for samsung electronics co., ltd., Gyuhee PARK of Suwon-si (KR) for samsung electronics co., ltd., Younjoung CHO of Suwon-si (KR) for samsung electronics co., ltd., Atsushi YAMASHITA of Tokyo (KR) for samsung electronics co., ltd.
IPC Code(s): C07F5/00, C01F17/218, H01L21/02
Abstract: an yttrium compound, a method of manufacturing an integrated circuit device, and a raw material for forming an yttrium-containing film, the yttrium compound being represented by the following general formula (1):
Inventor(s): Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kazuki HARANO of Tokyo (JP) for samsung electronics co., ltd., Kiyoshi MURATA of Tokyo (JP) for samsung electronics co., ltd., Haruyoshi SATO of Tokyo (JP) for samsung electronics co., ltd., Seungmin RYU of Suwon-si (KR) for samsung electronics co., ltd., Gyuhee PARK of Suwon-si (KR) for samsung electronics co., ltd., Younjoung CHO of Suwon-si (KR) for samsung electronics co., ltd., Atsushi YAMASHITA of Tokyo (KR) for samsung electronics co., ltd.
IPC Code(s): C07F5/00, C01F17/218, H01L21/02
Abstract:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract:
m(l)(l) formula 1
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract: wherein mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract: wherein xto xare each independently c or n, yis o, s, se, c(r)(r), n(r), or si(r)(r), ring cyand ring cyare each independently a c-ccarbocyclic group or a c-cheterocyclic group, ring cyis a 6-membered heterocyclic group, a 6-membered heterocyclic group condensed with a c-ccarbocyclic group, or a 6-membered heterocyclic group condensed with a c-cheterocyclic group, zcomprises at least one deuterium, and the other variables are as provided herein.
[[20240067772.EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Changho NOH of Suwon-si (KR) for samsung electronics co., ltd., Insu LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Songwon HYUN of Yongin-si (KR) for samsung electronics co., ltd., Yoonseok KO of Suwon-si (KR) for samsung electronics co., ltd., Mijeong KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Keechang LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08G59/24, C08K3/013, C08G59/62, C08L63/00
Abstract: an epoxy compound having an aromatic ring represented by formula 1 or formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
[[20240067772.EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Changho NOH of Suwon-si (KR) for samsung electronics co., ltd., Insu LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Songwon HYUN of Yongin-si (KR) for samsung electronics co., ltd., Yoonseok KO of Suwon-si (KR) for samsung electronics co., ltd., Mijeong KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Keechang LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08G59/24, C08K3/013, C08G59/62, C08L63/00
Abstract:
e1-(m1)-(l1)-(m2)-l2-a1-l3-(m3)-(l4)-(m4)-e2 formula 1
[[20240067772.EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Changho NOH of Suwon-si (KR) for samsung electronics co., ltd., Insu LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Songwon HYUN of Yongin-si (KR) for samsung electronics co., ltd., Yoonseok KO of Suwon-si (KR) for samsung electronics co., ltd., Mijeong KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Keechang LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08G59/24, C08K3/013, C08G59/62, C08L63/00
Abstract:
e3-(a2)-(l5)-(m5)-l6-(m6)-l7-(m7)-(l8)-(a3)-e4 formula 2
[[20240067772.EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Changho NOH of Suwon-si (KR) for samsung electronics co., ltd., Insu LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Songwon HYUN of Yongin-si (KR) for samsung electronics co., ltd., Yoonseok KO of Suwon-si (KR) for samsung electronics co., ltd., Mijeong KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Keechang LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08G59/24, C08K3/013, C08G59/62, C08L63/00
Abstract: in formulae 1 and 2, m1, m2, m3, m4, m5, m6, m7, a1, a2, a3, l1, l2, l3, l4, l5, l6, l7, l8, e1, e2, e3, e4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.
Inventor(s): Sungmo LEE of Suwon-si (KR) for samsung electronics co., ltd., Junhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungjong KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Haneal LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F33/40, D06F23/02, D06F23/04, D06F33/48, D06F34/16, D06F34/20, D06F37/30, D06F39/12
Abstract: a washing machine includes: a cabinet on a front side thereof with an inlet through which laundry is input; a tub inside the cabinet and having an opening corresponding to the inlet; a drum rotatably inside the tub; a motor configured to provide power for rotating the drum; a first vibration sensor configured to detect vibration generated from the tub; a second vibration sensor configured to detect vibration generated from the cabinet; and at least one processor. the at least one processor is configured to perform a spin-drying process according to a spin-drying profile defined by a rotational speed of the drum, and to control rotation of the drum based on a first vibration value corresponding to an output of the first vibration sensor and a second vibration value corresponding to an output of the second vibration sensor during a spin-drying process.
Inventor(s): Joongwon NA of Suwon-si (KR) for samsung electronics co., ltd., Minsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kookjeong SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/26, D06F58/10, D06F58/20, D06F58/24, D06F58/26
Abstract: a clothes care apparatus including an accommodating chamber to accommodate a target; a heat pump apparatus to dehumidify and heat air circulating through the accommodating chamber, the heat pump apparatus including a refrigerant pipe through which a refrigerant circulates and at least one of a compressor, a condenser, an expansion apparatus, or an evaporator; and a condensed water collecting apparatus configured to collect condensed water generated from the heat pump apparatus, and having a storage space in which the collected condensed water is stored, wherein a portion of the refrigerant pipe passes through the storage space so that, in an operating course for taking care of the target, the refrigerant circulating through the refrigerant pipe passes through the portion of the refrigerant pipe while in a high temperature state, to evaporate the condensed water stored in the storage space.
Inventor(s): Kanghee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Eunjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/42, F24F11/70, F24F13/22
Abstract: provided is an air conditioner comprising an outdoor unit comprising an outdoor heat exchanger; and an injection device configured to inject water to the outdoor unit, the injection device including a water tank configured to store water; a nozzle configured to inject the water to the outdoor heat exchanger; a communication interface; a memory storing at least one instruction; and at least one processor configured to: obtain state information of the outdoor unit, wherein the obtained state information includes at least one of condenser operating frequency information or fan revolution per minute information of the outdoor unit, and control a water injection operation of the nozzle to inject water to the outdoor heat exchanger, in accordance with the at least one of the condenser operating frequency information or the fan revolution per minute (rpm) information of the outdoor unit included in the obtained state information.
Inventor(s): Wonho JANG of Suwon-si (KR) for samsung electronics co., ltd., Inyong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Yongman SEO of Suwon-si (KR) for samsung electronics co., ltd., Yountae SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06, F25D29/00
Abstract: a control box and a refrigerator comprising same are disclosed. the refrigerator may comprise: a main body; a storage compartment provided within the main body; a housing body which is disposed at the rear of the main body and is open at one side thereof to accommodate electrical/electronic components therein; and a housing cover which is coupled to the housing body to cover the open side of the housing body, wherein: the housing body includes a plurality of ribs which protrude toward the housing cover; and the housing cover includes contact portions which are formed in the housing cover to correspond to the ribs and are brought into contact with the ribs when an impact is applied to the housing cover.
20240068748.WAFER HEATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joohee KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjae JEON of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun CHO of Suwon-si (KR) for samsung electronics co., ltd., Yihwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangmin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F27B17/00, H05B3/00
Abstract: a wafer heating apparatus may include a heating chamber having an internal space and a heating lamp disposed in the internal space of the heating chamber. the heating lamp may be configured to heat a wafer. the heating lamp may include a plurality of lamps. each of the plurality of lamps may have circular band shapes with open regions. at least one lamp may be disposed in at least one region among regions adjacent to the open regions of the plurality of lamps.
Inventor(s): Dong-Jun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G01C21/36
Abstract: a method and an apparatus are provided for a displaying a route in a first electronic device. a first message is received from a second electronic device. first position information included in the first message is identified. the first position information includes position information of the second electronic device. a user input for selecting the first message from a plurality of messages is received. position information of the first electronic device is calculated. route information between a start position and a destination position is received from a navigation server. the start position corresponds to the position information of the first electronic device and the destination position corresponds to the position information of the second electronic device. based at least on receiving the route information from the navigation server, a route representing the received route information between the start position and the destination position is displayed on the first electronic device.
Inventor(s): Kwang Wook CHOI of Suwon-si (KR) for samsung electronics co., ltd., IIhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokwhan CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N15/06
Abstract: a sensor device includes: a support structure having a cantilever shape extending in a first direction and having a first end fixed; a sensing element having a surface and a resonant frequency changing according to contaminants adsorbed to the surface and disposed at a second end of the support structure; a frequency detector configured to detect the resonant frequency of the sensing element; and an actuator disposed at the one end of the support structure and configured to move the support structure so that the second end of the support structure moves in a second direction perpendicular to the first direction.
Inventor(s): Vinayak NARASIMHAN of Altadena CA (US) for samsung electronics co., ltd., Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Wonjong JUNG of Seoul (KR) for samsung electronics co., ltd., Kak NAMKOONG of Seoul (KR) for samsung electronics co., ltd., Youngzoon YOON of Kyonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/64, B82Y5/00, C12Q1/6844
Abstract: an amplification reaction chamber and a method for nucleic acid (na) amplification in a gene analysis system are provided. the amplification reaction chamber includes an interior surface within which an na amplification reaction is performed. the amplification reaction chamber also includes a multi-layered nanostructure coating conformally applied to at least a portion of the interior surface and including sub-micrometer nanostructures that enhance fluorescence in the na amplification reaction based on at least one of plasmonic material of which the sub-micrometer nanostructures are made and geometric dimensions of the sub-micrometer nanostructures.
Inventor(s): Sehyun Hwang of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Joongwon Shin of Suwon-si (KR) for samsung electronics co., ltd., Jimin Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/28, H01L23/00, H01L23/50, H01L23/528, H10B80/00
Abstract: provided are a semiconductor chip with a reduced thickness and improved reliability, and a semiconductor package including the semiconductor chip. the semiconductor chip includes a semiconductor substrate, an integrated device layer on the semiconductor substrate, a multi-wiring layer on the integrated device layer, and a pad metal layer of a plurality of pad metal layers on the multi-wiring layer, and having test pads defined therein. the pad metal layers extend in a first direction parallel to a top surface of the semiconductor substrate or in a second direction perpendicular to the first direction. a test pad is a central portion of the pad metal layer and, and an outer portion of the pad metal layer excluding the test pad overlaps the wires in a third direction perpendicular to the top surface of the semiconductor substrate.
Inventor(s): Kyungwoo YOO of Suwon-si (KR) for samsung electronics co., ltd., Hyung Sun LIM of Suwon-si (KR) for samsung electronics co., ltd., Dooseok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Joonhoi HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/32, G01S7/35
Abstract: an electronic device is provided. the electronic device includes: a transceiver configured to transmit or receive a wireless signal; and a processor configured to: control a first detector to detect whether an object is within a first distance range, based on a transmission/reception power ratio of the wireless signal; control a second detector to detect, based on the object not being detected within the first distance range, whether the object is within a second distance range outside the first distance range, based on a chirp pulse, which is obtained by frequency-modulating the wireless signal; and control transmission power of the wireless signal, based on whether the object is detected by the first detector or the second detector.
Inventor(s): Jeayun SO of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sangsik YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/931, G01S17/89, G05D1/02
Abstract: provided are a robot driven by controlling a time of flight (tof) light detection and ranging (lidar) sensor, and a driving method thereof. the robot outputs laser pulse signals of the tof lidar sensor by switching a laser pulse signal of a short-range pulse energy and a laser pulse signal of a remote pulse energy, while the tof lidar sensor rotates, corrects information about a distance between the robot and peripheral objects of the robot, based on reflection signals of the laser pulse signals, the reflection signals being received from the peripheral objects of the robot, and controls the driving module to move the robot based on the corrected information about the distance.
Inventor(s): Raul H. ETKIN of Sunnyvale CA (US) for samsung electronics co., ltd., Makarand S. PHATAK of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G01S19/25, G01S19/48
Abstract: a system and a method are disclosed for smoothing global navigation satellite system (gnss) data. in some embodiments, the method includes receiving a first estimate from a navigation engine of a global navigation satellite system (gnss) receiver, and processing the first estimate with a first kalman smoother.
Inventor(s): Seungseok HONG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungbum LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01, G06F3/01, G06F3/04812, G06F3/04883
Abstract: a processor of an electronic device displays, by controlling a wearable device, a portion of a first screen in an fov of the wearable device and displays a second screen within a displaying area of the display of the electronic device. in a first state identifying a reference position to be displayed within the fov based on first information received from the wearable device and for identifying the reference position of the pointer in the fov, the processor obtains the position of the pointer in the fov, based on the reference position and a position of a contact point of a touch input on the second screen. the processor obtains a position of the pointer in the fov based on the position of the contact point within a second state and transmits second information for displaying the pointer in the first screen to wearable device based on the obtained position.
Inventor(s): Kwanghyun WON of Suwon-si (KR) for samsung electronics co., ltd., Hyungki KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/28, G02B17/08
Abstract: a display apparatus includes an image forming device configured to provide image light; a concave mirror configured to focus the image light provided by the image forming device; and a delivery optical system configured to deliver the image light provided by the image forming device to a field of view of an observer via the concave mirror, wherein the delivery optical system may include a beam splitter and at least one polarization control optical element, and wherein the at least one polarization control optical element is configured to block noise light incident to the delivery optical system from the field of view of the observer.
Inventor(s): Daesik KIM of Suwon-Si (KR) for samsung electronics co., ltd., Kyonaghyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Yasuhiro NISHIDA of Suwon-si (KR) for samsung electronics co., ltd., Jongil KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1335, G02F1/13357
Abstract: a display device includes a backlight unit including: a substrate; a light emitting diode (led) disposed on a surface of the substrate; and a refractive cover configured to surround the led. the refractive cover includes: a first refractive surface to: be spaced apart from the led by a preset distance, be positioned on the upper surface of the substrate, be parallel to an axis of the led or be inclined within one angle from the axis of the led; a second refractive surface to be a curved surface in which an angle between a tangent line and the axis of the led increases from a region connected to another upper portion of the first refractive surface toward a direction of the axis of the led; and a third refractive surface to be connected to an portion of the second refractive surface and be perpendicular to the axis of the led.
Inventor(s): Sungpil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Chulho SON of Suwon-si (KR) for samsung electronics co., ltd., Kilhong LEE of Suwon-si (KR) for samsung electronics co., ltd., Byoungjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/13357
Abstract: a backlight unit includes a light source module including a plurality of light sources, a reflection sheet configured to reflect light emitted rearward from the plurality of light sources, and a diffuser plate provided in front of the light source module, where the diffuser plate includes at least two regions having different distances to the plurality of light sources, wherein a first gloss of a first region of the at least two regions and a second gloss of a second region of the at least two regions are different from each other.
20240069386.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungpil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byoungjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/13357, F21V8/00, G02F1/1333, G02F1/1339
Abstract: a display apparatus includes a liquid crystal panel; a light guide plate behind the liquid crystal panel; a light source adjacent to a thickness surface of the light guide plate and configured to emit light toward the thickness surface of the light guide plate; a rear chassis behind the light guide plate; and a holder coupled to the rear chassis and supporting the light guide plate, wherein the holder includes: a first tooth; a first tooth groove next to the first tooth; a second tooth facing the first tooth; and a second tooth groove next to the second tooth, wherein in a first state, the first tooth is disposed outside the second tooth groove and the second tooth is disposed outside the first tooth groove, and in a second state, the first tooth is inserted into the second tooth groove and the second tooth is inserted into the first tooth groove, and wherein the holder is configured to elastically deform between the first state and the second state.
Inventor(s): Woosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunil BYUN of Suwon-si (KR) for samsung electronics co., ltd., Dongjae SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/295, G01S7/481
Abstract: an optical phased array device according to at least one embodiment includes a light distribution unit configured to branch a traveling path of light, input through an input terminal, at least twice, and to direct distributed pieces of sub-light to a plurality of output terminals; at least one light modulator configured to form a plurality of channels by modulating phases of the pieces of sub-light; at least one first amplifier in an optical path between the input terminal and the at least one light modulator, the at least one first amplifier configured to amplify at least a piece of sub-light; at least one first complementary amplifier configured to replace the at least one first amplifier; and a switch configured to switch the first complementary amplifier in or out of the optical path between the input and the at least one light modulator.
Inventor(s): Suk Koo HONG of Suwon-si (KR) for samsung electronics co., ltd., Moo Hyun KOH of Suwon-si (KR) for samsung electronics co., ltd., Kyungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaemyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/004, H01L21/027
Abstract: a resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being combinable with the central metal via a coordination bond.
20240069443.ILLUMINATION CORRECTION APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donghyeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Eunhee Jeang of Suwon-si (KR) for samsung electronics co., ltd., Teun Boeren of Suwon-si (KR) for samsung electronics co., ltd., Yoonsang Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeonggil Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyungbin Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/20, G01J1/42
Abstract: an illumination correction apparatus for correcting a radiation beam incident on a reticle from an exposure apparatus includes a plurality of fingers each having a surface facing an incident direction of the radiation beam, the plurality of fingers being arranged in a first direction to be adjacent to a path of the radiation beam, and configured to adjust an amount of the incident radiation beam by moving in a second direction, intersecting the first direction, a controller connected to the plurality of fingers and configured to control movement of the plurality of fingers such that an intensity of the radiation beam has uniformity in the first direction, at least one optical sensor on the surface of at least one finger of the plurality of fingers, and a measurement unit configured to measure, based on an output of the at least one optical sensor, the intensity of the radiation beam.
Inventor(s): SeungKyo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyuncheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojin JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/20, H01L21/027, H01L23/544, H10B12/00
Abstract: a semiconductor device may include a substrate including a chip region and an edge region enclosing the chip region, and at least one coarse key pattern divided into fine key patterns on the edge region, extend in a first direction and are spaced apart from each other in a second direction crossing the first direction. each of the fine key patterns may include a first key pattern, extending in the first direction, and a second key pattern including a first portion extending along a side surface of the first key pattern, and a second portion extending along an opposite side surface of the first key pattern. a width of each of the first and second portions may be smaller than a width of the first key pattern, when measured in the second direction.
Inventor(s): SANGJINE PARK of Suwon-si (KR) for samsung electronics co., ltd., Ji Hwan PARK of Suwon-si (KR) for samsung electronics co., ltd., KUNTACK LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G03F7/16
Abstract: disclosed are supercritical fluid supply apparatuses, substrate processing apparatuses, and substrate processing methods. the substrate processing apparatus comprises a dry chamber including a dry space configured in which to dispose a substrate, and a supercritical fluid supply apparatus configured to supply the dry chamber with a supercritical fluid. the supercritical fluid supply apparatus includes a fluid supply tank, a high-temperature fluid tank configured in which to store a fluid supplied from the fluid supply tank at a first temperature, and a low-temperature fluid tank configured in which to store a fluid supplied from the fluid supply tank at a second temperature different from the first temperature. the high-temperature fluid tank and the low-temperature fluid tank are connected in parallel between the fluid supply tank and the dry chamber.
Inventor(s): Dongho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaewon Jung of Suwon-si (KR) for samsung electronics co., ltd., Nakwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sooyeon Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jaeneung Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihae Lim of Suwon-si (KR) for samsung electronics co., ltd., Chulyong Cho of Suwon-si (KR) for samsung electronics co., ltd., Soohyun Whang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03H1/22, G03H1/04, G06F3/01, G06F3/04842
Abstract: a display apparatus is disclosed. the display apparatus according to the disclosure includes a display including a display panel and a plurality of reflectors that are arranged in a form of an inverted pyramid on the front surface of the display panel and reflect an image output from the display panel, a sensor, and at least one processor which identifies an object from an input image, acquires an output image including the plurality of objects based on the plurality of reflectors, and controls the display panel to display the output image, wherein the processor is configured to, based on identifying a user through the sensor, update the output image based on the identified user, and control the display panel to display the updated output image.
Inventor(s): Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G04B37/14, A44C5/14, G04G99/00
Abstract: an electronic device is provided. the electronic device includes a housing, at least one coupling member configured to be connected to the housing, a bracket disposed between the housing and the at least one coupling member and including a first through hole and a second through hole, and a connecting member at least partially disposed within the at least one coupling member, wherein the connecting member includes a first protruding area configured to be inserted into the first through hole and a second protruding area configured to be inserted into the second through hole, wherein the first protruding area is configured to rotate within a first angular range in the first through hole, and the second protruding area is configured to rotate within the first angular range in the second through hole.
Inventor(s): Hyunki HONG of Suwon-si (KR) for samsung electronics co., ltd., Youngil KOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02, B66B25/00
Abstract: provided is a robot and method of controlling same, where the robot includes: a sensor; a driver; a memory storing an instruction; and a processor configured to execute the instruction to: identify, through the sensor, a height difference between a first stair and a second stair of an escalator, identify whether the robot is adjacent to a disembarkment area of the escalator based on the identified height difference, based on identifying that the robot is adjacent to the disembarkment area, identify, through the sensor, whether an object is located within a first distance of the robot in a movement direction of the escalator, and based on identifying the object located within the first distance of the robot in the movement direction of the escalator, control the driver to cause the robot to move on the escalator in a direction opposite to the movement direction of the escalator.
Inventor(s): Youngil KOH of Suwon-si (KR) for samsung electronics co., ltd., Soonbeom KWON of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02
Abstract: a robot includes: at least one sensor configured to detect an external environment within a viewing zone of the at least one sensor; at least one memory storing information on a travel space including a privacy protection zone; and at least one processor configured to: identify whether the viewing zone of the at least one sensor will be within a predetermined distance from the privacy protection zone while the robot travels along a travel path in the travel space, based on identifying that the viewing zone of the at least one sensor will be within the predetermined distance, determine whether the viewing zone of the at least one sensor will overlap with the privacy protection zone based on the travel path, and based on determining that the viewing zone of the at least one sensor will overlap with the privacy protection zone, change a heading direction of the robot from a first heading direction to a second heading direction to prevent the viewing zone of the at least one sensor from overlapping with the privacy protection zone.
Inventor(s): Soonbeom KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaeha LEE of Suwon-si (KR) for samsung electronics co., ltd., Mideum CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junyeong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02
Abstract: provided is a robot device and a method of controlling same. the robot device includes: at least one memory storing at least one instruction; a sensor configured to detect an environment of the robot device and output detection data; and at least one processor configured to execute the at least one instruction to: acquire a map of a space where the robot device is positioned based on the detection data received from the sensor, and a reliability value of each of a plurality of areas of the map, store the map and the reliability value of each of the plurality of areas in the at least one memory, identify at least one area having a reliability value greater than or equal to a critical value, based on the reliability value of each of the plurality of areas, and identify a movement path of the robot device in the space, based on the at least one area.
Inventor(s): Bosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Yilee SEO of Suwon-si (KR) for samsung electronics co., ltd., Jaemin JOO of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiyoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06T7/11, G06V10/40, H04M1/02
Abstract: an electronic device is provided. the electronic device includes a flexible display divided into a first face and a second face with respect to a folding axis, and at least one processor operatively coupled to the display. the at least one processor is configured to display main content through a first area of the display, detect folding of the display while the main content is displayed, display the main content through a second area smaller than the first area, based on a folding angle of the display and a positional relationship between the electronic device and a user, and display background content in a third area which is an area excluding the second area. the background content is an image for filling a margin produced by displaying the main content in the second area.
Inventor(s): Byounggyu Park of Suwon-si (KR) for samsung electronics co., ltd., Taejeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmin Moon of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Bae of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan Song of Suwon-si (KR) for samsung electronics co., ltd., Jinwan An of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04M1/02
Abstract: an electronic device includes a flexible display panel connected to a first housing and a second housing; and a flexible window that is coupled to one surface of the flexible display panel. the flexible window includes a deformation area that is deformable together with the flexible display panel around at least one folding axis. the flexible window includes a glass layer. a first polymer layer is disposed between the glass layer and the flexible display panel. an adhesive layer is laminated on the second surface of the glass layer. the adhesive layer includes at least one uneven structure formed on one surface that faces an opposite direction to the second surface of the glass layer and is at least partially overlapped with the at least one first curved-surface portion or the at least one second curved-surface portion. a second polymer layer is laminated on the adhesive layer.
Inventor(s): Jongchul CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sangho YOON of Suwon-si (KR) for samsung electronics co., ltd., Bonkon KOO of Suwon-si (KR) for samsung electronics co., ltd., Jeonggeun YUN of Suwon-si (KR) for samsung electronics co., ltd., Youngmo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06T7/50
Abstract: an augmented reality (ar) device for obtaining depth information of an object in a real world, includes: a gaze tracking sensor configured to obtain a gaze point by tracking a gaze direction of a user's eye; a depth sensor configured to obtain depth information of the object; a memory storing one or more instructions; and at least one processor configured to execute the one or more instructions to: determine a region of interest (roi) confidence level indicating a degree to which at least one partial region within a field of view (fov) of the ar device is predicted as an roi, based on at least one of a moving speed, an acceleration, a fixation time, a fixation number, or a location of the gaze point; determine an roi based on the roi confidence level; and set a parameter for controlling an operation of the depth sensor to obtain depth information of the object within the roi.
20240069668.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungjik Min of Suwon-si (KR) for samsung electronics co., ltd., MINSUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., JUNESOO KIM of Suwon-si (KR) for samsung electronics co., ltd., SUNG-JIN PARK of Suwon-si (KR) for samsung electronics co., ltd., SEUNG-HOON BAEK of Suwon-si (KR) for samsung electronics co., ltd., KEYEONGGON LEE of Suwon-si (KR) for samsung electronics co., ltd., CHOONGHOON LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041
Abstract: a semiconductor device is disclosed. the semiconductor device includes a transceiver including an amplifier region configured to output a data signal to a source line connected to a pixel during a first period and receive a detection signal from a touch electrode during a second period different from the first period, and configured to generate the data signal based on input data; and a driving controller configured to generate the data based on input image data, outputting the data to the transceiver, and generate a touch signal based on the detection signal.
Inventor(s): Choonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Minsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungjik MIN of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon BAEK of Suwon-si (KR) for samsung electronics co., ltd., Kyeonggon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041
Abstract: a touch controller, a touch screen device, and an operating method of the touch controller are provided. a touch controller, performing a touch sensing operation of sensing a touch of a touch panel in a touch sensing period, includes a first clock generator configured to generate a low frequency clock signal for calculating the touch sensing period, a second clock generator configured to generate a high frequency clock signal for performing the touch sensing operation, and a first calibration circuit configured to calibrate a frequency of the low frequency clock signal by using the high frequency clock signal.
Inventor(s): Hyung Min YOOK of Seoul (KR) for samsung electronics co., ltd., Sung Sik YOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Kang Won LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Myeong Lo LEE of Seoul (KR) for samsung electronics co., ltd., Young Ae KANG of Seoul (KR) for samsung electronics co., ltd., Hui Chul YANG of Seoul (KR) for samsung electronics co., ltd., Yong Ki MIN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04817, G06F3/0481, G06F3/0486, G06F3/04886, G06F3/14, G09G5/14
Abstract: a method of supporting divided screen areas and a mobile terminal employing the same are disclosed. the method includes: generating input signals for one of sequentially and simultaneously activating a plurality of user functions; activating the user functions according to generated input signals; dividing a screen into divided screen areas that correspond to activated user functions; and outputting functional view areas associated with the activated user functions to the corresponding divided screen areas.
Inventor(s): Sungjun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jiyeon Ma of Suwon-si (KR) for samsung electronics co., ltd., Jingun Jung of Suwon-si (KR) for samsung electronics co., ltd., Euijun Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngah Lee of Suwon-si (KR) for samsung electronics co., ltd., Chad Philip Hall of Seattle WA (US) for samsung electronics co., ltd., Marine Au Yeung of Seattle WA (US) for samsung electronics co., ltd., Felix Yushin Chang of Seattle WA (US) for samsung electronics co., ltd., Carolyn Yuen Ming Yip of Seattle WA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/04842, G06F3/14, G06V10/25, G06V40/16
Abstract: an electronic apparatus includes a display, a camera, a communication interface, a memory configured to store information, and a one or more processor configured to, based on the specific object being identified from an image obtained through the camera, identify a preset zone with respect to the identified specific object, based on a user being identified from the image obtained through the camera, identify whether the identified user is located within the preset zone, and based on a signal corresponding to a user interaction being received by the communication interface while the user is located in the preset zone, control the display to display a user interface screen corresponding to a type of the user interaction.
Inventor(s): Seunghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04847
Abstract: an electronic apparatus includes: a display; a memory storing at least one instruction; and a processor configured to execute the at least one instruction to: based on a user command for executing a peripheral device control function being identified, identify a screen state of the display, control the display to display a user interface (ui) screen corresponding to the peripheral device control function at a whole area of the display by turning on the display based on the identified screen state being in a turned off state, identify a ui type from among a plurality of ui types with a different size based on at least one of a content type or a display state of content displayed on the display, and control the display to display a ui screen corresponding to the peripheral device control function at a partial area of the display based on the identified ui type.
Inventor(s): Kui-Yon MUN of Suwon-si (KR) for samsung electronics co., ltd., Junyeong HAN of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Gyeongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Keunsan PARK of Suwon-si (KR) for samsung electronics co., ltd., Joon-Whan BAE of Suwon-si (KR) for samsung electronics co., ltd., Heetak SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a storage device, including: a nonvolatile memory device including a plurality of memory cells; and a controller configured to perform a write operation on at least one write unit included in the plurality of memory cells, and to perform an erase operation on at least one erase unit included in the plurality of memory cells, wherein the controller is further configured to: allocate a plurality of zones to a storage space of the nonvolatile memory device in response to a request of an external host device, select two or more erase units among a plurality of erase units of the plurality of memory cells to be allocated to each of the plurality of zones based on a zone map table, fixedly and sequentially manage logical addresses of data written in the plurality of zones, wherein the controller includes an internal buffer configured to store first data to be written in a first zone from among the plurality of zones, and wherein the controller is further configured to perform a backup operation for the first data by selecting an erase unit in which the first data are to be written, and a cell type of the erase unit based on a feature of the first zone.
Inventor(s): Heeseok Eun of Suwon-si (KR) for samsung electronics co., ltd., Jinwook Lee of Suwon-si (KR) for samsung electronics co., ltd., Bongsoon Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a method is provided to operate a storage device including a storage controller and a plurality of nonvolatile memory devices. a plurality of original data blocks are received at the storage controller from a host. an original parity block is generated based on the original data blocks. the original data blocks and the original parity block are stored in respective ones of the nonvolatile memory devices, wherein a first original data block of the original data blocks is stored in a first one of the nonvolatile memory devices, and wherein the original parity block is stored in a second one of the nonvolatile memory devices. a new data block corresponding to the first original data block is received at the storage controller from the host after storing the original data blocks and the original parity block. the new data block is stored in the first nonvolatile memory device. a new parity block is generated at the second nonvolatile memory device based on the original parity block and based on differences between the first original data block and the new data block.
Inventor(s): Junyoung Ko of Suwon-si (KR) for samsung electronics co., ltd., Jungmin Bak of Suwon-si (KR) for samsung electronics co., ltd., Changhwi Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a memory control device includes a threshold generating circuit, which is configured to set a first threshold for a first memory module electrically coupled to the memory control device. this first threshold is based on information associated with the first memory module. an attack defense circuit is also provided, which is configured to count an input row address, and decide a row address whose count value exceeds the first threshold among row addresses of the first memory module as an aggressor row address.
Inventor(s): Keunsan Park of Suwon-si (KR) for samsung electronics co., ltd., Gyeongmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Joon-Whan Bae of Suwon-si (KR) for samsung electronics co., ltd., Heetak Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a storage device, including: a nonvolatile memory device including a plurality of memory cells; and a controller including an internal buffer including zone buffers, and configured to: allocate a plurality of zones to a storage space, select two or more erase units to be allocated to each zone based on a zone map table, fixedly and sequentially manage logical addresses of data written in the plurality of zones, based on reads for sequential logical addresses being requested by the external host device, read first data corresponding to the sequential logical addresses from the nonvolatile memory device, and output the first data to the external host device, and based on the reads being requested, perform a prefetch operation by reading second data corresponding to next sequential logical addresses, and storing the second data in the internal buffer, without receiving a next read request from the external host device.
Inventor(s): Joon-Whan BAE of Suwon-si (KR) for samsung electronics co., ltd., Junyeong HAN of Suwon-si (KR) for samsung electronics co., ltd., Kui-Yon MUN of Suwon-si (KR) for samsung electronics co., ltd., Heetak SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a storage device, including: a nonvolatile memory device including a plurality of memory cells; and a controller configured to, based on receiving an open zone command from an external host device: based on a number of free erase units from among a plurality of erase units included in the plurality of memory cells being greater than a threshold value, allocate at least two free erase units to a first-type zone, and based on the number of the free erase units being smaller than or equal to the threshold value, allocate the at least two free erase units to a second-type zone. wherein the controller is further configured to permit a random write based on a random logical address received from the external host device for the first-type zone, and to permit a zone write based on a sequential logical address received from the external host device for the second-type zone.
Inventor(s): Eun Chu OH of Suwon-si (KR) for samsung electronics co., ltd., Beomkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/02
Abstract: the present disclosure provides storage devices and methods for operating the same. in some embodiments, a storage device includes a non-volatile memory including a plurality of sub-blocks that are independently erasable, and a processor configured to control a garbage collection operation on the plurality of sub-blocks. the plurality of sub-blocks includes a plurality of first sub-blocks that have a first block size and a plurality of second sub-blocks that have a second block size. the second block size is different from the first block size. the processor is further configured to select a victim sub-block with a lowest ratio of a valid page count to an invalid page count from among the plurality of sub-blocks, and copy a valid page of the victim sub-block to a target sub-block from among the plurality of sub-blocks.
Inventor(s): Hyojin AHN of Suwon-si (KR) for samsung electronics co., ltd., Seoyeong Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo Shin of Suwon-si (KR) for samsung electronics co., ltd., Changjun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: an operating method of a storage device including a memory controller and a non-volatile memory, the method including: performing a first read in response to a read request by reading data from the non-volatile memory using a default read voltage set; and performing a second read when the first read fails, by calculating a degradation compensation level, using a weight table, offset table, and displacement level, calculating a history read voltage set by performing an operation on the default read voltage set and degradation compensation level, and reading the data using the history read voltage set, wherein the weight table includes weights preset according to word line groups and state read voltages, the offset table includes offset levels preset according to the word line groups and the state read voltages, and the displacement level corresponds to a difference between a default read voltage level and an optimal read voltage level.
Inventor(s): Youngsam SHIN of Suwon-si (KR) for samsung electronics co., ltd., Deok Jae OH of Suwon-si (KR) for samsung electronics co., ltd., Yeongon CHO of Suwon-si (KR) for samsung electronics co., ltd., Seongwook PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a data processing apparatus spaced apart from a host and configured to process data in a memory in conjunction with the host includes a near-memory processing unit configured to receive a command from the host, compress or decompress the data in response to the command, and manage an entry of the compressed data; and a buffer configured to store the data or the compressed data based on the entry.
Inventor(s): Jinwook LEE of Suwon-si (KR) for samsung electronics co., ltd., Heeseok Eun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a method of operating a storage server which includes a plurality of storage devices and a storage node configured to control the plurality of storage devices is provided. the method includes grouping first virtual machines based on workload characteristics of the first virtual machines, to generate a virtual machine group table; receiving, from first storage devices, attribute information of the first storage devices, the first storage devices being allocated to the first virtual machines; collecting recovery information from the first storage devices; generating a recovery sequence table by determining recovery sequences based on the virtual machine group table, the attribute information, and the recovery information; and providing a corresponding recovery sequence to a second storage device of the plurality of storage devices, based on the recovery sequence table, the second storage device being allocated to a new second virtual machine different from the first virtual machines.
Inventor(s): Juho HYUN of Suwon-si (KR) for samsung electronics co., ltd., Sung-wook BYUN of Seoul (KR) for samsung electronics co., ltd., Haksoon IM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/0484
Abstract: a method and an apparatus for providing a lock-screen are provided. the method includes turning off a display unit, configuring content for the lock-screen in response to the turning off of the display unit, receiving a user interaction, based on at least one button, turning on the display unit in response to the user interaction, and displaying the lock-screen that is changed based on the content configured to correspond to the user interaction when the display unit is turned on.
Inventor(s): Nina LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F1/16
Abstract: an electronic device includes a first display, a second display disposed in a direction opposite to the first display, a processor and memory storing instructions, which when executed, cause the electronic device to output a content through the first display. the instructions are configured to cause the electronic device to identify a direction of an external electronic device connected to the electronic device through short-range communication scheme with respect to the electronic device while outputting the content. the instructions are configured to cause the electronic device to, in response to identifying that the direction of the external electronic device is within a first range of directions, keep outputting the content through the first display. the instructions are configured to cause the electronic device to, in response to identifying that the direction of the external electronic device is within a second range of directions, output the content through the second display.
Inventor(s): Minjeong MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyundo LEE of Suwon-si (KR) for samsung electronics co., ltd., Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Chanpyo PARK of Suwon-si (KR) for samsung electronics co., ltd., Bona LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungyong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F1/16, G06F3/01, H04M1/02
Abstract: according to an embodiment, an electronic device includes a display module including a main display and a sub-display. the electronic device includes a memory configured to store computer-executable instructions. the electronic device includes a processor configured to execute the instructions by accessing the memory. the instructions, when executed, may cause the processor to, in response to a state of the electronic device executing an application being changed to a partially unfolded intermediate state, display a graphic object associated with switching a screen display of the application from the main display to the sub-display on a partial area of the main display. the instructions, when executed, may cause the processor to, in response to the graphic object being displayed in a specified position on the partial area before the state of the electronic device is changed to a folded state, display a screen of the application on the sub-display.
Inventor(s): Jinseong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinpil LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/487, G06F9/50, G06F17/16
Abstract: a method of performing a floating-point operation using a memory processor (the floating-point operation being a multiplication of a first matrix and a second matrix that are double-precision floating-point matrices) includes: determining whether an emulation is to be used to perform the floating-point operation, based on a result of the determining whether the emulation is to be used, determining whether to use the memory processor for the emulation, the emulation comprising stages, based on a result of the determining whether to use the memory processor for the emulation, individually determining whether to use the memory processor for each stage of the emulation, and multiplying the first matrix and the second matrix based on a result of the individually determining whether to use the memory processor.
Inventor(s): Seok Ju YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Soon-Wan KWON of Suwon-si (KR) for samsung electronics co., ltd., Sungmeen MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Daekun YOON of Suwon-si (KR) for samsung electronics co., ltd., Dong-Jin CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/523, G06F7/501, G06F7/544, G11C7/10
Abstract: an apparatus and method with in-memory computing (imc) are provided. an in-memory computing (imc) circuit includes a plurality of memory banks, each memory bank including a bit cell configured to store a weight value and an operator configured to receive an input value, the operator being connected to the bit cell such that the operator upon receiving the input value outputs a logic operation result between the input value and the weight value, and a logic gate configured to receive the logic operation result of each of the memory banks.
Inventor(s): Jungho CHO of Suwon-si (KR) for samsung electronics co., ltd., Byoungchul LEE of Suwon-si (KR) for samsung electronics co., ltd., Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Juyeon JIN of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Bokun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F8/65, H02J7/00, H04B1/3827, H04B3/54
Abstract: according to various embodiments of the present disclosure, an electronic device may comprise: a communication circuit, a memory, and at least one processor operatively connected to the communication circuit and the memory, wherein on or more of the ate least one processor is configured to: receive an updating file for updating a second external electronic device from a first external electronic device based on establishing a communication connection with the first external electronic device through the communication circuit; identify whether the second external electronic device needs to be updated, based on the electronic device being safely mounted on the second external electronic device; identify whether a designated condition for transmitting the updating file to the second external electronic device is satisfied, based on state information of the second external electronic device and/or state information of the electronic device based on the second external electronic device needing to be updated; and transmit the updating file received from the first external electronic device to the second external electronic device based on the designated condition for transmitting the updating file to the second external electronic device being satisfied.
Inventor(s): Madhava Krishnan Ramanathan of Blacksburg VA (US) for samsung electronics co., ltd., Shashwat Jain of Blacksburg VA (US) for samsung electronics co., ltd., Changwoo Min of Blacksburg VA (US) for samsung electronics co., ltd., Vishwanath Maram of San Jose CA (US) for samsung electronics co., ltd., Naga Sanjana Bikonda of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F9/50
Abstract: systems and methods for executing compute functions are disclosed. a processing circuit may be configured to: receive a first task from a first application, wherein the first task identifies a first compute function and a second compute function; determine a first order of execution of the first compute function and the second compute function based on first information in the first task; and execute the first compute function and the second compute function according to the first order.
Inventor(s): Heekwon Park of Cupertino CA (US) for samsung electronics co., ltd., Ho bin Lee of San Jose CA (US) for samsung electronics co., ltd., IIgu Hong of Santa Clara CA (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/14, G06F16/17, G06F16/22, G06F21/62
Abstract: provided is a method of database management including locating, with a recovery logic, a first metadata table using a beginning metadata table key, reading, by the recovery logic, the first metadata table, retrieving, with the recovery logic, a first next metadata table key of the first metadata table, locating, by the recovery logic, a second metadata table based on the first next metadata table key or based on a third next metadata table key of a third metadata table having a third metadata table range between a first metadata table range of the first metadata table and a second metadata table range of the second metadata table, reading, by the recovery logic, the second metadata table, determining, by the recovery logic, the second metadata table lacks valid keys in the second metadata table range, and making available, by the recovery logic, memory space associated with the second metadata table.
Inventor(s): Junyeong HAN of Suwon-si (KR) for samsung electronics co., ltd., Kui-Yon Mun of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd., Keunsan Park of Suwon-si (KR) for samsung electronics co., ltd., Gyeongmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Heetak Shin of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/14, G06F3/06
Abstract: a storage device, including a nonvolatile memory device including a plurality of memory cells forming a user area and a reserved area; and a controller configured to perform a write operation on at least one write unit included in the plurality of memory cells, and to perform an erase operation on at least one erase unit included in the plurality of memory cells, wherein the controller includes an internal buffer, wherein the controller is configured to: perform a backup operation by writing first data stored in the internal buffer in a backup erase unit included in the reserved area, and after performing the backup operation adjust a buffering unit of the internal buffer to correspond to a cell type of the backup erase unit.
Inventor(s): Seunghyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Keunsan PARK of Suwon-si (KR) for samsung electronics co., ltd., Heetak SHIN of Suwon-si (KR) for samsung electronics co., ltd., Junyeong HAN of Suwon-si (KR) for samsung electronics co., ltd., Gyeongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Joon-Whan BAE of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F11/10
Abstract: a storage device, including a nonvolatile memory device comprising a plurality of memory cells; and a controller configured to: allocate a plurality of zones to a storage space of the nonvolatile memory device based on a request received from an external host device, fixedly and sequentially manage logical addresses of data written in the plurality of zones, generate a first page map table corresponding to a first zone based on performing the write operation on the first zone, the first page map table comprising a logical address and a physical address of the first zone, based on the first zone being full, activate a read service, which is based on the zone map table, and based on the read service being activated, process read requests for the first zone from the external host device using the zone map table.
Inventor(s): Seunghyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Keunsan PARK of Suwon-si (KR) for samsung electronics co., ltd., Joon-Whan BAE of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Gyeongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Heetak SHIN of Suwon-si (KR) for samsung electronics co., ltd., Junyeong HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
Abstract: a storage device, including: a nonvolatile memory device comprising a plurality of memory cells; and a controller configured to perform a write operation on at least one write unit included in the plurality of memory cells, and to perform an erase operation on at least one erase unit included in the plurality of memory cells, wherein the controller is further configured to: allocate a plurality of zones to a storage space of the nonvolatile memory device based on a request received from an external host device, select two or more erase units from among a plurality of erase units included in the plurality of memory cells to be allocated to each zone of the plurality of zones, fixedly and sequentially manage logical addresses of data to be written in the plurality of zones, and generate at least two map tables for the each zone
Inventor(s): Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Yuhwan RO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
Abstract: disclosed are a device and method with memory request processing using an extension of a memory address space. an electronic device includes a host processor configured to generate a memory request and a memory address that is mapped to a target memory mode that is any one of available memory modes and is mapped to a physical memory address to which the memory request is to be applied, a memory controller configured to generate the physical memory address and a command according to the target memory mode mapped to the memory address based on the memory request and the memory address received from the host processor, and a memory configured to execute, at the physical memory address, the command received from the memory controller.
Inventor(s): Seongyoung KANG of Irvine CA (US) for samsung electronics co., ltd., Mohammadreza SOLTANIYEH of Sunnyvale CA (US) for samsung electronics co., ltd., Xuebin YAO of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/901
Abstract: methods and memory devices are provided in which at least one parser of a memory device converts graph input data into an edge list and a vertex list for a graph database. a merge sorter of the memory device sorts the vertex list to generate a sequential list of vertices. the edge list is converted into a translated list of edges using identifiers (ids) of the sequential list of vertices. the merge sorter sorts the translated list of edges to generate a sequential list of edges. the graph database is generated using the sequential list of edges.
Inventor(s): Amit SARKAR of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F21/62, H04L9/40, H04M1/72454
Abstract: a method for personalizing user data privacy associated with an application of an electronic device is provided. the method includes monitoring over time one or more user interactions associated with the application of the electronic device. furthermore, the method includes determining a privacy parameter of the user and a utility preference of the user based on the monitored user interactions. furthermore, the method includes generating a generic/content specific privacy profile of the user based on the determined privacy parameter of the user and utility preference of the user, determining a privacy protection characteristic of the user based on the generic privacy profile and/or the content specific privacy profile, and generating one or more personalized settings for a future user interaction associated with the application of the electronic device based on the privacy protection characteristic.
Inventor(s): Kwangsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungjung Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/3308
Abstract: provided are a circuit analysis method, a circuit analysis device, and a circuit analysis system. an embodiment provides a circuit analysis method, including: building a circuit graph based on a netlist of a circuit; defining a node in the circuit graph; extracting an x (unknown) event for each node based on a waveform built as a result of simulation for the node; building an x event node from the x event that was extracted; building an x event graph by linking the x event node to at least one other x event node; traversing the x event graph and identifying a source x event and an involvement x event; and finding an x propagation path for the x event node, the x propagation path comprising the source x event and the involvement x event.
Inventor(s): Sung-Min HONG of Gwangju-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/367
Abstract: a simulation method includes establishing a carrier distribution function of a semiconductor device model, computing one or more values corresponding to a solution of an approximate boltzmann transport equation with respect to the carrier distribution function, and outputting a performance value of the semiconductor device model, which corresponds to the one or more values corresponding to the solution of the approximate boltzmann transport equation, as a simulation result value.
Inventor(s): Nam Soo KIM of Seoul (KR) for samsung electronics co., ltd., Jiwon YOON of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
Abstract: provided is a method and an apparatus with neural network (nn) training. a method of operating a neural network model includes predicting first latent target data based on source data and based on target data corresponding to the source data, predicting second latent target data based on the source data and based on constant data, and training the nn model based on the first latent target data and the predicted second latent target data; the first latent target data and the target data have a many-to-one relationship.
Inventor(s): Mostafa EL-KHAMY of San Diego CA (US) for samsung electronics co., ltd., Yanlin ZHOU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
Abstract: a system and a method are disclosed for neural architecture search. in some embodiments, the method includes: processing a training data set with a neural network during a first epoch of training of the neural network; computing a training loss using a smooth maximum unit regularization value; and adjusting a plurality of multiplicative connection weights and a plurality of parametric connection weights of the neural network in a direction that reduces the training loss.
Inventor(s): Nguyen Thang Long Le of Richardson TX (US) for samsung electronics co., ltd., Tyler Luu of Richardson TX (US) for samsung electronics co., ltd., John William Glotzbach of Allen TX (US) for samsung electronics co., ltd., Hamid Rahim Sheikh of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06T7/20, G06T11/00
Abstract: an electronic device includes a processor configured to estimate green values at red and blue pixel locations of an input bayer frame based on green values at green pixel locations of the input bayer frame. the processor is also configured to generate red, green, and blue channels of joint demosaiced-warped output rgb pixels from the input bayer frame based on the green values at the green pixel locations, the estimated green values at the red and blue pixel locations, an alignment vector map, and kernels for red, green, and blue pixels.
Inventor(s): Youngchan SONG of Suwon-si (KR) for samsung electronics co., ltd., Hanul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Soomin KANG of Suwon-si (KR) for samsung electronics co., ltd., Tammy LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T3/40
Abstract: an electronic device for generating an image with an enhanced depth as perceived by a viewer includes at least one memory storing instructions, and at least one processor configured to execute the instructions to receive an input image, receive a control parameter for adjusting a first level of at least one pictorial depth cue included in the input image, and generate an output image including the at least one pictorial depth cue at a second level that is adjusted from the first level based on the control parameter using a deep neural network.
Inventor(s): Jiyoun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangyoun LEE of Seoul (KR) for samsung electronics co., ltd., Sangjin LEE of Seoul (KR) for samsung electronics co., ltd., Hyeongmin LEE of Seoul (KR) for samsung electronics co., ltd., Hanbin SON of Seoul (KR) for samsung electronics co., ltd., Chajin SHIN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T7/246
Abstract: an electronic device is provided. the electronic device includes at least one processor and a memory. the memory may store at least one instruction that, when executed by the at least one processor, enables the electronic device to obtain a first image frame and a second image frame. the memory may store at least one instruction that, when executed by the at least one processor, enables the electronic device to identify a first interpolation-applied object and a first interpolation non-applied object among objects included in the first image frame and identify a second interpolation-applied object and a second interpolation non-applied object among objects included in the second image frame. the memory may store at least one instruction that, when executed by the at least one processor, enables the electronic device to provide an interpolation image frame including a result of interpolation on the first interpolation-applied object and the second interpolation-applied object and the first interpolation non-applied object or the second interpolation non-applied object.
Inventor(s): Musa Maharramov of The Woodlands TX (US) for samsung electronics co., ltd., Ye Zhao of San Jose CA (US) for samsung electronics co., ltd., Brian Patton of San Francisco CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/50
Abstract: in one embodiment, a method includes accessing (1) a corrupted image of a scene captured by a camera, (2) an estimated true image of the scene, (3) an estimated corruption operator f for the camera, and (4) one or more uncertainty metrics for f. the method further includes generating, by applying a corruption operation to the estimated true image and the corruption operator f, a predicted corrupted image of the scene captured by the camera and determining a difference between the predicted corrupted image and the corrupted image captured by the camera. the method further includes determining, based on the one or more uncertainty metrics for f, a likelihood distribution for the corruption operator f, and updating, based on the likelihood distribution for the corruption operator f and on the determined difference between the predicted corrupted image and the corrupted image captured by the camera, the estimated corruption operator f.
Inventor(s): Young Hoon KIM of SUWON-SI (KR) for samsung electronics co., ltd., Kun Dong KIM of SUWON-SI (KR) for samsung electronics co., ltd., Sung Su KIM of SUWON-SI (KR) for samsung electronics co., ltd., Jin Hyun KIM of SUWON-SI (KR) for samsung electronics co., ltd., Da Gyeom HONG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, H04N23/80
Abstract: a system of automatic optimization of image quality of an image sensor includes an image learning data generation unit generating an image tuning knowledge database, which includes pairs of a plurality of sets of values of a plurality of parameters and a plurality of sets of image quality evaluation scores for a plurality of image quality evaluation items for evaluating a quality of each of a plurality of images generated by the image sensor, using an image tuning database sampling module, an image signal processor modeling unit generating a machine learning model, for each image, for automatically optimizing the quality of each image, and an image sensor image quality optimization unit automatically controlling values of some of the plurality of parameters based on a user's image quality selection and the machine learning model. the image quality evaluation scores are produced by a distributed camera simulation system including servers.
Inventor(s): Taihoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghak Oh of Suwon-si (KR) for samsung electronics co., ltd., Seungeun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/215, G06F3/0346, G06V10/20
Abstract: an electronic device includes: a first housing; a second housing; a first sensor; a second sensor; at least one camera provided on the first housing; and a processor configured to: identify an angle between the first housing and the second housing, in a state of obtaining a video by controlling the at least one camera; identify a magnitude of a rotational motion of the electronic device, in the state of obtaining the video; and obtain information for segmenting a portion of the video, which corresponds to a time interval in which at least one of the identified angle being changing by exceeding a designated range or the identified magnitude of the rotational motion being exceeding a designated magnitude.
Inventor(s): Keehwan KA of Suwon-si (KR) for samsung electronics co., ltd., Seongjoo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/73, G06T7/11, G06T7/50, H05B1/02
Abstract: a cooking apparatus including a chamber; a door configured to open or close the chamber; a plurality of supporters inside the chamber at different heights from each other, each supporter being configured to support a tray; a plurality of markers at different locations on the door; a camera configured to obtain an image of an interior of the chamber; and a controller configured to identify the location of a marker, at least a portion of which is hidden by the tray, of the plurality of markers, in an image of the interior of the chamber obtained by the camera while the tray is being supported inside the chamber by at least one supporter of the plurality of supporters, estimate a height of the tray in the chamber based on the identified location, and determine a cooking parameter to cook an object to be cooked in the chamber based on the estimated height.
Inventor(s): Wenbo Li of Santa Clara CA (US) for samsung electronics co., ltd., Yi Wei of Sunnyvale CA (US) for samsung electronics co., ltd., Jing Zhu of Jackson Heights NY (US) for samsung electronics co., ltd., Hongxia Jin of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T13/80, G06T7/246, G06T7/70, G06V10/82, G06V40/16
Abstract: a method includes obtaining a source image of a user and obtaining a driving video in which a face or a head of the user is moving. the method also includes generating metadata identifying animations to be applied to the source image so that the source image mimics at least some movements of the user's face or head in the driving video. the method further includes transmitting the source image and the metadata to an end user device configured to animate the source image based on the metadata. generating the metadata includes suppressing one or more artifacts associated with one or more objects that temporarily occlude at least a portion of the user's head or body in the driving video or that temporarily appear in the driving video.
Inventor(s): Eunbin LEE of Suwon-si (KR) for samsung electronics co., ltd., Sookkyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/20, G06T7/50, G09G3/20
Abstract: a head-mounted electronic device configured to convert a screen of an electronic device into an extended reality and the electronic device connected thereto are disclosed. the electronic device includes a processor further configured to convert objects into a plurality of virtual objects to display the objects in a visual image output by a display of the head-mounted electronic device. the electronic device includes the processor further configured to verify information on a theme corresponding to a color of an execution screen of an application and information on the visual image output by the display of the head-mounted electronic device. the electronic device includes the processor further configured to control at least one of a brightness and a saturation of the virtual objects based on at least one of the information on the theme and the information on the visual image.
Inventor(s): HOJOON LEE of SUWON-SI (KR) for samsung electronics co., ltd., SEOYEON PARK of SUWON-SI (KR) for samsung electronics co., ltd., SEONGRYEOL KIM of SUWON-SI (KR) for samsung electronics co., ltd., ILKWON KIM of SUWON-SI (KR) for samsung electronics co., ltd., SANGGUL PARK of SUWON-SI (KR) for samsung electronics co., ltd., YOUNGGU KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/26, G06T5/50, G06T7/11, G06V10/774, G06V10/82
Abstract: a neural network device includes: (1) a pre-processor configured to select target images from scanning electron microscope (sem) images, based on frequencies respectively corresponding to the sem images, and crop each of the target images into a plurality of cropped images; (2) a neural network processor configured to generate a crop detection image by inferring a target object from each of the plurality of cropped images by using a segmentation model trained to detect the target object in each of the plurality of cropped images; and (3) a post-processor configured to merge crop detection images with each other in a same size as the sem images, based on position information of the plurality of cropped images.
Inventor(s): Stavros TSOGKAS of Toronto CA (US) for samsung electronics co., ltd., Fengjia ZHANG of Toronto (CA) for samsung electronics co., ltd., Aleksai LEVINSHTEIN of Thornhill (CA) for samsung electronics co., ltd., Allen Douglas JEPSON of Oakville (CA) for samsung electronics co., ltd.
IPC Code(s): G06V10/26, G06T5/00, G06T7/215, G06T7/254, G06T7/38, G06V10/77, G06V20/40
Abstract: the present disclosure provides methods, apparatuses, and computer-readable mediums for performing multi-frame de-fencing by a device. in some embodiments, a method includes obtaining an image burst having at least one portion of a background scene obstructed by an opaque obstruction. the method further includes generating a plurality of obstruction masks marking the at least one portion of the background scene obstructed by the opaque obstruction in images of the image burst. the method further includes computing a motion of the background scene, with respect to a keyframe selected from the plurality of images, by applying an occlusion-aware optical flow model. the method further includes reconstructing the selected keyframe by providing a combination of features to an image fusion and inpainting network. the method further includes providing, to the user, the reconstructed keyframe comprising an unobstructed version of the background scene of the image burst.
Inventor(s): Abdelrahman Abdelhamed of Scarborough (CA) for samsung electronics co., ltd., Michael S. Brown of Toronto (CA) for samsung electronics co., ltd., Abhijith Punnappurath of North York (CA) for samsung electronics co., ltd., Hoang Minh Le of Toronto (CA) for samsung electronics co., ltd., Luxi Zhao of Toronto (CA) for samsung electronics co., ltd.
IPC Code(s): G06V10/56, G06V10/141, G06V10/54
Abstract: a method for processing image data, including obtaining a raw input image that is captured using a first image sensor under an input illumination condition; obtaining, using a transform estimator, a color transform that maps a characteristic of the first image sensor to a characteristic of a second image sensor, based on the input illumination condition; and generating a raw output image having the characteristic of the second image sensor based on the raw input image and the color transform.
Inventor(s): Keehwan KA of Suwon-si (KR) for samsung electronics co., ltd., Seongjoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Yoonhee CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, A47J36/32, G06V20/68, G10K15/02, G11B27/036
Abstract: a cooking apparatus including: a chamber; a camera configured to photograph a cooking object placed in the chamber; and a controller to be electrically connected to the camera, the controller configured to: control the camera to acquire a plurality of image frames of the cooking object while cooking is being performed; identify a change in a state of the cooking object in the chamber from the acquired plurality of image frames; extract a portion of image frames among the acquired plurality of image frames based on the change in the state of the cooking object; and add a sound corresponding to the change in the state of the cooking object to the extracted portion of image frames to generate a summary video of a cooking process.
Inventor(s): Hyosang KIM of Suwon-si (KR) for samsung electronics co., ltd., Younguk KIM of Suwon-si (KR) for samsung electronics co., ltd., Yehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanwon SEO of Suwon-si (KR) for samsung electronics co., ltd., Hyein HYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V30/148, G06V10/94, G06V20/62, G06V30/19
Abstract: a method performed by a server, may include: obtaining an image including a first text and a second text overlapping the first text; separating a first text region corresponding to the first text from the image; extracting pixels corresponding to the first text from the first text region to obtain an undamaged portion and a damaged portion of the first text; and reconstructing the first text by inpainting the damaged portion of the first text in which the first text overlaps the second text in the image.
Inventor(s): Seokjung YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G08B17/12, F24C7/08, F24C15/00, G06V10/56, G06V20/52
Abstract: a cooking apparatus comprises: a cooking chamber configured to accommodate objects to be cooked; a camera configured to photograph the inside of the cooking chamber; an output interface; a memory configured to store at least one instruction; and at least one processor, wherein the at least one processor is configured to execute the at least one instruction to: detect a fire hazard during cooking based on a captured image obtained by the camera; and based on the detection of the fire hazard, outputting a fire hazard notification through the output interface.
Inventor(s): Unjeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Hojung Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungbin Son of Seoul (KR) for samsung electronics co., ltd., Suyeon Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20, G06T7/90
Abstract: an operating method of a calibration system for a display device obtains image information about an image displayed on display device and wavelength information about pixels of the image information using a hyperspectral camera included in an electronic device, transmits the obtained image information and wavelength information to a first application in the electronic device, generates calibration data about the obtained image information and wavelength information through the first application and transmits the calibration data to a second application in the display device, and performs color calibration of the display device based on the calibration data transmitted to the second application to display a color calibrated image.
Inventor(s): Jaesung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungbae BAE of Suwon-si (KR) for samsung electronics co., ltd., Joongyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Taewoong LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3208, H10K59/38
Abstract: an electronic device is provided. the electronic device includes a display, at least one optical sensor, a display driver, at least one processor, and a memory. the display includes a plurality of pixels, and a plurality of color filters disposed on top of the plurality of pixels. the at least one optical sensor may generate an ultraviolet light exposure value in accordance with the exposure of the plurality of color filters to ultraviolet light. the display driver may control the driving of the display. the at least one processor may control the driving of the display driver. the memory may be operatively connected to the at least one processor. the memory may store instructions which, when executed, allow the at least one processor to calculate a radiation amount based on the value of exposure to ultraviolet rays and exposure time, and compensate color deviation of the plurality of pixels in accordance with deterioration of the plurality of color filters based on the radiation amount.
Inventor(s): Jisun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seolhee KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L13/02, G10L25/00
Abstract: disclosed are an electronic device and a method of controlling a text-to-speech (tts) rate. an electronic device may include a processor, and a memory configured to store instructions to be executed by the processor. the processor may receive a voice signal of a user. the processor may calculate a speaking rate of the voice signal based on the voice signal. the processor may generate an output text to be output to the user based on the voice signal. the processor may determine a tts rate of the output text based on the speaking rate. the processor may convert the output text into voice data based on the tts rate and output the voice data.
Inventor(s): Tapas Kanungo of Redmond WA (US) for samsung electronics co., ltd., Qingxiaoyang Zhu of Woodland CA (US) for samsung electronics co., ltd., Nehal A. Bengre of Cupertino CA (US) for samsung electronics co., ltd.
IPC Code(s): G10L15/18, G10L15/06, G10L15/197, G10L15/22, G10L15/30
Abstract: a method includes receiving, by at least one processing device of an electronic device, an utterance provided by a user. the method also includes delexicalizing at least a portion of the utterance using a named entity database stored on the electronic device to create an encoded utterance. the method further includes transmitting the encoded utterance to a server on which a language model is stored. the method also includes receiving an intent and one or more slots associated with the utterance, where at least one slot of the one or more slots is a representative tag. the method further includes identifying a named entity corresponding to the at least one slot based on the named entity database. in addition, the method includes performing an action based on the intent and the one or more slots.
Inventor(s): Yoonju LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/18
Abstract: according to an embodiment, an electronic device comprises a microphone and at least one processor operatively connected with the microphone, wherein the processor is configured to obtain one or more commands corresponding to a first utterance obtained through the microphone, based on the first utterance, execute an operation corresponding to a first command having a highest confidence score for the first utterance among the one or more commands, identify that a second utterance obtained through the microphone is an utterance for correcting the operation corresponding to the first command, based on the second utterance, determine a second command having another highest confidence score for the second utterance among the one or more commands except for the first command, based on identifying that the second utterance is the utterance for correcting the operation corresponding to the first command, and execute another operation corresponding to the second command that is determined.
Inventor(s): Taegu KIM of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyung YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/26, G06F16/9032, G10L15/22
Abstract: a method includes receiving a designated event related to a second application while an execution screen of a first application is displayed on a display. the method also includes executing an artificial intelligent application in response to the designated event. the method further includes transmitting data related to the designated event to an external server, based on the executed artificial intelligent application. additionally, the method includes sensing a user utterance related to the designated event for a designated period of time. the method also includes transmitting the user utterance to the external server. the method further includes receiving an action order for performing a function related to the user utterance from the external server. the method also includes executing the second application at least based on the received action order. the method further includes outputting a result of performing the function by using the second application.
Inventor(s): Lava Kumar PULLURU of Bengaluru (IN) for samsung electronics co., ltd., Gopi Sunanth Kumar Gogineni of Bengaluru (IN) for samsung electronics co., ltd., Manish Chandra Joshi of Bengaluru (IN) for samsung electronics co., ltd., Pushp Khatter of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G11C7/10, G11C7/12, G11C7/22
Abstract: various example embodiments of the inventive concepts include a sram apparatus including a left memory array and right memory array, each of the left memory array and the right memory array including a left memory array and a right memory array, each comprising a plurality of columns, the plurality of columns in each of the left memory array and the right memory array divided into a plurality of segments, and each of the segments comprising a plurality of memory bit cells, and central driver circuitry comprising a plurality of driver devices, each of the plurality of driver devices communicatively connected to a corresponding segment of the plurality of segments through a corresponding metal control line of a plurality of metal control lines, the central driver circuitry configured to route at least one array signal to at least one segment of the plurality of segments.
Inventor(s): Younghwa KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10
Abstract: a memory device supporting otf latency includes a plurality of signal pins connected to a plurality of signal lines; and a control logic circuit configured to receive an otf command including a command latency (cdl) value indicating the otf latency through command lines among the plurality of signal lines, and control an operation of the memory device to be performed based on the otf latency and a time point at which the otf command is applied.
Inventor(s): Hyungjin Kim of Seoul (KR) for samsung electronics co., ltd., Jungsik Park of Suwon-si (KR) for samsung electronics co., ltd., Soongmann Shin of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10, G11C8/18
Abstract: in an apparatus, a memory controller, a memory device, and a method for switching frequencies of clock signals to reduce power consumption, when the memory device performs an internal operation according to a command of the memory controller, a frequency of a clock signal of the memory controller is changed. the memory controller switches the frequency of the clock signal to a low frequency according to assertion of a status signal that indicates a busy operation status of the memory device according to the command, and switches the frequency of the clock signal to a high frequency according to de-assertion of the status signal that indicates a ready operation status of the memory device.
Inventor(s): You Hwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyung Duk Lee of Suwon-si (KR) for samsung electronics co., ltd., Ho-Sung Ahn of Suwon-si (KR) for samsung electronics co., ltd., Youn-Soo Cheon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/24, G11C7/10
Abstract: a storage device, a non-volatile memory device, and a method of operating the non-volatile memory device are provided. the storage device includes a storage controller configured to send a command and program data including a pattern of one or more bits, a non-volatile memory device configured to receive the command and the program data, and a pattern monitoring circuit configured to monitor a pattern of the program data sent from the storage controller. the pattern monitoring circuit is configured to send an abnormal status check bit to the storage controller when the program data includes repeated patterns that are repeated a preset number of times or more, and the storage controller is configured to resend the program data to the non-volatile memory device in response to receiving the abnormal status check bit.
Inventor(s): YOON-JOO EOM of Hwaseong-si (KR) for samsung electronics co., ltd., SEUNGJUN BAE of Hwaseong-si (KR) for samsung electronics co., ltd., HYE JUNG KWON of Seoul (KR) for samsung electronics co., ltd., YOUNG-JU KIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4093, G11C5/14, G11C7/02, G11C7/10, G11C7/14, G11C7/20, G11C11/4072, G11C11/4074, G11C11/4076, G11C11/408, G11C11/4091, G11C11/4096, G11C29/02, G11C29/50
Abstract: a memory device may include a first data line driver circuit that generates a first reference voltage set based on a first code and a second code associated with a first data line, and determines bit values of the first input data received through the first data line, based on the first reference voltage set. a second data line driver circuit may similarly generate a second reference voltage set. the reference voltages may have levels based on a decision feedback equalization (dfe) technique to reduce bit errors otherwise caused by inter symbol interference.
Inventor(s): KYUWON CHOI of SUWON-SI (KR) for samsung electronics co., ltd., CHANHO LEE of SUWON-SI (KR) for samsung electronics co., ltd., HYEONGCHEOL KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4099, G11C11/4091, G11C11/4094
Abstract: a static random access memory includes a memory cell that stores data, a reference voltage generator that generates a reference voltage, a precharge circuit that is connected with the memory cell through a bit line, is connected with the reference voltage generator through a reference bit line, and pre-charges the bit line and the reference bit line, and a sense amplifier that is connected with the bit line and the reference bit line, compares a voltage of the bit line and a voltage of the reference bit line to generate a comparison result, and determines a value of the data stored in the memory cell based on the comparison result. the reference voltage generator includes first-type transistors.
Inventor(s): Seungyeon Kim of Seoul (KR) for samsung electronics co., ltd., Daeseok Byeon of Seongnam-si (KR) for samsung electronics co., ltd., Pansuk Kwak of Goyang-si (KR) for samsung electronics co., ltd., Hongsoo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/24, G11C5/06, G11C16/26, H10B41/27, H10B43/27
Abstract: a memory device includes; a memory cell array including a first memory block and a second memory block adjacently disposed in a first direction, driving signal lines respectively corresponding to vertically stacked word lines, and a pass transistor circuit including an odd number of pass transistor groups and connected between the driving signal lines and the memory cell array. one of the odd number of pass transistor groups includes a first pass transistor connected between a first word line of the first memory block and a first driving signal line among the driving signal lines, and a second pass transistor connected between a first word line of the second memory block and the first driving signal line adjacently disposed to the first pass transistor in a second direction.
Inventor(s): Seungjun Oh of Suwon-si (KR) for samsung electronics co., ltd., Seong Geon Lee of Suwon-si (KR) for samsung electronics co., ltd., Dae-Won Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyungduk Lee of Suwon-si (KR) for samsung electronics co., ltd., Youn-Soo Cheon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12, G11C29/42
Abstract: a method of operating a memory device includes reading a first page of memory cells containing at least one worn-out memory cell therein using a read voltage, from a first memory block, and reading a second page of memory cells, which extends adjacent to the first page in the first memory block, using the read voltage. an operation is performed to determine a match rate between a position of a column including a “0” bit in the first page with a position of a column including a “0” bit in the second page. thereafter, the second page is read by adjusting a read pass voltage applied to a word line of another page in the first memory block, when the match rate exceeds a threshold match rate.
Inventor(s): Sungmeen MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Seok Ju YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungchul JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/36, G11C29/00, G11C29/44
Abstract: a method and memory device with in-memory computing defection detection is disclosed. a memory device includes a memory including banks, wherein each bank includes a respective plurality of bit-cells, an in-memory computation (imc) operator configured to perform an imc operation between first data while the first data is in the bit-cells of the memory and second data received as input to the memory device, wherein the banks share the operator, and wherein the memory device is configured to: generate a first test pattern that is stored in the memory and generate a second test pattern applied to the imc operator, and based thereon determine whether a defect has occurred in either the memory or the operator, and perform a repair based on the determination that a defect has occurred.
Inventor(s): SeungWan YOO of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Dohyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehong PARK of Suwon-si (KR) for samsung electronics co., ltd., Dong-Chan LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/20, H01J37/317
Abstract: an ion beam deposition method includes placing a substrate into an ion beam deposition apparatus, irradiating an ion beam from an ion beam source toward a target plate, and rotating the target plate during the irradiating of the ion beam. the target plate includes a first region that includes a first material, and a second region that includes a second material different from the first material.
Inventor(s): Hyun-Sik HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung BANG of Suwon-si (KR) for samsung electronics co., ltd., Sungil CHO of Suwon-si (KR) for samsung electronics co., ltd., Junghwan UM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/3065, H01L21/311
Abstract: a dry etching apparatus includes a process chamber; a support provided in the process chamber and configured to support a substrate; a gas supply configured to supply a process gas including a hydrogen gas (h2) and a fluorocarbon gas (cxfy) into the process chamber; a plasma source configured to generate plasma using the process gas in the process chamber, wherein the support includes: an electrostatic chuck on which the substrate is disposed; an edge ring provided along a circumference of the electrostatic chuck and supporting an edge region of the substrate; an adhesive gel pad provided between the electrostatic chuck and the edge ring; and a coating layer formed only on a surface of the edge ring, which is exposed to the plasma.
20240071737.PLASMA SENSOR MODULE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungwon Cho of Suwon-si (KR) for samsung electronics co., ltd., Dohoon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Kyunghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Dougyong Sung of Suwon-si (KR) for samsung electronics co., ltd., Jungmo Yang of Suwon-si (KR) for samsung electronics co., ltd., Younseon Wang of Suwon-si (KR) for samsung electronics co., ltd., Younsok Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, G01N9/00
Abstract: a plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (pcb). the upper substrate may be configured to be exposed to plasma. the lower substrate may contact a lower surface of the upper substrate. the lower substrate may have a thickness that is thicker than a thickness of the upper substrate. the probe may be in the lower substrate. the pcb may be in the lower substrate. the pcb may be configured to apply an alternating current to the probe to detect a density of the plasma. thus, the structural strength of the plasma sensor module may have improved structural strength.
Inventor(s): Moosong LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangho YUN of Suwon-si (KR) for samsung electronics co., ltd., Hyoungkook Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, H01L21/449, H01L21/67
Abstract: a method of manufacturing a semiconductor device. the method includes providing a viscous solution to a wafer, spinning the wafer to coat at least a portion of the wafer with the viscous solution, and treating the wafer coated with the viscous solution, by using an acoustic wave, wherein a frequency of the acoustic wave and an eigenfrequency of the wafer coated with the viscous solution are same.
Inventor(s): Sang - Il CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yeong Jun JO of Suwon-si (KR) for samsung electronics co., ltd., Seong Gi JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/304, B23K26/0622, H01L21/683
Abstract: a semiconductor device fabrication apparatus including a grinder comprising a grinding part, the grinding part configured to grind a first surface of a substrate, a laser emitter configured to emit a femtosecond pulse laser to the first surface of the substrate transferred from the grinder, and a mount configured to attach a die attach film to the first surface of the substrate transferred from the laser emitter, wherein the grinding part is configured to grind the first surface of the substrate, which has been introduced into the grinder, and the laser emitter is configured to emit the femtosecond pulse laser to the ground first surface of the substrate may be provided.
Inventor(s): Youngwoo KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Yonghan PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiho PARK of Suwon-si (KR) for samsung electronics co., ltd., Geumjung SEONG of Suwon-si (KR) for samsung electronics co., ltd., Seunguk HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/311, H01L21/308
Abstract: a method of manufacturing an integrated circuit device includes preparing a semiconductor substrate having an active area and a field area, sequentially forming a lower insulation layer, a buried layer, a first sacrificial layer, a second sacrificial layer, and a third sacrificial layer on the semiconductor substrate, removing a portion of the third sacrificial layer to form a first sacrificial pattern, removing a portion of the second sacrificial layer and the first sacrificial pattern to form a second sacrificial pattern, removing a portion of the first sacrificial layer and the second sacrificial pattern to form a third sacrificial pattern, removing a portion of the buried layer and the third sacrificial pattern to form a buried pattern, and removing a portion of the lower insulation layer and a portion of the semiconductor substrate by using the buried pattern as an etch mask to form a word line trench.
Inventor(s): Tae Soon KANG of Suwon-si (KR) for samsung electronics co., ltd., Jin Hee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67
Abstract: a method of manufacturing a semiconductor device may comprise loading a first substrate and a second substrate into a substrate processing apparatus, wherein the first substrate is loaded into a first chamber and the second substrate is loaded into a second chamber on the first chamber, and processing the loaded first substrate and the loaded second substrate, wherein the substrate processing apparatus comprises, the first and second chambers, a first pipe through which a first processing solution supplied to the first chamber to process the first substrate is moved, a second pipe through which a second processing solution supplied to the second chamber to process the second substrate is moved, and a temperature adjusting pipe configured to surround at least a part of the first pipe, through which the temperature adjusting solution adjusting a temperature of the first processing solution is moved, wherein a length of the first pipe is shorter than a length of the second pipe.
20240071806.APPARATUS FOR HEATING WAFER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeongdu Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunghyup Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyoun Park of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Hwang of Suwon-si (KR) for samsung electronics co., ltd., Dahee Jin of Suwon-si (KR) for samsung electronics co., ltd., Geonsoo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/687, H01L21/67
Abstract: an apparatus for heating a wafer includes a heater, a heating block on an upper surface of the heater, and a plurality of support protrusions protruding from an upper surface of the heating block, wherein the upper surface of the heating block has a curved shape with a concave central portion, and at least the support protrusion at the central portion of the heating block, among the plurality of support protrusions, is configured to be deformed in response to heating by the heater.
Inventor(s): Eun Hyea KO of Suwon-si (KR) for samsung electronics co., ltd., Hoon Han of Suwon-si (KR) for samsung electronics co., ltd., Byung Keun Hwang of Suwon-si (KR) for samsung electronics co., ltd., Young Hun Sung of Suwon-si (KR) for samsung electronics co., ltd., Youn Joung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/762, H01L21/8238
Abstract: provided is a method of fabricating a semiconductor device. the method of fabricating a semiconductor device comprises forming a first layer which has a first surface, does not comprise an acid, and comprises a metal material; forming, on the first layer, a second layer which comprises a trench exposing the first surface, has a second surface intersecting the first surface within the trench, and comprises an acid and an organic material; providing a first precursor comprising an alkoxy group and silicon; and forming a third layer comprising silicon oxide on the second surface within the trench. the third layer is in contact with a portion of the first surface within the trench.
Inventor(s): Sumin PARK of Suwon-si (KR) for samsung electronics co., ltd., Taeseong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyung PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyuha LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeojin LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwangjin MOON of Suwon-si (KR) for samsung electronics co., ltd., Hojin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, B24B37/013, G06F30/392, H01L23/00
Abstract: in a manufacturing method of a wafer, the method including: an operation of preparing a wafer including a semiconductor chip region and a test region, measuring a measurement region included in the test region with an atomic force microscope (afm), the measurement region including a plurality of metal lines having a constant line width and a constant pitch; determining a surface roughness value of the test region based on a result of the measuring of the measurement region; determining a step difference value of the metal lines of the test region based on the surface roughness value; and determining a step difference value of bonding pads in the semiconductor chip region based on the step difference value of the metal lines.
Inventor(s): Jaesun KIM of Suwon-si (KR) for samsung electronics co., ltd., Yunseok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Youngbae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00, H01L23/498, H01L25/10
Abstract: a semiconductor package includes: a redistribution layer including a plurality of conductive lines; a plurality of conductive vias each connected to at least one of the plurality of conductive lines; and a plurality of lower pads each connected to one of the plurality of conductive vias; a semiconductor chip on the redistribution layer; and a plurality of external connection terminals attached to the plurality of lower pads; and a plurality of electrical paths, wherein each of the plurality of electrical paths includes at least one of the plurality of conductive lines and at least one of the plurality of conductive vias. the plurality of electrical paths is configured for testing the plurality of conductive lines and the plurality of conductive vias and is connected to at least four of the external connection test terminals.
20240071866.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): CHEOL KIM of SUWON-SI (KR) for samsung electronics co., ltd., SEOKHYUN LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/433, H01L23/00, H01L23/31, H01L23/498, H01L25/10
Abstract: a semiconductor package includes a package substrate, a first semiconductor chip, and an encapsulant surrounding the semiconductor chip. the first semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite to the active surface, the semiconductor chip disposed on the package substrate such that the active surface faces the package substrate. the semiconductor package further includes a first redistribution structure on the encapsulant. the first redistribution structure includes a thermally conductive pattern, a heat-conducting through via providing a path for heat to conduct from the semiconductor substrate to the thermally conductive pattern, and a redistribution insulating layer surrounding the heat-conducting through via. the semiconductor substrate includes a first contact region having a higher temperature than a surrounding area on the inactive surface, and the heat-conducting through via passes through the encapsulant and contacts the first contact region.
20240071882.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seongho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Juyoun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/373, H01L25/065
Abstract: a semiconductor package may include a package substrate and a silicon-free interposer. the silicon-free interposer may include a second core layer, first interposer through electrodes passing through the second core layer and connected to the first core through electrodes, and second interposer through electrodes passing through the second core layer and connected to the second core through electrodes. diameters of the first core through electrodes may be different from diameters of the second core through electrodes, and diameters of the first interposer through electrodes may be different from diameters of the second interposer through electrodes.
Inventor(s): Seongho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonseok SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/552
Abstract: a package substrate includes a plurality of sequentially stacked insulating layers, a first signal line configured to transmit a first signal therethrough, and a ground line. the first signal line including a first signal via at least partially penetrating the plurality of insulating layers, a first signal pad provided at one end of the first signal via in any selected one of the insulating layers, and a first signal wiring extending from the first signal pad in the selected insulating layer. the ground line including a ground via at least partially penetrating the plurality of insulating layers, a ground pad provided at one end of the ground via in the selected insulating layer, a ground wiring extending from the ground pad in the selected insulating layer, and a ground stub extending from the ground pad toward the first signal via or the first signal pad.
Inventor(s): Hyeonjeong Hwang of Suwon-si (KR) for samsung electronics co., ltd., Dongkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyounglim Suk of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498
Abstract: a packaged integrated circuit includes a redistribution layer having a plurality of electrically conductive vias extending at least partially therethrough, and a plurality of lower pads electrically connected to corresponding ones of the plurality of electrically conductive vias. a semiconductor chip is provided on the redistribution layer, and external connection terminals are provided, which electrically contact corresponding ones of the plurality of lower pads within the redistribution layer. each of the plurality of lower pads includes: (i) a lower under-bump metallization (ubm) layer in contact with a corresponding external connection terminal, and (ii) an upper ubm layer extending on and contacting the lower ubm layer. in addition, an upper surface of the lower ubm layer has a greater lateral width dimension relative to an upper surface of the upper ubm layer, which contacts a corresponding electrically conductive via.
20240071895.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seoeun KYUNG of Suwon-si (KR) for samsung electronics co., ltd., Byung Ho KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jae-Ean LEE of Suwon-si (KR) for samsung electronics co., ltd., Dahee KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/538, H01L25/10, H01L25/18
Abstract: a semiconductor package may include a lower redistribution layer including a lower wiring and a lower via, an embedded region on the lower redistribution layer, a core layer on the lower redistribution layer and including a core via, and an under bump structure including an under bump pad on a lower surface of the lower redistribution layer and an under bump via connecting the lower wiring and the under bump pad, the under bump pad may overlap the under bump via, the lower via, and the core via in a plan view, and the under bump via may be spaced apart from at least one of the lower via and the core via in the plan view.
20240071896.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin Won CHAE of Suwon-si (KR) for samsung electronics co., ltd., Moon Gil JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Bae KIM of Suwon-si (KR) for samsung electronics co., ltd., So Yoen PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyung Jun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L23/31, H01L25/10
Abstract: a semiconductor package includes a redistribution substrate having a first side and an opposite second side. a plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. a plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. a plurality of solder balls are on the second side of the redistribution substrate. each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. the fourth side has a square or octagonal shape in plan view.
Inventor(s): Gyuho KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyungjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Seonghoon BAE of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuck OH of Suwon-si (KR) for samsung electronics co., ltd., Kwangok JEONG of Suwon-si (KR) for samsung electronics co., ltd., Juil CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/538, H01L25/10
Abstract: provided is a semiconductor package. the semiconductor package including a redistribution structure including a plurality of redistribution conductive patterns, a plurality of conductive vias connected to at least one of the plurality of redistribution conductive patterns, a plurality of lower pads connected to the plurality of conductive vias, and a plurality of redistribution insulation layers and the plurality of redistribution conductive patterns alternating each other, a semiconductor chip arranged on the redistribution structure, and an external connection terminal attached to the plurality of lower surface pads of the redistribution structure, wherein each of the plurality of redistribution conductive patterns includes a metal layer including copper and a skin layer arranged on an upper surface of the metal layer and including copper and nickel, may be provided.
Inventor(s): Ah Reum LEE of Suwon-si (KR) for samsung electronics co., ltd., Woo Sung YANG of Suwon-si (KR) for samsung electronics co., ltd., Ji Mo GU of Suwon-si (KR) for samsung electronics co., ltd., Jao Ho KIM of Suwon-si (KR) for samsung electronics co., ltd., Suk Kang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/48, H01L23/528, H10B43/27, H10B43/35
Abstract: a semiconductor device includes first and second substrates connected to each other. the second substrate includes a plate layer having first and second faces. gate electrode layers are disposed on the first face of the plate layer. channel structures extend through the gate electrode layers. word-line cutting structures extend through the gate electrode layers and are spaced apart from each other. via structures are disposed on the second face of the plate layer. via connecting structures are disposed on the top face of the via structures. a width of the bottom face of each of the via structures is greater than a width of the top face of each of the via structures. a width of the bottom face of each of the via connecting structures is less than a width of the top face of each of the via connecting structures.
Inventor(s): Minkyu CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang SIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L25/065
Abstract: a semiconductor device may include a first structure, a second structure on the first structure, and gate contact plugs penetrating through the first and second structures. the first structure may include a first stack structure including first gate layers and first insulating layers alternately stacked, a first pad capping pattern penetrating through at least a first portion of the first stack structure, and a first buffer capping pattern penetrating through at least a second portion of the first stack structure and spaced apart from the first pad capping pattern. the second structure may include a second stack structure including second gate layers and second insulating layers alternately stacked, and a second pad capping pattern penetrating through at least a portion of the second stack structure. the first gate layers may include first gate pads covered by the first pad capping pattern.
20240071923.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minjun SONG of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Joongwon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Nara LEE of Suwon-si (KR) for samsung electronics co., ltd., Jimin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/00, H01L23/522, H01L23/532, H01L25/065, H10B80/00
Abstract: a semiconductor device may include lower metal wirings on a substrate, a first upper insulating interlayer on the lower metal wirings, a first upper wiring including a first upper via in the first upper insulating interlayer and a first upper metal pattern on the first upper insulating interlayer. the semiconductor device may also include a second upper insulating interlayer on the first upper insulating interlayer, an uppermost wiring including an uppermost via in the second upper insulating interlayer, an uppermost metal pattern on the second upper insulating interlayer, and an oxide layer for supplying hydrogen on the second upper insulating interlayer. the lower metal wirings may be stacked in a plurality of layers. the oxide layer for supplying hydrogen may cover the uppermost wiring. a thickness of the uppermost via may be less than 40% of a thickness of the uppermost metal pattern.
Inventor(s): Jungil PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon AHN of Suwon-si (KR) for samsung electronics co., ltd., Yunki CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L23/522, H01L23/532
Abstract: an integrated circuit device includes an interconnection structure that includes: an interlayer insulating layer arranged on a substrate and having a plurality of trenches; a first conductive layer formed inside a first trench of the plurality of trenches; a second conductive layer formed inside a second trench of the plurality of trenches, wherein the second trench is spaced apart from the first trench; a third conductive layer formed inside a third trench of the plurality of trenches, wherein the third trench is spaced apart from the second trench; and a dielectric layer formed between the first conductive layer and the second conductive layer, wherein a portion of interlayer insulating layer is disposed between the second conductive layer and the third conductive layer, and wherein a first width of the first conductive layer is greater than a second width of the second conductive layer.
Inventor(s): Young kun JEE of Suwon-si (KR) for samsung electronics co., ltd., Jihwan HWANG of Suwon-si (KR) for samsung electronics co., ltd., Chungsun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00
Abstract: a semiconductor chip including a semiconductor substrate having first and second surfaces, a transistor on the first surface, a first interlayer dielectric layer on the transistor, a second interlayer dielectric layer on the first interlayer dielectric layer, a wiring line in the second interlayer dielectric layer, a first conductive pad on the second interlayer dielectric layer, a first passivation layer on the second interlayer dielectric layer, a second conductive pad in the first passivation layer, a through via penetrating the semiconductor substrate and the first interlayer dielectric layer to come into connection with the wiring line, a second passivation layer on the second surface, and a third conductive pad in the second passivation layer and connected to the through via. the first passivation layer has a first thickness 0.4 to 0.6 times a second thickness between the first surface and a top surface of the second passivation layer.
20240071943.SEMICONDUCTOR PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunseok Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/498, H01L23/64, H01L25/065, H10B80/00
Abstract: a semiconductor package includes a substrate having a cavity, a bridge chip structure in the cavity of the substrate and including a first bridge chip and a second bridge chip stacked on the first bridge chip, and a plurality of semiconductor chips spaced apart laterally on the substrate. each of the plurality of semiconductor chips includes a first region that is electrically connected to the first bridge chip and a second region that is electrically connected to the second bridge chip.
Inventor(s): Gunho CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L23/498, H10B80/00
Abstract: a semiconductor package including a substrate comprising a plurality of vias; a chip stack on the substrate; and a mold layer on the substrate and on at least a portion of the chip stack. the chip stack includes a first semiconductor chip; second semiconductor chips stacked on the first semiconductor chip; a third semiconductor chip on the uppermost one of the second semiconductor chips; and non-conductive layers between the first semiconductor chip and the second semiconductor chips. a first chip pad of the first semiconductor chip is bonded to a substrate pad of the substrate. a second chip pad of the uppermost one of the second semiconductor chips is bonded to a third chip pad of the third semiconductor chip. each of the second semiconductor chips is electrically connected to another of the second semiconductor chips or the first semiconductor chip.
20240071983.SOLDER BALL ATTACHING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bongken YU of Suwon-si (KR) for samsung electronics co., ltd., Cheolsoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Kwangjin BAE of Suwon-si (KR) for samsung electronics co., ltd., Youngjin JANG of Suwon-si (KR) for samsung electronics co., ltd., Inwook JUNG of Suwon-si (KR) for samsung electronics co., ltd., Minchul CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B23K3/06
Abstract: a solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. the working die may be provided with an upper plate on which the lifting members are installed. the upper plate may be provided with an insertion groove, into which an upper end portion of the lifting member is inserted when the lifting member is lowered, and a locking groove into which a lower end portion of the lifting member is inserted when the lifting member is raised. the lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed.
Inventor(s): Raeyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Minki Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyuekjae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498, H01L23/522, H01L23/538
Abstract: a semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode, and a second semiconductor chip including a second semiconductor layer on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad below the wiring pad and in contact with the first bonding pad, wherein the second bonding pad includes a protrusion protruding toward the wiring pad.
Inventor(s): Wonil SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498, H01L25/00, H10B80/00
Abstract: a semiconductor package includes a redistribution wiring layer having redistribution wirings stacked in at least two levels; a first semiconductor chip arranged on the redistribution wiring layer; a plurality of second semiconductor chips arranged on the first semiconductor chip; first conductive wires electrically connecting first chip pads of the first semiconductor chip and the redistribution wirings of the redistribution wiring layer; second conductive wires electrically connecting second chip pads of the plurality of second semiconductor chips and the redistribution wirings of the redistribution wiring layer; and a sealing unit disposed on the redistribution wiring layer.
20240071997.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonghyun BAEK of Suwon-si (KR) for samsung electronics co., ltd., In LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498, H01L23/538, H10B80/00
Abstract: a semiconductor package includes: a substrate that includes a wiring circuit; an interposer on the substrate, wherein the interposer includes a first side and a second side opposing each other and a third side and a fourth side between the first side and the second side, and wherein the interposer includes an interconnect circuit electrically connected to the wiring circuit; a first and second buffer chips on the interposer; a first chip stack adjacent to the first side of the interposer and connected to the first buffer chip; a second chip stack adjacent to the second side of the interposer and connected to the second buffer chip; a third chip stack adjacent to the third side of the interposer, and wherein the third chip stack includes first and second groups of semiconductor chips, which are electrically connected to the first and second buffer chips, respectively, via the interconnect circuit.
20240072000.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin-Woo PARK of Suwon-si (KR) for samsung electronics co., ltd., Un-Byoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Chung Sun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498, H01L25/10
Abstract: a semiconductor package includes a substrate; a substrate pad on the substrate; a first semiconductor chip and a second semiconductor chip on the substrate; a connective terminal between the substrate pad and the first semiconductor chip and between the substrate pad and the second semiconductor chip; a dummy pad on the substrate, and spaced apart from the substrate pad, wherein the dummy pad is between the first semiconductor chip and the second semiconductor chip; and an underfill material layer interposed between the substrate and the first semiconductor chip and between the substrate and the second semiconductor chip, wherein the dummy pad and the substrate pad include a same material.
Inventor(s): HYUEKJAE LEE of SUWON-SI (KR) for samsung electronics co., ltd., MINKI KIM of SUWON-SI (KR) for samsung electronics co., ltd., SEUNGDUK BAEK of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L25/10
Abstract: a semiconductor device includes a first chip and a second chip stacked on the first chip. the first chip includes a first substrate, a first upper pad on an upper surface of the first substrate, a first upper insulating layer surrounding a lower portion of the first upper pad and a sacrificial layer surrounding an upper portion of the first upper pad. the second chip includes a second substrate, a second upper pad on an upper surface of the second substrate and a second upper insulating layer surrounding the second upper pad, wherein a thickness of the second upper pad is less than a thickness of the first upper pad.
20240072006.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): WON IL LEE of Suwon-si (KR) for samsung electronics co., ltd., HYUNGCHUL SHIN of Suwon-si (KR) for samsung electronics co., ltd., GWANGJAE JEON of Suwon-si (KR) for samsung electronics co., ltd., ENBIN JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498
Abstract: a semiconductor package includes a first semiconductor chip including a first main region and a first edge region, and a second semiconductor chip on the first semiconductor chip and including a second main region and a second edge region. the first semiconductor chip includes a first main pad and a first dummy pad respectively on the first main region and the first edge region on a top surface of the first semiconductor chip. the second semiconductor chip includes a first semiconductor substrate, a wiring layer below the first semiconductor substrate and including a wiring dielectric layer and wiring patterns, a second main pad and a second dummy pad respectively on the second main region and the second edge region below the wiring layer. a thickness of the wiring layer is greater on the second main region than on the second edge region.
20240072007.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): In Lee of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498
Abstract: a semiconductor package includes a base substrate, a first semiconductor chip mounted on the base substrate, and a second semiconductor chip mounted on the first semiconductor chip. the first semiconductor includes first conductive connection structures that have a first pitch interval in a first direction and a second pitch interval in a second direction, and the second semiconductor chip includes second conductive connection structures that have the first pitch interval in the first direction and the second pitch interval in the second direction. the first conductive connection structures include first power connection structures, first ground connection structures, and first dummy structures. the first ground connection structure or the first dummy structure is between two first power connection structures neighboring in the first direction and between two first power connection structures neighboring in the second direction among the first power connection structures.
Inventor(s): Kiho KONG of Suwon-si (KR) for samsung electronics co., ltd., Junhee Chol of Suwon-si (KR) for samsung electronics co., ltd., Eunsung Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/075, H01L33/00, H01L33/10, H01L33/14, H01L33/62
Abstract: an ultra-high pixel per inch (ppi) micro-light-emitting diode (led) display includes a micro-led layer including a plurality of micro-leds, a backplane layer including a switching device connected to the micro-led layer, and a field shielding member provided between the plurality of micro-leds and the switching device, the field shielding member configured to shield the switching device from a field applied to the switching device from the plurality of micro-leds during an operation of the micro-led display, where the micro-led layer and the backplane layer form a single body in a sequentially stacked structure.
20240072020.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JAE CHOON KIM of Suwon-si (KR) for samsung electronics co., ltd., Hwanjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunggu KANG of Suwon-si (KR) for samsung electronics co., ltd., SUNG-HO MUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H10B80/00, H01L23/31, H01L23/498, H01L23/538, H01L23/00
Abstract: a semiconductor package may include a lower structure, a first semiconductor chip on the lower structure, the first semiconductor chip including a hot spot, a second semiconductor chip horizontally spaced apart from the first semiconductor chip on the lower structure, and a connection chip in the lower structure and connecting the first and second semiconductor chips to each other. the hot spot may vertically overlap the connection chip.
Inventor(s): Seungchan Yun of Waterford NY (US) for samsung electronics co., ltd., Seungmin Song of Halfmoon NY (US) for samsung electronics co., ltd., Myunghoon Jung of Clifton Park NY (US) for samsung electronics co., ltd., Keumseok Park of Slingerlands NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/8234, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
Abstract: an integrated circuit device may comprise an upper transistor that is on a substrate. the upper transistor may comprise an upper channel region. the integrated circuit device may further comprise a lower transistor that is between the substrate and the upper transistor. the lower transistor may comprise a lower channel region. the integrated circuit device may further include an integrated insulator that is between the lower channel region and the upper channel region. the integrated insulator may comprise an outer layer and an inner layer in the outer layer, wherein the inner layer and the outer layer comprise different materials.
20240072056.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junggun You of Suwon-si (KR) for samsung electronics co., ltd., Gigwan Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/8238, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/78, H01L29/786
Abstract: a semiconductor device includes first and second active fins on first and second regions of a substrate, an isolation pattern on a boundary between the first and second regions and portions of the first and second regions adjacent thereto and separating the first and second active fins, a first gate structure on the first active fin and the isolation pattern on the first region, a second gate structure on the second active fin and the isolation pattern on the second region, a first source/drain layer on the first active fin adjacent to the first gate structure, and a second source/drain layer on the second active fin adjacent to the second gate structure. a width of a portion of the first gate structure overlapping the first active fin is greater than that of a portion of the second gate structure overlapping the second active fin.
Inventor(s): BYOUNGHAK HONG of Albany NY (US) for samsung electronics co., ltd., SEUNGHYUN SONG of Albany NY (US) for samsung electronics co., ltd., KI-IL KIM of Clifton Park NY (US) for samsung electronics co., ltd., GUNHO JO of Clifton Park NY (US) for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/12, H01L21/822, H01L21/8234, H01L21/84, H01L27/088
Abstract: nanosheet transistor devices are provided. a nanosheet transistor device includes a transistor stack that includes a lower nanosheet transistor having a first nanosheet width and a lower gate width. the transistor stack also includes an upper nanosheet transistor that is on the lower nanosheet transistor and that has a second nanosheet width and an upper gate width that are different from the first nanosheet width and the lower gate width, respectively. related methods of forming a nanosheet transistor device are also provided.
20240072081.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JAEKWAN SEO of SUWON-SI (KR) for samsung electronics co., ltd., NOSAN PARK of SUWON-SI (KR) for samsung electronics co., ltd., WONCHUN YANG of SUWON-SI (KR) for samsung electronics co., ltd., KIBUM YU of SUWON-SI (KR) for samsung electronics co., ltd., HARAM YU of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a pixel, a rear side anti-reflective layer on the pixel, a color filter on the rear side anti-reflective layer, a color filter cover layer on the color filter, a passivation layer on the color filter cover layer, a microlens on the passivation layer, a first capping layer on the microlens, and a second capping layer on the first capping layer.
Inventor(s): Youngjae Choi of Suwon-si (KR) for samsung electronics co., ltd., Sungho Suh of Suwon-si (KR) for samsung electronics co., ltd., Minsun Keel of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: provided are an image sensor package with improved reliability and a method of fabricating the same. the image sensor package includes: a package substrate; an image sensor chip provided on the package substrate, and including a pixel area and a peripheral area surrounding the pixel area; a dam in the peripheral area, the dam having a rectangular ring shape and surrounding the pixel area; a transparent cover provided on the dam and covering an upper portion of the image sensor chip; and a sealing material sealing the image sensor chip and covering side surfaces of the transparent cover. the dam includes a stress relaxation layer (srl) and a body layer on the srl, and the srl has a lower viscosity than a viscosity of the body layer.
Inventor(s): EUNSUB SHIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a shared pixel including a plurality of subpixels and a plurality of micro-lenses respectively disposed at upper portions of the plurality of subpixels. the shared pixel shares one color pattern, and a highest point of each of the plurality of micro-lenses is close to a center of the shared pixel.
20240072089.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kook Tae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jingyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Byeongtaek BAE of Suwon-si (KR) for samsung electronics co., ltd., Seunghwi YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor may include a substrate having a first surface and a second surface, which are opposite to each other, and micro lenses on the second surface, interconnection lines on the first surface, and a pixel isolation portion in the substrate, the pixel isolation portion configured to isolate pixels from direct contact with each other. the pixel isolation portion may include an insulating isolation pattern and a conductive pattern, wherein the conductive pattern is spaced apart from the substrate, and the insulating isolation pattern is between the substrate and the conductive pattern. the conductive pattern may include a sequential arrangement of a first conductive pattern, a second conductive pattern, and a third conductive pattern on a side surface of the insulating isolation pattern.
Inventor(s): MINHO JANG of SUWO-SI (KR) for samsung electronics co., ltd., DOOWON KWON of SUWON-SI (KR) for samsung electronics co., ltd., DOYEON KIM of SUWON-SI (KR) for samsung electronics co., ltd., KYUNGTAE LIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L23/00
Abstract: an image sensor includes a lower substrate having a first surface and a second surface opposing the first surface, lower circuit devices disposed on the first surface, a lower wiring structure electrically connected to the lower circuit devices on the first surface, a lower bonding pad on the second surface, a lower bonding via penetrating through the lower substrate between the lower bonding pad and the lower wiring structure, a landing structure disposed on the first surface and contacting the lower bonding via, an upper bonding pad bonded to the lower bonding pad on the lower bonding pad, and an upper substrate disposed on the upper bonding pad and including photoelectric conversion devices. at least a portion of the landing structure horizontally overlaps the lower circuit devices.
20240072092.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JUNGWOOK LIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a first chip including a first substrate having a plurality of pixels, and a first wiring structure, each of the plurality of pixels including first and second isolated photodiodes; a second chip including a second wiring structure, and a second substrate; and a third chip including a third wiring structure, and a third substrate having logic devices, wherein each of the plurality of pixels includes a first floating diffusion node on the first photodiode, a second floating diffusion node on the second photodiode, a third floating diffusion node between the first and second floating diffusion nodes on the second photodiode, and a first switching transistor on the second substrate, and wherein the first switching transistor is connected to the first floating diffusion node through the first and second wiring structures, and the third floating diffusion node through the first and second wiring structures.
Inventor(s): Jinjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Joosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongchul SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/15
Abstract: a multi-wavelength light-emitting device configured to emit light of a first wavelength, light of a second wavelength, and a third wavelength, includes a substrate, a first type semiconductor layer provided on the substrate, an active layer provided on the first type semiconductor layer, a second type semiconductor layer provided on the active layer, and an electrode provided on the second type semiconductor layer. the active layer includes a first active area configured to emit the light of the first wavelength, a second active area configured to emit the light of the second wavelength, and a third active area configured to emit the light of the third wavelength.
20240072105.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit device includes a transistor disposed on a substrate and a capacitor structure electrically connected with the transistor, wherein the capacitor structure includes a first electrode, a dielectric film composite disposed on the first electrode, and a second electrode disposed on the dielectric film composite, and the dielectric film composite includes a first dielectric film including an anti-ferroelectric material, a second dielectric filler distributed and disposed in the first dielectric film, the second dielectric filler including a ferroelectric material, and a third dielectric filler distributed and disposed in the first dielectric film, the third dielectric filler including a paraelectric material and having an average diameter which is less than an average diameter of the second dielectric filler.
20240072106.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/10, H10B53/30
Abstract: an integrated circuit device may include a transistor on a substrate, and a capacitor structure electrically connected to the transistor. the capacitor structure may include a first electrode, a dielectric layer structure on the first electrode, and a second electrode on the dielectric layer structure. the dielectric layer structure may include a plurality of first dielectric layers and a plurality of second dielectric layers which are alternately stacked. each of the plurality of first dielectric layers may include an anti-ferroelectric material, and each of the plurality of second dielectric layers includes hfzroin which 0<x<0.5, as a ferroelectric material. an x value may gradually change in a stack direction inside each of plurality of second dielectric layers.
Inventor(s): Gukhee Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeewoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangcheol Na of Suwon-si (KR) for samsung electronics co., ltd., Minchan Gwak of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Anthony Dongick Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L21/8234, H01L27/088
Abstract: a semiconductor device includes a substrate having a first and second active patterns therein, first and second source/drain patterns extending on the first and second active patterns, respectively, and an active contact on the first and second source/drain patterns. an upper contact is provided, which extends from the active contact towards the substrate, and between the first and second active patterns. a lower power interconnection line is provided, which is buried in a lower portion of the substrate and includes: a buried interconnection portion having a line shape, and a lower contact portion extending vertically from the buried interconnection portion to a bottom surface of the upper contact. a barrier pattern is provided, which extends between the lower contact portion and the upper contact, but not between the buried interconnection portion and the lower contact portion.
Inventor(s): Won Hyuk Lee of Incheon (KR) for samsung electronics co., ltd., Jong Chul Park of Seoul (KR) for samsung electronics co., ltd., Sang Duk Park of Hwaseong-si (KR) for samsung electronics co., ltd., Hong Sik Shin of Seoul (KR) for samsung electronics co., ltd., Do Haing Lee of Hwaseong-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/485, H01L23/522, H01L23/528, H01L29/66, H01L29/78
Abstract: a semiconductor device includes, first and second source/drain patterns on an active pattern and spaced apart from each other, a first source/drain contact on the first source/drain pattern and including a first source/drain barrier film and a first source/drain filling film on the first source/drain barrier film, a second source/drain contact on the second source/drain pattern, and a gate structure on the active pattern between the first and second source/drain contacts and including a gate electrode, wherein a top surface of the first source/drain contact is lower than a top surface of the gate structure, and a height from a top surface of the active pattern to a top surface of the first source/drain barrier film is less than a height from the top surface of the active pattern to a top surface of the first source/drain filling film.
20240072149.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younggwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Myunggil Kang of Suwon-si (KR) for samsung electronics co., ltd., Dongwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Beomjin Park of Suwon-si (KR) for samsung electronics co., ltd., Inu Jeon of Suwon-si (KR) for samsung electronics co., ltd., Soojin Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/06, H01L29/417, H01L29/66, H01L29/775, H01L29/786
Abstract: a semiconductor device includes a substrate including an active region extending in a first direction, a gate electrode layer crossing the active region and extending in a second direction, a plurality of channel layers on the active region, spaced apart from each other in a third direction, perpendicular to an upper surface of the substrate, and disposed sequentially from the active region, and surrounded by the gate electrode layer, gate spacer layers disposed on side surfaces of the gate electrode layer in the first direction, and source/drain regions disposed on the active region, on sides of the gate electrode layer, and connected to the plurality of channel layers. an uppermost channel layer among the plurality of channel layers includes channel portions separated from each other in the first direction and disposed below the gate spacer layers.
Inventor(s): Dukhyun CHOE of Suwon-si (KR) for samsung electronics co., ltd., Jinseong HEO of Seoul (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd., Sanghyun JO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/51, H01L29/78
Abstract: provided is a semiconductor device including a substrate on which a channel layer is provided, an insulation layer provided on the substrate, a ferroelectric layer provided on the insulation layer, a fixed charge region provided in the ferroelectric layer and containing charges of a predetermined polarity, and a gate provided on the ferroelectric layer. an absolute value of a charge density in the fixed charge region is greater than 0 and less than 5 �c/cm.
Inventor(s): Junhwa Song of Suwon-si (KR) for samsung electronics co., ltd., Changsik Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaewon Na of Suwon-si (KR) for samsung electronics co., ltd., Deokhwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H10B12/00
Abstract: a semiconductor device includes an upper conductive line on a substrate, a channel structure adjacent the upper conductive line, a gate dielectric film between the channel structure and the upper conductive line, and a conductive contact pattern electrically connected to the channel structure. the channel structure includes a main channel portion including an oxide semiconductor layer having a first composition, and a channel contact portion between the main channel portion and the conductive contact pattern. the channel contact portion is in contact with the conductive contact pattern and includes a material having a second composition that is different from the first composition.
20240072177.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chul Kim of Suwon-si (KR) for samsung electronics co., ltd., Yeondo Jung of Suwon-si (KR) for samsung electronics co., ltd., Gwirim Park of Suwon-si (KR) for samsung electronics co., ltd., Yelin Lee of Suwon-si (KR) for samsung electronics co., ltd., Kichul Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyungin Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L29/06, H01L29/423, H01L29/66, H01L29/775
Abstract: a semiconductor device includes channels spaced apart from each other on a substrate in a vertical direction substantially perpendicular to an upper surface of the substrate, a gate structure on the substrate and bordering lower and upper surfaces and a first sidewall of at least a portion of each of the channels, and a source/drain layer on a portion of the substrate adjacent to the gate structure and contacting second sidewalls of the channels. a nitrogen-containing portion is formed at an upper portion of an uppermost one of the channels, and may be doped with nitrogen.
Inventor(s): Kyoung Suk YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L25/075, H01L33/64
Abstract: there is provided a semiconductor package with improved heat dissipation function. the semiconductor package comprising, a film, a wiring pattern layer disposed on the film, and including a first area and a second area surrounding the first area, a semiconductor chip disposed on the first area of the wiring pattern layer and electrically connected to the wiring pattern layer, a first insulating layer disposed on the second area of the wiring pattern layer, a first metal layer disposed on the first insulating layer and spaced apart from the semiconductor chip and a heat dissipating layer covering the semiconductor chip and made of a synthetic resin.
Inventor(s): Hyunggon KIM of Suwon-si (KR) for samsung electronics co., ltd., Daeyoung OH of Suwon-si (KR) for samsung electronics co., ltd., Jeseung OH of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/22, H01Q1/32, H01Q21/24
Abstract: an antenna device for a vehicle and a vehicle including the same are provided. the antenna device includes a printed circuit board (pcb), a plurality of antenna arrays arranged on a first surface of the pcb, a plurality of radio frequency integrated circuits (rfics) arranged on a second surface of the pcb and electrically connected to the plurality of antenna arrays, and an intermediate frequency integrated circuit (ific) arranged on the second surface of the pcb to be apart from each of the plurality of rfics by a same distance, the ific being electrically connected to the plurality of rfics.
20240072416.ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungkoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Himchan YUN of Suwon-si (KR) for samsung electronics co., ltd., Kookjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Donguk CHOl of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/50, H01Q1/52
Abstract: an electronic device includes: a housing forming an exterior of the electronic device; a first display; a second display facing in a direction different from that of the first display, wherein the second display may include a conductive pattern; a metal part electrically connected to the conductive pattern; and a wireless communication circuit electrically connected to at least one of the metal part or the conductive pattern.
Inventor(s): Youngki LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunwoo LEE of Suncheon-si (KR) for samsung electronics co., ltd., Dooseok CHOI of Hwaseong-si (KR) for samsung electronics co., ltd., Seungchan HEO of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q1/38
Abstract: provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (ebg) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.
Inventor(s): Huidong GWON of SUWON-SI (KR) for samsung electronics co., ltd., Taehwang KONG of SUWON-SI (KR) for samsung electronics co., ltd., Minjae KIM of SUWON-SI (KR) for samsung electronics co., ltd., Junhyeok YANG of SUWON-SI (KR) for samsung electronics co., ltd., Yunho LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158, H02M1/00, H02M1/36
Abstract: a power management chip includes a gate driver configured to output a first gate signal driving a first power switch and a second gate signal driving the second power switch, a multiplexer configured to receive an error detect signal from a first error amplifier and a first gate signal from the gate driver, and drive the first power switch with either of the error detect signal or the first gate signal in response to a mode select signal; an inductor detection logic configured to receive the inductor detect signal, output a comparison detect signal and a pulse signal for detecting an external inductor, and output the mode select signal corresponding to a result of the detecting, and a comparator comparing an internal output voltage of an output node and an output voltage of the feedback node in response to the comparison detect signal.
20240072737.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeong Yeol BAE of Suwon-si (KR) for samsung electronics co., ltd., Jong Soo Lee of Suwon-si (KR) for samsung electronics co., ltd., Duk Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Eui Bong Yang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/56, H03F3/72, H04B1/18
Abstract: a semiconductor device includes a first low noise amplifier (lna), a second lna, first and second receiving circuits, an a radio frequency multiplexer. the first lna is connected to a first receiving port, and the second lna is connected to a second receiving port different from the first receiving port. the first receiving circuit includes a first transformer and processes one or more outputs of the first and second lnas. the second receiving circuit processes one or more of the outputs of the first and second lnas. the radio frequency multiplexer controls connection between the first and second lnas and the first and second receiving circuits. the first receiving circuit includes a first variable capacitor having a first end connected to an output of the radio frequency multiplexer and a second end connected to the first transformer.
Inventor(s): DAEHOON NA of Suwon-si (KR) for samsung electronics co., ltd., SEONKYOO LEE of Suwon-si (KR) for samsung electronics co., ltd., SEUNGJUN BAE of Suwon-si (KR) for samsung electronics co., ltd., TAESUNG LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/013, G06F13/16, G11C7/10, G11C7/22, H03K3/017
Abstract: an equalizer includes a first pulse width controller that is configured to generate a first signal by increasing a first pulse width of a first data signal having a first logic level, the first data signal corresponding to a current data bit, a second pulse width controller that is configured to generate a second signal by increasing a second pulse width of the first data signal having a second logic level, a first sampler that is configured to generate a first sampled signal by sampling the first signal, a second sampler that is configured to generate a second sampled signal by sampling the second signal, and a multiplexer that is configured to output the first sampled signal or the second sampled signal based on a value of a previous data bit.
Inventor(s): Sangheon LEE of Suwon-si (KR) for samsung electronics co., ltd., Heewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Heejune LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjae CHO of Suwon-si (KR) for samsung electronics co., ltd., Michael CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K5/135, G01R19/25
Abstract: a digital droop detector for detecting whether a droop occurs in a power supply voltage, may include processing circuitry configured to, detect a voltage level change of a power supply voltage in response to a clock signal, the detecting the voltage level change including converting the detected voltage level change into a first code, correct at least one nonlinearity included in the first code, the correcting including converting the first code into a second code and a target range, and adjust a delay magnitude of the clock signal based on the second code.
Inventor(s): HYOUNGJOONG KIM of SUWON-SI (KR) for samsung electronics co., ltd., CHEOLMIN AHN of SUWON-SI (KR) for samsung electronics co., ltd., MYEONG-CHEOL KIM of SUWON-SI (KR) for samsung electronics co., ltd., WOONGKI MIN of SUWON-SI (KR) for samsung electronics co., ltd., SANGHO KIM of SUWON-SI (KR) for samsung electronics co., ltd., SOOMIN LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H03K19/003
Abstract: a electronic device includes a transceiver including a transmitter and a receiver that operate based on a power source voltage and a pad voltage applied from a pad; and an overvoltage protection circuit to apply a first protection voltage to the transmitter and a second protection voltage to the receiver. the overvoltage protection circuit includes: a reference voltage generator to generate a reference voltage when the power source voltage is in an on state; and a voltage detector to set the first protection voltage and the second protection voltage based on the reference voltage when the power source voltage is in an on state, and set the first protection voltage and the second protection voltage based on the pad voltage when the power source voltage is in an off state.
Inventor(s): KYUNGWOO YOO of Suwon-si (KR) for samsung electronics co., ltd., DOOSEOK CHOI of Suwon-si (KR) for samsung electronics co., ltd., HYUNG SUN LIM of Suwon-si (KR) for samsung electronics co., ltd., JOONHOI HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/38, G01S13/04, H04W52/18
Abstract: an electronic device is provided. the electronic device includes: a transceiver configured to transmit and receive a wireless signal; and a processor configured to: control a measurement circuit to identify a transmission/reception power ratio of the wireless signal; control a converter to transform the transmission/reception power ratio into frequency domain data; detect whether an object is adjacent the electronic device, based on the frequency domain data and an adjustable threshold; and control the transceiver based on whether the object is detected adjacent the electronic device.
Inventor(s): Sungwoo LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Hyoungseok OH of Seoul (KR) for samsung electronics co., ltd., Minkyu KWON of Hwaseong-si (KR) for samsung electronics co., ltd., Sungkyu CHO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B3/56, H04B3/02
Abstract: a first mobile device including a connection terminal configured to electrically connect to a second mobile device, a variable impedance device connected to the connection terminal, the variable impedance device configured to vary an impedance, processing circuitry configured to determine a power line communication (plc) mode between the first mobile device and the second mobile device to be one of a low-speed plc mode or a high-speed plc mode, and control the impedance of the variable impedance device according to the determined plc mode, and a plc modem configured to receive power from the second mobile device or communicate data with the second mobile device based on the determined plc mode.
Inventor(s): Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04B7/12, H04L5/00, H04L25/02, H04L27/26, H04W72/0453, H04W72/23, H04W74/00
Abstract: a method for a user equipment (ue) to receive physical downlink control channels (pdcchs) is provided. the ue receives configuration information for a first control resource set that includes a number of symbols in a time domain and a number of resource blocks (rbs) in a frequency domain, configuration information indicating a first number of nfrequency-contiguous rb s, and a pdcch in the first control resource set in a number of frequency distributed blocks of nrbs. the ue assumes that a demodulation reference signal associated with the reception of the pdcch has a same precoding over the nrbs. a method for constructing a search space to reduce a number of channel estimations that the ue performs for decoding pdcchs, relative to conventional search spaces, is also provided.
Inventor(s): Ahmad AlAmmouri of Richardson TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Mustafa Furkan Ozkoc of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B17/327
Abstract: a method includes identifying child beams of a current composite beam. the method also includes determining an order at which the child beams of the current composite beam are measured based on a likelihood that each child beam of the current composite beam is an optimal beam, among the child beams, to be a serving narrow beam. the method also includes determining a threshold for use in deciding whether to measure one or more additional child beams or select an already measured child beam when selecting the optimal beam. the method also includes selecting the optimal beam, among the child beams, to be the serving narrow beam based on the determined order and the determined threshold.
Inventor(s): Nayoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Minchull PAIK of Suwon-si (KR) for samsung electronics co., ltd., Jungsik PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/12, H04B7/06
Abstract: a communication circuit and an electronic device are provided. the communication circuit includes a first radio frequency integrated circuit (rfic) for processing transmission signals and reception signals of a plurality of frequency bands, a second rfic for processing the reception signals of the plurality of frequency bands, a first front end module (fem), and a second fem, such that the first rfic is connected to a plurality of transmission chains of the first fem and the second fem and some reception chains from among reception chains included in the first fem and the second fem, the second rfic is connected to some other reception chains among the plurality of reception chains included in the first fem and the second fem, and frequency bands of the reception signals processed by the first rfic can be same as frequency bands of the reception signals processed by the second rfic.
Inventor(s): Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Nishithkumar Dhananjay TRIPATHI of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/1867, H04L1/1812, H04W72/232
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. according to an embodiment of the present disclosure, a method performed by a terminal in a communication system is provided. the method performed by the terminal comprises the steps of: receiving, from a base station, logical channel configuration information that includes first information about an available hybrid automatic repeat request (harq) mode corresponding to a logical channel, and serving cell configuration information that includes second information about an available harq mode for each harq process id; performing a logical channel prioritization procedure on the basis of the first information and the second information; and transmitting uplink data to the base station on the basis of the result of the logical channel prioritization procedure.
Inventor(s): Joo Seung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Young Ju KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jung Joon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sung Chul PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B1/04, H04L5/14
Abstract: according to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first rf block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an rf reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and the transceiver performs ca on the signal of the first frequency band and/or the second frequency band and performs diversity on the signals received from the first rf block and the rf reception circuit.
Inventor(s): Youngwoo KWAK of Gyeonggi-do (KR) for samsung electronics co., ltd., Hoondong NOH of Gyeonggi-do (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Taehan BAE of Gyeonggi-do (KR) for samsung electronics co., ltd., Seunghoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Taehyoung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B7/0417, H04W72/23
Abstract: methods and apparatuses in a communication system is provided. one or more configurations associated with an aperiodic channel state information (csi) report are received from a base station via higher layer signaling. downlink control information (dci) including a csi request field indicating a configuration among the one or more configurations is received from the base station. the aperiodic csi report is transmitted to the base station based on the configuration. in case that a medium access control (mac) control element (ce) is used to map the configuration to a value of the csi request field based on a number of the one or more configurations and a size of the csi request field, the csi request field indicates the configuration from at least one configuration selected via the mac ce.
Inventor(s): YOUNG SIK MOON of Suwon-si (KR) for samsung electronics co., ltd., JIYOUP KIM of Suwon-si (KR) for samsung electronics co., ltd., HANBYEUL NA of Suwon-si (KR) for samsung electronics co., ltd., HONG RAK SON of Suwon-si (KR) for samsung electronics co., ltd., SEONGHYEOG CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/00, H04L9/08
Abstract: a homomorphic encryption operator includes: a level configuration unit configured to set an encryption level by selecting a plurality of prime numbers of different values according to a scale factor condition used for multiplication of a homomorphic encryption operation and an increase/decrease condition for increasing or decreasing consecutively selected prime numbers, and a modular multiplication operator configured to perform lightweight modular multiplication using the selected plurality of prime numbers, wherein the level configuration unit includes: a level constructor configured to select prime number sets whose number have selected hamming weights, respectively, based on the scale factor condition and the increase/decrease condition, and wherein the level configuration unit is further configured to configure the selected prime number sets with the encryption level using a prime number table.
Inventor(s): Younsung CHU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/32
Abstract: a device may include processing circuitry configured to, generate a device identifier associated with the device, and generate a unique endorsement identity (id) associated with the device identifier, a first layer sub-circuit configured to, receive the device identifier, and generate a first certificate and a second certificate based on the device identifier and the unique endorsement id, the first certificate and the second certificate including information to authenticate the device, and the processing circuitry is further configured to, receive the first certificate and the second certificate, and verify whether the device has been modified based on the first certificate and the second certificate, wherein, in response to the first layer sub-circuit being modified, the first layer sub-circuit is further configured to, generate an endorsement key based on a new unique endorsement id, and generate a certificate signing request for the new unique endorsement id based on the endorsement key.
Inventor(s): Yeqing Hu of Allen TX (US) for samsung electronics co., ltd., Yang Li of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L25/02
Abstract: methods and apparatuses for canonical model (cm) based channel status information enhancement. a base station includes a transceiver configured to receive a reference signal from a user equipment (ue) and a processor operably coupled to the transceiver. the processor is configured to perform a linear transformation based on the received reference signal, select a basis set based on the linear transformation, select a set of kernels based on the selected basis set and the linear transformation, and reconstruct a channel based on the selected set of kernels.
Inventor(s): Yosub PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyojin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hanjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/26
Abstract: disclosed are a method and device for transmitting and receiving a signal in a wireless communication system. the method may comprise the following steps: transmitting, to a terminal, information of a plurality of demodulation reference signal (dmrs) sequences and information of a plurality of data transformation techniques, transforming a data symbol sequence on the basis of the plurality of data transformation techniques, performing an inverse discrete fourier transformation (idft) on combinations of the plurality of transformed data symbol sequences and the plurality of dmrs sequences, measuring peak-to-average power ratio (papr) values with respect to each of the idft-performed signals, selecting an idft-performed signal having the lowest papr value as a result of the measurement, and the selected idft-performed signal may be transmitted to a terminal.
Inventor(s): Seongyeal Yang of Suwon-si (KR) for samsung electronics co., ltd., Moonchul Choi of Suwon-si (KR) for samsung electronics co., ltd., Sungyong Cho of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeok Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/36
Abstract: provided is a transmitting device for enlarging the size of a data eye of a transmission signal. the transmitting device includes an output driver including a plurality of driver circuits that drive a plurality of multi-level signals onto an output node, and a logic circuit configured to detect a direction of a pull-up or pull-down operation of each of the plurality of driver circuits by transitions of the plurality of driver control signals and generate pulse signals. the plurality of multi-level signals are driven based on a plurality of driver control signals and pulse signals, respectively, and the logic circuit provides a pulse signal to at least one static driver circuit connected to a driver control signal that does not transition, from among the plurality of driver circuits.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunah OH of Suwon-si (KR) for samsung electronics co., ltd., Sunkee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L41/0816, H04L41/50, H04W4/80, H04W12/08, H04W72/0446, H04W72/30, H04W72/542
Abstract: an electronic device is provided, which includes a housing, at least one wireless communication circuit located inside the housing and configured to: receive, from an ap device through a wireless medium, a target wake time (twt) element indicating a twt service period and a type of traffic that is associated with latency of the traffic; in response to receiving the twt element, generate data frame associated with the type of traffic indicated by the twt element; and transmit, to the ap device through the wireless medium, the data frame associated with the type of traffic during the twt service period indicated by the twt element.
Inventor(s): Sunhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongmyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L69/22
Abstract: a data transmission method and apparatuses in a wireless communication system are provided. more particularly, a method performed by a first node in a wireless communication system is provided. the method includes receiving header configuration information from a second node, if header configuration information indicates to contain first data including one or more of network management information and user service provision information into a header, transmitting a packet including the first data and additional information for parsing the first data to the second node, and receiving a response to the first data from the second node which receives the packet.
Inventor(s): Junghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Minsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Joohan KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonggil HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing slidably disposed with the first housing, a rollable display having a display area reduced or expanded based on slide-in or slide-out of the second housing, a pipeline having a first opening disposed on one side of the second housing for an inflow of external air flows, having a second opening disposed in a direction toward the first housing, and extending from the first opening in a direction toward the second opening, an air sensor disposed at least in part inside the pipeline, and an opening and closing member disposed to be fixed to the first housing and opening or closing the second opening of the pipeline based on slide-in or slide-out of the second housing.
Inventor(s): Bumhee BAE of Suwon-si (KR) for samsung electronics co., ltd., Kiman KIM of Suwon-si (KR) for samsung electronics co., ltd., Junggil KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghun SEONG of Suwon-si (KR) for samsung electronics co., ltd., Jeongnam CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H05K1/02, H05K1/18
Abstract: a flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. the first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (ccls) are stacked. the highly bendable region includes a structure in which a single ccl extending from one ccl among the plurality of ccls in the first multi-layer region and the second multi-layer region is stacked. the single ccl may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single rf signal.
Inventor(s): Kwangha SHIN of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/24
Abstract: an electronic device is provided. the electronic device includes a display, a support member, and a printed circuit board including at least one terminal electrically connected to a connection area of the support member, wherein the support member includes a first metal member including a first protrusion and a first through-hole, a second metal member surrounding at least a part of the first metal member, the second metal member including a second protrusion positioned in the first through-hole and a second through-hole accommodating the first protrusion, a first solder connected to the first protrusion and the second metal member, and a second solder connected to the second protrusion and the first metal member, and the first solder may be positioned in a direction different from that of the second solder with reference to the connection area.
Inventor(s): Joonhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jisu KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungwook RO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72403, H04M1/02, H04M1/72454
Abstract: an apparatus and/or method for displaying a multi-window on a foldable electronic device may be provided. the electronic device may include a display device having a display area having a shape that varies depending on first and second housing structures connected to a hinge structure, and a processor operatively connected to the display device, in which the processor may divide a first type display area into a plurality of areas and display information related to a plurality of applications when the electronic device is in an unfolded state, the processor may check at least one application set to be continuously used among the plurality of applications when the electronic device switches to a folded state, and the processor may set up a screen constitution in the folded state based on the at least one application and output information related to the at least one application through a second type display area based on the screen constitution. other embodiments may also be possible.
Inventor(s): Seonyul LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N5/44, H04N21/426, H04N21/436, H04N21/4363
Abstract: a first electronic device includes: at least one processor configured to: transmit first edid information including a first block structure to a second electronic device; receive av data from the second electronic device; identify an output state of the av data; based on that the output state of the av data is identified as abnormal, requesting a first parameter to the second electronic device; generate third edid information including a second block structure based on the first parameter, a second parameter related to a number of acks obtained based on storing the first edid information in the at least one memory of the first electronic device, or a third parameter related to a number of blocks of fourth edid information; and transmit a hpd signal for transmitting third edid information including the second block structure to the second electronic device.
Inventor(s): Indon JU of Suwon-si (KR) for samsung electronics co., ltd., Donghee KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31, G06F3/01
Abstract: the electronic apparatus includes sensor circuitry to obtain sensing data; projection circuitry; and at least one processor configured to, based on a preset gesture of a user being identified based on the sensing data, identify a first position corresponding to a first part of the user and a second position corresponding to a second part of the user, the first position and the second position indicating the preset gesture, obtain direction information corresponding to the preset gesture based on the first position and the second position, obtain a projection position corresponding to the preset gesture based on a position of a projection surface and the direction information, and control the projection to project a projection image based on the projection position.
Inventor(s): Sangkyun IM of Suwon-si (KR) for samsung electronics co., ltd., Jaehoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Joowhan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/393, G09G3/00, G09G3/32, H01L25/075, H01L33/58
Abstract: a display device includes a main body; a first rotatable shaft included in a first portion of the main body; a second rotatable shaft included in a second portion of the main body, the second portion being opposite to the first portion; a motor disposed inside the main body, and connected to at least one of the first rotatable shaft and the second rotatable shaft; a transparent wire including a first end connected to the first rotatable shaft and a second end connected to the second rotatable shaft; a plurality of light emitting diodes (leds) included inside the transparent wire in a longitudinal direction of the transparent wire; a driving circuit configured to drive the plurality of leds; and a processor configured to control the motor to rotate the transparent wire, and to provide an image frame to the driving circuit to display an image by rotation of the transparent wire.
[[20240073414.VIDEO ENCODING METHOD AND DEVICE AND VIDEO DECODING METHOD AND DEVICE_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Narae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Woongil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/11, H04N19/105, H04N19/132, H04N19/159, H04N19/176
Abstract: provided are video encoding/decoding methods and apparatuses for determining an intra prediction mode of a current block, based on a width and height of the current block. when the current block has a square shape in which the width and height are equal, the intra prediction mode of the current block is determined from among first intra prediction mode candidates including a plurality of predetermined intra prediction directions, and when the current block has a non-square shape in which the width and height are not equal, the intra prediction mode of the current block is determined from among second intra prediction mode candidates configured based on the non-square shape.
Inventor(s): Sungho JUN of Suwon-si (KR) for samsung electronics co., ltd., Youngbeom JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jungyeop YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/124, H04N19/103, H04N19/127, H04N19/136, H04N19/176, H04N19/182, H04N19/423, H04N19/50, H04N19/70, H04N19/91
Abstract: an image processing device and an operating method of the image processing device are disclosed. the image processing device includes a multimedia intellectual property (ip) configured to generate second image data by performing image processing on first image data and an encoder configured to compress the second image data, the encoder is further configured to generate first compressed data by performing quantization and at least one compression processing on a first block of the second image data based on a target compression ratio in a first compression condition, and generate second compressed data by performing the quantization on a second block of the second image data based on a first quantization step in a second compression condition, without performing the at least one compression processing.
[[20240073425.IMAGE ENCODING APPARATUS AND IMAGE DECODING APPARATUS BOTH BASED ON ARTIFICIAL INTELLIGENCE, AND IMAGE ENCODING METHOD AND IMAGE DECODING METHOD PERFORMED BY THE IMAGE ENCODING APPARATUS AND THE IMAGE DECODING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Quockhanh DINH of Suwon-si (KR) for samsung electronics co., ltd., Hyungmin ROH of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/139, H04N19/172, H04N19/42, H04N19/52
Abstract: an image encoding method based on artificial intelligence (ai) includes obtaining motion vector feature data of a current frame by inputting the current frame and a reference frame to a motion vector encoder and applying a plurality of resolution scales to the current frame and the reference frame via the motion vector encoder; obtaining a current motion vector by inputting the motion vector feature data to a motion vector decoder; obtaining a current predicted image based on the current motion vector and the reference frame; and generating a bitstream based on the motion vector feature data and the current predicted image.
Inventor(s): Yinji Piao of Suwon-si (KR) for samsung electronics co., ltd., Kyungah Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/44, H04N19/105, H04N19/137, H04N19/176
Abstract: provided are an image decoding method and apparatus. the image decoding method includes identifying at least two neighboring sub-blocks that have a same motion vector and are adjacent to each other from among a plurality of neighboring sub-blocks adjacent to a current block, determining a representative motion vector and representative location information corresponding to the at least two neighboring sub-blocks, determining a parameter of a model for determining a motion vector based on the representative motion vector and the representative location information, determining a motion vector of a current sub-block included in the current block, based on location information of the current sub-block and the parameter, and predicting the current block based on the motion vector of the current sub-block wherein the representative motion vector is determined based on the same motion vector, and the representative location information indicates coordinates that are determined based on the at least two neighboring sub-blocks.
Inventor(s): Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/56, H04N19/109, H04N19/176
Abstract: provided is a video decoding method including: determining a prediction mode of a current block to be one of a skip mode and a merge mode; when a motion vector, which is determined from a merge candidate list of the current block, and a merge motion vector difference are to be used, obtaining merge candidate information indicating one candidate in the merge candidate list by performing entropy encoding on a bitstream by applying one piece of context information; determining a base motion vector from one candidate determined from the merge candidate list, based on the merge candidate information; and determining a motion vector of the current block by using a distance index of a merge motion vector difference of the current block and a direction index of the merge motion vector difference to use the base motion vector and the merge motion vector difference.
Inventor(s): SEONGIN KANG of SUWON-SI (KR) for samsung electronics co., ltd., TECKSHENG NG of SUWON-SI (KR) for samsung electronics co., ltd., BONGCHAN CHO of SUWON-SI (KR) for samsung electronics co., ltd., HYEONGSU CHOI of SUWON-SI (KR) for samsung electronics co., ltd., DOOYOUNG JANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/4363, H04N21/258, H04N21/442
Abstract: a method of controlling consumer electronics control (cec) communication between a sink device and a plurality of source devices connected through high-definition multimedia interface (hdmi) cables may include; generating cable connection information by monitoring whether the hdmi cables are respectively connected to a hdmi port among a plurality of hdmi ports of the sink device, generating cec error information by monitoring whether a voltage of an internal cec node is fixed, wherein cec lines included in connected hdmi cables are commonly connected to the internal cec node and the connected hdmi cables indicate present connection to the plurality of hdmi ports, and executing a user guide to diagnose a stuck state of the cec lines of the connected hdmi cables in response to the cable connection information and the cec error information.
Inventor(s): Jongmin YOON of Suwon-si (KR) for samsung electronics co., ltd., Seungnyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Seungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Gisoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyusik CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/611, G06F1/16, H04N23/65, H04N23/90
Abstract: a wearable electronic device is provided. the wearable electronic device may include a housing, at least one processor included in the housing, at least one first camera module configured to capture an image for a first field of view (fov), and at least one second camera module configured to capture an image for a second fov different from the first fov. the at least one processor may be configured to control the at least one first camera module to obtain first image frames at a first frame rate, based on identification, based on at least a part of the first image frames, that a user's hand is disposed in a designated area of the first fov, control the at least one first camera module to obtain second image frames at a second frame rate greater than the first frame rate, and maintain, in an inactive state, the at least one second camera module, or activate the second camera module, and control the at least one second camera module to operate the at least one second camera module at the first frame rate.
Inventor(s): Christopher Anthony Peri of Mountain View CA (US) for samsung electronics co., ltd., Ravindraraj Mamadgi of Fremont CA (US) for samsung electronics co., ltd., Yingen Xiong of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N23/60, G06T7/246, G06T7/73, G06V10/44, G06V10/70, G06V40/16, G06V40/20
Abstract: a method includes, in response to initiating a shooting mode of a camera application on an electronic device, collecting sensor information comprising at least one of: motion data of the electronic device, position data of the electronic device, and image data captured by one or more imaging sensors of the electronic device, wherein the shooting mode represents at least one of: a video record mode and an image capture mode. the method also includes determining, using a trained machine learning model, whether a user intention is to record video or capture an image based on features extracted from the sensor information. the method further includes recording video regardless of the shooting mode in response to determining that the user intention is to record video or capturing the image regardless of the shooting mode in response to determining that the user intention is to capture the image.
Inventor(s): Solae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungyoul PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungin PARK of Suwon-si (KR) for samsung electronics co., ltd., Changbeom PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyeongseok SON of Suwon-si (KR) for samsung electronics co., ltd., Byung In YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/69, H04N23/60, H04N23/61, H04N23/62
Abstract: an apparatus and a method of controlling a camera is provided. the apparatus includes a receiver configured to receive an image from an image sensor and a processor configured to detect a target object from the image, perform a first zoom adjustment operation of the camera including the image sensor based on whether the target object is changed and perform a second zoom adjustment of the camera based on a center point of the target object and a center point of the camera.
Inventor(s): Sung-Ho CHA of Suwon-si (KR) for samsung electronics co., ltd., Daeil YU of Suwon-si (KR) for samsung electronics co., ltd., Kundong KIM of Suwon-si (KR) for samsung electronics co., ltd., Suhyun JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/13, H04N25/62, H04N25/767
Abstract: disclosed is a camera module which includes an image sensor including pixels outputting raw image data based on light incident from at least one of a display or the exterior, and control logic receiving the raw image data and generating image data. in a first operation mode, the control logic turns off calibration of the image sensor, receives first raw image data, which are based on the light incident from the display, from the image sensor, and generates crosstalk calibration data based on first output values included in the first raw image data. in a second operation mode, the control logic turns on the calibration of the image sensor, receives second raw image data, which are based on light incident from the display and the exterior, from the image sensor, and generates the image data based on second output values included in the second raw image data.
Inventor(s): Taehoon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinwan AN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/28
Abstract: according to an embodiment of the disclosure, an electronic device may include a housing including a first housing and a second housing receiving at least a portion of the first housing and configured to guide a slide of the first housing, a display including a first display area disposed on the second housing and a second display area extending from the first display area, a speaker module disposed in the housing, a resonance space facing at least a portion of the speaker module and configured to vary in size based on a slide of the first housing with respect to the second housing, and a processor configured to adjust a sound output from the speaker module based on the size of the resonance space.
Inventor(s): Junhee HAN of Suwon-si (KR) for samsung electronics co., ltd., Youngjun AN of Suwon-si (KR) for samsung electronics co., ltd., Seonguk PARK of Suwon-si (KR) for samsung electronics co., ltd., Pilwon SEO of Suwon-si (KR) for samsung electronics co., ltd., Seokwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung LIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongseob KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R3/14, H04M1/02, H04R1/02, H04R1/26, H04R5/02, H04S1/00, H04S7/00
Abstract: a foldable electronic device includes a first and second housings foldably coupled through a hinge, a flexible display supported by the first and second housings, a first speaker disposed in the first housing and a second speaker disposed in the second housing. the electronic device determines first and second states in which the first and second housings unfolded or folded. the electronic device controls sound frequency characteristics of the first and second speakers to have first sound frequency characteristics with the electronic device being in the first state. the electronic device controls sound frequency characteristics of the first speaker to have second sound frequency characteristics with the electronic device being in the second state. the electronic device may also control sound frequency characteristics of the second speaker to have third sound output frequency characteristics with the electronic device being in the second state.
Inventor(s): Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeontaek LIM of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd., Sangdok MO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04S7/00
Abstract: provided is an electronic apparatus comprising a microphone, a communication interface, a memory, and at least one processor to control the electronic apparatus. the processor may execute at least one instruction stored in the memory to: based on a preset user voice of a user being received through the microphone, control the communication interface to request at least one first sound information from at least one home appliance, each of the at least one first sound information corresponding to the preset user voice received at each of the at least one home appliance, receive, through the communication interface, the at least one first sound information from the at least one home appliance, and identify a position of the user based on the preset user voice and the at least one first sound information.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., Himke VAN DER VELDE of Middlesex (GB) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04W76/11, H04W76/27, H04W76/30
Abstract: a communication technique for convergence of the 5g communication system for supporting higher data transmission rate after the 4g system with iot technologies and a system thereof. certain embodiments may be applied to intelligent services based on the 5g communication technologies and the iot-associated technologies (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail services, security and safe-associated services, etc.). a method and an apparatus which can substitute reporting ue capabilities by use of an identifier of the ue, without reporting the overall ue capabilities in a method of reporting ue's own capability.
Inventor(s): Younggyoun MOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongmyung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunghwan KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Yoonseon HAN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W24/08
Abstract: disclosed is a 5g or 6g communication system to be provided for supporting higher data rates beyond a 4g communication system such as lte. in particular, a method performed by a first device in a communication system is disclosed, and includes detecting a need to update a traffic processing rule in a second device processing traffic together with the first device; determining whether to update the traffic processing rule to be used in the second device based on performance information of the first device and performance profile information of the second device; and delivering information related to the update of the traffic processing rule to the second device based on the determination.
Inventor(s): Aditya Kumar PADHI of Bengalaru (IN) for samsung electronics co., ltd., Isakkiraja Isakki of Bengalaru (IN) for samsung electronics co., ltd., Shrinath Ramamoorthy Madhurantakam of Bengalaru (IN) for samsung electronics co., ltd., Arunakumar Bettappanavar of Bengalaru (IN) for samsung electronics co., ltd., Deepak Rajendran of Bengalaru (IN) for samsung electronics co., ltd., Sathia Chandrane Sundararaju of Bengalaru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/32
Abstract: provided is a method for performing a cell search operation that includes: determining whether a user equipment (ue) is camped on a first radio access technology (rat) among a plurality of rats and supports camping on a second rat; acquiring first information corresponding to a first public land mobile network identity (plmn id) associated with the first rat and at least one first inter-rat (irat) frequency, the at least one first irat frequency being associated with the first rat; storing the first information corresponding to the first plmn id in a database of the ue; detecting an occurrence of one or more first events indicating that the ue is required to leave the first rat and camp on another rat to handle the event; performing the cell search operation corresponding to the first plmn id based on the stored first information to camp the ue on the second rat.
Inventor(s): Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd., Aby Kanneath ABRAHAM of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00, H04W36/32
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed herein is a method of a user equipment (ue) for non-terrestrial network (ntn) the method comprising: receiving, from a network, assistance information related to the non-terrestrial network (ntn) for cell reselection; and performing a measurement on a neighbouring cell for the cell reselection based on the assistance information, wherein the assistance information includes ephemeris information on the neighbouring cell. in the embodiments, the assistance information is included in a system information block (sib) broadcast by at least one of a serving cell or the neighbouring cell.
Inventor(s): Hanjung PARK of Suwon-si (KR) for samsung electronics co., ltd., Joonhwan KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00, H04W36/30, H04W76/27
Abstract: a method, performed by a first distributed unit (du), of performing communication in a wireless communication system, includes obtaining inter-du interface configuration information for connection to a second du; performing the connection to the second du based on the inter-du interface configuration information; obtaining information about a throughput of data of at least one radio unit (ru) connected to the first du based on information about the at least one ru connected to the first du; selecting at least one target ru based on the information about the throughput of data of the at least one ru; and performing migration of the at least one target ru from the first du to the second du.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/14, H04W36/00, H04W76/27
Abstract: embodiments herein provide a method for coordinated switching gap operations by a ue () comprising a plurality of sims () in a wireless network (). the method includes detecting that at least one of a bsr triggering, grant for uplink transmission, and measurement report and csi reporting time for a first network operator apparatus () lies in between one of the switching gap start and stop time, a switching gap duration, and a number of repetitions of the switching gap. in an embodiment, the method includes preventing a triggering of the bsr to the first network operator apparatus (). in another embodiment, the method includes reporting a new bsr report to the first network operator apparatus () to indicate no buffered data. in another embodiment, the method includes abandoning or discarding at least one of the measurement report or the csi reporting from the ue ().
Inventor(s): Samiran BHOWMIK of Bangalore (IN) for samsung electronics co., ltd., Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Erik GUTTMAN of Middlesex (GB) for samsung electronics co., ltd., Mahmoud WATFA of Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/04, H04W8/06, H04W48/18
Abstract: the present disclosure relates to a communication method and system for converging a 5g communication system for supporting higher data rates beyond a 4g system with a technology for iot. embodiments herein provide method for controlling disaster roaming service in a wireless network by ue. the method includes receiving a disaster roaming enabled indication from first plmn or second plmn associated with ue. further, the method includes detecting a disaster condition. further, the method includes determining whether the disaster roaming enabled indication indicates that a disaster roaming is disabled in ue or disaster roaming is enabled in ue. in an embodiment, the method includes enabling the disaster roaming service at ue and allowing ue to select the plmn for using the disaster roaming service during the disaster condition in response to determining that disaster roaming is enabled in ue.
Inventor(s): Sunghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04L67/306, H04L67/51, H04W8/20, H04W12/06
Abstract: the present disclosure relates to methods and devices for providing an edge computing service to a user equipment (ue) in a communication system, and more particularly, to a method and device for managing an identifier of a wireless communication ue so as to provide an edge computing service to the ue. a method includes receiving a first message via a mobile communication network from a ue of a mobile communication system, wherein the first message includes a generic public subscription identifier (gpsi) of the ue, and the received identifier of the ue identifies validity on the basis of a previously received profile of the ue; if the identifier of the ue is valid, binding and storing the identifier of the ue and a ue ip address based on the received first message; and if the identifier of the ue is valid, transmitting a first response message to the ue.
Inventor(s): Jong Moo LEE of Seoul (KR) for samsung electronics co., ltd., Seung Min CHOI of Seongnam-si (KR) for samsung electronics co., ltd., Gyu Chual KIM of Bucheon-si (KR) for samsung electronics co., ltd., Ji Woo LEE of Gumi-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, G06F1/16, G06F1/3234, G06F3/041, G06F3/0488, G06F3/04883, G06F3/04886, H04M1/02, H04M1/724, H04M19/04, H04W68/00
Abstract: an electronic device is provided. the electronic device includes a housing including a front surface and a rear surface, a display, a communication circuit, at least one processor, and a memory. the memory stores instructions which, when executed, cause the at least one processor to receive a signal from outside of the electronic device using the communication circuit, in response to receiving the signal, display a user interface on an elongated region that extends along at least one edge region of the display, and display at least one content corresponding to the signal, while displaying the user interface or after displaying the user interface.
Inventor(s): Byongok Lee of Suwon-si (KR) for samsung electronics co., ltd., Joohyun Do of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok Yu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/14, H04W52/18, H04W52/42
Abstract: provided is a method of operating an electronic device, the method including receiving, from a base station, a downlink control signal requesting repeated transmission of an uplink signal, determining a repeated transmission mode for changing at least one of a precoding matrix, an analog transmission beam, and transmission power of the uplink signal when the uplink signal is repeatedly transmitted in response to reception of the downlink control signal, and repeatedly transmitting a plurality of uplink signals according to a determined repeated transmission mode.
Inventor(s): Seho MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Jeongho YEO of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04B7/185
Abstract: an example method performed by a terminal in a non-terrestrial network (ntn) system may include receiving, from a base station, system information including position information about the base station and information about a common timing advance (ta) offset; determining the distance between the terminal and the base station based on the position information about the base station and position information about the terminal; determining a specific ta offset for the terminal based on the determined distance; determining a ta value on the basis of the common ta offset and the specific ta offset; determining the transmission start time point of a preamble based on the determined ta value; and transmitting the preamble to the base station based on the determined transmission start time point.
Inventor(s): Beomseok OH of Suwon-si (KR) for samsung electronics co., ltd., Joonhwan KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/04
Abstract: a method, performed by a first distributed unit (du), of performing communication in a wireless communication system may include performing, based on resource usage of the first du, configuration of an inter-du interface with a second du requiring a connection with the first du, obtaining information about at least one first radio unit (ru) to be migrated to the second du from among at least one ru connected to the first du, stopping resource allocation for at least one uplink packet associated with at least one user equipment (ue) connected to the first ru, and transmitting, based on the configured inter-du interface, to the second du, at least one downlink packet required to be transmitted to the first ru or the at least one ue.
Inventor(s): Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyungjun CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04B7/0456, H04B7/06, H04L5/00
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving, from a base station, downlink control information (dci) including a sounding reference signal resource set indicator (srsi), two sounding reference signal resource indicator (sri) fields, and two transmission precoding matrix indicator (tpmi) fields and transmitting, to the base station, a physical uplink shared channel (pusch) based on the dci.
Inventor(s): Hongbo Si of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/30, H04L27/26, H04W16/14, H04W56/00, H04W72/53
Abstract: apparatuses and methods for transmitting or receiving a synchronization signals and physical broadcast channel (ss/pbch) block in a wireless communication system. a method of operating a user equipment (ue) includes receiving a ss/pbch block, decoding a content of a pbch in the ss/pbch block, and determining whether the wireless communication system operates with shared spectrum channel access based on the content of the pbch. the method further includes determining the content of the pbch in a first manner based on determining that the wireless communication system operates with shared spectrum channel access or determining the content of the pbch in a second manner based on determining that the wireless communication system operates without shared spectrum channel access.
Inventor(s): Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/40
Abstract: method and apparatus for sidelink (sl) initial beam acquisition in a wireless communication system. a method for operating a user equipment (ue) includes transmitting, to a second ue, first physical sidelink control channels (pscchs) and corresponding first physical sidelink shared channels (psschs) using multiple spatial domain transmission filters, respectively. the first pscchs and the corresponding first psschs includes a first link establishment message. the method further includes receiving, from the second ue, assistance information associated with a spatial domain transmission filter. the method further includes determining, based on the assistance information, the spatial domain transmission filter. the method further includes transmitting, based on the spatial domain transmission filter, a second pscch and a corresponding second pssch to the second ue.
Inventor(s): Ankur GOYAL of Bangalore (IN) for samsung electronics co., ltd., Anusha GUNTURU of Bangalore (IN) for samsung electronics co., ltd., Mohammed Saquib Noorulhuda KHAN of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar Reddy CHAVVA of Bangalore (IN) for samsung electronics co., ltd., Hari Krishna BODDAPATI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W72/54
Abstract: a method of beam failure recovery managed by a transmitter of a communication system, includes: detecting a first occurrence of a beam failure between the transmitter and a receiver; based on the detection of the first occurrence of the beam failure, identifying at least one first reconfigurable intelligent surface (ris) for transmitting at least one reference signal; transmitting the at least one reference signal to the at least one first ris; receiving, from the at least one first ris, a receiver feedback for the at least one of reference signal; generating an ris candidate beam list based on the receiver feedback; and transmitting, to the receiver via the at least one first ris, a radio resource control (rrc) message including the ris candidate beam list as a beam failure recovery configuration.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W76/15, H04W76/50
Abstract: a wireless communication network includes an access point (ap) multi-link device (mld) and a non-ap mld. the ap mld generates an extreme high throughput (eht) variant enhanced distributed channel access (edca) parameters set element including an edca parameters set element and a link indication. the edca parameters set element applies to a non-primary link between the ap mld and the non-ap mld. the ap mld generates a beacon frame including the eht variant edca parameters set element and the link indication subfield and transmits the beacon frame to the non-ap mld.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04B7/06, H04W48/02
Abstract: various embodiments of the disclosure relate to apparatuses and methods for wlan communication in an electronic device. example electronic devices according to the present disclosure may include a communication circuit configured to support wlan communication and at least one processor, wherein the processor is configured to identify the number of times of reception of retransmission data of each of a plurality of links with an external electronic device for a designated time period, based on the number of times of reception of the retransmission data, when the plurality of links includes a link satisfying a designated error condition, identify another link related to the link satisfying the designated error condition, and restrict the wlan communication via the another link related to the link satisfying the designated error condition.
Inventor(s): Seongil HAHM of Suwon-si (KR) for samsung electronics co., ltd., Jinhwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/30, H04W8/00, H04W76/19
Abstract: an electronic apparatus includes at least one communication interface; and at least one processor operatively coupled with the at least one communication interface and configured to control the electronic apparatus, wherein the processor may be further configured to: based on a release of a communication connection with a first access point, control the at least one communication interface to perform scanning for rejoining with the first access point, and based on reception of a signal including identification information of the electronic apparatus from a user terminal device through the at least one communication interface, control the at least one communication interface to operate as a second access point.
Inventor(s): Himanshu SHARMA of Uttar Pradesh (IN) for samsung electronics co., ltd., Sakshi BHATIA of Uttar Pradesh (IN) for samsung electronics co., ltd., Dheerendra KUMAR of Uttar Pradesh (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/38
Abstract: a method for managing a connection by a server is provided. the method may comprise monitoring a state of a transmission control protocol (tcp) connection for a communication session of a receiver device by internet protocol multimedia subsystem (ims) stack, based on a plurality of signal parameters and connection context information for a defined period in absence of packet communication; based on the state of the tcp connection for the communication session being suspended, closing the tcp connection; and based on the state of the tcp connection for the communication session being registered, selecting one or more session initiation protocol (sip) timers for resetting and routing the communication session of the receiver device.
Inventor(s): Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W80/08, H04L1/1607, H04W76/27, H04W80/02
Abstract: a communication method performed by a terminal communicating in a wireless communication system by using a plurality of radio link control (rlc) entities is provided. the method includes receiving, from a base station, a radio resource control (rrc) message for configuring packet duplication for a radio bearer, configuring at least one rlc entity corresponding to the radio bearer based on the rrc message, and when packet data convergence protocol (pdcp) configuration information is included in the rrc message, configuring a pdcp entity corresponding to the radio bearer based on the pdcp configuration information.
Inventor(s): Youngho YOON of Suwon-si (KR) for samsung electronics co., ltd., Sangchul JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H01L23/367, H01L23/427, H01L23/467, H05K7/20
Abstract: an electronic device is provided. the electronic device includes a printed circuit board (pcb) comprising a first surface and a second surface opposite to the first surface. the electronic device includes a processor on the second surface. the electronic device includes a heat sink on the second surface, partially contacted on the processor. the electronic device includes a first integrated circuit (ic) on the first surface. the electronic device includes a second ic on the first surface spaced apart from the first ic. the electronic device includes a heat pipe including a first portion surrounding the first ic and the second ic when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink.
20240074051.PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jonghyun SEOK of Seoul (KR) for samsung electronics co., ltd., Kyeongseon PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/11
Abstract: a printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. the pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. the dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.
Inventor(s): JAEKWANG LEE of Suwon-si (KR) for samsung electronics co., ltd., HYUN A LEE of Suwon-si (KR) for samsung electronics co., ltd., DOHYUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., DONGMIN JANG of Suwon-si (KR) for samsung electronics co., ltd., JINWOO JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/11, H05K3/18, H05K3/28
Abstract: a module board includes a substrate having a wire pattern on a surface, a protection layer covering the surface of the substrate so as to expose one edge region of the substrate surface, and a plurality of tab terminals connected to the wire pattern and arranged on one edge region. each tab terminal has a width larger than a width of the wire pattern. each tab terminal has a pattern layer. a protection layer is on the pattern layer at a region where each tab terminal is connected to the wire pattern, and a plating layer is on a remainder of the pattern layer.
Inventor(s): Jungsik PARK of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Gwacheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/14, G06F1/16, G06F1/20, G06F1/26, H01Q1/52, H01Q9/04, H01R12/53, H04B1/3883, H04M1/02, H05K1/11
Abstract: an electronic device including an interposer is provided. the electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (ap) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (cp) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the cp.
Inventor(s): Poonggi JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seonjung Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyunghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hakju Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
Abstract: a housing of an electronic device includes a base layer, a first visible layer provided on a first surface of the base layer, and a second visible layer provided on a second surface of the base layer. the second visible layer is non-visible from an outside of the electronic device in a first illumination environment and where the first visible layer and the second visible layer are visible from the outside of the electronic device in a second illumination environment.
20240074139.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongmoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Julpin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jihoon CHANG of Suwon-si (KR) for samsung electronics co., ltd., Dongsik PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/78
Abstract: a semiconductor memory device including a substrate, a plurality of conductive lines extending in a first horizontal direction on the substrate and spaced apart from each other in a second horizontal direction perpendicular to the first horizontal direction, a first cell stack on each of the plurality of conductive lines and including a plurality of first vertical transistor structures and a plurality of first connection contacts, a second cell stack on the first cell stack and including a plurality of second vertical transistor structures and a plurality of second connection contacts, and a plurality of capacitor structures arranged on the second cell stack and connected to the plurality of first vertical transistor structures and the plurality of second vertical transistor structures.
Inventor(s): Eunjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Eun A KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H10B61/00, H10B63/00, H10B63/10
Abstract: a semiconductor device and a method of fabricating a semiconductor device, the semiconductor device includes an active pattern; a gate structure on the active pattern; a bit-line structure electrically connected to the active pattern; a storage node contact electrically connected to the active pattern; and a landing pad electrically connected to the storage node contact, wherein the landing pad includes a first pad flat sidewall and a second pad flat sidewall that are opposite to each other, a third pad flat sidewall between the first pad flat sidewall and the second pad flat sidewall, a fourth pad flat sidewall between the first pad flat sidewall and the second pad flat sidewall, a first pad curved sidewall between the first pad flat sidewall and the third pad flat sidewall, and a second pad curved sidewall between the first pad flat sidewall and the fourth pad flat sidewall.
20240074148.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seunghee Lee of Suwon-si (KR) for samsung electronics co., ltd., Yurim Kim of Suwon-si (KR) for samsung electronics co., ltd., Teawon Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Tak of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a plurality of bit lines arranged on a substrate and extending in a first horizontal direction, a mold insulating layer arranged on the bit lines and including a plurality of openings extending in a second horizontal direction, respectively, a plurality of channel layers respectively arranged on the bit lines and including a first vertical extension portion, in each opening of the mold insulating layer, a plurality of passivation layers respectively arranged on each vertical extension portion, a gate insulating layer arranged to face each vertical extension portion with each passivation layer therebetween, and a plurality of word lines extending in the second horizontal direction on the gate insulating layer and including first word lines respectively arranged on a first sidewall of each opening of the mold insulating layer and second word lines respectively arranged on a second sidewall of each opening of the mold insulating layer.
20240074149.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yangdoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangwuk Park of Suwon-si (KR) for samsung electronics co., ltd., Minkyu Suh of Suwon-si (KR) for samsung electronics co., ltd., Geonyeop Lee of Suwon-si (KR) for samsung electronics co., ltd., Dokeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Jungpyo Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit (ic) device may include a conductive area on a substrate; a first electrode connected to the conductive area on the substrate, a width of the first electrode in a lateral direction gradually increasing toward the substrate; a second electrode on the substrate, the second electrode including a silicon germanium (sige) film, the sige film surrounding the first electrode; and a dielectric film between the first electrode and the second electrode. a content of a component of the sige film may vary according to a distance from the substrate.
20240074150.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Intak JEON of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a lower structure; a lower electrode on the lower structure; an upper electrode covering the lower electrode on the lower structure; and a dielectric structure disposed between the lower electrode and the upper electrode. the dielectric structure includes a first dielectric film including a first material and a second dielectric film including a second material different from the first material. the first dielectric film includes a first surface in contact with or facing the lower electrode and a second surface facing the first surface. the second dielectric film includes a first portion disposed in an opening of the first dielectric film and extending in a direction from the second surface toward the first surface.
Inventor(s): Seonhaeng LEE of Suwon-si (KR) for samsung electronics co., ltd., SANGWOO PAE of Suwon-si (KR) for samsung electronics co., ltd., NAMHYUN LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor memory may include a substrate, a buried dielectric layer on the substrate and providing a first recess that extends in a first direction, a word line in the first recess of the buried dielectric layer, first and second source/drain patterns on opposite sides of the word line, a channel pattern between the word line and the first recess of the buried dielectric layer and contacting the first and second source/drain patterns, and a bit line electrically connected to the second source/drain pattern and extending in a second direction that intersects the first direction. the channel pattern includes vertical parts and a horizontal part connected to each other. the vertical parts are on opposite lateral surfaces of the word line. the horizontal part is below the word line.
20240074155.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taehyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Taegyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Seokho Shin of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangho Lee of Suwon-si (KR) for samsung electronics co., ltd., Keunnam Kim of Suwon-si (KR) for samsung electronics co., ltd., Seokhan Park of Suwon-si (KR) for samsung electronics co., ltd., Joongchan Shin of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung Jeong of Suwon-si (KR) for samsung electronics co., ltd., Eunju Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate, a bit line extending on the substrate in a first direction, first and second active patterns on the bit line, a back-gate electrode between the first and second active patterns and extending across the bit line and in a second direction that is perpendicular to the first direction, a first word line extending in the second direction at one side of the first active pattern, a second word line extending in the second direction at the other side of the second active pattern, and a contact pattern connected to each of the first and second active patterns, wherein the contact pattern sequentially includes an epitaxial growth layer, a doped polysilicon layer, and a silicide layer.
20240074157.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunsuk HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon UHM of Suwon-si (KR) for samsung electronics co., ltd., Minhee CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device may include a bit line on a substrate, a gate electrode over the bit line and spaced apart from the bit line, a gate insulation pattern on a sidewall of the gate electrode, a channel on a sidewall of the gate insulation pattern and including an oxide semiconductor material, a conductive pattern contacting an upper surface of the channel and including an amorphous oxide semiconductor material, and a contact plug contacting an upper surface of the conductive pattern. the contact plug may include a metal. the amorphous oxide semiconductor material may include fluorine (f), chlorine (cl), nitrogen (n), hydrogen (h), or argon (ar).
20240074163.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yangdoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangwuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Minkyu SUH of Suwon-si (KR) for samsung electronics co., ltd., Geonyeop LEE of Suwon-si (KR) for samsung electronics co., ltd., Dokeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungpyo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit device includes a substrate having a plurality of active regions defined therein, a first word line structure including a first word line, a first gate dielectric film surrounding the first word line, and an oxide semiconductor channel layer surrounding the first gate dielectric film, the first word line structure being buried in the substrate, and crossing a first active region of the plurality of active regions, a second word line structure including a second word line and a second gate dielectric film surrounding the second word line, the second word line structure being buried in the substrate and separated from the first word line structure, and crossing the first active region, a direct contact partially passing through the first active region and the first word line structure and contacting the oxide semiconductor channel layer, and a bit line contacting the direct contact.
Inventor(s): Ahreum Lee of Suwon-si (KR) for samsung electronics co., ltd., Woosung Yang of Suwon-si (KR) for samsung electronics co., ltd., Jimo Gu of Suwon-si (KR) for samsung electronics co., ltd., Jaeho Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, H01L23/528, H10B41/10, H10B41/40, H10B43/10, H10B43/27, H10B43/40
Abstract: according to some embodiments of inventive concepts, vertical nonvolatile memory devices and related methods may reduce chip size. the nonvolatile memory device may include a substrate wherein a first direction is orthogonal with respect to a surface of the substrate and wherein the substrate includes a cell array area and an extension area. a first gate structure layer on the substrate may include a plurality of first gate layers. a contact separation layer may be on the first gate structure layer on the extension area. a second gate structure layer on the first gate structure layer and on the contact separation layer may include a plurality of second gate layers. a plurality of channel structures may extend in the first direction through the first and second gate structure layers on the cell array area. a plurality of first metal contacts may extend through the first gate structure layer in the first direction between the substate and the contact separation layer in the extension area. a plurality of second metal contacts may extend through the second gate structure layer in the first direction in the extension area. the contact separation layer may be between the first plurality of metal contacts and the second plurality of metal contacts, and each of the second metal contacts may be aligned with a respective one of the first metal contacts in the first direction. the device may also include a plurality of first electrode pads and a plurality of second electrode pads. each of the first electrode pads may extend from a sidewall of a respective one of the first metal contacts to provide electrical coupling with a respective one of the first gate layers. each of the second electrode pads may extend from a sidewall of a respective one of the second metal contacts to provide electrical coupling with a respective one of the second gate layers.
Inventor(s): Seung Yoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Byoung Jae Park of Suwon-si (KR) for samsung electronics co., ltd., Jae-Hwang Sim of Suwon-si (KR) for samsung electronics co., ltd., Jongseon Ahn of Suwon-si (KR) for samsung electronics co., ltd., Young-Ho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/522, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/35, H10B43/40, H10B80/00
Abstract: a three-dimensional semiconductor device includes: a source structure including a cell region and an extension region; a gate stacking structure disposed on the source structure, the gate stacking structure including insulating patterns and conductive patterns, which are alternately stacked on each other; an insulating structure disposed on the gate stacking structure, the insulating structure including a plurality of insulating layers; a memory channel structure penetrating the gate stacking structure and electrically connected to the cell region; a separation structure penetrating the gate stacking structure and extending from the cell region to the extension region; and a penetration plug penetrating the gate stacking structure and the extension region, wherein the penetration plug includes: a first plug portion penetrating the gate stacking structure; and a second plug portion on the first plug portion, wherein the separation structure includes: a first separation portion penetrating the gate stacking structure; and a second separation portion on the first separation portion, and wherein a top surface of the first plug portion and a top surface of the first separation portion are at a substantially same level.
20240074193.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungyoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Doohyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunju Kim of Suwon-si (KR) for samsung electronics co., ltd., Heesuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Yejin Park of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang Sim of Suwon-si (KR) for samsung electronics co., ltd., Jongseon Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/35, H10B43/40
Abstract: a semiconductor device includes a lower circuit pattern on a substrate, a common source plate (csp) on the lower circuit pattern, a gate electrode structure including gate electrodes spaced apart from each other on the csp in a first direction that is substantially perpendicular to an upper surface of the substrate, each of the gate electrodes extending in a second direction that is substantially parallel to the upper surface of the substrate, a first insulation pattern structure on a portion of the csp that is adjacent to the gate electrode structure in the second direction, and a first division pattern extending on the csp in a third direction that is substantially parallel to the upper surface of the substrate and that crosses the second direction, the first division pattern extending through a portion of the gate electrode structure that is adjacent to the first insulation pattern structure.
Inventor(s): Byongju Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongsung Choi of Suwon-si (KR) for samsung electronics co., ltd., Wonjun Park of Suwon-si (KR) for samsung electronics co., ltd., Donghwa Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaemin Jung of Suwon-si (KR) for samsung electronics co., ltd., Changheon Cheon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/40
Abstract: a semiconductor device includes a conductive pattern, an insulating pattern, a channel film extending in a vertical direction inside a channel hole, a charge trap pattern between the conductive pattern and the channel film inside the channel hole, a tunneling dielectric film between the charge trap pattern and the channel film, and a blocking dielectric film extending between the conductive pattern and the charge trap pattern and between the insulating pattern and the tunneling dielectric film. the insulating pattern includes a first insulating pattern overlapping the conductive pattern in the vertical direction and a second insulating pattern protruding in the lateral direction from the first insulating pattern into the channel hole and toward the channel film. the first insulating pattern has a first dielectric constant, and the second insulating pattern has a second dielectric constant that is lower than the first dielectric constant.
Inventor(s): Euntaek JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/50, H10B43/27
Abstract: a semiconductor device may include a peripheral circuit structure including cell region and an outside region, a cell structure on the cell region, an outside structure on the outside region, and an insulating layer. the outside structure may include a dummy stacked structure, a through electrode penetrating the dummy stacked structure and connected to the peripheral circuit structure, and a dummy vertical structure adjacent to the through electrode and penetrating at least a portion of the dummy stacked structure. the insulating layer may be between the dummy stacked structure and the peripheral circuit structure. the dummy stacked structure may include an upper dummy stacked structure on a lower dummy stacked structure. the upper dummy stacked structure may include upper dummy patterns stacked on the lower dummy stacked structure. the lower dummy stacked structure may include lower dummy patterns stacked on the outside region.
20240074208.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byoungjae BAE of Suwon-si (KR) for samsung electronics co., ltd., Seungpil Ko of Suwon-si (KR) for samsung electronics co., ltd., Inho Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungjiong Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B61/00
Abstract: a semiconductor device includes an etch stop layer, an insulating layer on the etch stop layer, and a contact structure passing through the etch stop layer and the insulating layer, the contact structure including a first conductive layer, a second conductive layer having a side surface and a lower surface facing the first conductive layer, a third conductive layer on an upper surface of the second conductive layer, and a natural oxide film between the first conductive layer and the second conductive layer and between the second conductive layer and the third conductive layer, the first to third conductive layers including metal or metal nitride, and the natural oxide film including metal oxide.
Inventor(s): Kiyeon YANG of Suwon-si (KR) for samsung electronics co., ltd., Bonwon Koo of Suwon-si (KR) for samsung electronics co., ltd., Hajun Sung of Suwon-si (KR) for samsung electronics co., ltd., Changseung Lee of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00, H10N70/00
Abstract: disclosed are a memory device and a memory apparatus including the memory device. the memory device may include a first electrode, a second electrode spaced apart from the first electrode, an intermediate layer between the first electrode and the second electrode, and an interface layer in contact with the intermediate layer. the intermediate layer and the interface layer each may have ovonic threshold switching (ots) characteristics. a material of the interface layer may have a threshold voltage shift greater than a threshold voltage shift (a vth) of the intermediate layer.
Inventor(s): Hyungeun Choi of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/065, H01L25/18, H10B12/00
Abstract: a method of fabricating a semiconductor device may use, as an internal contact region, a region in which a memory cell region overlaps a core and/or peripheral region by bonding at least a partial region of the memory cell region to at least a partial region of the core and/or peripheral region by a direct bonding method, and thus, even when an additional contact region is secured outside the memory cell region to be smaller, signals and/or power may be transmitted between the memory cell region and the core and/or peripheral region.
Inventor(s): Oul CHO of Suwon-si (KR) for samsung electronics co., ltd., Kwanghee KIM of Suwon-si (KR) for samsung electronics co., ltd., Yuho WON of Suwon-si (KR) for samsung electronics co., ltd., Jae Yong LEE of Suwon-si (KR) for samsung electronics co., ltd., Taehyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/115, C09K11/56, C09K11/88, H10K50/16
Abstract: an electroluminescent device includes a quantum dot layer disposed between a first electrode and a second electrode, and an electron transport layer disposed between the quantum dot layer and the second electrode; wherein the quantum dot layer is configured to emit a first light, the quantum dot layer including first quantum dots, wherein the first quantum dots include a first semiconductor nanocrystal, wherein the electron transport layer includes zinc oxide nanoparticles, wherein the electroluminescent device further comprises a first layer between the quantum dot layer and the electron transport layer, the first layer including inorganic nanoparticles, wherein the inorganic nanoparticles has a different composition from the zinc oxide nanoparticles and the first quantum dots, and wherein the inorganic nanoparticles comprises a metal chalcogenide having a bandgap energy of greater than or equal to about 2.9 electron volts (ev) and less than or equal to about 10 ev.
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract:
()() formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract: wherein mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract: wherein xand xare each independently c or n, ring cyand ring cyare each independently a c-ccarbocyclic group or a c-cheterocyclic group, ring cyis a 5-membered heterocyclic group; a 5-membered heterocyclic group condensed with a c-ccarbocyclic group; or a 5-membered heterocyclic group condensed with a c-cheterocyclic group, yis o, s, se, c(r)(r), n(r), si(r)(r), or ge(r)(r), at least one of rand rcomprises deuterium, and the other substituent groups are as described herein.
20240074303.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Taegon Kim of Suwon-si (KR) for samsung electronics co., ltd., Shinae Jun of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho Choi of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C09K11/02, C09K11/06, C09K11/08, C09K11/88, H10K50/115, H10K50/12, H10K59/10, H10K85/60
Abstract: a display apparatus, including a substrate including at least one blue light-emitting unit, and a color control portion provided on the substrate and configured to control a color of a light generated at the substrate, wherein the color control portion includes a first color control element, wherein the first color control element includes a first quantum dot for green light conversion, and the at least one blue light-emitting unit of the substrate includes an emission layer, wherein the emission layer includes a host, a first dopant, and a second dopant, and wherein the display apparatus further satisfies conditions as defined herein.
Inventor(s): Sangdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Ho PARK of Suwon-si (KR) for samsung electronics co., ltd., Rae Sung KIM of Suwon-si (KR) for samsung electronics co., ltd., Insun PARK of Suwon-si (KR) for samsung electronics co., ltd., Dong-Seok LEEM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, H10K39/00, H10K39/32
Abstract: a compound represented by chemical formula 1, and near-infrared absorbing/blocking films, photoelectric devices, organic sensors, and electronic devices including the compound are provided:
Inventor(s): Sangdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Ho PARK of Suwon-si (KR) for samsung electronics co., ltd., Rae Sung KIM of Suwon-si (KR) for samsung electronics co., ltd., Insun PARK of Suwon-si (KR) for samsung electronics co., ltd., Dong-Seok LEEM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, H10K39/00, H10K39/32
Abstract:
Inventor(s): Sangdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Ho PARK of Suwon-si (KR) for samsung electronics co., ltd., Rae Sung KIM of Suwon-si (KR) for samsung electronics co., ltd., Insun PARK of Suwon-si (KR) for samsung electronics co., ltd., Dong-Seok LEEM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, H10K39/00, H10K39/32
Abstract: wherein, in chemical formula 1, xto x, and rto rare the same as defined in the detailed description.
Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- Samsung Electronics Co., Ltd.
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