Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on December 26th, 2024
Samsung Electronics Co., Ltd.: 145 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (18), H01L25/065 (15), H10B80/00 (9), H01L23/498 (9), H01L23/538 (8) H04W74/0833 (3), H05K5/0217 (3), H01L25/0655 (2), H10B12/488 (2), H01L23/49838 (2)
With keywords such as: layer, device, surface, configured, including, portion, based, substrate, semiconductor, and housing in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
20240423432. ROBOT CLEANER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyungmin SON of Suwon-si (KR) for samsung electronics co., ltd., Yongsoo KWAK of Suwon-si (KR) for samsung electronics co., ltd., Euisik KIM of Suwon-si (KR) for samsung electronics co., ltd., Sajid SADI of Mountain View CA (US) for samsung electronics co., ltd., Leo JUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/24, A47L5/12, B25J9/00
CPC Code(s): A47L9/24
Abstract: a robot cleaner is provided. the robot cleaner includes a plurality of bending tubes which are integrally connected along a longitudinal direction thereof and each of which is closed at one end and changes in volume depending on pressure in an internal space thereof, a pump device that adjusts the pressure in the internal space of each of the plurality of bending tubes, a head part disposed at one end of the plurality of bending tubes to suck air, a dust collection device that separates dust from the air sucked through the head part, and a dust collection tube that communicates the head part and the dust collection device.
Inventor(s): Md Mahbubur Rahman of San Jose CA (US) for samsung electronics co., ltd., Yincheng Jin of Port Jefferson NY (US) for samsung electronics co., ltd., Mehrab Bin Morshed of Gilroy CA (US) for samsung electronics co., ltd., Nafiul Rashid of San Jose CA (US) for samsung electronics co., ltd., Jilong Kuang of San Jose CA (US) for samsung electronics co., ltd., Jun Gao of Menlo Park CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/091, A61B5/00, A61B5/0205, A61B5/0295, A61B5/08, A61B5/11
CPC Code(s): A61B5/091
Abstract: in one embodiment, a method includes detecting, by a motion sensor of a mobile device worn by a user, multiple motion signals, each representing a motion of the user about one of a number of mobile-device axes defined by an orientation of the mobile device. the method further includes determining, for each of the multiple mobile-device axes, a ballistocardiogram (bcg) signal based on the motion signal corresponding to that mobile-device axis; selecting, based on a strength of the determined bcg signals, one or more particular mobile-device axes and corresponding motion signals for estimating a user's tidal volume; determining, based on the one or more selected motion signals, one or more breathing features; and estimating, by providing the one or more breathing features to a trained machine-learning model, the user's current tidal volume.
Inventor(s): Hyunjoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Sebin Choi of Suwon-si (KR) for samsung electronics co., ltd., Myeongjun Gil of Suwon-si (KR) for samsung electronics co., ltd., Sunghyup Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunjoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Cheol-Jae Lee of Suwon-si (KR) for samsung electronics co., ltd., Donghwy Chin of Suwon-si (KR) for samsung electronics co., ltd., Donghee Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01F25/314, B01F23/10, B01F25/31
CPC Code(s): B01F25/3143
Abstract: a gas mixing device may include a main conduit and a gas transferring device connected to the main conduit. the gas transferring device may include a distribution device surrounding the main conduit, a supplying conduit connected to the distribution device and defining a supplying path, and a plurality of connection conduits connecting the first distribution device to the main conduit. the distribution device may include inner and outer cylinders, which are sequentially provided to surround the main conduit and are sequentially spaced apart from the main conduit in a radial direction. a distribution space may be defined between the inner and outer cylinders, and the supplying conduit may be coupled to the outer cylinder, such that the supplying path is connected to the distribution space. the connection conduits may be spaced apart from each other in a circumferential direction.
Inventor(s): Hoseop Choi of Hwaseong-si (KR) for samsung electronics co., ltd., Minseop Park of Suwon-si (KR) for samsung electronics co., ltd., Jubong Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Sung Yong Park of Suwon-si (KR) for samsung electronics co., ltd., Kiju Sohn of Gunpo-si (KR) for samsung electronics co., ltd., Jaeyoung Eom of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): B23Q3/155, B24B53/017, B24D9/08
CPC Code(s): B23Q3/15513
Abstract: a conditioning disk replacement apparatus includes; a detacher configured to separate a conditioning disk from to a holder, a transfer part configured to transfer the conditioning disk, and a container configured to store the conditioning disk. the detacher includes a detachment body and a rotary part coupled to the detachment body, the rotary part includes a key protruding outward from the rotary part in a first horizontal direction, and the rotary part is configured to rotate about a central axis extending in the first horizontal direction.
Inventor(s): WONKEUN CHO of Suwon-si (KR) for samsung electronics co., ltd., DONGHOON KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B49/12, B24B49/18
CPC Code(s): B24B49/12
Abstract: a back grinding apparatus includes a grinding wheel that is rotatable and movable in a vertical direction and including at least one abrasive, and a grinding gauge below the grinding wheel and configured to measure a wear amount of the at least one abrasive, where the grinding gauge includes a measuring body and a photoelectric sensor supported by the measuring body and configured to determine the wear amount of the at least one abrasive, and where the photoelectric sensor includes at least one light emitter, and at least one light receiver spaced apart from the at least one light emitter in a horizontal direction and configured to receive light emitted from the at least one light emitter.
Inventor(s): Donghee YE of Suwon-si (KR) for samsung electronics co., ltd., Koeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd., Jungku LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J11/00, B25J19/02
CPC Code(s): B25J9/1697
Abstract: a robot and a controlling method thereof are provided. the robot includes: a camera; a driver; at least one memory storing instructions; and at least one processor operatively connected to the at least one memory. the at least one processor may be configured to execute the instructions to: recognize at least one user located around the robot based on an image acquired through the camera; identify a first rotation angle and a first rotation direction of the robot based on a location of at least one target region in which the at least one user is located among a plurality of regions within a field angle of the camera and a first gaze order for the at least one target region; and control the driver to rotate the robot based on the first rotation angle and the first rotation direction.
Inventor(s): Yong-Jhin CHO of Hwaseong-si (KR) for samsung electronics co., ltd., Young Tae KIM of Incheon (KR) for samsung electronics co., ltd.
IPC Code(s): C23C18/16, H01L21/02, H01L21/67
CPC Code(s): C23C18/1685
Abstract: an apparatus for fabricating a semiconductor device includes a chamber accommodating a substrate coated with a first fluid, a lower inlet which is placed in a lower wall of the chamber and providing a first supercritical fluid into the chamber, an upper inlet placed in an upper wall of the chamber and providing a second supercritical fluid into the chamber, a fluid outlet placed in the lower wall of the chamber and discharging a second fluid which is a mixture of the first fluid and the first supercritical fluid to outside of the chamber, and a drain cup placed between the lower wall of the chamber and the substrate, and having a first portion of which a width, in a horizontal direction, decreases toward the lower wall of the chamber, and a second portion which connects the first portion and the fluid outlet to each other.
Inventor(s): Eunkyeong KWAK of Suwon-si (KR) for samsung electronics co., ltd., Taehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Minhwan OH of Suwon-si (KR) for samsung electronics co., ltd., Sungjong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/24, D06F58/52, D06F103/02
CPC Code(s): D06F58/24
Abstract: a clothing dryer is provided. the clothing dryer includes a water tray provided to store residual water including condensate generated by drying of laundry, a drain pump provided to pump the residual water in the water tray to an outside, a sensor provided to detect a residual water amount of the condensate stored in the water tray, memory storing one or more computer programs, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the clothing dryer to control a drain processing speed of the drain pump, and control the drain pump so that the drain processing speed is slower when the residual water amount of the condensate is smaller than a first threshold level than when the residual water amount of the condensate is larger than or equal to the first threshold level, based on residual water data provided by the sensor, wherein the drain processing speed is determined by at least one of a rotational speed of the drain pump or a driving time of the drain pump.
Inventor(s): Kihwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Minjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Kisun NAM of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo RYU of Suwon-si (KR) for samsung electronics co., ltd., Incheol HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F04B35/04, F04B53/22, F25B31/02
CPC Code(s): F04B35/04
Abstract: a reciprocating compressor is provided. the reciprocating compressor includes a bearing block, a fixed shaft extending vertically from a lower surface of the bearing block, formed in a cylindrical shape, and having a shaft hole formed therein, a stator disposed on the bearing block and including a coupling hole into which the fixed shaft is inserted, a holder disposed on an outer circumferential surface of the fixed shaft and configured to fix the stator to the bearing block, a rotating shaft inserted into the shaft hole of the fixed shaft, and a rotor disposed outside the stator and fixed to one end of the rotating shaft. the outer circumferential surface of the fixed shaft and the shaft hole may be formed concentrically.
Inventor(s): Hyoju MOON of Suwon-si (KR) for samsung electronics co., ltd., Youngjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Daechul HAN of Suwon-si (KR) for samsung electronics co., ltd., Leegyu SON of Suwon-si (KR) for samsung electronics co., ltd., Ilyong CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Dongsu HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/63
CPC Code(s): F24F11/63
Abstract: an air conditioner according to the disclosure may include: an indoor unit; an outdoor unit configured to be connected to the indoor unit, and including a plurality of electronic devices comprising various circuitry; an inputter comprising input circuitry configured to obtain an input and transmit a signal corresponding to the input; and a controller comprising at least one processor, comprising processing circuitry, configured to: set a maximum current applied to the outdoor unit based on the signal received from the inputter, and adjust a driving current applied to each of the plurality of electronic devices included in the outdoor unit based on the set maximum current.
Inventor(s): Taewoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungwon OH of Suwon-si (KR) for samsung electronics co., ltd., Daehui KIM of Suwon-si (KR) for samsung electronics co., ltd., Minseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Junkyu SEONG of Suwon-si (KR) for samsung electronics co., ltd., Sunhee SON of Suwon-si (KR) for samsung electronics co., ltd., Younguk YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/86, F24F110/10, F24F120/20, F25B49/02
CPC Code(s): F24F11/86
Abstract: an air conditioner is provided. the air conditioner includes a compressor configured to compress a refrigerant, an indoor heat exchanger in which heat exchange between indoor air and the refrigerant is performed, a discharge temperature sensor configured to measure a discharge temperature of air at which the heat exchange has been completed, an intake temperature sensor configured to measure an intake temperature of the indoor air drawn into the indoor heat exchanger, an inputter configured to receive a target temperature from a user, memory storing one or more computer programs, and one or more processors communicatively coupled the compressor, the indoor heat exchanger, the discharge temperature sensor, the intake temperature sensor, the inputter, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the air conditioner to adjust an operating frequency of the compressor by comparing the intake temperature and the target temperature, and control the compressor to reduce the operating frequency in response to the discharge temperature reaching a reference temperature.
Inventor(s): Jinho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangbin MOON of Suwon-si (KR) for samsung electronics co., ltd., Tae Won SONG of Suwon-si (KR) for samsung electronics co., ltd., Youngjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyukrae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungwook HEO of Suwon-si (KR) for samsung electronics co., ltd., Terrance Christopher HUANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/392, G01R31/367, G01R31/388, G01R31/389
CPC Code(s): G01R31/392
Abstract: an electronic apparatus includes: a battery; a first calculator configured to obtain sensing data of the battery using a sensor, determine first state information of the battery using the obtained sensing data and a first battery model, and preprocess the obtained sensing data; and a second calculator configured to receive the preprocessed sensing data from the first calculator, determine an aging state of the battery using a second battery model and the received sensing data, update a parameter of the first battery model based on the determined aging state, and transmit the updated parameter to the first calculator.
Inventor(s): Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Gyeongtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Heecheul MOON of Suwon-si (KR) for samsung electronics co., ltd., Sangyoup SEOK of Suwon-si (KR) for samsung electronics co., ltd., Heebo SHIM of Suwon-si (KR) for samsung electronics co., ltd., Dongoh LEE of Suwon-si (KR) for samsung electronics co., ltd., Changmin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B7/02, G06F1/16
CPC Code(s): G02B7/023
Abstract: an electronic device includes: a first lens support coupled to a first lens; a second lens support configured to move with respect to the first lens support, the second lens support being coupled to a second lens; a first adjusting structure configured to adjust a distance between the first lens and the second lens, the first adjusting structure including a first protruding part and a second protruding part disposed on the first protruding part; and a second adjusting structure including: a plurality of grooves spaced apart from each other and arranged with respect to the first protruding part and the second protruding part, and a plurality of protrusions disposed between the plurality of grooves.
Inventor(s): Byungje JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36
CPC Code(s): G03F1/36
Abstract: the inventive concepts provide an optical proximity correction (opc) method capable of implementing a pattern having a critical pitch by using a single exposure patterning, and a mask manufacturing method including the opc method. the opc method includes receiving a design layout for a target pattern to be formed on a substrate, obtaining an opc pattern by performing a first opc on the design layout, obtaining a simulation contour of the opc pattern, based on the simulation contour of the opc pattern, performing a line-end sharpening (les) opc on line-ends of line patterns extending in a first direction and adjacent to each other in the first direction, cutting a portion of the line-end of the line pattern, and performing a second opc on side lines of another line pattern adjacent to the line-end in a second direction perpendicular to the first direction and extending in the first direction.
Inventor(s): Hansol KIM of Suwon-si (KR) for samsung electronics co., ltd., Heeyoung YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H01Q1/27, H05K1/02, H05K1/18, H01Q13/10
CPC Code(s): G06F1/163
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing including a metal frame, a display within the housing, a bracket within the housing, including a side surface facing an inner surface of the metal frame, a rigid flexible printed circuit board including a rigid portion located between the inner surface of the metal frame and the side surface of the bracket, and an electronic circuitry on the rigid portion, wherein the rigid portion includes a first portion under the electronic circuitry, and a second portion extending from a portion of the first portion toward the display and disposed on the side surface of the bracket so that the rigid portion is supported by the bracket, and wherein the second portion includes a non-conductive portion arranged with respect to a slot between the metal frame and a portion of the display, the slot used to radiate a signal to an external electronic device.
Inventor(s): Heetae KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F1/3212, G06F1/3234, H02P29/40
CPC Code(s): G06F1/1675
Abstract: an electronic device may include a first housing, a second housing configured to accommodate at least a part of the first housing and guide sliding movement of the first housing, a flexible display including a first display area coupled to the first housing and a second display area extending from the first display area, a gear disposed inside the second housing and configured to move the flexible display, a motor configured to rotate the gear, at least one sensor, and at least one processor. the at least one processor may be configured to identify a state of the electronic device including at least one of a battery current, a battery voltage, an internal consumption current, a battery level, or an electronic device temperature, based on information sensed through the at least one sensor, and control a speed of the motor or discontinue driving of the motor based on the state of the electronic device.
Inventor(s): Jaeyoung JUN of Suwon-si (KR) for samsung electronics co., ltd., Byoungjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunglak KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunmuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Jooyeol RYU of Suwon-si (KR) for samsung electronics co., ltd., Shinhyuk YOON of Suwon-si (KR) for samsung electronics co., ltd., Gyudae JANG of Suwon-si (KR) for samsung electronics co., ltd., Jinwook CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kangwook BYUN of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Changryong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3218, G06F1/16, G06F3/0488
CPC Code(s): G06F1/3218
Abstract: an electronic device according to an embodiment may comprise a touch input unit, a first pmic, a first switching circuit, and a battery controller. the battery controller may be configured to control the first switching circuit such that power is supplied from the battery to the touch input unit and no power is supplied from the battery to the first pmic. the battery controller may be configured to, while power is supplied from the battery to the touch input unit and no power is supplied from the battery to the first pmic, obtain an input through the touch input unit. the battery controller may be configured to control, based on obtaining the input, the first switching circuit such that power is supplied from the battery to the first pmic.
Inventor(s): Kyungsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sooyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Junho HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/324
CPC Code(s): G06F1/324
Abstract: a dynamic voltage and frequency scaling (dvfs) controller, an integrated circuit including dvfs, and a method of operating the dvfs controller are provided. the integrated circuit includes at least one subblock circuit configured to process an instruction, and a dvfs controller configured to control a power management unit (pmu) and a clock management unit (cmu) to control an operating voltage and an operating frequency, respectively, based on a resonance frequency calculated from a frequency response resulting from dynamic characteristics of an entire power system including the pmu, a power delivery network (pdn), and the subblock circuit.
Inventor(s): Heungsuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungik LLE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/042, H04N9/31, H04N23/12, H04N23/72, H04N23/73, H04N23/76
CPC Code(s): G06F3/0425
Abstract: an electronic device including a projector; a camera; a memory storing at least one instruction; and one or more processors operatively connected to the projector, the camera, and the memory, where the one or more processors are configured to execute the at least one instruction to: control the projector to output an original image as a picture of the original image on a projection surface; acquire a first image by controlling the camera to set at least one of a gain value and an exposure value of the camera to a first predetermined value while the original image is output as the picture on the projection surface and capture the first image of the picture on the projection surface with the at least one of the gain value and the exposure value set to the first predetermined value.
Inventor(s): Chanwon SEO of Suwon-si (KR) for samsung electronics co., ltd., Youngeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Eunseo KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungjin Eom of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04845, G06F18/214, G06F18/22, G06N3/08, G06T5/00, G06V10/82, G06V20/00, G06V40/16
CPC Code(s): G06F3/04845
Abstract: an electronic device and a controlling method thereof are provided. an electronic device includes a memory configured to store at least one instruction and a processor configured to execute the at least one instruction and operate as instructed by the at least one instruction. the processor is configured to: obtain a first image; based on receiving a first user command to correct the first image, obtain a second image by correcting the first image; based on the first image and the second image, train a neural network model; and based on receiving a second user command to correct a third image, obtain a fourth image by correcting the third image using the trained neural network model.
Inventor(s): Moonjeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun JO of Suwon-si (KR) for samsung electronics co., ltd., Youngrog KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhan LEE of Suwon-si (KR) for samsung electronics co., ltd., Raetae KIM of Suwon-si (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04886, G06F1/16, G06F3/04842, G06F3/04847, G06F3/0485
CPC Code(s): G06F3/04886
Abstract: an electronic device for controlling a screen is provided. the electronic device includes a virtual keypad and a method for controlling same. the electronic device includes a first housing, a second housing disposed to be movable with respect to the first housing and overlapping at least a portion of the first housing, at least one motor configured to move the first housing or the second housing, memory storing one or more computer programs, one or more processors disposed inside the first housing or the second housing and communicatively coupled to the at least one motor and the memory, and a flexible display at least partially mounted on a surface of the second housing and at least partially exposed to an outside of the electronic device, wherein a portion of the flexible display is inserted into or drawn out of the first housing according to driving of the motor, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to display, on the flexible display, a first screen including at least one text input field in a state in which a portion of the second housing is inserted in the first housing, obtain a first user input to the at least one text input field, display, on the flexible display, a second screen including at least one virtual keypad based on obtaining the first user input, wherein the at least one virtual keypad overlaps a portion of the at least one text input field, and display, on the flexible display, a third screen different from the second screen, based on the at least one virtual keypad overlapping the portion of the at least one text input field.
Inventor(s): Jinwoo Hong of Suwon-si (KR) for samsung electronics co., ltd., Kwangwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Yunjung Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: provided are a storage device and an operating method of a memory controller. the storage device includes a non-volatile memory that outputs data from selected memory cells based on read voltage information, the read voltage information including a start read voltage, an end read voltage, and a read command. moreover, the storage device includes a memory controller that determines whether a search region defined by the start read voltage and the end read voltage is within a multi-peak region of a threshold voltage distribution corresponding to a first state of the selected memory cells, based on the search region being within the multi-peak region, change the search region, and based on the search region not being within to the multi-peak region, determine a new read voltage using the search region.
Inventor(s): Hyunseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Jingyu Heo of Suwon-si (KR) for samsung electronics co., ltd., Inhae Kang of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoul Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0625
Abstract: an operating method may include; communicating maximum power information from the memory system to the host, communicating power table information and battery information from the host to the memory system in response to the maximum power information, and controlling power consumption by a component of the memory system in response to a maximum consumption power value, wherein each of the power table information and the battery information is related to a battery associated with the memory system and operating in accordance with battery steps, the power table information includes a number of entries including a first entry related to a first battery step among the battery steps and associated with a first maximum consumption power value, and a second entry related to a second battery step among the battery steps and associated with a second maximum consumption power value.
Inventor(s): Soonyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Dongmin Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: an example memory system includes a memory device and a memory controller. the memory device is configured to read, from a memory cell array, hard decision data based on a hard read voltage and first soft decision data based on first soft read voltages obtained based on the hard read voltage and a first voltage offset, generate a first compressed sub-segment based on encoding a position of a bit having a first value into a position value for each of first soft decision sub-segments in the first soft decision data, and output first compressed data including first compressed sub-segments. the memory controller is configured to receive the first compressed data, count the number of position values in each of the first compressed sub-segments, and provide, to the memory device based on the counted number, a command to request a change of a voltage offset and a recompression operation.
Inventor(s): Junseok HONG of Suwon-si (KR) for samsung electronics co., ltd., Banghyun KWON of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F1/16, H04M1/02, H04M1/724
CPC Code(s): G06F3/1423
Abstract: according to an embodiment, an electronic device includes a cover display, one or more communication circuits, memory, at least one sensor, and at least one processor operably coupled to the cover display, a flexible display, the one or more communication circuits, the memory, and the at least one sensor. the at least one processor is configured to obtain first data and second data. the at least one processor is configured to, based on the first data, display a first screen. the at least one processor is configured to, while the first screen is displayed through the cover display, obtain information on a second screen based on the second data. the at least one processor is configured to change a screen displayed through the cover display from the first screen to the second screen based on the information on the second screen.
Inventor(s): JONGYEON PARK of Suwon-si (KR) for samsung electronics co., ltd., JIMYUNG NA of Suwon-si (KR) for samsung electronics co., ltd., SEOKHIE HONG of Seoul (KR) for samsung electronics co., ltd., GYUSANG KIM of Seoul (KR) for samsung electronics co., ltd., DONG-JUN PARK of Seoul (KR) for samsung electronics co., ltd., DAEHYEON BAE of Seoul (KR) for samsung electronics co., ltd., MYUNG-HUN LEE of Seoul (KR) for samsung electronics co., ltd., JANGWON JU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F5/01, G06F7/523
CPC Code(s): G06F5/01
Abstract: a conditional calculator includes an input unit configured to receive a first operand, a second operand, and a control value and a calculation unit configured to perform a conditional operation in which a determination is made as to whether a predetermined operation is performed on the first and second operands, depending on the control value. the calculation unit may perform the conditional operation based on an operation of left-shifting an intermediate value of the conditional operation according to the control value or an operation of multiplying the intermediate value of the conditional operation by the control value.
Inventor(s): JOONHO JUN of Suwon-si (KR) for samsung electronics co., ltd., Minwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Byoungkon JO of Suwon-si (KR) for samsung electronics co., ltd., Duksung KIM of Suwon-si (KR) for samsung electronics co., ltd., Doohee HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F13/40, G11C11/42
CPC Code(s): G06F13/1694
Abstract: an optical memory module includes a substrate, a first memory controller on the substrate, and a plurality of first memory devices on the substrate. the first memory controller includes the first transceiver. the first transceiver receives a first optical input signal through a first optical interconnection or outputs a first optical output signal through the first optical interconnection. the first memory controller is optically connected to an optical logic module located outside the optical memory module through the first transceiver and the first optical interconnection. the plurality of first memory devices are controlled by the first memory controller and accessed by the optical logic module through the first memory controller, the first transceiver and the first optical interconnection.
Inventor(s): Veronica LAGRANGE MOUTINHO DOS REIS of Cupertino CA (US) for samsung electronics co., ltd., Vishwanath MARAM of San Jose CA (US) for samsung electronics co., ltd., Huan LI of San Jose CA (US) for samsung electronics co., ltd., Howard BUTLER of San Jose CA (US) for samsung electronics co., ltd., Oscar P. PINTO of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/2453, G06F16/22
CPC Code(s): G06F16/24549
Abstract: a system is described. the system may include a storage device, which may include storage for data and a controller to write the data to the storage and to read the data from the storage. the storage device may also include an accelerator implementing at least one operation on files stored on the storage device. these operations may be drawn from a set including a merge operation and a split operation.
Inventor(s): Yutao LI of Xi'an (CN) for samsung electronics co., ltd., Shuaijun WU of Xi'an (CN) for samsung electronics co., ltd.
IPC Code(s): G06F16/2455
CPC Code(s): G06F16/24552
Abstract: disclosed are a data query method, a data query device, a storage device, and an electronic device. the data query method comprises: receiving a data query request carrying a keyword associated with data to be queried; querying the keyword in the main cache, wherein ordered views that have been accessed historically are stored in the main cache and each of the ordered views comprises a plurality of historical keywords; in a case that a historical keyword matching the keyword is not found in the main cache, querying the data corresponding to the keyword in the hard disk and the memory based on the keyword and obtaining the data to be queried; and in a case that a historical keyword matching the keyword is found in the main cache, querying the data corresponding to the keyword in the memory based on the keyword and obtaining the data to be queried.
Inventor(s): Junghyun BYUN of Suwon-si (KR) for samsung electronics co., ltd., Yeonghyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Changmin Keum of Suwon-si (KR) for samsung electronics co., ltd., Myungho Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungkweon Bae of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06K19/06, G06T11/00, G06T11/20
CPC Code(s): G06K19/06037
Abstract: a method includes generating a pattern, and projecting the pattern. a plurality of elements are arranged in the pattern. the method further includes selecting a color for each of the plurality of elements from a color candidate group including a plurality of colors with equal differences between the plurality of colors. the color of each of the plurality of elements is different from a neighboring color of a neighboring element adjacent to that element. a plurality of color sequences corresponding to a plurality of sub-arrays are different from each other. the plurality of sub-arrays includes at least one element from among the plurality of elements. distances between pairs of color sequences of the plurality of color sequences within the pattern are greater than or equal to a predetermined threshold.
Inventor(s): Jonghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Chulsoo Park of Suwon-si (KR) for samsung electronics co., ltd., Cheolgyu Jin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/063, G06N3/048
CPC Code(s): G06N3/063
Abstract: an electronic device includes: a neural processing unit (npu) configured to process an activation function; and an accelerator in the npu, wherein the accelerator includes: a function processing block including at least one sub-operation block, and a final output block connected to the function processing block, wherein the at least one sub-operation block includes: a first sub-operation block configured to calculate an approximation output value for the activation function by processing the activation function based on a first point number and a first bit resolution, and a second sub-operation block configured to calculate a detailed output value for the activation function by processing the activation function based on a second point number and a second bit resolution, and wherein the final output block is configured to calculate a final output value corresponding to the activation function based on the approximation output value and the detailed output value.
Inventor(s): Xin JIN of Nanjing (CN) for samsung electronics co., ltd., Ban CHEN of Nanjing (CN) for samsung electronics co., ltd., Longhai Wu of Nanjing (CN) for samsung electronics co., ltd., Jie CHEN of Nanjing (CN) for samsung electronics co., ltd., Jayoon KOO of Suwon-si (KR) for samsung electronics co., ltd., Cheulhee HAHM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/18, G06V10/74, G06V10/82, G06V20/40
CPC Code(s): G06T3/18
Abstract: a method for generating a video intermediate frame includes performing a warp operation on a plurality of target video frames, based on a bidirectional optical flow between the plurality of target video frames, to obtain a plurality of pictures, determining a similarity between sub-pictures corresponding to image sub-regions in the plurality of pictures, predicting, based on the similarity, a network depth of a frame synthesis network matched with a corresponding image sub-region, the network depth increasing as the similarity decreases, performing synthetic processing, using the frame synthesis network, on corresponding sub-pictures of each of the image sub-regions, based on the network depth matched with the corresponding image sub-region, to obtain a plurality of images, and splicing the plurality of images to obtain intermediate frames of the plurality of target video frames, based on each of the image sub-regions.
Inventor(s): Jaesung Park of Suwon-si (KR) for samsung electronics co., ltd., Youngsu Moon of Suwon-si (KR) for samsung electronics co., ltd., Younghoon Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T7/194, G06T7/73
CPC Code(s): G06T7/0012
Abstract: a display device includes: a display; communication circuitry configured to communicate with an external device; and at least one memory storing one or more instructions; and at least one processor configured to execute the one or more instructions, wherein the one or more instructions, when executed by the at least one processor, cause the display device to: display an image on the display based on image information received through the communication circuitry, identify, in the image, one or more feature points of a patient and an omega shape of the patient, identify, based on the one or more feature points and the omega shape, whether the image may include a predetermined detection area associated with biometric information of the patient, and based on identifying that the image may include the predetermined detection area, adjust a display parameter of at least one of the display or the image.
Inventor(s): Naomi Shamul of Suwon-si (KR) for samsung electronics co., ltd., Tal Bernstein of Suwon-si (KR) for samsung electronics co., ltd., Tamar Dreifuss of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/55, G06T3/40
CPC Code(s): G06T7/55
Abstract: a method for disparity estimation between digital images includes generating an interleaved image from two or more digital images with an offset between them, where the interleaved image is subdivided into a plurality of patches, computing discrete cosine transform (dct) coefficients of each of the plurality of patches, computing, for each of the plurality of patches, a mean dct descriptor from the dct coefficients of each patch, and determining a disparity map from the mean dct descriptor of each of the plurality of patches using a classifier. the disparity map is configured for real-time depth estimation from the two or more digital images.
Inventor(s): Vishakha S R of Bengaluru (IN) for samsung electronics co., ltd., Pawan Prasad BINDIGAN HARIPRASANNA of Bengaluru (IN) for samsung electronics co., ltd., Green Rosh K S of Bengaluru (IN) for samsung electronics co., ltd., Akula JAYAPRAKASH of Bengaluru (IN) for samsung electronics co., ltd., Prateek KUKREJA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06V40/20, G06T3/40, G06T7/20, G06V10/74
CPC Code(s): G06V40/20
Abstract: provided are a system and a method for recognizing non-line-of-sight human action, the method including receiving a plurality of image frames in a sequential order from an imaging device, wherein at least one of the plurality of image frames comprises at least one entity performing an action; identifying, based on the plurality of image frames, that a first partial portion of the action occurs within a field of view of the imaging device and a second partial portion of the action occurs outside the field of view of the imaging device; identifying a type of a motion which occurs during the action based on the first partial portion; extrapolating the motion based on the first partial portion, and generating a trajectory of the motion corresponding to the second partial portion of the action; and recognizing the human action from the type of the motion and the trajectory of the motion.
Inventor(s): Donghan LEE of Suwon-si (KR) for samsung electronics co., ltd., Nahoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyun Ju of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20
CPC Code(s): G09G3/20
Abstract: according to an embodiment of the present disclosure, gamma line interconnect circuit may include a resistor string including a first resistor connected between a first node and a second node and a second resistor connected between the second node and a third node, a first switch connected between a first gamma line and the first node, and configured to operate based on an interconnect signal, a second switch connected between a second gamma line and the second node, and configured to operate based on the interconnect signal, and a third switch that is connected between a third gamma line and the third node, and configured to operate based on the interconnect signal.
Inventor(s): Donghyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seonghan RYU of Suwon-si (KR) for samsung electronics co., ltd., Yubin SEO of Suwon-si (KR) for samsung electronics co., ltd., Eunji LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungja CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jiyeon HONG of Suwon-si (KR) for samsung electronics co., ltd., Sechun KANG of Suwon-si (KR) for samsung electronics co., ltd., Yongjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Seungchul LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G06F3/16, G06F40/30, G10L13/00, G10L15/30
CPC Code(s): G10L15/22
Abstract: in response to occurrence of at least one event, an application is executed to transmit and receive at least one of text data or voice data with external device using the communication module. in response to receiving text data or voice data from the external device through the communication module, a response is obtained to the text data or the voice data based on a characteristic of a user utterance stored in memory. a determination is made whether a confirmation of a user is necessary for a response based on information included in at least one of the the text data or the voice data, information included in the response, or information regarding an utterance history of the user stored in the memory. based on a determination that the user's confirmation is necessary, a notification is provided including an object to approve content of the received text data or voice data. the determination that a confirmation is necessary may include using a rule-based or ai algorithm such as a machine learning, a neural network, or a deep learning algorithm.
Inventor(s): Subhasis SANYAL of Noida (IN) for samsung electronics co., ltd., Mohit Kumar Barai of Noida (IN) for samsung electronics co., ltd., Arif Samad of Noida (IN) for samsung electronics co., ltd., Yash Beniwal of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): G10L17/06, G10L17/02
CPC Code(s): G10L17/06
Abstract: a method of controlling an electronic apparatus for distinguishing original voice from synthetic voice in an internet of things (iot) environment includes obtaining a voice of a user and environmental factors associated with a user-initiated request, extracting a plurality of features from the voice of the user and the environmental factors, obtaining a score using the plurality of features and ranking the score based on a type of the voice of the user and the environmental factors, and determining the voice of the user as the original voice or the synthetic voice by comparing the ranked score with a dynamic threshold value.
Inventor(s): Sijung YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/22, G06N3/0464, G11C7/16, G11C11/54, H01L29/78, H10B51/30
CPC Code(s): G11C11/223
Abstract: a synapse device including a ferroelectric field effect transistor, and a neural network apparatus including the same, are provided. the synapse device includes a first ferroelectric field effect transistor and a second ferroelectric field effect transistor electrically connected in parallel with the first ferroelectric field effect transistor, wherein the first ferroelectric field effect transistor may have a first coercive voltage, and the second ferroelectric field effect transistor may have a second coercive voltage that is greater than the first coercive voltage.
Inventor(s): Hyun-Chul YOON of Suwon-si (KR) for samsung electronics co., ltd., Youngcheol CHAE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/4074, G11C11/4094
CPC Code(s): G11C11/4091
Abstract: a memory device including: a memory cell array including a first memory cell connected to a bit line, and a second memory cell connected to a complementary bit line; a bit line sense amplifier including a sensing bit line and a sensing complementary bit line; a first charge transfer transistor between the bit line and the sensing bit line; a second charge transfer transistor between the complementary bit line and the sensing complementary bit line; a first pre-charge transistor pre-charging the bit line and the complementary bit line with a first pre-charge voltage; a second pre-charge transistor pre-charging the sensing bit line and the sensing complementary bit line with a second pre-charge voltage; a first transfer gate transistor providing a first transfer gate voltage to the first charge transfer transistor; and a second transfer gate transistor providing a second transfer gate voltage to the second charge transfer transistor.
20240428857. NON-VOLATILE MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kuihan KO of Seoul (KR) for samsung electronics co., ltd., Sanwon PARK of Seoul (KR) for samsung electronics co., ltd., Minyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jekyung CHOI of Hwaseong-si (KR) for samsung electronics co., ltd., Junho CHOI of Gwangju-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/04, G11C5/06, G11C16/10, H10B43/10, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): G11C16/0483
Abstract: a non-volatile memory device is provided. the memory device includes: word lines stacked on a substrate; a string select lines on the word lines, the string select lines being spaced apart from each other in a first horizontal direction and extending in a second horizontal direction; and a memory cell array including memory blocks, each of which includes memory cells connected to the word lines and the string select lines. the string select lines include a first string select line, and a second string select line which is farther from a word line cut region than the first string select line, and a program operation performed on second memory cells connected to a selected word line and the second string select line is performed before a program operation performed on first memory cells connected to the selected word line and the first string select line.
Inventor(s): Juhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Haewook PARK of Suwon-si (KR) for samsung electronics co., ltd., Younsok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H03F3/45
CPC Code(s): H01J37/32917
Abstract: a plasma diagnostic circuit includes a signal generator that outputs a first alternating current (ac) signal to a first reference node, a variable diagnostic circuit that includes a default electronic element connected between the first reference node and a measurement node and floated other electronic elements, a first probe that is connected to the measurement node and is exposed to plasma in a chamber, a differential amplifier that amplifies a difference between a first voltage of the first reference node and a second voltage of the measurement node and generates an analysis signal, and a selection controller that outputs a selection signal to the variable diagnostic circuit responsive to the analysis signal, wherein the selection signal indicates a target electronic element among the floated other electronic elements.
20240429039. METHOD OF DEPOSITING FILM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eun Hyea Ko of Suwon-si (KR) for samsung electronics co., ltd., Soyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Hoon Han of Suwon-si (KR) for samsung electronics co., ltd., Byungkeun Hwang of Suwon-si (KR) for samsung electronics co., ltd., Jaewoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Younghun Sung of Suwon-si (KR) for samsung electronics co., ltd., Younjoung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, C09D5/00, C09D5/26, C09D175/02, C23C16/56, H01L21/285, H01L21/3105
CPC Code(s): H01L21/02118
Abstract: methods of depositing a film are provided. the methods may include providing a substrate that includes a first surface and a second surface adjacent to the first surface; forming a polymer sacrificial layer on the first surface by using a molecular layer deposition (mld) process; forming a first film on the second surface; and removing the polymer sacrificial layer formed on the first surface. a functional group density of the first surface may be higher than a functional group density of the second surface, and the polymer sacrificial layer may include a thermally decomposable polymer.
Inventor(s): Jeonggyu SONG of Suwon-si (KR) for samsung electronics co., ltd., Ilkwon OH of Gunpo-si (KR) for samsung electronics co., ltd., Beomseok KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Jooho LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonsik CHOI of Hwaseong-si (KR) for samsung electronics co., ltd., Byungjun WON of Suwon-si (KR) for samsung electronics co., ltd., Minjeong RHEE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, C23C16/34, C23C16/40, C23C16/455
CPC Code(s): H01L21/0228
Abstract: provided is a method of forming an insulating film on a substrate by using atomic layer deposition (ald). the method of forming an insulating film on a substrate by using ald includes transferring a deposition-hindering material to the substrate, and depositing a first material layer by transferring a first precursor to the deposition-hindering material, wherein the deposition-hindering material includes an organic ligand, and the first precursor includes an alkoxide ligand.
Inventor(s): Sangjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongcheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeongeun YOOK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/027, H01L21/308, H01L21/311
CPC Code(s): H01L21/0274
Abstract: a method of manufacturing a semiconductor device includes sequentially forming an etch target film and an insulating film on a substrate. a first photoresist film is formed on the insulating film. a first photoresist pattern is formed exposing a first region of the insulating film by patterning the first photoresist film. a protective film is formed covering the first photoresist pattern and the first region of the insulating film. a second photoresist pattern is formed exposing a second region of the protective film. the protective film covers the first photoresist pattern during the forming of the second photoresist pattern. a first trench is formed by etching the etch target film using the first photoresist pattern. a second trench is formed by etching the etch target film using the second photoresist pattern. the forming of the first trench is performed after the forming of the second photoresist pattern.
Inventor(s): SUNGMIN KIM of Incheon (KR) for samsung electronics co., ltd., DAEWON HA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/306, H01L21/20, H01L21/3105, H01L21/762, H01L21/84
CPC Code(s): H01L21/30625
Abstract: methods of forming a semiconductor device and semiconductor device formed by the methods are provided. the methods of forming a semiconductor device may include providing a first substrate and a first bonding layer that is provided on the first substrate, forming a sacrificial pattern and an active pattern on a second substrate, forming a second bonding layer on the active pattern, bonding the second bonding layer onto the first bonding layer, removing the second substrate, and removing the sacrificial pattern to expose the active pattern. forming the sacrificial pattern and the active pattern on the second substrate may include forming a preliminary sacrificial pattern and the active pattern on the second substrate and oxidizing the preliminary sacrificial pattern. the preliminary sacrificial pattern and the active pattern may be sequentially stacked on the second substrate.
Inventor(s): Jane P. Chang of Los Angeles CA (US) for samsung electronics co., ltd., Owen Watkins of Los Angeles CA (US) for samsung electronics co., ltd., Harsono S. Simka of Saratoga CA (US) for samsung electronics co., ltd., Ryan Sheil of Los Angeles CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L21/3213, H01L21/02, H01L21/033
CPC Code(s): H01L21/32139
Abstract: a method of manufacturing an interconnect in a metal layer in a back-end-of-line of a semiconductor device includes nplasma passivation, through an opening a hard mask, of a ruthenium layer on a substrate. the nplasma passivation forms a ruthenium nitride layer on the ruthenium layer. the ruthenium nitride layer includes a first portion aligned with the opening and a second portion underneath the hard mask. the method also includes hplasma reduction of the ruthenium nitride layer after the nplasma passivation. the hplasma reduction removes the first portion of the ruthenium nitride layer. the method also includes oplasma etching the ruthenium layer after the hplasma reduction. the method also includes repeatedly performing the nplasma passivation, the hplasma reduction, and the oplasma etching to remove the ruthenium layer down to the substrate.
Inventor(s): Junghoon KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48, H01L23/00, H01L23/36
CPC Code(s): H01L21/4853
Abstract: a method of fabricating a semiconductor package is disclosed. the method may include providing an insulating layer, forming a seed layer to cover a top surface of the insulating layer, forming a sacrificial layer on the seed layer, forming penetration holes to penetrate the sacrificial layer and expose the seed layer, forming conductive posts in the penetration holes, removing the sacrificial layer, performing a laser irradiation process on the seed layer to form seed patterns below the conductive posts, attaching a semiconductor chip to a portion of the insulating layer which is placed between the conductive posts, and removing the insulating layer. an outer side surface of the conductive post and an outer side surface of the seed pattern may be substantially coplanar with each other, thereby forming a flat surface.
Inventor(s): Kyu Ok LEE of Seongnam-si (KR) for samsung electronics co., ltd., Ji Yong KIM of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/677, H01L21/67, H01L21/68
CPC Code(s): H01L21/67766
Abstract: a foup comprises: an external server; and a substrate processing device for performing substrate processing and transmitting integrated management data to the external server. the substrate processing device comprises: foups for accommodating a plurality of substrates; load ports to which the foups are detachably coupled; a process chamber in which substrate processing is performed; an efem, which is provided between the process chamber and the load ports, and has an end effector for getting, into the process chamber, the substrates accommodated in the foups or putting, into the foups, the substrates for which processing is completed in the process chamber; and a control unit for transmitting, if the foups are loaded in the load ports, moving path data of the end effector to the external server when the end effector enters into or retreats from the foups.
20240429084. SUBSTRATE PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngbok LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangchul HAN of Suwon-si (KR) for samsung electronics co., ltd., Yihwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeontae KIM of Suwon-si (KR) for samsung electronics co., ltd., Namjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H01L21/67
CPC Code(s): H01L21/6833
Abstract: a substrate processing apparatus that includes a mounting table including an insulator having a loading surface; a gas distribution unit including injection holes; and a gas supply unit that supplies process gas. an electrode and a heater are embedded in the insulator, and a dielectric layer covers the loading surface. the dielectric layer includes a lower material layer, an intermediate material layer, and an upper material layer. the intermediate material layer has a third thickness, greater than each of a first thickness of the lower material layer and a second thickness of the upper material layer. the intermediate material layer has a third dielectric constant, greater than each of a first dielectric constant of the lower material layer and a second dielectric constant of the upper material layer.
Inventor(s): Jangwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunglak MA of Suwon-si (KR) for samsung electronics co., ltd., Jiyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongbo SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/16, H01L23/31, H01L23/498, H01L25/065, H01L25/10
CPC Code(s): H01L23/16
Abstract: a semiconductor package includes a lower package having opposite first and second lower package sides that extend in a first direction; an upper package stacked on the lower package by conductive connection members, the upper package having opposite first and second upper package sides that extend in the first direction, wherein the second upper package side is spaced apart from the second lower package side by a predetermined distance to define an underfill region on an upper surface of the lower package; and an underfill member extending from the underfill region on the upper surface of the lower package to fill a space between the lower package and the upper package.
Inventor(s): Hyunggyun NOH of Suwon-si (KR) for samsung electronics co., ltd., JINSOO BAE of Suwon-si (KR) for samsung electronics co., ltd., KEUN-HO RHEW of Suwon-si (KR) for samsung electronics co., ltd., DEOK-SEON CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jongchan CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/24, H01L23/00, H01L23/36, H10B80/00
CPC Code(s): H01L23/24
Abstract: a semiconductor memory module is disclosed. the semiconductor memory module includes a first substrate including a first corner, first semiconductor packages mounted on a lower surface of the first substrate, a second substrate disposed over the first substrate and including a second corner corresponding to the first corner, second semiconductor packages mounted on an upper surface of the second substrate, and a fixing structure in which the first corner and the second corner are fitted.
Inventor(s): Tae Sun Kim of Ballston Spa NY (US) for samsung electronics co., ltd., Wonhyuk Hong of Clifton NY (US) for samsung electronics co., ltd., Jongjin Lee of Clifton Park NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd., Jason Martineau of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: provided is a semiconductor device and a method of manufacturing the semiconductor device. the semiconductor device includes: a 1source/drain region; a 2source/drain region; a channel structure connecting the 1source/drain region to the 2source/drain region; a gate structure surrounding the channel structure; a backside contact structure, below the 1source/drain region, connected to the 1source/drain region; and a 1backside spacer at a lateral side of the backside contact structure.
Inventor(s): Minwoo Cho of Suwon-si (KR) for samsung electronics co., ltd., Hyunggil Baek of Suwon-si (KR) for samsung electronics co., ltd., Shlege Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49816
Abstract: a semiconductor package includes a lower substrate that includes a chip mounting region and a peripheral region, where the lower substrate includes lower redistribution wirings; a first semiconductor chip on the chip mounting region, where the first semiconductor chip includes: a silicon substrate that includes a first surface and a second surface that are opposite to each other, an activation layer on the second surface, and a chip redistribution wiring layer that is on the first surface and includes a plurality of chip redistribution wirings that are electrically insulated from the activation layer; a plurality of connecting members that are on the peripheral region and are electrically connected to the lower redistribution wirings; and an upper substrate on the plurality of connecting members, and where at least a portion of the first semiconductor chip is in a through cavity defined by the upper substrate.
Inventor(s): Heejin YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L25/065
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a package substrate having a first surface and a second surface opposite to each other, the package substrate comprising a plurality of first substrate pads and a plurality of second substrate pads that are exposed from the first surface; a semiconductor device mounted on the first surface of the package substrate; at least one semiconductor element on the package substrate, the at least one semiconductor element spaced apart from the semiconductor device, the at least one semiconductor element being mounted on the package substrate via solder members that are disposed on the plurality of second substrate pads; and a plurality of insulating structures on the first surface of the package substrate to space a lower surface of the at least one semiconductor element from the first surface of the package substrate.
Inventor(s): Myungsam Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/15, H01L23/538, H01L25/065, H01L25/10
CPC Code(s): H01L23/49838
Abstract: a package substrate including a glass substrate having a first surface and a second surface opposite thereto, and including a plurality of through holes extending from the second surface to the first surface of the glass substrate, a plurality of wiring patterns each including a through electrode positioned in the plurality of through holes and a via pad extending from the through electrode to cover a portion of the second surface of the glass substrate, a seed layer arranged between the glass substrate and the plurality of wiring patterns, and including a first surface coplanar with the first surface of the glass substrate, wherein the through electrode of each of the plurality of wiring patterns includes a first surface coplanar with the first surface of the glass substrate.
20240429165. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongsik PARK of Suwon-si (KR) for samsung electronics co., ltd., Jihoon CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/49, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device may include a lower wiring structure on a substrate, the lower wiring structure including a plurality of wirings. the plurality of wirings includes a first wiring group having a first stacked structure including a metal pattern and a barrier metal pattern constituting a contact plug and a conductive pattern, and the barrier metal pattern surrounding a lower surface of the metal pattern; and a second wiring group having a second stacked structure different from the first stacked structure, the second stacked structure including a lower metal pattern and a lower barrier metal pattern surrounding a lower surface of the lower metal pattern constituting the contact plug, and an upper metal pattern constituting the conductive pattern, the upper metal pattern having a resistance lower than the lower metal pattern.
Inventor(s): Dalhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangjung JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L27/092, H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/78, H01L29/786
CPC Code(s): H01L23/5286
Abstract: an integrated circuit includes a plurality of standard cells on a front surface of a substrate and a backside wiring layer on a back surface of the substrate, where the plurality of standard cells include a first standard cell, the first standard cell includes a first p-type transistor and a first n-type transistor, the backside wiring layer includes a first backside wiring pattern configured to receive a first power supply voltage, a second backside wiring pattern configured to receive a second power supply voltage, and a third backside wiring pattern configured to receive a ground voltage, and the first standard cell at least partially overlaps the first backside wiring pattern, the second backside wiring pattern, and the third backside wiring pattern.
20240429174. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Kwangbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/29, H01L23/31, H01L25/18, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a semiconductor package according to an embodiment includes a first semiconductor chip, a second semiconductor chip, a first dielectric film surrounding the first semiconductor chip and the second semiconductor chip; first vias; second vias; a bridge chip; a second dielectric film surrounding the bridge chip and having an upper surface and a lower surface opposite to the upper surface; and a third via, some of the first vias are electrically connected to some of the bridge chip pads, some of the second vias are electrically connected to others of the bridge chip pads, and the passivation layer includes a same material as a material of the first dielectric film.
Inventor(s): JU-IL CHOI of Suwon-si (KR) for samsung electronics co., ltd., KWANGOK JEONG of Suwon-si (KR) for samsung electronics co., ltd., JAEMOK JUNG of Suwon-si (KR) for samsung electronics co., ltd., JEONGGI JIN of Suwon-si (KR) for samsung electronics co., ltd., TAE OH HA of Suwon-si (KR) for samsung electronics co., ltd., HONGSEO HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L21/48, H01L23/00, H01L23/498, H01L23/538
CPC Code(s): H01L23/544
Abstract: a semiconductor package including: a first redistribution structure; a semiconductor chip on the first redistribution structure; a pad insulation layer on a lower surface of the first redistribution structure; a conductive pad extending into a lower surface of the pad insulation layer and electrically connected to the first redistribution structure; and a plurality of alignment patterns on an edge of the pad insulation layer, each of the plurality of alignment patterns including a first portion extending into a lower surface of the pad insulation layer and a second portion extending away from the lower surface of the pad insulation layer.
Inventor(s): Homoon Shin of Suwon-si (KR) for samsung electronics co., ltd., Jooyong Park of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Jeon of Suwon-si (KR) for samsung electronics co., ltd., Pansuk Kwak of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H01L24/08
Abstract: an integrated circuit device includes; a peripheral circuit structure including a peripheral circuit, a first insulating layer covering the peripheral circuit, extension lines in the first insulating layer, and a first bonding pad in the first insulating layer, and a cell array structure including a conductive plate, a memory cell array below the conductive plate, a second insulating layer covering the memory cell array, a second bonding pad in the second insulating layer, a conductive via on the conductive plate, and a line connected to the conductive via. the first bonding pad contacts the second bonding pad, and the integrated circuit device further includes contact plugs electrically connecting the line to the extension lines.
20240429189. SEMICONDUCTOR PACKAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ju-Il CHOI of Seongnam-si (KR) for samsung electronics co., ltd., Gyuho KANG of Cheonan-si (KR) for samsung electronics co., ltd., Heewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Junyoung PARK of Asan-si (KR) for samsung electronics co., ltd., Seong-Hoon BAE of Cheonan-si (KR) for samsung electronics co., ltd., Jin Ho AN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/532, H01L23/538
CPC Code(s): H01L24/14
Abstract: a semiconductor package device may include a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. the redistribution substrate may include an under-bump pattern, which includes including a body portion and a protruding portion extended from the body portion to form a single object, an insulating layer covering a side surface of the body portion, and an outer coupling terminal on the protruding portion. the body portion may have a first diameter in a first direction parallel to the top surface of the redistribution substrate, and the protruding portion may have a second diameter in the first direction, which is smaller than the first diameter. a top surface of the protruding portion may be parallel to the first direction, and a side surface of the protruding portion may be inclined at an angle to a top surface of the body portion.
Inventor(s): CHAJEA JO of Suwon-si (KR) for samsung electronics co., ltd., Jaejun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyiyeong Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/00, H01L25/10, H01L25/18, H10B80/00
CPC Code(s): H01L24/20
Abstract: a semiconductor package includes a lower semiconductor chip including a first circuit layer, an upper semiconductor chip disposed on the lower semiconductor chip and including a second circuit layer, and an interconnection layer disposed between the lower semiconductor chip and the upper semiconductor chip, the interconnection layer including a plurality of pads, including at least a first pad offset from the lower semiconductor chip or the upper semiconductor chip, and a wiring portion horizontally extended and connecting the first pad of the plurality of pads to a second pad of the plurality of pads disposed between the lower semiconductor chip and the upper semiconductor chip, wherein the wiring portion of the interconnection layer electrically connects the first circuit layer to the second circuit layer.
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L23/544, H01L25/00, H01L25/065, H01L25/16, H10B80/00
CPC Code(s): H01L24/96
Abstract: a method of manufacturing a semiconductor package according to embodiments of the present disclosure has an effect of reducing the size of the semiconductor package by minimizing a distance between semiconductor chips by self-aligning the semiconductor chips on pads having fine gaps due to the surface tension of solder bumps.
20240429200. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/495, H01L23/538, H10B80/00
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a redistribution structure including: a passivation layer; an under bump metallurgy (ubm) layer on a portion of a lower surface of the passivation layer; and a conductive layer in contact with the ubm layer and exposed from an upper surface of the passivation layer opposite to the lower surface of the passivation layer. the semiconductor package further includes: a bridge chip on the redistribution structure and including a bridge chip pad; a first molding layer sealing the bridge chip on the redistribution structure; conductive posts spaced apart from each other in a horizontal direction within the first molding layer, the bridge chip being between the conductive posts and each of the conductive posts; and a semiconductor chips on the first molding layer and the bridge chip, each of the semiconductor chips including a chip pad and a solder bump.
20240429202. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SANGHO SHIN of Suwon-si (KR) for samsung electronics co., ltd., YOUNG LYONG KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes: a first substrate including lower bonding pads; at least one semiconductor chip disposed on the first substrate; bumps disposed on a first surface of the first substrate; and a mold layer disposed on the first substrate and covering the at least one semiconductor chip, wherein the bumps include: a pillar portion bonded to the first surface of the first substrate; a solder portion bonded to a first surface of the pillar portion; and a metal layer including a material including high-melting-point metal atoms, wherein the metal layer covers a first surface of the solder portion, wherein the solder portion includes the high-melting-point metal atoms.
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/538
CPC Code(s): H01L25/0655
Abstract: provided is a semiconductor package including a first redistribution structure, a second redistribution structure on the first redistribution structure, a plurality of semiconductor chips on an upper surface of the second redistribution structure, a bridge chip on a lower surface of the second redistribution structure, and a first molding layer between the first redistribution structure and the second redistribution structure and adjacent to the bridge chip, wherein the first molding layer is between the bridge chip and the first redistribution structure.
Inventor(s): SANG-SICK PARK of Hwaseong-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Hwaseong-si (KR) for samsung electronics co., ltd., JONGHO LEE of Hwaseong-si (KR) for samsung electronics co., ltd., TEAK HOON LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00
CPC Code(s): H01L25/0657
Abstract: disclosed is a semiconductor package with increased thermal radiation efficiency, which includes: a first die having signal and dummy regions and including first vias in the signal region, a second die on the first die and including second vias in the signal region, first die pads on a top surface of the first die and coupled to the first vias, first connection terminals on the first die pads which couple the second vias to the first vias, second die pads in the dummy region and on the top surface of the first die, and second connection terminals on the second die pads and electrically insulated from the first vias and the second vias. each of the second die pads has a rectangular planar shape whose major axis is provided along a direction that leads away from the signal region.
20240429214. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ju-Il CHOI of Seongnam-si (KR) for samsung electronics co., ltd., Gyuho KANG of Cheonan-si (KR) for samsung electronics co., ltd., Heewon KIM of Asan-si (KR) for samsung electronics co., ltd., Sechul PARK of Bucheon-si (KR) for samsung electronics co., ltd., Jongho PARK of Cheonan-si (KR) for samsung electronics co., ltd., Junyoung PARK of Asan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/48, H01L23/498, H01L23/538, H01L25/065
CPC Code(s): H01L25/105
Abstract: disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. the semiconductor chip has third and fourth surfaces opposite to each other. the third surface of the semiconductor chip faces the first surface of the interposer substrate. the redistribution patterns are connected to the fourth surface of the semiconductor chip. the semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun Jee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/00, H01L21/56, H01L23/00, H01L23/367, H01L23/538, H01L25/065, H01L25/18, H10B80/00
CPC Code(s): H01L25/50
Abstract: a method of manufacturing a semiconductor package includes bonding a first semiconductor chip and a bridge structure onto a carrier structure; bonding a second semiconductor chip and a third semiconductor chip onto the bridge structure, the second semiconductor chip and the third semiconductor chip being apart from each other in a horizontal direction; and forming a plurality of connection bumps on the second semiconductor chip and the third semiconductor chip.
Inventor(s): Changkeun Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L21/768, H01L23/48
CPC Code(s): H01L27/14605
Abstract: disclosed are image sensors and methods of fabricating the same. the image sensor includes a semiconductor substrate including a pixel zone and a pad zone and having a first surface and a second surface opposing each other, a first pad separation pattern on the pad zone and extending from the first surface of the semiconductor substrate toward the second surface of the semiconductor substrate, a second pad separation pattern extending from the second surface toward the first surface of the semiconductor substrate on the pad zone the second pad and in contact with the first pad separation pattern, and a pixel separation pattern on the pixel zone and extending from the second surface of the semiconductor substrate toward the first surface of the semiconductor substrate.
Inventor(s): Gwangho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyein PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaedeok LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N23/56, H04N23/57
CPC Code(s): H01L27/14623
Abstract: an electronic device according to an embodiment of the disclosure includes an upper structure that forms at least a portion of an exterior of the electronic device, a sensor module including a light emitting unit and a light receiving unit spaced apart from each other on a surface thereof that faces in a first direction and faces the upper structure, and a shielding structure that has a thin film form and surrounds at least a portion of the surface of the sensor module that faces in the first direction, the first direction being a direction in which the light emitting unit emits light. the upper structure is spaced apart from a surface of the shielding structure that faces in the first direction. the shielding structure includes a shielding film layer, a lusterless layer, and a diffuse reflection layer stacked on the sensor module in the first direction. the diffuse reflection layer is formed of a mixture of a plurality of silica particles and a binder and includes, on a surface of the diffuse reflection layer, a plurality of raised parts having a mountain shape, the width of which is decreased in the first direction.
20240429259. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghyung PYO of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor includes: a substrate including a first side configured to receive light and a second side that is opposite the first side; a pixel separating pattern configured to at least partially define a unit pixel in the substrate; a first photoelectric conversion layer and a second photoelectric conversion layer arranged in a first direction in the pixel separating pattern; a first separating pattern configured to at least partially define the first photoelectric conversion layer and the second photoelectric conversion layer in the substrate between the first photoelectric conversion layer and the second photoelectric conversion layer; a first grid pattern on the pixel separating pattern; and a second grid pattern on the first separating pattern and having a lower height than the first grid pattern.
Inventor(s): Jeongil BANG of Suwon-si (KR) for samsung electronics co., ltd., Haeryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jooho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/008, H10B12/00
CPC Code(s): H01L28/60
Abstract: a capacitor includes a first electrode including a conductive layer, a second electrode spaced apart from the first electrode, a dielectric layer disposed between the first electrode and the second electrode, and an interfacial layer disposed between the first electrode and the dielectric layer, wherein the conductive layer includes a first element, a second element, and a third element, the first element includes ti or al, the second element includes ti, al, hf, zr, ta, cr, y, sc, si, nb, mo, v, w, mn, ni, or co, the third element includes n, the first element and the second element are different from each other, and the conductive layer has a rock salt crystal structure.
Inventor(s): Taekyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewon SHIM of Suwon-si (KR) for samsung electronics co., ltd., Jaejin CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/06
CPC Code(s): H01L28/75
Abstract: a semiconductor device includes a capacitor including a first electrode, a second electrode, and a dielectric layer between the first electrode and the second electrode, where at least one of the first electrode and the second electrode includes a nanolaminate electrode, the nanolaminate electrode includes a plurality of first material layers and a plurality of second material layers, the plurality of first material layers and the plurality of second material layers being alternately arranged, the plurality of first material layers includes indium oxide (ino), the plurality of second material layers includes molybdenum oxide (moo), each of the plurality of first material layers has a thickness between about 2 angstroms to about 6 angstroms, and each of the plurality of second material layers includes a monolayer of molybdenum oxide.
20240429303. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donggon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Eunhyea Ko of Suwon-si (KR) for samsung electronics co., ltd., Sunjung Lee of Suwon-si (KR) for samsung electronics co., ltd., Yongho Ha of Suwon-si (KR) for samsung electronics co., ltd., Jeongwon Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/45, H01L29/06, H01L29/40, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L29/45
Abstract: an integrated circuit device includes a substrate, a fin-type active region extending in a first horizontal direction on a first surface of the substrate, a source/drain region on the fin-type active region, an active contact on the source/drain region and electrically connected to the source/drain region, a wiring line extending at a vertical level higher than the source/drain region, a via contact penetrating an insulating layer on the source/drain region and serving as a medium of electrical connection between the active contact and the wiring line, and an adhesive layer between the wiring line and the insulating layer and contacting the wiring line, wherein the via contact includes a top via contact and a bottom via contact, the top via contact includes a metal different from a metal included in the bottom via contact, and the wiring line and the top via contact are in direct contact with each other.
Inventor(s): Rebecca PARK of Mountain View CA (US) for samsung electronics co., ltd., Mehdi SAREMI of Danville CA (US) for samsung electronics co., ltd., Ming HE of San Jose CA (US) for samsung electronics co., ltd., Muhammed AHOSAN UL KARIM of San Jose CA (US) for samsung electronics co., ltd., Aravindh KUMAR of Mountain View CA (US) for samsung electronics co., ltd., Harsono SIMKA of Saratoga CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/417, H01L29/78
CPC Code(s): H01L29/66545
Abstract: provided are systems, methods, and apparatuses for applying stress in transistors. in one or more examples, the systems, devices, and methods include depositing an epitaxial film on a surface between a first sidewall and a second sidewall of the transistor; depositing a dielectric over the epitaxial film and on the surface between the first sidewall and the second sidewall to increase stress in a silicon channel of the transistor; removing a polysilicon fin between the second sidewall and a third sidewall; and depositing a first metal between the second sidewall and the third sidewall based on removing the polysilicon fin.
Inventor(s): Kiyeong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Wanjae JU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M10/42, H01M10/46, H01M50/574, H02J7/00, H05K1/18
CPC Code(s): H01M10/425
Abstract: an electronic device capable of selectively performing normal charging and fast charging,, may comprise: a battery having a first surface and a second surface facing a different direction than the first surface, and includes a first connector and a second connector; a first printed circuit board (pcb) connected to the first connector and disposed closer to the first surface than to the second surface of the battery; a second pcb connected to the second connector and disposed closer to the second surface than to the first surface of the battery; a first charging integrated circuit (ic) and a second charging
Inventor(s): Kiyeong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Wanjae JU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M10/42, H01M10/46, H01M50/574, H02J7/00, H05K1/18
CPC Code(s): H01M10/425
Abstract: ic configured to supply power to the battery; at least one processor, comprising processing circuitry, disposed at the first pcb and configured to select one of fast charging and normal charging of the battery based on a charging algorithm; and a charging port connected to the second pcb, wherein at least one processor, individually and/or collectively, is configured to turn off the second charging ic to perform normal charging of the battery and turn on the second charging ic to perform fast charging of the battery, and the second charging ic is disposed at the second pcb and is configured to supply power from the second pcb to the battery through the second connector.
Inventor(s): Youngjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hua LI of Suwon-si (KR) for samsung electronics co., ltd., Minseok PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q9/04, H01Q21/08
CPC Code(s): H01Q1/243
Abstract: an electronic device is provided. the electronic device includes a housing including a first surface facing a front side of the electronic device, a second surface opposite to the first surface, and a peripheral part surrounding a space between the first surface and the second surface and including a conductive portion and a first non-conductive portion contacted with an end portion of the conductive portion, and an antenna module including a substrate, in the housing, disposed in a direction parallel to a portion of the peripheral part and a plurality of antenna elements disposed on a surface of the substrate and spaced apart from each other in the direction, wherein, when the peripheral part is viewed vertically, the peripheral part includes a first region overlapping the antenna module and a second region including the conductive portion having a thickness greater than a thickness of the conductive portion included in the first region, and wherein, when the peripheral part is viewed vertically, the first non-conductive portion overlaps one of the plurality of antenna elements in the first region.
Inventor(s): Kyuho LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngseok BANG of Suwon-si (KR) for samsung electronics co., ltd., Donguk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Youngjin OH of Suwon-si (KR) for samsung electronics co., ltd., Juntaek OH of Suwon-si (KR) for samsung electronics co., ltd., Yongsang YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/27, H01Q1/22, H04R1/10
CPC Code(s): H01Q1/273
Abstract: an electronic device is provided. the electronic device includes a housing including a first surface facing a first direction and a second surface facing a second direction different from the first direction, an sound output module disposed within the housing, a circuit board disposed within the housing, a first antenna pattern disposed within the housing and electrically connected to the circuit board, and a second antenna pattern disposed on the first surface of the housing and configured to be electromagnetically coupled to the first antenna pattern, wherein the first antenna pattern includes a first portion disposed adjacent to the second surface of the housing and a second portion extending from the first portion, and wherein the first portion of the first antenna pattern faces at least a portion of the second antenna pattern with the housing interposed therebetween.
Inventor(s): Bumhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungtae KO of Suwon-si (KR) for samsung electronics co., ltd., Junsig KUM of Suwon-si (KR) for samsung electronics co., ltd., Yoongeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/00, H01Q1/24
CPC Code(s): H01Q21/0006
Abstract: the disclosure relates to a fifth generation (5g) or pre-5g communication system supporting higher data rates after a fourth generation (4g) communication system such as long term evolution (lte). a module in a wireless communication system is provided. the module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a radio frequency (rf) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. the conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. the conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.
Inventor(s): Jaehyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Beomwoo GU of Suwon-si (KR) for samsung electronics co., ltd., Joonhong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeseok PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungku YEO of Suwon-si (KR) for samsung electronics co., ltd., Youngho RYU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/00, H02J7/00, H02J50/12
CPC Code(s): H02J50/005
Abstract: according to various embodiments, a cover device capable of being coupled to a wireless power-receiving unit comprising circuitry configured to receive wireless power from a wireless power-transmitting unit comprising circuitry may comprise: a first capacitor; a first coil connected to the first capacitor; a ferrite sheet arranged, on at least a portion of the first coil, in the coupling direction between the wireless power-receiving unit and the cover device; and a metal sheet arranged, on at least a portion of the ferrite sheet, in the coupling direction between the wireless power-receiving unit and the cover device. the first capacitor and the first coil can form a closed loop. a first resonance frequency of the first coil can be higher than a second resonance frequency of a second coil of the wireless power-receiving unit.
Inventor(s): Wonsoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Younmo KANG of Suwon-si (KR) for samsung electronics co., ltd., Jimin KIM of Suwon-si (KR) for samsung electronics co., ltd., Taesang PARK of Suwon-si (KR) for samsung electronics co., ltd., Geonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Keeyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Minshin CHO of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Woong HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02K5/173, A47L5/28, F16C19/08, H02K7/08, H02K21/16
CPC Code(s): H02K5/1732
Abstract: a cleaner including a suction head; a main body; and a motor to form a suction airflow from the suction head to the main body. the motor includes a stator; a rotor; and an impeller coupled to the rotor and configured to generate an airflow by being rotated. the motor includes a housing that includes a base portion including a receiving space provided to accommodate the rotor and the stator; and a cover portion including a through-hole through which the rotor passes, the cover portion provided to cover the impeller. the base portion includes a bearing hole formed in an upper portion of the base portion to install a bearing provided to support the rotor; and a stator insertion hole formed to be open on a lateral side of the base portion to allow the stator to be inserted into the receiving space.
Inventor(s): Jungwoo YANG of Suwon-si (KR) for samsung electronics co., ltd., Jeongil KANG of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyong JOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158, H02M1/00, H02M1/42
CPC Code(s): H02M3/158
Abstract: a converter circuit according to an aspect of the disclosure may comprise: first, second, third and fourth inductors which are connected in parallel to each other; first, second, third and fourth switching elements comprising at least one switch connected to the first, second, third and fourth inductors respectively; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to control the first, second, third and fourth switching elements, wherein the first inductor and the second inductors are coupled to each other, and the third inductor and fourth inductor are coupled each other.
Inventor(s): Joonho JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungjae BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jooseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/24
CPC Code(s): H03F3/245
Abstract: an electronic device, according to various embodiments, may comprise: a power amplifier configured to amplify an input signal; an antenna module including at least one antenna and configured to transmit an rf signal amplified in a circuit of the power amplifier; and a communication processor including at least one processor, comprising processing circuitry, individually and/or collectively configured to control the power amplifier and the antenna module.
20240429943. ENCODER AND ENCODING METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kijun Jeon of Suwon-si (KR) for samsung electronics co., ltd., Kyoungbin Park of Suwon-si (KR) for samsung electronics co., ltd., Minki Song of Suwon-si (KR) for samsung electronics co., ltd., Dongmin Shin of Suwon-si (KR) for samsung electronics co., ltd., Daeyeol Yang of Suwon-si (KR) for samsung electronics co., ltd., Bohwan Jun of Suwon-si (KR) for samsung electronics co., ltd., Youngjun Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M13/11, H03M13/00
CPC Code(s): H03M13/1174
Abstract: an ldpc encoder is described with memory for storing a parity check matrix and a calculation unit to encode information bits into a codeword with reference to the parity check matrix. the parity check matrix includes an information part matrix and a parity part matrix. in the parity part matrix, z*z sub-matrices are sub-matrices, other than a zero matrix, and are arranged in each of the m rows and m columns. a sub-matrix is a scaled cyclic matrix obtained by shifting elements of an identity matrix by one to the left and multiplying the shifted elements by a scaling element. except for the scaled cyclic matrix, the remaining sub-matrices are a zero matrix or an identity matrix, and the scaling element is an element allowing the parity part matrix to satisfy a full rank condition on a galois field.
Inventor(s): Seongyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Gilyong Ku of Suwon-si (KR) for samsung electronics co., ltd., Hyunjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungsik Min of Suwon-si (KR) for samsung electronics co., ltd., Seunghee Son of Suwon-si (KR) for samsung electronics co., ltd., Jiyeong Yu of Suwon-si (KR) for samsung electronics co., ltd., Jungeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungkyoon Chung of Suwon-si (KR) for samsung electronics co., ltd., Janghoon Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H04W52/24
CPC Code(s): H04B1/0475
Abstract: disclosed are an electronic device and a method of controlling a spurious emission. a spurious emission is identified by setting a first time interval in which a feedback receiver operates in a spurious emission detection mode, and identifying a spurious emission from the electronic device by analyzing a feedback signal obtained by the feedback receiver based on a first resolution bandwidth and a second resolution bandwidth in the first time interval.
Inventor(s): Changho LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwangtaek Woo of Suwon-si (KR) for samsung electronics co., ltd., Jaeho Choi of Suwon-si (KR) for samsung electronics co., ltd., Seonghun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinwan An of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/3827, G06F1/3212, H04R1/10
CPC Code(s): H04B1/3827
Abstract: an electronic device and method identifies a charging status, and based on the charging status satisfying a designated condition, identifies whether short-range wireless communication is connected with a designated external device. based on identifying that the connection of the short-range wireless communication with the designated external device is released, the electronic device transmits a request for establishing a connection of the short-range wireless communication to the designated external device. based on the connection of the short-range wireless communication with the designated external device being established, the electronic device transmits charging-related information to the designated external device through the communication circuitry.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeonu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/024, H04L47/2441, H04W84/12
CPC Code(s): H04B7/024
Abstract: in embodiments incorporating features of the present disclosure, a method of operating an electronic device can include, for example, identifying a service through the electronic device. in some embodiments, the method can further include negotiating multi-access point (ap) coordination for the service. in some embodiments, the method can further include receiving traffic of the service through the multi-ap coordination.
20240429974. DISTRIBUTED MIMO CALIBRATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): R A Nadisanka Perera Rupasinghe of McKinney TX (US) for samsung electronics co., ltd., Yang Li of Plano TX (US) for samsung electronics co., ltd., Thuy Van Nguyen of Dallas TX (US) for samsung electronics co., ltd., Namjeong Lee of Yongin-si (KR) for samsung electronics co., ltd., Dongwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyung-joong Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/0413, H04B17/11, H04B17/21
CPC Code(s): H04B7/0413
Abstract: a method of operating a network entity includes receiving, via a first trp and a second trp, information associated with a srs from a ue, and estimating a channel based on the information associated with the srs. the method further includes, for n iterations: transmitting, via a first csi-rs port from a csi-rs resource, from the first trp, a csi-rs; transmitting, via a second csi-rs port from the csi-rs resource, from the second trp, the csi-rs with a controlled phase offset; receiving a pmi report associated with the csi-rs including a measured phase offset between the first csi-rs port and the second csi-rs port; and updating the controlled phase offset, based on the measured phase offset. the method further includes, after the n iterations, based on the controlled phase offset and the measured phase offset, determining a phase mis-match for phase calibration between the first trp and the second trp.
Inventor(s): Thuy Van Nguyen of Plano TX (US) for samsung electronics co., ltd., Yang Li of Plano TX (US) for samsung electronics co., ltd., R A Nadisanka Perera Rupasinghe of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B17/12, H04B17/21
CPC Code(s): H04B7/0626
Abstract: a method performed by a network entity includes determining a target timing mismatch for a phase timing slope between first and second channel state information-reference signal (csi-rs) resources, and determining, based on the target timing mismatch, a first band separation between a first calibrated phase for the first the second csi-rs resource and a second calibrated phase for the first and the second csi-rs resource. the method further includes determining a first frequency band for the first calibrated phase, and determining, based on the band separation, a second frequency band for the second calibrated phase. the method further includes determining, based on the band separation between the first calibrated phase the second calibrated phase, a first phase timing slope between the first the second csi-rs resource, and performing joint transmission from a first trp and a second trp based on the first phase timing slope.
Inventor(s): Hyochang Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/03, H04B1/12
CPC Code(s): H04L25/03267
Abstract: a receiver includes a decision feedback equalizer therein. the equalizer, which includes a cascaded arrangement of a first stage having a first plurality of summers therein and a second stage having a second plurality of summers therein, is configured to: (i) generate a compensated data signal by summing a current value of a data signal and a plurality of feedback signals, in response to a plurality of selection signals, (ii) generate a sampled signal including a decision value by sampling bits of the compensated data signal, in response to a plurality of divided strobe signals, and (iii) generate the feedback signals in response to a plurality of weights, the sampled signal, and at least one delayed version of the sampled signal.
Inventor(s): Jinwook Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungcheol Lee of Suwon-si (KR) for samsung electronics co., ltd., Seunghan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L47/6295, B60W60/00
CPC Code(s): H04L47/6295
Abstract: an electronic device, which is configured to be mounted on an autonomous vehicle, includes: a first interface circuit configured to communicate with a plurality of storage devices, a second interface circuit configured to communicate with a plurality of zones of the autonomous vehicle, an event detector configured to output an event signal in response to detecting event data received through the second interface circuit, an event manager configured to output a data division signal in response to the event signal, and an interface manager. the interface manager is configured to: divide the event data into a plurality of data fragments in response to the data division signal, allocate the plurality of data fragments to two or more storage devices among the plurality of storage devices, respectively, and control the first interface circuit such that the plurality of data fragments are respectively transmitted to the allocated two or more storage devices.
Inventor(s): Arunprasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd., Kiran Gurudev KAPALE of Bangalore (IN) for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
CPC Code(s): H04L63/102
Abstract: a method for managing mission critical data (mcdata) by an mcdata server is provided. the method comprises receiving a request message for controlling a storage of mcdata communications into an mcdata message store from an mcdata client device; identifying whether a user of the mcdata client device is authorized; controlling the storage of the mcdata communications based on the request message, in case of identifying that the mcdata client device is authorized; and transmitting, to the mcdata client device, a response message in response to the request message.
Inventor(s): Sapan Pramodkumar SHAH of Bangalore (IN) for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd., Arunprasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L65/1063, H04L9/40, H04L67/125, H04L67/51
CPC Code(s): H04L65/1063
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a pirates (personal internet of things (iot) network and residential network) management server (pms) in a personal iot network (pin) is provided. the pim includes at least one processor configured to support management capabilities of a pirates network; and at least one interface supporting interaction between the pms, a pirates gateway configured to provide gateway functionality within the pirates network, and at least one pin element configured with pirates clients which communicate within the pirates network.
Inventor(s): Daehyeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Soobin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, F16C11/04
CPC Code(s): H04M1/0216
Abstract: the disclosure relates to a foldable electronic device and a hinge structure included therein. the foldable electronic device includes a display, a first housing and a second housing, and a hinge housing in which the hinge structure is seated. the hinge structure includes a fixed bracket having a first rail and a second rail, a first rotating member fastened to the first rail, a second rotating member fastened to the second rail, a first link member coupled with a rail structure formed on the first rotating member, a second link member coupled with a rail structure formed on the second rotating member, a first arm member fastened to the first link member, and a second arm member fastened to the second link member. the first arm member includes a seventh rail disposed at a position extending from the fifth rail structure.
Inventor(s): Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Nakhyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0237
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing disposed to be slidable in a first direction relative to the first housing, and a display including a first region contacted with a surface of the second housing, a second region deformable according to movement of the second housing a guide member disposed on a surface of a rollable display to support at least portion of the rollable display, a motor disposed in the first housing and to provide driving force to the second housing, a pinion gear rotatably coupled to the motor, and a rack gear disposed in the second housing, engaged with the pinion gear, and movable according to a rotation of the pinion gear, wherein the first housing includes a frame cover accommodating the motor, the frame cover including a first periphery facing the first direction, a second periphery spaced apart from the first periphery and facing in a second direction opposite to the first direction, a third periphery perpendicular to the first periphery and accommodating the lack gear, and a fourth periphery parallel to the third periphery and opposite to the third periphery, wherein the motor is closer to the first periphery among the first periphery and the second periphery, and wherein the motor is spaced apart from a portion of the second region disposed in the second housing, when the display is viewed from above.
Inventor(s): Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungmoon SEOL of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/27
CPC Code(s): H04M1/0268
Abstract: an electronic device is provided. the electronic device includes a first housing including a first side portion in which a first antenna is formed, a second housing configured to slide with respect to the first housing and including a second side portion in which a second antenna is formed, a rollable display including a first display area and a second display area extending from the first display area, wherein at least a portion of the second display area is configured to be moveable based on a sliding movement of the second housing, and a linear motion guide including a rail disposed on an inner side of the first side portion, a head disposed on the outer side of the second side portion and slidably fastened to the rail, and a ball bearing disposed between the rail and the head, wherein the first antenna and the second antenna are configured to be electrically connected to each other through the head and the rail.
Inventor(s): Young-jae KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72436, G06F3/0481, G06F3/0488, G06Q10/107, G06Q50/00, H04M1/72451, H04W4/12
CPC Code(s): H04M1/72436
Abstract: a method of providing content in a terminal includes obtaining a first message that is input through a user interface of the terminal that is provided by a messaging application that executes a messaging service in the terminal; generating content based on the first message, and a second message stored in the terminal; and providing the generated content via the terminal.
Inventor(s): Hyungchul KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun MOON of Suwon-si (KR) for samsung electronics co., ltd., Kihong PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31
CPC Code(s): H04N9/3185
Abstract: an electronic device includes a projection assembly configured to output an image to a projection surface; a memory configured to store at least one instruction; at least one sensor; and at least one processor configured to execute the at least one instruction, which causes the at least one processor to: detect a change in a projection environment; determine whether a focus correction is required for the image output to the projection surface, based on the change in the projection environment; after determining whether the focus correction is required, determine whether a keystone correction is required for the image, based on the change in the projection environment; and control the projection assembly to output a corrected image to the projection surface.
Inventor(s): Soongeun JANG of Suwon-si (KR) for samsung electronics co., ltd., Woo-Shik KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/16, H04N23/56, H04N23/71, H04N23/84, H04N23/88
CPC Code(s): H04N23/16
Abstract: an image acquisition apparatus may include a multispectral image sensor configured to acquire an image of at least one object in an environment in which at least one illumination source exists, through eight or more channels with minimum overlap between the channels, and a processor configured to estimate illumination spectral data of the acquired image by using channel signals corresponding to the eight or more channels, and perform lens shading correction on the acquired image, based on the estimated illumination spectral data.
Inventor(s): Seonghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Byunghun OH of Suwon-si (KR) for samsung electronics co., ltd., Seyeong CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/74, H04N23/53, H04N23/71
CPC Code(s): H04N23/74
Abstract: an electronic device, according to an embodiment, may comprise: a display; a camera of which at least a portion is visible to the outside through an opening formed in a display area of the display; a memory which stores instructions; and at least one processor, comprising processing circuitry, which is operably coupled to the display, the camera, and the memory. at least one processor may be configured to execute the instructions and may be configured to: control the display to display a screen including an area having a designated color in the display on the basis of receiving a shooting input; identify a change in light received by the camera according to an extent of the area while the screen is displayed; and acquire an image corresponding to the shooting input by controlling the camera in a state in which the extent of the area is adjusted on the basis of the identified change in light.
Inventor(s): Jungwook Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/59, H04N25/76, H04N25/78
CPC Code(s): H04N25/59
Abstract: an image sensor includes a first photoelectric element, a second photoelectric element having a larger receiving area than that of the first photoelectric element, a first floating diffusion region in which charges generated by the first photoelectric element are stored, a second floating diffusion region, in which charges generated by the second photoelectric element are stored, and which is connected to a gate of a driving transistor, a capacitor selectively connected to the first floating diffusion region based on a readout mode and configured to store charges overflowing from the first photoelectric element, a third floating diffusion region connected to the first and second floating diffusion regions through first and second switch transistors, respectively, a reset transistor, a first end of which is selectively connected to one of plural voltage nodes through a reset node, and a second end of which is connected to the third floating diffusion region.
Inventor(s): Soonik CHO of Suwon-si (KR) for samsung electronics co., ltd., Jahyun KOO of Suwon-si (KR) for samsung electronics co., ltd., Dahsom KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghoon SUNG of Suwon-si (KR) for samsung electronics co., ltd., Seokyong HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/78, H03M1/56, H04N25/51, H04N25/57
CPC Code(s): H04N25/78
Abstract: an image sensor includes a pixel array, a ramp signal generating circuit configured to output a first reference ramp signal of a first slope as a first ramp signal in a first period and a second reference ramp signal of a second slope as the first ramp signal in a second period, an offset voltage sampling circuit configured to, to sample an offset voltage based on a dc level of the first reference ramp signal, to output the first ramp signal in the first period, and to output a signal obtained by adding the offset voltage to the first ramp signal as a second ramp signal in the second period, a buffer configured to buffer the first ramp signal and the second ramp signal, and an adc circuit configured to compare a pixel signal from the pixel array with the first ramp signal or the second ramp signal.
20240430613. ACOUSTIC OUTPUT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Euihan YOON of Suwon-si (KR) for samsung electronics co., ltd., Taemyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/28, G10K11/16
CPC Code(s): H04R1/2873
Abstract: an acoustic output device includes: an enclosure; a speaker driver arranged inside and fixed by the enclosure and comprising a vibration plate exposed to a front surface of the enclosure, the vibration plate being configured to generate sounds; and a filter arranged between a rear surface of the speaker driver and an inner surface of the enclosure. the filter may be distanced from the inner surface of the enclosure and include a plurality of through holes.
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04B7/0456
CPC Code(s): H04W24/10
Abstract: a method for operating a user equipment (ue) comprises receiving information about a channel state information (csi) report, the information including information about two numbers for basis vectors, n and m, where n≥m; identifying n consecutive basis vectors with indices m+i, i=0, 1, . . . , n−1 starting at index m, wherein the n consecutive basis vectors belong to a set of nbasis vectors, and n≤n; determining mbasis vectors, wherein: when n=m, the mbasis vectors=the n consecutive basis vectors, and when n>m, the mbasis vectors are selected from the n consecutive basis vectors; determining the csi report based on the mbasis vectors, wherein when n>m, the csi report includes an indicator indicating an information about the selected mbasis vectors; and transmitting the csi report including the indicator indicating the information about the selected mbasis vectors when n>m.
Inventor(s): Anum Ali of Frisco TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Yuqiang Heng of Plano TX (US) for samsung electronics co., ltd., Priyabrata Parida of Dallas TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
CPC Code(s): H04W28/0268
Abstract: apparatuses and methods for traffic type based quality of experience (qoe) maintenance for mobile devices. a user equipment (ue) includes a transceiver. the transceiver is configured to receive and transmit traffic over a link with a wireless network. the ue further includes a processor operably coupled to the transceiver. the processor is configured to classify the traffic into at least one of real time (rt) traffic or non-real-time (nrt) traffic, generate a link deterioration prediction, select, based on the link deterioration prediction and the traffic class, a qoe maintenance action, and perform the qoe maintenance action.
Inventor(s): Dahae CHONG of Suwon-si (KR) for samsung electronics co., ltd., Mingoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinho KIM of Suwon-si (KR) for samsung electronics co., ltd., Joohyun DO of Suwon-si (KR) for samsung electronics co., ltd., Jungwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Huiwon JE of Suwon-si (KR) for samsung electronics co., ltd., Yongin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/084, H04L67/1004
CPC Code(s): H04W28/084
Abstract: a user equipment includes: a communication circuit configured to perform a communication connection with an external electronic device; at least one processor; and a memory configured to store instructions executed during operations of the at least one processor, wherein the at least one processor is configured to: control the communication circuit to transmit, to the external electronic device, device information related to a first target task of the user equipment; and in response to receiving, from the external electronic device, first result data generated by using computing resources of the external electronic device, perform the first target task, based on the first result data, and wherein the first result data is generated based on the device information allocated to the computing resources of the external electronic device.
Inventor(s): Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/02, H04W36/08
CPC Code(s): H04W36/0022
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. according to an aspect of the embodiments of the present disclosure, a method for supporting handover is provided, comprising: receiving a message from a central unit control plane entity of a target base station; receiving a data packet from a source base station; and discarding a packet data convergence protocol (pdcp) service data unit (sdu) including the pdcp sequence number (sn) in the received data packet according to the indication of the message.
Inventor(s): Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Nishithkumar D. Tripathi of Parker TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/24, H04W48/16, H04W84/06
CPC Code(s): H04W36/00835
Abstract: methods and apparatuses in a wireless communication system. a method of a ue comprises: receiving, from a base station (bs) in a non-terrestrial network (ntn), a system information block (sib); determining that the sib includes first neighboring cell information and first timing information associated therewith; determining that a first neighboring cell is not a candidate cell for a cell selection or re-selection operation when a current time is before or equal to a time indicated by the first timing information; and determining that the first neighboring cell is a candidate cell for the cell selection or re-selection operation when the current time is after the time indicated by the first timing information.
Inventor(s): Venkata Ratnakar Rao RAYAVARAPU of Bangalore (IN) for samsung electronics co., ltd., Jajohn MATHEW MATTAM of Bangalore (IN) for samsung electronics co., ltd., Dibyajyoti PATI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/06, H04B17/318, H04W36/00
CPC Code(s): H04W36/06
Abstract: according to an aspect of the disclosure, a user equipment (ue) in a wireless network is provided. the ue comprises a processor; and a memory storing instructions that, when executed by the processor, cause the ue to determine whether a trigger condition is detected or not; based on the trigger condition being not detected, select a cell among a plurality of cells for the ue in accordance with a signal quality; based on the trigger condition being detected, select a cell from at least one cell of low-band frequency category, the plurality of cells categorized into the low-band frequency category, a mid-band frequency category, and high-band frequency category; and camp to the cell or transmit, on a serving cell, a measurement report including a measurement result of the cell.
Inventor(s): ARUNAKUMAR BETTAPPANAVAR of Bengaluru (IN) for samsung electronics co., ltd., ADITYA KUMAR PADHI of Bengaluru (IN) for samsung electronics co., ltd., ISAKKIRAJA ISAKKI of Bengaluru (IN) for samsung electronics co., ltd., MEHA GOEL of Bengaluru (IN) for samsung electronics co., ltd., SHALINI GOVIL of Bengaluru (IN) for samsung electronics co., ltd., SHRINATH RAMAMOORTHY MADHURANTAKAM of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/18, H04W36/00, H04W76/20, H04W76/30
CPC Code(s): H04W36/18
Abstract: a method and system for managing source cell connection during a dual active protocol stack (daps) handover with respect to a ue. the method includes establishing, while maintaining daps data bearers with a source cell, daps data bearers with a target cell during daps handover in response to receiving a daps handover message from the source cell. the method monitors a plurality of channel condition parameters of the target cell upon successful establishment of the daps data bearers with the target cell. thereafter, the method determines whether a value of each of the monitored plurality of channel condition parameters is more than a respective predefined threshold value, if so, the daps data bearers with the source cell are managed.
Inventor(s): Ahmad AlAmmouri of Richardson TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Younghan Nam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/34, H04L5/00, H04W72/044
CPC Code(s): H04W52/34
Abstract: techniques for implementations of hybrid wireless systems, methods, and apparatuses are introduced. in one aspect of the disclosure, a base station (bs) configures a group that specifies a plurality of sounding reference signal (srs) resource sets. the bs also configures a power control rule that ensures all srss corresponding to the srs resource sets in the group are transmitted with the same ue power. the bs receives from the ue the srss associated with the srs resource sets in the group and identifies one or more beams for use in reconstructing the channel and optimizing subsequent data exchanges.
Inventor(s): Youngkwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungjoon YU of Suwon-si (KR) for samsung electronics co., ltd., Myungjin KANG of Suwon-si (KR) for samsung electronics co., ltd., Yongjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongphil LEE of Suwon-si (KR) for samsung electronics co., ltd., Myoungjoon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04W72/044, H04W76/15
CPC Code(s): H04W52/367
Abstract: a communication device is provided. the communication device includes first communication circuitry configured to perform first wireless communication with a first external device based on a first communication protocol, second communication circuitry configured to perform second wireless communication with a second external device based on a second communication protocol, memory storing one or more computer programs, and one or more application processors communicatively connected to the first communication circuitry, the second communication circuitry and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more application processors, causes the communication device to control the first communication circuitry and the second communication circuitry such that a sum of a first output power value output by the first communication circuitry during a predetermined time range and a second output power value output by the second communication circuitry during the predetermined time range does not exceed a preset total threshold.
Inventor(s): Feng Qi of Richardson TX (US) for samsung electronics co., ltd., Abhishek Sehgal of Frisco TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W56/00
CPC Code(s): H04W56/0015
Abstract: a method includes calibrating, at a wireless device, a wireless fidelity (wi-fi) chipset-level timer based on a time synchronization function (tsf) frame received from a wi-fi access point. the method also includes performing, at the wireless device, a coarse synchronization of a microcontroller-level or cpu-level timer based on the calibrated wi-fi chipset-level timer. the method further includes performing, at the wireless device, a fine synchronization of the microcontroller-level or cpu-level timer after the coarse synchronization. the fine synchronization is performed according to a first time scale measured in first time units and the coarse synchronization is performed according to a second time scale measured in second time units that are a multiple of the first time units.
Inventor(s): Wei Sun of Allen TX (US) for samsung electronics co., ltd., Shunyao Wu of Allen TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04B7/06, H04W72/02, H04W72/0453
CPC Code(s): H04W64/00
Abstract: methods and apparatuses for operating multiple carriers in a wireless communication system. a method for a first network entity comprises: identifying a plurality of carrier frequencies for measuring carrier phases from a set of predefined carrier frequencies; estimating, based on the measured carrier phase, a distance between the first network entity and a second network entity using a carrier ranging operation that is performed between the first network entity and the second network entity; selecting, based on the estimated distance, historical information, a variation of measured distance, and channel status information, at least one carrier frequency from the plurality of carrier frequencies to refine distance measurement; and transmitting, to and receive from the second network entity, signals over the selected at least one carrier frequency.
Inventor(s): Vinay Kumar Shrivastava of Bangalore (IN) for samsung electronics co., ltd., Avijit Manna of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W68/00, H04W52/02, H04W56/00, H04W72/1263, H04W72/23
CPC Code(s): H04W68/005
Abstract: the present subject matter refers targeting paging reduction to improve upon power consumption performance for the user equipment in wireless networks. the methods and systems are disclosed where indication signal is applied for idle/inactive mode ues. in one embodiment of the present disclosure, an indication signal is introduced for idle/inactive mode ues for paging reception. in another embodiment, the group of ues may be divided into plurality of paging sub-groups of ues having common paging occasion and each paging sub-group be assigned a paging sub-group id. this paging sub-group id may be incorporated in the indicating signal to reduce paging reception. the indicating signal may indicate presence or absence of paging dci for a ue/or a paging sub-group identity of ue/ues.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/02, H04L1/1812, H04L5/00, H04W74/0808
CPC Code(s): H04W72/02
Abstract: disclosed is a method performed by a first terminal in a wireless communication system, including identifying that a procedure associated with determination of a set of resources for reception from a second terminal is triggered, identifying at least one parameter associated with the procedure and being configured by a higher layer, determining a set of preferred resources or a set of non-preferred resources for the reception from the second terminal, based on the at least one parameter, and in case that the procedure is triggered by a condition at the first terminal, transmitting, to the second terminal, information including the set of non-preferred resources, based on a groupcast or broadcast manner, and transmitting, to the second terminal, information including the set of preferred resources, based on a unicast manner.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Joonyoung Cho of Portland OR (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/541, H04W56/00, H04W68/00, H04W72/0446, H04W72/56
CPC Code(s): H04W72/541
Abstract: methods and apparatuses for interference reduction and coordination in a wireless communication system. a method for operating a base station includes determining first information for a first serving cell that includes a first interference level from a set of interference levels, a first priority level from a set of priority levels, and a first resource from a set of resources. the first interference level and the first priority level are associated with the first resource. the method further includes transmitting the first information.
Inventor(s): Yi WANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/56, H04L1/00, H04W24/08, H04W72/0446, H04W72/23
CPC Code(s): H04W72/56
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the application discloses a method of receiving physical downlink control channel and corresponding equipment. according to an aspect of the application, there is provided a method performed by user equipment (ue) in a communication system, including: receiving, by the ue, time resource information of a search space configured by a base station; determining, by the ue, the time resource position of the search space according to the time resource information of the search space configured by the base station; determining, by the ue, the times of blind detection for a physical downlink control channel (pdcch)/a number of non-overlapping control channel elements (cce) in the search space.
Inventor(s): Donggun KIM of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833
CPC Code(s): H04W74/0833
Abstract: a method of transmitting a random access preamble in a telecommunication system is provided. the method includes, if the random access procedure is initiated by a physical downlink control channel (pdcch) ordering for a layer 1 (l1)/layer 2 (l2)-triggered mobility (ltm) candidate cell as preamble re-transmission, and incrementing a variable, preamble_power_ramping_counter, by 1.
Inventor(s): Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyewon YANG of Suwon-si (KR) for samsung electronics co., ltd., Jaewon LEE of Suwon-si (KR) for samsung electronics co., ltd., Junyung YI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04B17/318, H04W74/08, H04W76/20
CPC Code(s): H04W74/0833
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting higher data rates. a method performed by a terminal in a wireless communication system is provided. the method includes receiving, on a serving cell, information on a measurement for a pathloss associated with a physical random access channel (prach) transmission for non-serving cell, identifying a way of the measurement for the pathloss associated with the prach transmission, based on an indication of a cell specific measurement or a transmission configuration indication (tci) specific measurement, or identifying the way of the measurement for the pathloss associated with the prach transmission, based on an indication of a layer 1 (l1) measurement or a layer 3 (l3) measurement, performing the measurement for the pathloss for a reference signal based on the identified way, and transmitting, on a candidate cell, the prach transmission based on the pathloss.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Joonyoung Cho of Portland OR (US) for samsung electronics co., ltd., Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04B17/318, H04W52/36
CPC Code(s): H04W74/0833
Abstract: methods and apparatuses for multiple concurrent random access procedures. a method for operating a user equipment includes receiving first configuration for a random access (ra) procedure, initiating a first ra procedure on a cell based on the first configuration, and initiating a second ra procedure on the cell prior to completion of the first ra procedure. a method for a base station includes transmitting a first random access response (rar) and a second rar. the first rar includes a first temporary cell radio network temporary identifier (tc-rnti) and a first uplink grant. the second rar includes a second tc-rnti and a second uplink grant. the method further includes receiving a first pusch scheduled by the first uplink grant and a second pusch scheduled by the second uplink grant. the first pusch includes the first tc-rnti. the second pusch includes only the first tc-rnti or both the first and second tc-rntis.
Inventor(s): Yongin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Mingoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinho KIM of Suwon-si (KR) for samsung electronics co., ltd., Joohyun DO of Suwon-si (KR) for samsung electronics co., ltd., Jungwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Dahae CHONG of Suwon-si (KR) for samsung electronics co., ltd., Huiwon JE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04W76/28
CPC Code(s): H04W76/10
Abstract: an electronic device includes a memory storing pre-connection information; a first modem; a second modem; and a processor operatively connected to the memory, the first modem, and the second modem, wherein the processor is configured to: establish a first wireless communication connection with a base station, using the first modem, and establish a second wireless communication connection with a terminal in a vehicle, using the second modem, based on at least one piece of the pre-connection information, and wherein the pre-connection information comprises at least one of access frequency band information, system information, radio resource control (rrc) initial configuration value information, and registered device identification information.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/27, H04W72/30
CPC Code(s): H04W76/27
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides method and apparatus for managing system information in a wireless communication system.
Inventor(s): Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Soobin KWON of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungmin CHO of Suwon-si (KR) for samsung electronics co., ltd., Minsu KANG of Suwon-si (KR) for samsung electronics co., ltd., Junhan BAE of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Hoon WEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B3/26, H05B3/14
CPC Code(s): H05B3/26
Abstract: a humidifying apparatus can include a water tank, and a duct through which water vapor generated in the water tank flows, wherein the water tank includes a bottom plate generating heat, the bottom plate includes a first glass plate disposed within the water tank and a second glass plate disposed below the first glass plate and spaced apart from the first glass plate, and the first glass plate includes a heating layer coated on a lower surface of the first glass plate, and the second glass plate includes a low emissivity layer coated on an upper surface of the second glass plate to suppress heat generated in the heating layer from being transferred to the outside of the second glass plate.
Inventor(s): Joohan KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonglak CHO of Suwon-si (KR) for samsung electronics co., ltd., Min PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K1/14
CPC Code(s): H05K1/0201
Abstract: according to an embodiment, a printed circuit board (pcb) structure may include: a first pcb; an interposer; a second pcb; and a cover structure including a mounting layer which is connected to the second pcb and includes a base hole, a support layer which is on a surface of the mounting layer that faces away from the second pcb, and a visible layer which is connected to the support layer and includes a material having transparency.
Inventor(s): Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungmoon SEOL of Suwon-si (KR) for samsung electronics co., ltd., Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Baekeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H04R1/02, H04R1/34, H04R3/00, H05K5/02
CPC Code(s): H05K1/0215
Abstract: an electronic device may include: a first housing; a second housing slidably coupled to the first housing; a flexible display including a display area that is reduced or expanded according to sliding-in or sliding-out of the second housing; a driving unit for driving the second housing; a support member disposed on the second housing and supporting at least a portion of the flexible display; a speaker assembly disposed on a surface of the support member, which is opposite to the surface of the support member facing the flexible display; and a printed circuit board disposed on a surface of the speaker assembly, which is opposite to the surface of the speaker assembly facing the flexible display. the speaker assembly may include a case electrically connecting the printed circuit board to the support member, and a speaker disposed in the case. various other embodiments are also possible.
Inventor(s): Kwangmo YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Bumhee BAE of Gyeonggi-do (KR) for samsung electronics co., ltd., Younho KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Changwon JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongnam CHEON of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, G06F1/16
CPC Code(s): H05K1/0225
Abstract: an electronic device according to an example embodiment includes a printed circuit board (pcb) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. the pcb may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.
Inventor(s): Jaeho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongyoon SEO of Suwon-si (KR) for samsung electronics co., ltd., Dohyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Daae HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/11, H05K1/18
CPC Code(s): H05K1/115
Abstract: an apparatus including via structures capable of reducing crosstalk effects is provided. the apparatus includes a printed circuit board (pcb) including sequentially stacked multi-layers, a first via structure that partially penetrates the multilayers of the pcb and is connected to a first metal plate on a first layer of the multilayers, and a second via structure adjacent to the first via structure in a horizontal direction, partially penetrating the multi-layers of the pcb, and connected to a second metal plate disposed on a second layer of the multi-layers. a portion where the first metal plate and the second metal plate overlap each other is configured to provide a first mutual capacitive coupling between the first and second via structures.
Inventor(s): Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Nakhyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/14, H01Q1/24, H04M1/02, H05K1/02
CPC Code(s): H05K1/147
Abstract: the electronic device according to an embodiment include a first support member, a second support member slidably coupled to the first support member in a first direction, a first printed circuit board connected to an antenna module disposed on the first support member, a second printed circuit board disposed on the second support member, a first flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board; and a second flexible printed circuit board, and the first flexible printed circuit board includes a conductive layer distinct from a signal line, is spaced apart from the second flexible printed circuit board, and overlaps the second flexible printed circuit board when the second support member is viewed in a direction perpendicular to a direction in which the display faces. various other embodiments are possible.
Inventor(s): Yeonggyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Wonho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunggun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: an electronic device is be provided. the electronic device includes a first housing, a second housing configured to slidably move relative to the first housing, a rollable display configured to be unrolled or rolled based on a slide movement of the second housing, a multi-bar structure supporting the rollable display, and attached to at least a portion of the rollable display, and a guide assembly configured to guide the slide movement of the second housing, wherein the guide assembly includes a rail structure connected to the second housing, and a rail receiving part including a first surface, in which a first slit receiving at least a portion of the multi-bar structure is formed, and a second surface opposite to the first surface and receiving at least a portion of the rail structure, and wherein the rail structure is configured to slide with respect to the rail receiving portion.
Inventor(s): Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Nakhyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K5/00
CPC Code(s): H05K5/0217
Abstract: an electronic devices according to various embodiments disclosed in this document may include a first housing, a second housing coupled to the first housing so as to slide in a first direction and in a second direction opposite the first direction, a printed circuit board disposed in the second housing, a rear cover disposed in the second housing and configured to support the printed circuit board, a rollable display including a display area exposed to the outside of the electronic device, an accommodation area received inside the electronic device, and a bending area connecting the display area and the accommodation area and configured to be bent, and having the display area that is reduced or expanded based on a sliding-in or sliding-out operation of the second housing, a driving motor disposed in the first housing and configured to drive the second housing to slide in or slide out, and a battery disposed in a space provided in the first housing and the second housing, wherein the rear cover may be formed so as not to overlap the accommodation area of the rollable display when the rollable display is viewed vertically when the second housing is in a full slide-in state in the second direction.
Inventor(s): Jihyung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sungho AHN of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Sunggwan WOO of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngmin JI of Suwon-si (KR) for samsung electronics co., ltd., Sungdae CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: an electronic device including a flexible display is provided. the electronic device includes a first housing, a second housing slidably coupled to the first housing, and a flexible display in which a size of a display area, which is an externally visible part of the electronic device is reduced or expanded based on slide-in or slide-out driving of the second housing, wherein the flexible display includes a panel layer including a display panel, a protective layer disposed in one direction of the panel layer and configured to protect the panel layer, a lattice layer disposed in another direction of the panel layer, a plurality of intermediate layers disposed between the protective layer and the panel layer and including at least one impact absorption layer, and a plurality of adhesive layers, each disposed between two adjacent layers of the other layers included in the flexible display and the protective layer includes a first area having one surface in which the plurality of adhesive layers and the other layers are stacked, the first area having a first thickness, and a second area extended from one end of the first area in a direction parallel to the first area, wherein the second area includes at least a portion having a second thickness smaller than the first thickness.
Inventor(s): Seonghoon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyungtae KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangtai KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Donghyun YEOM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/03, B32B7/12, B32B17/10, G02B5/30, H05K5/00, H05K5/02
CPC Code(s): H05K5/03
Abstract: according to certain embodiments, an electronic device comprises a first housing; a second housing; a hinge disposed between the first housing and the second housing such that the second housing is foldable at one end of the first housing; and a flexible display disposed on a surface of the first housing and a surface of the second housing, wherein the flexible display comprises a display panel, and a glass layer disposed on the display panel, such that the display panel is between the glass layer and the surface of the first housing and the surface of the second housing, wherein the glass layer comprises: a bendable portion configured to be flat in an unfolded state when the first housing and the second housing are disposed horizontally adjacent, and to be bent in a folded state when the first housing and the second housing are vertically adjacent; and a first flat portion adjacent to the bending portion to form a boundary and a second flat portion disposed to extend from the first flat portion to an edge of the glass layer, wherein the glass layer comprises a glass member, wherein the glass member has a first thickness in the second flat portion, has a second thickness at the center of the bending portion, and has a third thickness less than the first thickness and greater than the second thickness in a section between the first flat portion and the center of the bending portion, and wherein the thickness of the glass member gradually decreases from the first flat portion to the center of the bending portion forming a concave portion.
20240431096. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyungki Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/488
Abstract: disclosed is a semiconductor device comprising a bit line, a support dielectric layer on the bit line, a first word line and a second word line on the support dielectric layer, a first gate dielectric layer on a first sidewall of the first word line, a second gate dielectric layer on a first sidewall of the second word line, and channel layers that are spaced apart from one another. the support dielectric layer, the first word line, the second word line, the first gate dielectric layer, and the second gate dielectric layer are between a first one of the channel layers and a second one of the channel layers.
Inventor(s): Hyunjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Yun Choi of Suwon-si (KR) for samsung electronics co., ltd., Inwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sohyun Park of Suwon-si (KR) for samsung electronics co., ltd., Heejae Chae of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/488
Abstract: disclosed is a semiconductor device comprising an active pattern including first and second edge parts spaced apart from each other in a first direction, a word line extending along a second direction between the first and second edge parts, a bit line extending along a third direction on the first edge part, a storage node contact on the second edge part, a first active pad between the bit line and the first edge part, and a second active pad between the storage node contact and the second edge part. the first active pad extends in the third direction more than the first edge part. the second active pad extends in a direction opposite to the third direction more than the second edge part.
Inventor(s): Dongkyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyumin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes bitlines on a cell region of a substrate; a contact plug between the bitlines; a landing pad on the contact plug; a peripheral gate on a peripheral circuit region of the substrate; a lower interlayer insulating layer covering a side surface of the peripheral gate; a peripheral contact plug penetrating through the lower interlayer insulating layer; peripheral interconnection layers on the lower interlayer insulating layer and the peripheral contact plug; and peripheral insulating structures passing between the peripheral interconnection layers, wherein the peripheral insulating structures include a first peripheral insulating structure partially penetrating through the lower interlayer insulating layer, and wherein the first peripheral insulating structure includes a first peripheral insulating layer, a second peripheral insulating layer on the first peripheral insulating layer and passing between the peripheral interconnection layers, and a mixture layer between the lower interlayer insulating layer and the first peripheral insulating layer.
Inventor(s): Jihyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27
CPC Code(s): H10B43/27
Abstract: a semiconductor device according to an embodiment includes: a gate stacking structure that comprises a first stacking structure and a second stacking structure on the first stacking structure, the first stacking structure and the second stacking structure each comprising a plurality of gate electrodes; a channel structure that extends into the gate stacking structure; and a plurality of gate contact portions that are respectively connected to the plurality of gate electrodes of a first pad area of the first stacking structure and a second pad area of the second stacking structure; where the first stacking structure comprises a buffer insulating portion that comprises a boundary portion that is adjacent to the second pad area, where the buffer insulating portion comprises a first section, a second section, and an inner section that is between the first section and the second section in a first direction.
Inventor(s): Young Sik Lee of Suwon-si (KR) for samsung electronics co., ltd., Yeon Su Kim of Suwon-si (KR) for samsung electronics co., ltd., Hwan Chul Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device and electronic system including the same are provided. the semiconductor memory device may include a first stacked structure including a plurality of first interlayer insulating films, a second stacked structure including a plurality of second interlayer insulating films on the first stacked structure, and a hole that extends into the first stacked structure and the second stacked structure. the plurality of second interlayer insulating films may include a plurality of first films that include first impurities, and a plurality of second films that are free of the first impurities.
Inventor(s): Kang Lib KIM of Suwon-si (KR) for samsung electronics co., ltd., Sea Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Junhee LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B43/40
Abstract: a semiconductor device includes a circuit region including a peripheral circuit on a substrate; and a cell region adjacent to the circuit region. the cell region includes a cell array region and a connecting region. the cell region also includes a gate stack that includes an interlayer insulating layer and a gate electrode, alternately stacked on the substrate; a channel in the cell array region that extends through the gate stack; a main support in the connecting region that extends through the gate stack; and a contact electrode in the connecting region connected to the gate electrode through the gate stack. the main support includes a first portion extending along a first direction; and a second portion extending from the first portion in a second direction crossing the first direction. at least a portion of the contact electrode is surrounded by the first and second portions of the main support.
20240431119. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kilho Lee of Suwon-si (KR) for samsung electronics co., ltd., Yongjae Kim of Suwon-si (KR) for samsung electronics co., ltd., Junho Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B61/00
CPC Code(s): H10B61/00
Abstract: a semiconductor device may include a lower dielectric layer on a substrate, data storage patterns on the lower dielectric layer and spaced apart from each other in first and second directions, a cell dielectric layer on the lower dielectric layer and on the data storage patterns, voids in the cell dielectric layer and between ones of the data storage patterns, upper conductive contacts respectively on the data storage patterns and spaced apart from each other in the first and second directions, and upper conductive lines on the upper conductive contacts and spaced apart from each other in the second direction and extending in the first direction. each of the upper conductive lines may be electrically connected to respective ones of the upper conductive contacts. the respective ones of the upper conductive contacts may be spaced apart from each other in the first direction.
Inventor(s): Yunseok Yang of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Shin of Suwon-si (KR) for samsung electronics co., ltd., Minhwan An of Suwon-si (KR) for samsung electronics co., ltd., Yunkyeong Jeong of Suwon-si (KR) for samsung electronics co., ltd., Jin Suk Chung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: the present disclosure relates to memory devices and memory systems. an example memory device includes a first core die, a second core die, and a base die stacked in a first direction. the base die is configured to output data of memory cells provided by the first and second core dies through a through-via. the through-via passes through the first and second core dies in the first direction with different burst lengths based on a mode signal.
20240431122. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Incheol NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, G11C11/4091, H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a semiconductor device includes a lower chip structure, and an upper chip structure on the lower chip structure. the lower chip structure includes a memory structure, a lower interconnection structure electrically connected to the memory structure, and a lower bonding pad electrically connected to the lower interconnection structure. the upper chip structure includes an upper base, a peripheral transistor on the upper base, a first upper interconnection structure electrically connected to the peripheral transistor, on the upper base, a through-via penetrating through the upper base and electrically connected to the first upper interconnection structure, an upper bonding pad bonded to the lower bonding pad, below the upper base, and an intermediate connection structure electrically connecting the upper bonding pad and the through-via, between the upper base and the lower chip.
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12
CPC Code(s): H10K85/342
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12
CPC Code(s): H10K85/342
Abstract:
m(l)(l) formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12
CPC Code(s): H10K85/342
Abstract: wherein mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12
CPC Code(s): H10K85/342
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minhan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12
CPC Code(s): H10K85/342
Abstract: with the proviso that i) xis c(r), xis c(r), and rand rare bonded to each other to form a group represented by formula 2, ii) xis c(r), xis c(r), and rand rare bonded to each other to form a group represented by formula 2, or iii) xis c(r), xis c(r), and rand rare bonded to each other to form a group represented by formula 2, ring cyand ring cyare condensed with each other, and the remaining substituent groups are as defined herein.
Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd.
- A47L9/24
- A47L5/12
- B25J9/00
- CPC A47L9/24
- Samsung electronics co., ltd.
- A61B5/091
- A61B5/00
- A61B5/0205
- A61B5/0295
- A61B5/08
- A61B5/11
- CPC A61B5/091
- B01F25/314
- B01F23/10
- B01F25/31
- CPC B01F25/3143
- B23Q3/155
- B24B53/017
- B24D9/08
- CPC B23Q3/15513
- B24B49/12
- B24B49/18
- CPC B24B49/12
- B25J9/16
- B25J11/00
- B25J19/02
- CPC B25J9/1697
- C23C18/16
- H01L21/02
- H01L21/67
- CPC C23C18/1685
- D06F58/24
- D06F58/52
- D06F103/02
- CPC D06F58/24
- F04B35/04
- F04B53/22
- F25B31/02
- CPC F04B35/04
- F24F11/63
- CPC F24F11/63
- F24F11/86
- F24F110/10
- F24F120/20
- F25B49/02
- CPC F24F11/86
- G01R31/392
- G01R31/367
- G01R31/388
- G01R31/389
- CPC G01R31/392
- G02B7/02
- G06F1/16
- CPC G02B7/023
- G03F1/36
- CPC G03F1/36
- H01Q1/27
- H05K1/02
- H05K1/18
- H01Q13/10
- CPC G06F1/163
- G06F1/3212
- G06F1/3234
- H02P29/40
- CPC G06F1/1675
- G06F1/3218
- G06F3/0488
- CPC G06F1/3218
- G06F1/324
- CPC G06F1/324
- G06F3/042
- H04N9/31
- H04N23/12
- H04N23/72
- H04N23/73
- H04N23/76
- CPC G06F3/0425
- G06F3/04845
- G06F18/214
- G06F18/22
- G06N3/08
- G06T5/00
- G06V10/82
- G06V20/00
- G06V40/16
- CPC G06F3/04845
- G06F3/04886
- G06F3/04842
- G06F3/04847
- G06F3/0485
- CPC G06F3/04886
- G06F3/06
- CPC G06F3/0619
- CPC G06F3/0625
- CPC G06F3/0655
- G06F3/14
- H04M1/02
- H04M1/724
- CPC G06F3/1423
- G06F5/01
- G06F7/523
- CPC G06F5/01
- G06F13/16
- G06F13/40
- G11C11/42
- CPC G06F13/1694
- G06F16/2453
- G06F16/22
- CPC G06F16/24549
- G06F16/2455
- CPC G06F16/24552
- G06K19/06
- G06T11/00
- G06T11/20
- CPC G06K19/06037
- G06N3/063
- G06N3/048
- CPC G06N3/063
- G06T3/18
- G06V10/74
- G06V20/40
- CPC G06T3/18
- G06T7/00
- G06T7/194
- G06T7/73
- CPC G06T7/0012
- G06T7/55
- G06T3/40
- CPC G06T7/55
- G06V40/20
- G06T7/20
- CPC G06V40/20
- G09G3/20
- CPC G09G3/20
- G10L15/22
- G06F3/16
- G06F40/30
- G10L13/00
- G10L15/30
- CPC G10L15/22
- G10L17/06
- G10L17/02
- CPC G10L17/06
- G11C11/22
- G06N3/0464
- G11C7/16
- G11C11/54
- H01L29/78
- H10B51/30
- CPC G11C11/223
- G11C11/4091
- G11C11/4074
- G11C11/4094
- CPC G11C11/4091
- G11C16/04
- G11C5/06
- G11C16/10
- H10B43/10
- H10B43/27
- H10B43/35
- H10B43/40
- CPC G11C16/0483
- H01J37/32
- H03F3/45
- CPC H01J37/32917
- C09D5/00
- C09D5/26
- C09D175/02
- C23C16/56
- H01L21/285
- H01L21/3105
- CPC H01L21/02118
- C23C16/34
- C23C16/40
- C23C16/455
- CPC H01L21/0228
- H01L21/027
- H01L21/308
- H01L21/311
- CPC H01L21/0274
- H01L21/306
- H01L21/20
- H01L21/762
- H01L21/84
- CPC H01L21/30625
- H01L21/3213
- H01L21/033
- CPC H01L21/32139
- H01L21/48
- H01L23/00
- H01L23/36
- CPC H01L21/4853
- H01L21/677
- H01L21/68
- CPC H01L21/67766
- H01L21/683
- CPC H01L21/6833
- H01L23/16
- H01L23/31
- H01L23/498
- H01L25/065
- H01L25/10
- CPC H01L23/16
- H01L23/24
- H10B80/00
- CPC H01L23/24
- H01L23/48
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H01L23/481
- CPC H01L23/49816
- CPC H01L23/49838
- H01L23/15
- H01L23/538
- H01L23/528
- H01L29/49
- H10B12/00
- CPC H01L23/5283
- H01L23/522
- H01L27/092
- CPC H01L23/5286
- H01L23/29
- H01L25/18
- CPC H01L23/5386
- H01L23/544
- CPC H01L23/544
- H01L25/00
- CPC H01L24/08
- H01L23/532
- CPC H01L24/14
- CPC H01L24/20
- H01L25/16
- CPC H01L24/96
- H01L23/495
- CPC H01L25/0652
- CPC H01L25/0655
- CPC H01L25/0657
- CPC H01L25/105
- H01L21/56
- H01L23/367
- CPC H01L25/50
- H01L27/146
- H01L21/768
- CPC H01L27/14605
- H04N23/56
- H04N23/57
- CPC H01L27/14623
- CPC H01L27/1463
- H01G4/008
- CPC H01L28/60
- H01G4/06
- CPC H01L28/75
- H01L29/45
- H01L29/40
- CPC H01L29/45
- CPC H01L29/66545
- H01M10/42
- H01M10/46
- H01M50/574
- H02J7/00
- CPC H01M10/425
- H01Q1/24
- H01Q9/04
- H01Q21/08
- CPC H01Q1/243
- H01Q1/22
- H04R1/10
- CPC H01Q1/273
- H01Q21/00
- CPC H01Q21/0006
- H02J50/00
- H02J50/12
- CPC H02J50/005
- H02K5/173
- A47L5/28
- F16C19/08
- H02K7/08
- H02K21/16
- CPC H02K5/1732
- H02M3/158
- H02M1/00
- H02M1/42
- CPC H02M3/158
- H03F3/24
- CPC H03F3/245
- H03M13/11
- H03M13/00
- CPC H03M13/1174
- H04B1/04
- H04W52/24
- CPC H04B1/0475
- H04B1/3827
- CPC H04B1/3827
- H04B7/024
- H04L47/2441
- H04W84/12
- CPC H04B7/024
- H04B7/0413
- H04B17/11
- H04B17/21
- CPC H04B7/0413
- H04B7/06
- H04B17/12
- CPC H04B7/0626
- H04L25/03
- H04B1/12
- CPC H04L25/03267
- H04L47/6295
- B60W60/00
- CPC H04L47/6295
- H04L9/40
- CPC H04L63/102
- H04L65/1063
- H04L67/125
- H04L67/51
- CPC H04L65/1063
- F16C11/04
- CPC H04M1/0216
- CPC H04M1/0237
- CPC H04M1/0268
- H04M1/72436
- G06F3/0481
- G06Q10/107
- G06Q50/00
- H04M1/72451
- H04W4/12
- CPC H04M1/72436
- CPC H04N9/3185
- H04N23/16
- H04N23/71
- H04N23/84
- H04N23/88
- CPC H04N23/16
- H04N23/74
- H04N23/53
- CPC H04N23/74
- H04N25/59
- H04N25/76
- H04N25/78
- CPC H04N25/59
- H03M1/56
- H04N25/51
- H04N25/57
- CPC H04N25/78
- H04R1/28
- G10K11/16
- CPC H04R1/2873
- H04W24/10
- H04B7/0456
- CPC H04W24/10
- H04W28/02
- CPC H04W28/0268
- H04W28/084
- H04L67/1004
- CPC H04W28/084
- H04W36/00
- H04W36/02
- H04W36/08
- CPC H04W36/0022
- H04W36/24
- H04W48/16
- H04W84/06
- CPC H04W36/00835
- H04W36/06
- H04B17/318
- CPC H04W36/06
- H04W36/18
- H04W76/20
- H04W76/30
- CPC H04W36/18
- H04W52/34
- H04L5/00
- H04W72/044
- CPC H04W52/34
- H04W52/36
- H04W76/15
- CPC H04W52/367
- H04W56/00
- CPC H04W56/0015
- H04W64/00
- H04W72/02
- H04W72/0453
- CPC H04W64/00
- H04W68/00
- H04W52/02
- H04W72/1263
- H04W72/23
- CPC H04W68/005
- H04L1/1812
- H04W74/0808
- CPC H04W72/02
- H04W72/541
- H04W72/0446
- H04W72/56
- CPC H04W72/541
- H04L1/00
- H04W24/08
- CPC H04W72/56
- H04W74/0833
- CPC H04W74/0833
- H04W74/08
- H04W76/10
- H04W76/28
- CPC H04W76/10
- H04W76/27
- H04W72/30
- CPC H04W76/27
- H05B3/26
- H05B3/14
- CPC H05B3/26
- H05K1/14
- CPC H05K1/0201
- H04R1/02
- H04R1/34
- H04R3/00
- H05K5/02
- CPC H05K1/0215
- CPC H05K1/0225
- H05K1/11
- CPC H05K1/115
- CPC H05K1/147
- CPC H05K5/0217
- H05K5/00
- H05K5/03
- B32B7/12
- B32B17/10
- G02B5/30
- CPC H05K5/03
- CPC H10B12/488
- CPC H10B12/50
- H10B41/27
- CPC H10B43/27
- H10B41/10
- H10B41/35
- H10B41/40
- CPC H10B43/40
- H10B61/00
- CPC H10B61/00
- CPC H10B80/00
- H10K85/30
- C07F15/00
- C09K11/06
- H10K50/12
- CPC H10K85/342
